格隆汇12月5日丨兴森科技(002436.SZ)在投资者互动平台表示，ABF膜是FCBGA封装基板的核心原材 料。 ...

Core Insights - The global IC substrate market is expected to grow moderately at a rate of 3.6%, reaching a revenue scale of $13.489 billion in 2024, with demand for ABF substrates and high-end BT substrates driven by AI data center and edge AI product upgrades, projected to reach $14.837 billion in 2025 [2] - The Chinese IC substrate market is rapidly emerging, with a revenue scale of $1.038 billion, reflecting a year-on-year growth of 34.9%. However, local companies mainly focus on MEMS, RF, and storage substrates, while high-end FCBGA substrates using ABF film are still dominated by international manufacturers [2][4] Industry Developments - ABF film, a high-performance insulating film in semiconductor packaging, consists of a PET substrate film and ABF resin, which includes epoxy resin or polyimide, curing agents, and special fillers [3] - Domestic companies have made progress in the localization of ABF film but are still in a catch-up phase [4] Company Progress - Major companies are advancing in the development of ABF film products: - Ajinomoto holds over 95% of the global market share and continues to innovate ABF film products to meet higher-end chip packaging demands [6] - Sekisui Chemical is developing self-researched insulating film materials for FC-BGA substrates [6] - Tainan Build-up Film (TBF) by Jinghua Technology has passed validation from multiple domestic and international packaging substrate manufacturers [6] - Panasonic is producing layered materials for semiconductor packaging substrates [6] - Wuhan Sanxuan Technology is one of the early domestic players in the research and development of dielectric materials for chip packaging [6] - Guangdong Yipas New Materials is entering the high-end packaging field with EBF and TPF films [6] - Other companies like Guangdong Shengyi Technology and Xi'an Tianhe Defense are also making strides in developing ABF-like films and have begun small-scale production [6] Upcoming Events - TrendBank plans to hold the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [7]

Summary of Key Points from Conference Call Records Industry Overview - The conference call discusses the convertible bond market and its performance in the context of the broader equity market, particularly focusing on the Chinese market dynamics and external geopolitical factors [1][5][6]. Core Insights and Arguments - **Market Dynamics**: The convertible bond market is experiencing a structural shift due to favorable external conditions, such as easing geopolitical tensions and supportive domestic policies, which have led to a bullish outlook for July [1][5]. - **Convertible Bonds Performance**: Convertible bonds have shown better resilience and upside potential compared to common stocks, particularly in a low-interest-rate environment where funds are increasingly chasing yield [1][4][5]. - **Sector Focus**: Key sectors to watch include AI, military, semiconductors, humanoid robots, and new consumption areas like dairy and beverages, which are expected to have strong earnings visibility [1][6][11]. - **Banking Sector Trends**: There is a notable acceleration in the exit of bank convertible bonds, with significant amounts expected to flow back into the pure bond market or into new bottom-fishing opportunities [1][7]. Important but Overlooked Content - **Convertible Bond Ratings**: In the first half of the year, 37 convertible bonds had their ratings downgraded, but the impact was manageable, with most experiencing limited price declines [7]. - **Solar Industry Outlook**: The solar sector is currently facing increased competition but is expected to stabilize as leading companies reduce production and consolidate, making it a potential bottom-fishing opportunity [8]. - **Investment Strategies**: Strategies such as downshift speculation and YTM replacement are highlighted as viable approaches for investors, particularly in the pharmaceutical sector [3][27]. - **Company-Specific Insights**: - **Hua Zheng Co.**: The company has turned profitable with a focus on high-frequency substrates and advanced materials, indicating a positive short-term outlook [12]. - **Guo Li Co.**: Expected revenue growth of 50% to 100% due to strong demand in military and semiconductor sectors [13]. - **Shui Yang Co.**: The company is leveraging both proprietary and agency brands to drive growth in the high-end beauty market [14]. - **Hua You Co.**: Positioned well in the new energy vehicle sector, benefiting from strong demand and integrated supply chain advantages [15][17]. - **Jing Wang Electronics**: The company is gaining traction in the GPU supply chain, indicating a positive performance outlook despite industry pressures [18]. - **Anji Technology**: The company is seeing significant growth in semiconductor materials, bolstered by partnerships with major players like TSMC [19]. - **Hang Yu Co.**: The company is well-positioned in the military sector with a solid order book and improving margins [20]. Conclusion - The overall sentiment for the convertible bond market and specific sectors remains optimistic, driven by favorable macroeconomic conditions and sector-specific growth opportunities. Investors are encouraged to focus on high-growth areas with strong earnings visibility while being mindful of potential risks associated with credit and market volatility [1][5][11].