人民财讯9月30日电，天风证券研报称，商务部等八部门联合印发《关于大力发展数字消费共创数字时 代美好生活的指导意见》，聚焦供需双侧协同发力，重点看好AI终端设备产业链机遇。文件明确提出 加速人工智能终端产品创新，重点释放人工智能手机、电脑、可穿戴设备、智能机器人等新产品消费潜 力，并推动智能家电互联互通及智能网联汽车试点，以新供给激发新需求。该政策举措不仅将直接刺激 数字消费市场，更将形成"需求牵引供给"的良性循环，带动芯片、传感器等上游产业链升级，为消费电 子产业注入新动能。 转自：证券时报 ...

作为继"互联网+"之后国家推动技术革命和产业融合的又一战略部署，国务院近日对外发布《关于深入 实施"人工智能+"行动的意见》(以下简称《意见》)。 《意见》提出，到2027年，率先实现人工智能与6大重点领域广泛深度融合，新一代智能终端、智能体 等应用普及率超70%，智能经济核心产业规模快速增长。到2030年，我国人工智能全面赋能高质量发 展，新一代智能终端、智能体等应用普及率超90%，智能经济成为我国经济发展的重要增长极，推动技 术普惠和成果共享。到2035年，我国全面步入智能经济和智能社会发展新阶段，为基本实现社会主义现 代化提供有力支撑。 陈晓华表示，总体而言，《意见》本质上是通过人工智能技术提升全要素生产率的重要尝试，其成功关 键在于能否将技术投入有效转化为产业生产力，并通过全球合作避免技术割裂，最终实现智能经济对 GDP增长和生产率提升的实质贡献。 当前，在我国大力提振消费，全方位扩大国内需求的背景下，《意见》把"人工智能+"消费提质作为一 项重点行动，围绕服务消费和产品消费这两个方面，给出了后续的重点工作方向。 "目前，人工智能已经进入了产业应用的关键阶段，然而，要真正让人工智能从'技术进步增量'形 ...

Group 1 - The core viewpoint of the articles highlights the transformation of Beijing's consumption market, driven by service orientation, technological advancement, and emotional value consumption, particularly among Generation Z [1][2] - Generation Z's emotional consumption has emerged as a new market engine, leading to rapid growth in sectors such as trendy toys, pet economy, and niche markets, with businesses creating feedback loops through social recognition and experiential events [1] - The structural transformation of consumption scenarios reflects a reconfiguration of market logic, with a notable shift towards cost-effectiveness and small, frequent purchases, as well as the integration of online and offline retail experiences [2] Group 2 - Technological consumption is identified as a core driver of high-quality development, with the durable consumer goods market expected to reach 24 trillion yuan in 2024, reflecting a 5% year-on-year growth, particularly in personal electronic devices [2] - The transformation of Beijing's consumption market is fundamentally shifting from product-led consumption to a composite drive of services, experiences, and technology, outlining a clear path for the development of international consumption centers [2]

Core Viewpoint - Honor Terminal Co., Ltd. has officially obtained the listing guidance record from the Shenzhen Securities Regulatory Commission, with CITIC Securities as the advisory institution, indicating a significant acceleration in its IPO process. Honor is transitioning from a traditional smartphone manufacturer to a "global AI terminal ecosystem company" by establishing an AI new industry department and launching a 1.44 billion yuan AI terminal industry fund to create a closed-loop AI industry ecosystem [1]. Group 1: AI Terminal and Robotics Development - Honor is focusing on advanced areas such as embodied intelligent robots, AI terminal devices, and bionic systems, which will face new thermal management challenges due to high computing power and compact packaging [1]. - The integration of edge computing modules, sensor systems, and electric drive modules in humanoid and embodied robots is leading to significantly increased thermal density in limited spaces and complex operating environments [3]. Group 2: Thermal Management Strategies - Common thermal management strategies include the use of micro heat pipes or heat spreaders to alleviate local overheating in dynamic structures, and the integration of annular heat pipes and small vapor chamber modules for effective heat transfer in core computing modules [3]. - The overall thermal management solutions are evolving towards multi-modal systems that incorporate flexible phase change materials, active air cooling, and micro-pump liquid cooling [4]. Group 3: Liquid Cooling Solutions - To address the heat generated by AI models and high-frequency graphics tasks, smart terminal manufacturers are constructing composite cooling systems, with liquid cooling solutions entering the terminal market [4]. - High-efficiency liquid cooling solutions are being developed for AI notebooks, high-end AR/VR devices, and mobile robots, indicating a redefinition of thermal management boundaries for next-generation AI terminal devices [4]. Group 4: Industry Forum and Collaboration - The 2025 Liquid Cooling Industry Innovation and Application Forum will take place from July 3-5, 2025, in Dongguan, Guangdong, organized by Shenzhen DT New Materials and iTherM, with various industry leaders and academic institutions participating [6][18].