Core Viewpoint - Honor Terminal Co., Ltd. has officially obtained the listing guidance record from the Shenzhen Securities Regulatory Commission, with CITIC Securities as the advisory institution, indicating a significant acceleration in its IPO process. Honor is transitioning from a traditional smartphone manufacturer to a "global AI terminal ecosystem company" by establishing an AI new industry department and launching a 1.44 billion yuan AI terminal industry fund to create a closed-loop AI industry ecosystem [1]. Group 1: AI Terminal and Robotics Development - Honor is focusing on advanced areas such as embodied intelligent robots, AI terminal devices, and bionic systems, which will face new thermal management challenges due to high computing power and compact packaging [1]. - The integration of edge computing modules, sensor systems, and electric drive modules in humanoid and embodied robots is leading to significantly increased thermal density in limited spaces and complex operating environments [3]. Group 2: Thermal Management Strategies - Common thermal management strategies include the use of micro heat pipes or heat spreaders to alleviate local overheating in dynamic structures, and the integration of annular heat pipes and small vapor chamber modules for effective heat transfer in core computing modules [3]. - The overall thermal management solutions are evolving towards multi-modal systems that incorporate flexible phase change materials, active air cooling, and micro-pump liquid cooling [4]. Group 3: Liquid Cooling Solutions - To address the heat generated by AI models and high-frequency graphics tasks, smart terminal manufacturers are constructing composite cooling systems, with liquid cooling solutions entering the terminal market [4]. - High-efficiency liquid cooling solutions are being developed for AI notebooks, high-end AR/VR devices, and mobile robots, indicating a redefinition of thermal management boundaries for next-generation AI terminal devices [4]. Group 4: Industry Forum and Collaboration - The 2025 Liquid Cooling Industry Innovation and Application Forum will take place from July 3-5, 2025, in Dongguan, Guangdong, organized by Shenzhen DT New Materials and iTherM, with various industry leaders and academic institutions participating [6][18].