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特价出售美光、博通、ON等芯片(10份料单更新)
芯世相· 2025-06-10 05:19
芯片超人现有 1600平米 芯片智能仓储基地,现货库存型号 1000+ ,品牌高达 100种 , 5000万颗 现 货库存芯片,总重量 10吨 ,库存价值高达 1亿+ 。同时,芯片超人在深圳设有独立实验室,每颗物料 均 安排QC质检 。 求购以下料号 | 品牌 | 型号 | 数量 | | --- | --- | --- | | ST | STPS30170DJF-TR | 21K | | TDK | ICM-42688-P | 40K | | 英飞凌 | TLD2314EL | 10K | | TI | CDC3RL02BYFPR | 30K | | 村田 | XRCGB27M000FAN16R0 | 15K | | 村田 | DFE322520FD-4R7M | 100K | 优势物料,特价出售 | 品牌 | 型号 | 数量 | 年份 | | --- | --- | --- | --- | | Micron | MT53E1536M32D4DT-046 AIT:A TR | 350000PCS | 22+到24+ | | BROADCOM | BCM53284MKPBG | 558PCS | 22+ | | ...
小米自研手机SoC芯片官宣:科研实力的具象化体现,潜在挑战亦不容忽视
3 6 Ke· 2025-05-16 08:37
Group 1 - The core point of the article is that Xiaomi has successfully developed its own mobile SoC chip, making it the fourth company globally, after Samsung, Apple, and Huawei, to achieve this capability, which represents a significant milestone in its research and development efforts [2][9] - The self-developed chip is seen as a manifestation of Xiaomi's research strength and a crucial step towards enhancing its brand and market competitiveness [3][9] - The ability to develop in-house chips allows manufacturers to control core technologies, reduce costs, and differentiate their products, which is essential for maintaining competitiveness in the market [3][4] Group 2 - The article highlights the cost-saving potential of self-developed chips, citing that the procurement prices for chips like MediaTek's Dimensity 9400 and Qualcomm's Snapdragon 8 Gen 4 have exceeded 1,000 yuan, which can account for a significant portion of a smartphone's bill of materials [3][4] - Apple's example is used to illustrate the cost benefits of self-developed chips, with estimates suggesting that its C1 chip could save Apple around $220 million annually based on projected sales of the iPhone 16e [6][4] - The article emphasizes that having self-developed chips can lead to better product performance and efficiency, particularly in areas like AI and imaging capabilities, which are becoming increasingly important in the competitive landscape [6][8] Group 3 - Despite the advantages, the article warns of potential challenges in establishing a self-sustaining cycle of product and chip development, particularly in a highly competitive market [10][11] - The high costs associated with chip development, such as the significant expenses for advanced process nodes, pose a risk for manufacturers if their chips do not perform well in the market [13][14] - The article also discusses the potential backlash from existing chip suppliers like MediaTek and Qualcomm, as well as the geopolitical risks associated with U.S. sanctions that could impact Xiaomi's access to advanced manufacturing processes [15][16][17] Group 4 - The article concludes by noting that Xiaomi's journey in developing its SoC chip has been a long-term commitment since 2014, reflecting the company's dedication to research and development despite the challenges faced [18][19] - There is optimism about Xiaomi's ability to navigate potential challenges and succeed in the competitive landscape of mobile technology [19]
对话辰至半导体徐琳洁:基于客户需求出发,填补高端国产车规域控芯片空白
IPO早知道· 2025-04-28 04:17
帮助整个产业能够真正在生态层面上实现自主可控。 本文为IPO早知道原创 作者| Stone Jin 微信公众号|ipozaozhidao 据 IPO早知道消息, 北京市辰至半导体科技有限公司(以下简称 "辰至半导体") 日前 携 C1芯片亮 相 2025上海国际车展。 | 一。 C1家族:汽车网络处理器 | 车规型号 | MPU Cores | MCU Cores | SRAM MByte | PCle Lanes | | --- | --- | --- | --- | --- | --- | | | C1Q312 (中央域控) | 8 | 8 | 20 | 4 | | C1Q312 | C1Q212 (低成本) | 4 | 6/8 | 15 | 4 | | | C1Q101 (区域控制) | 0 | б | 15 | 2 | 辰至半导体 专注于 ASIL-D级车规芯片的研发设计 ,其日前点亮的 C1芯片 作为一款 国产中央域控 芯片,具备高算力、低功耗、丰富的通信接口、高带宽、低延时等性能指标 ,填补国产化空白。 除智能汽车这个领域外, C1芯片 未来还可应用至工控、低空经济、机器人等领域。 在本次上海车展 ...
辰至半导体C1芯片点亮 补足国产高端车规芯片稀缺版图
Cai Jing Wang· 2025-04-22 05:41
据介绍,中央域控制器芯片技术壁垒高,市场长期由国际厂商主导,我国的量产国产化率几乎为零,该 芯片的国产化也是工信部汽车芯片自主可控攻坚任务的重点一环。辰至C1芯片的问世,恰逢其时地填 补了国内在高端车规级芯片领域空白,其稀缺性和独特优势不仅为国内汽车产业的自主可控发展注入了 强大动力,也为全球智能汽车芯片市场带来了新的活力。 近日,辰至半导体在广州举办"辰至半导体C1点亮仪式暨智能网联生态交流会",会上辰至半导体正式 宣布首款产品"C1系列"芯片已完成研发并成功点亮。 瞄准前沿技术 打造高价值创新产品 车规级芯片相较于消费级和工业级芯片,具有更高的技术门槛和严格的质量标准。首先,车规级芯片需 要满足AEC-Q100等国际标准,该标准涵盖了芯片在高温、低温、湿度、振动等多种极端环境下的可靠 填补国内空白 市场增长潜力巨大 在当今全球汽车产业加速向电动化、智能化、网联化转型的关键时期,车规级芯片作为智能汽车的"大 脑",其重要性日益凸显。但目前国内车规级芯片的国产化率仍处于较低水平,尤其是主控SOC芯片、 高性能MCU和模拟芯片等关键领域,长期依赖国际厂商供应。这种现状不仅制约了国内汽车产业的自 主发展,也使得国 ...