Summary of Conference Call Records Company and Industry Involved - **Company**: 华正新材 (Huazheng New Materials) - **Industry**: CCL (Copper Clad Laminate) industry, specifically focusing on high-end CCL materials and their applications in the domestic computing power sector Core Points and Arguments 1. **Price Increase in CCL Industry**: The CCL industry has entered a price increase phase driven by both cost push and demand pull, following price hikes announced by major players like 建滔 (Kingboard) and Resonac [1] 2. **Domestic Computing Power Surge**: The accelerated release of domestic computing power chips, such as Huawei's昇腾910C, is pushing for faster localization of high-frequency and high-speed CCL materials [1] 3. **Low Inventory Levels**: The CCL industry has experienced a prolonged destocking phase, resulting in current low inventory levels, which enhances price elasticity [1] 4. **Improved Bargaining Power**: With rising copper prices and a shortage of glass fiber cloth supply, CCL manufacturers are regaining bargaining power [1] 5. **Profit Margin Expansion**: 华正新材, as a leading domestic CCL manufacturer, is expected to benefit from the current price increase cycle, leading to potential profit margin expansion and performance elasticity [1] 6. **Strong Ties with Huawei**: The company has established deep ties with Huawei, positioning itself as a core supplier of essential materials for the domestic computing power base [1] Additional Important Content 1. **High Standards for PCB Layers**: Huawei's昇腾 servers require an increase in PCB layers and have stringent requirements for signal transmission loss [2] 2. **Ultra Low Loss Material Certification**: 华正新材's Ultra Low Loss materials have passed multiple terminal certifications and are being sold in small batches, directly competing with high-end products from companies like 台光电 (Taiwan Union Technology) and 松下 (Panasonic) [2] 3. **Revenue Growth Projection**: The revenue from CCL is expected to grow by 14.26% year-on-year in 2024, indicating a significant structural upgrade with increasing market share in high-frequency and high-speed boards within the server sector [2] 4. **CBF Film Development**: The company’s CBF laminated insulation film is set to break Japan's ABF monopoly and has been validated by major domestic IC substrate manufacturers, with small batch deliveries already achieved [2] 5. **Valuation Potential**: Given the tight supply of advanced packaging capacity in CoWoS, the need for domestically controlled packaging materials is urgent, and this business segment has high valuation elasticity [2] 6. **Risk Factors**: Potential risks include severe fluctuations in raw material prices and delays in the validation process for domestic computing power PCBs [2]

Group 1 - The core idea of the article is that several companies have successfully transitioned from their original industries to become key players in the semiconductor sector by leveraging their existing technologies and expertise [24][26][28] - Ajinomoto, originally a seasoning company, developed a thermosetting film called ABF from by-products, which now dominates 99% of the high-end CPU and GPU packaging market [1] - Donaldson, initially focused on tractor air filters, adapted its technology to create chemical air filtration systems for semiconductor clean rooms, ensuring high purity levels essential for chip manufacturing [4][19] - DISCO, which started as a manufacturer of grinding wheels, innovated ultra-thin cutting blades and specialized cutting machines, leading to a dominant market share in wafer cutting and grinding equipment [5][9][20] - Fujifilm transformed from a film company to a diversified high-tech group, successfully entering the semiconductor materials market by applying its expertise in photosensitive materials to photoresists [10][14][24] - Gore, known for its waterproof fabric, developed specialized cables for EUV lithography machines, showcasing the versatility of its ePTFE technology [15][17] - TOTO, a toilet manufacturer, leveraged its ceramic technology to produce components for semiconductor equipment, achieving significant profitability in this new sector [19] - JSR transitioned from synthetic rubber to become a leading supplier of photoresists, capitalizing on its polymer chemistry expertise [20] - HOYA, originally a glassware manufacturer, now plays a crucial role in the semiconductor industry by providing high-precision EUV mask substrates [21] - Henkel evolved from a detergent company to a major player in advanced packaging materials for semiconductors, utilizing its knowledge of surface chemistry [22] Group 2 - The common thread among these companies is their ability to understand the essence of their technologies and apply them creatively in new fields, demonstrating a long-term commitment to research and development [24][25][26] - The competition in semiconductor materials is fundamentally about "tacit knowledge," which cannot be easily transferred and requires years of experience to achieve high yield and consistency [25] - These companies often target niche markets rather than competing in larger, more saturated markets, allowing them to establish strong positions and maintain technological and profit barriers [25][26] - Japanese companies tend to rely on the chemical similarities of materials for their transitions, while Western companies focus on pushing existing processes to their limits in new applications [26]

公众号记得加星标⭐️，第一时间看推送不会错过。 上世纪70年代末，日本著名的调味品公司味之素开始研究副产品的应用。 在对蛋白质和氨基酸（关键调味料成分）进行研究时，味之素研发团队发现副产物可以做出拥有极高 绝缘性的树脂类合成材料，于是创造出了一种具有高耐用性，低热膨胀性，易于加工和其他重要特征 的热固性薄膜，该膜被命名为ABF。 1996年，英特尔与味之素联系，寻求使用氨基酸技术开发薄膜型绝缘子，这两家企业合作研发出了 FC-BGA（Flip Chip Ball Grid Array），最终让ABF成为了FC-BGA产品的主要方案。 那时没人会想到，这种从制作味精时产生的"废料"中提炼出的薄膜，最终会垄断全球99%的高端CPU 和GPU封装市场。到2021年，当全球芯片荒席卷而来时，味之素ABF材料的交付周期长达30周，英 特尔、AMD和英伟达等巨头不得不排队等待这家调味料公司的供货。 而当我们回望半导体行业近百年发展历程，像味之素这样跨界成功的半导体"隐形冠军"，远不止一两 家。 在漫长的时间里，唐纳森公司的工程师发现了一个惊人的相似性：半导体工厂面临的问题，本质上和 一百年前的拖拉机一模一样，就是如何防止 ...

Core Viewpoint - The article discusses the upcoming Future Industries New Materials Expo 2026 (FINE2026), focusing on five common demands in future industries, including advanced semiconductors, advanced batteries, lightweight materials, low-carbon sustainability, and thermal management [1]. Group 1: Company Developments - Hongchang Electronics announced the completion of its "Functional High-End Copper Clad Laminate Electronic Materials Project," which will produce 7.2 million high-end copper clad laminates and 14.4 million meters of semi-cured sheets annually [1]. - The company adjusted the expected operational date for its "80,000 tons of electronic-grade functional epoxy resin project" from December 31, 2025, to June 30, 2026, based on the project's actual progress [3][4]. Group 2: Project Investments - The total investment for the epoxy resin project is 420.99 million yuan, with 171.36 million yuan sourced from raised funds, and the construction period is set for 24 months [2]. - The project will produce various types of resins, including 50,000 tons of low-bromine epoxy resin, 5,000 tons of high-bromine epoxy resin, 4,500 tons of lead-free epoxy resin, 10,000 tons of solvent-based epoxy resin, 10,000 tons of solid epoxy resin, and 500 tons of high-frequency and high-speed resin [2]. Group 3: Industry Context - The FINE2026 expo will feature over 800 participating companies, research institutions, and thematic forums, highlighting China's rise in future industries and its leadership in global new materials innovation [6]. - The expo will cover various sectors, including advanced semiconductors, AI, quantum technology, and smart vehicles, showcasing the latest advancements in materials and devices [7].

Group 1 - The core material for FCBGA packaging substrate is ABF film, as stated by the company on the investor interaction platform [1]

Core Insights - The global IC substrate market is expected to grow moderately at a rate of 3.6%, reaching a revenue scale of $13.489 billion in 2024, with demand for ABF substrates and high-end BT substrates driven by AI data center and edge AI product upgrades, projected to reach $14.837 billion in 2025 [2] - The Chinese IC substrate market is rapidly emerging, with a revenue scale of $1.038 billion, reflecting a year-on-year growth of 34.9%. However, local companies mainly focus on MEMS, RF, and storage substrates, while high-end FCBGA substrates using ABF film are still dominated by international manufacturers [2][4] Industry Developments - ABF film, a high-performance insulating film in semiconductor packaging, consists of a PET substrate film and ABF resin, which includes epoxy resin or polyimide, curing agents, and special fillers [3] - Domestic companies have made progress in the localization of ABF film but are still in a catch-up phase [4] Company Progress - Major companies are advancing in the development of ABF film products: - Ajinomoto holds over 95% of the global market share and continues to innovate ABF film products to meet higher-end chip packaging demands [6] - Sekisui Chemical is developing self-researched insulating film materials for FC-BGA substrates [6] - Tainan Build-up Film (TBF) by Jinghua Technology has passed validation from multiple domestic and international packaging substrate manufacturers [6] - Panasonic is producing layered materials for semiconductor packaging substrates [6] - Wuhan Sanxuan Technology is one of the early domestic players in the research and development of dielectric materials for chip packaging [6] - Guangdong Yipas New Materials is entering the high-end packaging field with EBF and TPF films [6] - Other companies like Guangdong Shengyi Technology and Xi'an Tianhe Defense are also making strides in developing ABF-like films and have begun small-scale production [6] Upcoming Events - TrendBank plans to hold the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [7]

Summary of Key Points from Conference Call Records Industry Overview - The conference call discusses the convertible bond market and its performance in the context of the broader equity market, particularly focusing on the Chinese market dynamics and external geopolitical factors [1][5][6]. Core Insights and Arguments - **Market Dynamics**: The convertible bond market is experiencing a structural shift due to favorable external conditions, such as easing geopolitical tensions and supportive domestic policies, which have led to a bullish outlook for July [1][5]. - **Convertible Bonds Performance**: Convertible bonds have shown better resilience and upside potential compared to common stocks, particularly in a low-interest-rate environment where funds are increasingly chasing yield [1][4][5]. - **Sector Focus**: Key sectors to watch include AI, military, semiconductors, humanoid robots, and new consumption areas like dairy and beverages, which are expected to have strong earnings visibility [1][6][11]. - **Banking Sector Trends**: There is a notable acceleration in the exit of bank convertible bonds, with significant amounts expected to flow back into the pure bond market or into new bottom-fishing opportunities [1][7]. Important but Overlooked Content - **Convertible Bond Ratings**: In the first half of the year, 37 convertible bonds had their ratings downgraded, but the impact was manageable, with most experiencing limited price declines [7]. - **Solar Industry Outlook**: The solar sector is currently facing increased competition but is expected to stabilize as leading companies reduce production and consolidate, making it a potential bottom-fishing opportunity [8]. - **Investment Strategies**: Strategies such as downshift speculation and YTM replacement are highlighted as viable approaches for investors, particularly in the pharmaceutical sector [3][27]. - **Company-Specific Insights**: - **Hua Zheng Co.**: The company has turned profitable with a focus on high-frequency substrates and advanced materials, indicating a positive short-term outlook [12]. - **Guo Li Co.**: Expected revenue growth of 50% to 100% due to strong demand in military and semiconductor sectors [13]. - **Shui Yang Co.**: The company is leveraging both proprietary and agency brands to drive growth in the high-end beauty market [14]. - **Hua You Co.**: Positioned well in the new energy vehicle sector, benefiting from strong demand and integrated supply chain advantages [15][17]. - **Jing Wang Electronics**: The company is gaining traction in the GPU supply chain, indicating a positive performance outlook despite industry pressures [18]. - **Anji Technology**: The company is seeing significant growth in semiconductor materials, bolstered by partnerships with major players like TSMC [19]. - **Hang Yu Co.**: The company is well-positioned in the military sector with a solid order book and improving margins [20]. Conclusion - The overall sentiment for the convertible bond market and specific sectors remains optimistic, driven by favorable macroeconomic conditions and sector-specific growth opportunities. Investors are encouraged to focus on high-growth areas with strong earnings visibility while being mindful of potential risks associated with credit and market volatility [1][5][11].