Core Insights - The recent semiconductor technology roadmap by the Korean Society of Semiconductor Engineers (ISE) predicts advancements down to 0.2nm, indicating a shift in the competitive landscape of the semiconductor industry rather than just a focus on smaller process nodes [1][3]. Device and Process Technology Roadmap - The roadmap outlines a 15-year vision from 2025 to 2040, focusing on nine key semiconductor technology trends, including AI semiconductors, optical interconnects, and quantum computing [1][3]. - The evolution of logic devices aims to maintain performance and power efficiency while reducing size, with a shift from Design-Technology Co-Optimization (DTCO) to System-Technology Co-Optimization (STCO) [4][5]. Logic Technology Trends - Logic device nodes are projected to progress from 2nm in 2025 to 1nm by 2031, and approach 0.2nm by 2040, with key variables including gate length and 3D integration capabilities [5][12]. - The transition from FinFET to Gate-All-Around (GAA) structures is expected, with further innovations like CFET (Complementary FET) enhancing performance through 3D stacking [8][10]. Metal Interconnect Technology - Metal interconnects are becoming a critical performance bottleneck, necessitating innovations in materials and processes to achieve lower resistance and higher reliability [14][15]. - Backside Power Delivery Networks (BSPDN) are anticipated to be introduced around 2028, improving power efficiency and area utilization [14][15]. Memory Technology Trends - The semiconductor industry is shifting focus from computation to memory, with AI and HPC driving demand for high-capacity, high-bandwidth, low-latency, and low-power memory solutions [16][17]. - DRAM technology is evolving towards vertical channel transistors and stacked architectures, with significant advancements expected in the coming years [19][21]. Non-Volatile Memory (NVM) Developments - 3D NAND technology is projected to increase in layer count, reaching up to 2000 layers by 2040, while facing challenges in manufacturing processes [23][25]. - New NVM technologies like PCM and ReRAM are being explored, with PCM seen as having balanced scaling potential [26][27]. AI Semiconductor Roadmap - The AI hardware market is expected to grow significantly, with AI-related computing projected to account for about 20% of global computing demand by 2025 [29][30]. - Performance for training and inference hardware is expected to improve dramatically, with TOPS/W metrics increasing significantly by 2040 [30][31]. Optical Interconnect Technology - Optical interconnects are viewed as a key solution to the limitations of traditional copper interconnects, with applications expanding in data centers and AI-driven systems [33][36]. - The roadmap anticipates the introduction of Co-Packaged Optics (CPO) technology, which integrates optical and electronic components to enhance data transmission capabilities [42][44].

Core Viewpoint - The company has decided to terminate the acquisition of at least 51% of Beiyi Semiconductor Technology (Guangdong) Co., Ltd., reflecting a cautious approach in capital operations amid financial pressures and risks [1][3]. Group 1: Transaction Background - Kangda New Materials, a leader in adhesive and specialty resin materials in China, has pursued business expansion through acquisitions since 2017, acquiring companies like Biko Technology and Crystal Material Technology [2]. - Despite multiple acquisitions, the company has not achieved sustained profit growth, with net profit declining from 48 million yuan in 2022 to a loss of 246 million yuan in 2024, largely due to a significant goodwill impairment of 155 million yuan in 2024 [2]. - Beiyi Semiconductor focuses on power semiconductor module development and production, with a valuation of approximately 2.5 billion yuan based on its B+ round financing in May 2024 [2]. Group 2: Reasons for Termination - The acquisition was terminated due to insufficient progress in due diligence and audit work, as well as a lack of consensus among the parties involved [3]. - Financial pressure and cash flow concerns were significant factors, as the company faced a loss of 246 million yuan in 2024 and had not fully alleviated prior financial burdens [3]. - Discrepancies in the target's qualifications and valuation were noted, with potential issues regarding revenue and profit data, as well as concerns over the sustainability of new product profitability [3]. - Differences in transaction terms and valuation expectations between the shareholders of Beiyi Semiconductor and Kangda New Materials further complicated the acquisition [3]. Group 3: Industry Implications - The case of Kangda New Materials highlights a shift in the A-share merger and acquisition market, where companies are increasingly focusing on the profitability and synergy of acquisition targets rather than mere scale expansion [4]. - The termination of the acquisition serves as a prudent choice to avoid risks and reflects on past challenges such as goodwill impairment and asset sales [4]. - Moving forward, the company may prioritize its core adhesive business and semiconductor materials sector, aiming for growth through technological upgrades rather than capital operations [4].

Core Viewpoint - Kangda New Materials Co., Ltd. has terminated its acquisition plan of Beiyi Semiconductor Technology Co., Ltd. after only two and a half months, reflecting challenges in its strategic transition to the semiconductor industry [1][9][10]. Group 1: Acquisition Details - On August 28, Kangda New Materials signed a letter of intent to acquire at least 51% of Beiyi Semiconductor, a high-tech enterprise focused on power semiconductor modules [7]. - The acquisition was intended to accelerate Kangda's strategic transition to the semiconductor industry and create a "third growth curve" [8]. - The acquisition process faced difficulties, leading to its abrupt termination on November 13, with the company citing "work progress not meeting expectations" and "lack of consensus" as reasons [9][10]. Group 2: Financial Performance - Kangda New Materials has faced significant financial challenges, including a substantial goodwill impairment that led to losses in the previous year [3][14]. - The company's revenue increased from 1.932 billion in 2020 to 2.793 billion in 2023, but net profit declined from 215 million to 30 million during the same period [13]. - By the end of 2024, revenue was projected to reach 3.101 billion, while net profit was expected to drop to -294 million, primarily due to goodwill impairment provisions [14][15]. Group 3: Capital Operations - Kangda has engaged in frequent capital operations, attempting to transition from traditional adhesive materials to the semiconductor sector [2][12]. - The company has made several acquisitions since 2018, including companies like Biko Technology and Crystal Technology, but has struggled with profitability, leading to goodwill impairments [13][19]. - Kangda has raised significant capital through multiple rounds of financing, totaling 1.88 billion, to support its growth initiatives [21].

Core Viewpoint - Konda New Materials (002669.SZ) announced the termination of its acquisition of semiconductor assets due to insufficient progress in due diligence and lack of consensus among parties involved [2][3]. Group 1: Acquisition Details - Konda New Materials signed a Letter of Intent on August 28 to acquire at least 51% of Beiyi Semiconductor Technology (Guangdong) Co., Ltd. for cash, aiming to gain control [2]. - The acquisition was in the preliminary planning stage, with specific terms requiring further negotiation and validation among the parties [2][3]. - The termination agreement was signed by all parties involved, indicating a formal end to the acquisition process [2]. Group 2: Business Overview - Konda New Materials operates primarily in three sectors: adhesives and specialty resin materials, electronic information materials, and electronic technology, with adhesives accounting for over 80% of total revenue as per the 2025 semi-annual report [3]. - The planned acquisition of Beiyi Semiconductor was a strategic move for Konda New Materials to transition into the semiconductor industry [3][4]. Group 3: Future Prospects - Despite the termination of the Beiyi Semiconductor acquisition, Konda New Materials is pursuing another semiconductor-related transaction, aiming to acquire at least 51% of Chengdu Zhongke Huamei Electronics Co., Ltd. for 275 million yuan [5]. - The company expressed its commitment to continue seeking suitable acquisition targets to enhance its growth trajectory [4].

Core Viewpoint - Kanda New Materials announced the termination of the acquisition agreement with Beiyi Semiconductor and its shareholders due to unmet expectations in the progress of the transaction and lack of consensus among parties involved [1][3] Company Overview - Kanda New Materials primarily engages in the production of adhesives and specialty resin materials, with applications in wind turbine blade manufacturing, packaging materials, and rail transportation [1] - The company had planned to acquire at least 51% of Beiyi Semiconductor to gain control and integrate its power semiconductor module capabilities with Kanda's existing semiconductor materials business [1] Acquisition Details - The acquisition aimed to enhance Kanda's strategic transition into the semiconductor industry by leveraging Beiyi Semiconductor's research, packaging, testing, and wafer manufacturing capabilities [1] - Beiyi Semiconductor focuses on the development, production, and sales of new power semiconductor modules, with core products including IGBT, PIM, and IPM, applicable in sectors like electric vehicles, industrial control, and renewable energy [1] Financial Performance - Kanda New Materials has pursued external acquisitions as a key growth strategy, having acquired several companies since 2017 to expand into various sectors [2] - Despite these acquisitions, the company has faced declining profitability, with revenues of 2.466 billion yuan in 2022, 2.793 billion yuan in 2023, and projected 3.101 billion yuan in 2024, while net profits have decreased from 48 million yuan in 2022 to a projected loss of 246 million yuan in 2024 [2] Asset Sales - To improve its financial situation, Kanda has been selling significant assets to its controlling shareholder, including a 67% stake in Cai Jing Optoelectronics and a 51% stake in Biko Technology [2] Termination of Acquisition - The termination of the acquisition was a mutual decision among the parties involved, with no breach of contract or disputes reported [3]

Core Viewpoint - Kangda New Materials (Group) Co., Ltd. plans to acquire at least 51% of Beiyi Semiconductor Technology (Guangdong) Co., Ltd. to gain control and enhance its revenue and profit growth potential [1][4]. Group 1: Acquisition Details - The acquisition agreement was signed on August 28, 2025, and is currently in the preliminary planning stage, requiring further negotiation and validation [1]. - Beiyi Semiconductor specializes in the research, production, packaging, testing, sales, and service of new power semiconductor modules, with applications in electric vehicles, industrial control, robotics, photovoltaics, wind power generation, and energy storage [3]. Group 2: Beiyi Semiconductor's Capabilities - Beiyi Semiconductor has a production base of 16,500 square meters with 9 fully automated and semi-automated packaging lines, and over 170 advanced domestic and international equipment [3]. - The company is actively advancing its self-developed wafer fabrication project, focusing on 6-inch and 8-inch wafers, and is constructing a new 30,000 square meter factory for silicon carbide MOSFETs and other modules [3]. Group 3: Strategic Implications for Kangda New Materials - The acquisition aligns with Kangda New Materials' strategy of integrating "new materials + electronic technology" to accelerate its semiconductor industry layout and enhance its core competitiveness [4]. - The transaction is expected to optimize the business structure and improve profitability, contributing to the company's long-term development and strategic planning [5]. Group 4: Industry Context - The semiconductor industry is recognized as a strategic emerging industry in China, with continuous market demand and broad development prospects [5]. - Kangda New Materials aims to focus on key technological advancements and fill domestic gaps in the semiconductor sector, enhancing its integrated capabilities from design to manufacturing and testing [5].

Core Viewpoint - Kangda New Materials (康达新材) has signed a Letter of Intent for Acquisition to acquire at least 51% of Beiyi Semiconductor, aiming to gain control over the company, which specializes in power semiconductor modules [1][2] Group 1: Acquisition Details - The acquisition is in the preliminary planning stage, with significant uncertainties regarding the transaction details, which will require further negotiation and compliance with legal and regulatory procedures [1] - The overall valuation of Beiyi Semiconductor will be determined by an assessment report and the formal acquisition agreement [1] - The transaction is not expected to constitute a major asset restructuring as defined by relevant regulations [1] Group 2: Beiyi Semiconductor Overview - Beiyi Semiconductor, established in December 2020, focuses on the R&D, production, packaging, testing, sales, and service of new power semiconductor modules [2] - The company’s main products include IGBT, PIM, and IPM components, applicable in sectors such as electric vehicles, industrial control, robotics, photovoltaic, wind power, and energy storage [2] - Beiyi Semiconductor operates a 16,500 square meter IGBT module production base with nine fully automated and semi-automated packaging lines, equipped with over 170 advanced domestic and international devices [2] Group 3: Strategic Intent and Impact - The acquisition aligns with Kangda New Materials' strategy of integrating "new materials + electronic technology," aiming to enhance its semiconductor industry presence and optimize its business structure [2][3] - The transaction is expected to bring new revenue and profit growth opportunities, enhancing the company's profitability and sustainability [2] - Kangda New Materials plans to leverage its existing semiconductor materials business to accelerate its strategic transformation towards the semiconductor industry [3]

Core Viewpoint - Samsung Electronics is actively developing next-generation DRAM solutions to replace HBM (High Bandwidth Memory), with technologies like PIM (Processing-In-Memory) currently under standardization discussions in semiconductor organizations [1][2]. Group 1: Next-Generation DRAM Technologies - Key next-generation DRAM technologies include PIM, VCT (Vertical Channel Transistor), CXL (Compute Express Link), and LLW (Low Latency, High Bandwidth) DRAM, which are being developed for various potential customers and applications in the AI era [1][2]. - LPDDR (Low Power Double Data Rate) is currently commercialized up to LPDDR5X, with the standardization of the next generation, LPDDR6, nearing completion [2]. - PIM technology, which allows data processing capabilities within memory chips, is expected to enhance energy efficiency when combined with LPDDR [2]. - CXL is a next-generation interconnect interface designed for high-performance servers, enabling efficient connections between CPUs, GPU accelerators, DRAM, and storage devices, expanding memory bandwidth and capacity [2]. Group 2: Customization in HBM Market - The importance of "Custom HBM" in the next-generation HBM market is emphasized, with the base die of HBM4 being manufactured by foundries, allowing for product customization based on customer needs [3][4]. - This shift marks a significant transformation for Samsung's memory division, indicating a move towards tailored memory products for clients [4].