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“港股GPU第一股”,要来了
华尔街见闻· 2025-12-22 11:39
以下文章来源于硬AI ,作者专注科技产研的 AI时代,快人一步~ 作者龙玥 编辑硬AI 在与同行的激烈竞争中,被称为"国产GPU四小龙"之一的壁仞科技向"港股GPU第一股"的目标迈出了关键一步。 12月22日,根据壁仞科技向香港交易所提交的公告,公司计划在全球发售247,692,800股H股,发行价格区间定为每股17.00港元至19.60港元。若以发行价上 限计算,且不行使超额配股权,此次IPO最多可募集约48.55亿港元。 公告显示,壁仞科技的股票代码为"6082",预计其H股将于明年1月2日正式在港交所主板开始交易。此次IPO正值公司商业化初期的关键阶段,募集资金的注 入,对于公司推进下一代产品研发、在由少数巨头主导的市场中争夺份额至关重要。 硬AI . 壁仞科技的上市,不仅是其自身发展的重要里程碑,也为观察中国本土AI算力产业提供了一个重要窗口。作为"国产GPU四小龙"中又一家走向公开市场的企 业,其估值和市场表现将为同赛道的其他公司提供参照,并反映出投资者对中国半导体自主化前景的信心。 市场普遍将壁仞科技和摩尔线程、沐曦股份、燧原科技视为"国产GPU四小龙"。其中,摩尔线程、沐曦股份已上市,燧原科技目 ...
“港股GPU第一股”壁仞科技确定IPO发售价格区间,预计明年1月2日上市交易
硬AI· 2025-12-22 08:57
GPU开发商壁仞科技已确定其香港IPO发行价区间为每股17.00至19.60港元,计划于明年1月2日挂牌交易,股票代 码"6082"。公司手握总价值约8.22亿元的未完成约束力订单,IPO募资将主要用于下一代芯片的研发和商业化。 硬·AI 作者 | 龙 玥 编辑 | 硬 AI 在与同行的激烈竞争中,被称为"国产GPU四小龙"之一的壁仞科技向"港股GPU第一股"的目标迈出了关键 一步。 12月22日,根据壁仞科技向香港交易所提交的公告,公司计划在全球发售247,692,800股H股,发行价格 区间定为每股17.00港元至19.60港元。若以发行价上限计算,且不行使超额配股权,此次IPO最多可募集 约48.55亿港元。 公告显示,壁仞科技的股票代码为"6082",预计其H股将于明年1月2日正式在港交所主板开始交易。此次 IPO正值公司商业化初期的关键阶段,募集资金的注入,对于公司推进下一代产品研发、在由少数巨头主 导的市场中争夺份额至关重要。 | 全球發售的發售股份數目 : 247,692,800股H股(視乎發售量調整權 | | --- | | 及超額配股權行使與否而定) | | 香港發售股份數目 : 12.38 ...
“港股GPU第一股”壁仞科技确定IPO发售价格区间,预计明年1月2日上市交易
Hua Er Jie Jian Wen· 2025-12-22 00:31
在与同行的激烈竞争中,被称为"国产GPU四小龙"之一的壁仞科技向"港股GPU第一股"的目标迈出了关键一步。 12月22日,根据壁仞科技向香港交易所提交的公告,公司计划在全球发售247,692,800股H股,发行价格区间定为每股17.00港元至19.60港元。若以 发行价上限计算,且不行使超额配股权,此次IPO最多可募集约48.55亿港元。 公告显示,壁仞科技的股票代码为"6082",预计其H股将于明年1月2日正式在港交所主板开始交易。此次IPO正值公司商业化初期的关键阶段,其 营收呈现爆发式增长,但持续的巨额亏损也给其未来发展带来了不确定性。募集资金的注入,对于公司推进下一代产品研发、在由少数巨头主导 的市场中争夺份额至关重要。 | 重要提示: 閣下如對本招股章程的任何內容有任何疑問,應徵詢獨立專業意見。 | | --- | | 壁の科技 | | BIREN TECHNOLOGY | | Shanghai Biren Technology Co., Ltd. | | 上海壁仍科技股份有限公司 | | (於中華人民共和國註冊成立的股份有限公司) | | 全球發售 | | 全球發售的發售股份數目 : 247.69 ...
市占率不足1%,壁仞科技冲击“港股GPU第一股”
Cai Jing Wang· 2025-12-19 08:37
Core Viewpoint - The domestic GPU sector is witnessing significant activity as major players, including Shanghai Biren Technology Co., Ltd. (Biren Technology), are heading to the capital market, with Biren Technology aiming to become the first GPU stock listed on the Hong Kong Stock Exchange [1][4]. Company Overview - Biren Technology was established in 2019 and focuses on developing General-Purpose Graphics Processing Unit (GPGPU) chips and intelligent computing solutions for artificial intelligence [1]. - The company has successfully developed its first-generation GPGPU architecture and two chips, BR106 and BR110, with BR106 entering mass production in January 2023 and BR110 expected to follow in October 2024 [1][3]. Product Development - Biren Technology plans to launch the next-generation flagship data center chip, the BR20X series, by 2026, which will feature larger and faster memory and higher interconnect bandwidth compared to existing products [3]. - Future products include the BR30X for cloud training and the BR31X for edge inference, expected to be commercialized by 2028 [3]. Financial Performance - Since generating revenue from its intelligent computing solutions in 2023, Biren Technology has seen rapid revenue growth but has not yet achieved profitability [2]. - Revenue figures from 2022 to the first half of 2025 are as follows: 0.499 million yuan in 2022, 0.62 billion yuan in 2023, 3.37 billion yuan in 2024, and 0.59 billion yuan in the first half of 2025, with net losses of 1.474 billion yuan, 1.744 billion yuan, 1.538 billion yuan, and 1.601 billion yuan respectively [2][4]. Customer Concentration - The company has a high customer concentration, with revenue from the top five customers accounting for 98.1%, 90.3%, and 97.9% of total revenue from 2023 to the first half of 2025 [4]. - The largest customer contributed 85.7%, 54.5%, and 33.3% of total revenue during the same periods [4]. Market Opportunity - The global demand for AI computing power is rising, presenting significant market opportunities for domestic GPU manufacturers like Biren Technology [4]. - According to Frost & Sullivan, the AI chip market in China is projected to grow from 142.54 billion yuan in 2024 to 1,336.79 billion yuan by 2029, with a compound annual growth rate (CAGR) of 53.7% from 2025 to 2029 [4]. Competitive Landscape - The Chinese intelligent computing chip market is highly concentrated, with the top two players holding 94.4% of the market share [4]. - Biren Technology anticipates capturing approximately 0.2% of the market share in a projected market size of 50.4 billion USD by 2025 [4]. Future Plans - The funds raised from the IPO will be used for the development and upgrade of existing GPGPU chips and next-generation chips like BR20X and BR30X, as well as for software platform development and commercialization of intelligent computing solutions [5]. - Short-term prospects for domestic GPU companies are positive, as they can alleviate high R&D costs through IPO fundraising, while long-term growth is expected through increased R&D investment and strengthening of the technology product moat [5].