Group 1: ASIC Chip Market Outlook - Bank of America reports strong and sustained growth in the ASIC chip supply chain due to widespread adoption of AI ASICs by CSPs [1] - Despite extended project cycles, the demand for current generation products has created a historical super demand cycle for the global ASIC supply chain [1] - Google and Amazon are expected to maintain annual ASIC chip production above 1 million units, with Meta and Microsoft gradually catching up [1] Group 2: MPl's Growth and Market Position - MPl, a key supplier of probe cards for ASIC chips, is benefiting from strong customer demand, with MEMS probe card capacity expected to expand from 600,000 units per month to nearly 1 million by Q3 2025 [1][2] - The target price for MPl has been raised to NT$1050 based on a projected P/E ratio of 28 times for 2026 [2] Group 3: Aspeed's Business Performance - Aspeed is showing strong performance in its BMC business, with the AST2700 expected to be adopted by the Rubin platform, leading to reduced competitive pressure [2] - Earnings per share estimates for 2026 and 2027 have been raised by 5% and 12% respectively, with the target price increased to NT$6250 [2][3] - Aspeed's revenue is projected to reach NT$2.2 billion in Q3 2025, with a gross margin of 66% [3] Group 4: Alchip's Opportunities and Risks - Alchip is seeing increased collaboration opportunities with key customers as CSP projects advance, with a higher likelihood of mass production for Trainium 3 [4] - The target price for Alchip has been raised to NT$3900 based on a rolling valuation period extending to mid-2027 [4] - Upward risks for Alchip include faster mass production of non-AWS projects and improved profit margins due to relaxed restrictions on China [4]

如果您希望可以时常见面，欢迎标星收藏哦~ 来 源： 内容 编译自 zdnet 。 据悉，三星电子将向博通供应12层第五代高带宽存储器（HBM3E）。目前，在具体数量谈判后， 正在推进明年供货计划。随着全球大型科技公司纷纷加大自身专用集成电路（ASIC）开发的力 度，预计这将部分抵消英伟达HBM供应延迟带来的影响。 据业内人士3日透露，三星电子上个月与博通完成了HBM3E 12层质量测试，并计划量产供应该产 品。 目前两家公司商谈的供货量预计为12亿至14亿Gb（千兆位），预计最早将于今年下半年至明年实 现量产。 虽然与每年的HBM市场规模相比，这个数量并不算大，但对于急需确保HBM需求的三星电子来 说，这是一个意义重大的量。三星电子已设定目标，今年将HBM总供应量提升至80亿至90GB，是 去年的两倍。 参考链接 https://zdnet.co.kr/view/?no=20250703105748 点这里加关注，锁定更多原创内容 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代表半导体芯闻对该 观点赞同或支持，如果有任何异议，欢迎联系我们。 | | 推荐阅读 | | --- ...

Summary of Conference Call Notes Industry Overview - The conference call focuses on the ASIC (Application-Specific Integrated Circuit) market dynamics, particularly involving major players like AWS, Google, Microsoft, and META, with projections extending into 2026 and beyond [1][2][5]. Key Company Insights AWS - AWS has resolved issues with Trainium 3 and continues to secure orders from downstream suppliers. The development of Trainium 4 has commenced, with expectations for a contract signing soon [2][5]. - The specifications for AWS's TPU chips are significantly higher than competitors, with TPU v6p and TPU v7p expected to have ASPs of US$8,000 and higher, respectively [2]. Google - Google is progressing steadily with its TPU series, with TPU v6p featuring advanced specifications including multiple compute and I/O dies. The company is anticipated to become a top customer for GUC due to its rapid ramp-up in CPU development [2][10]. - The revenue from Google's 3nm server CPU is expected to contribute to GUC's revenue sooner than previously anticipated, moving from Q4 2025 to Q3 2025 [10]. Microsoft - Microsoft is working on its Maia v2 ASIC, with a target of ramping 500,000 chips in 2026. However, the project has faced delays, pushing the tape-out timeline from Q1 2025 to Q2 2025 [3][4]. - The allocation of chips has shifted, with expectations of 40-60k chips for MSFT/GUC and 400k chips for Marvell in 2026 [3]. META - META is transitioning from MTIA v2 to MTIA v3, with expectations of ramping 100-200k chips for MTIA v2 and 200-300k chips for MTIA v3 in 2026 [2]. Non-CSPs - Companies like Apple, OpenAI, and xAI are entering the ASIC server market, with many expected to tape out in 2H25 and ramp in 2H26. These companies are likely to collaborate with Broadcom for high-end ASIC specifications [7][8][9]. Financial Projections - GUC's FY25 revenue is expected to exceed previous forecasts, driven by contributions from Google and crypto projects. However, concerns remain about FY26 growth without crypto revenue, with a projected 50% YoY growth in MP revenue [10][11]. - The revenue contribution from various ASIC projects in 2026 includes significant figures such as US$16,756 million from TPU v6p and US$2,616 million from Trainium 3 [18]. Additional Insights - The competitive landscape for ASIC design services is intensifying, with Broadcom and MediaTek entering the fray alongside existing players like Marvell and GUC [4][15]. - The potential impact of geopolitical factors on HBM2E clients was discussed, highlighting the resilience of Faraday in the face of possible restrictions [14]. Conclusion - The ASIC market is poised for significant growth, driven by advancements in technology and increasing demand from both CSPs and non-CSPs. Key players are adapting their strategies to navigate challenges and capitalize on emerging opportunities in the sector [1][5][7].

Core Insights - Nvidia holds a significant share in AI training and inference markets, but competition from hyperscale computing companies developing their own XPU raises questions about sustainability [1] - Broadcom and Marvell are positioned to benefit from the demand for custom CPUs and XPUs, collaborating with major cloud providers like AWS, Google, Meta, and Microsoft [2][3] - The cost-effectiveness of these custom solutions must be significantly lower than existing offerings from Intel, AMD, Nvidia, and AMD to be viable [3] Financial Performance - Broadcom reported Q1 FY2025 sales of $14.92 billion, a 24.7% increase year-over-year, with profits reaching $5.5 billion, up 4.2 times from the previous year [5] - Marvell's Q4 FY2025 sales were $1.82 billion, a 19.9% quarter-over-quarter increase, with a net income of $200 million, marking a significant turnaround from previous losses [16] AI Revenue Growth - Broadcom's AI chip sales reached $4.12 billion in Q1 FY2025, a 77% year-over-year increase, while other semiconductor sales declined by 19.2% [11] - Marvell's AI revenue for FY2025 is projected to be around $1.85 billion, with expectations to exceed $3 billion in FY2026, driven by custom AI XPU and optical products [18][20] Market Dynamics - The IT industry is characterized by demanding clients seeking high service levels at low costs, which influences the pricing and development of custom CPUs and XPUs [3] - Broadcom's AI business is comparable in scale to Marvell's entire business, but Marvell's data center segment is rapidly growing [3][5] Future Outlook - Broadcom anticipates stable revenue of $14.9 billion for Q2 FY2025, with a projected 19.3% year-over-year growth [14] - Marvell's success in securing new hyperscale clients and developing shared AI XPU designs will be crucial for future revenue growth [20]