Guan Cha Zhe Wang

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长石资本硬科技三期基金三关7.28亿,LP结构突破“不可能三角”
Guan Cha Zhe Wang· 2025-07-18 09:24
Core Viewpoint - The current fundraising environment in the primary market is under pressure, with challenges stemming from the need to construct a stable and synergistic LP structure rather than a lack of capital supply [1] Group 1: Fundraising Environment - The fundraising difficulties are characterized by a "trilemma," where institutions must balance compliance and reinvestment requirements of state-owned LPs, stringent DPI assessments from financial institutions, and the attraction of industrial capital for deep resource binding [1] - Changshi Capital recently completed a fundraising of 728 million yuan, successfully navigating the "impossible triangle" by securing support from local governments, leading financial institutions, and market-oriented mother funds [1] Group 2: LP Composition - The LP structure includes contributions from leading industrial companies and founders in hard technology, such as Zhaoshengwei, Maiwei, and Shibu Testing, along with foundational investments from Ciyuan Capital and support from top financial institutions [1] - The involvement of Huazhong University of Science and Technology and the University of Electronic Science and Technology alumni funds reflects recognition of Changshi Capital's investment capabilities in hard technology [1] Group 3: Investment Performance - Changshi Capital's hard technology Phase I fund has invested in 24 projects, with 11 having completed IPOs, including Zhongwei Semiconductor and Suzhou Tianmai, achieving a DPI close to 2 times [2] - The Phase II fund has 4 projects in the IPO application stage, with a total IPO hit rate exceeding 50% across both funds [2] Group 4: Founders' Fund Philosophy - The Founders' Fund philosophy emphasizes the need for VC institutions to become "symbiotic" within the industrial ecosystem rather than merely acting as "hunters," fostering a collaborative network that transcends market cycles [2][3] - Changshi Capital's approach involves leveraging the insights and resources of industry-leading LPs to enhance the success rate of portfolio companies, creating a positive feedback loop within its industrial ecosystem [3] Group 5: Investment Methodology - Changshi Capital has developed a "70%/90%/100%" investment methodology, requiring 90% understanding of projects before investment, dedicating 70% of time to service, and aiming for 100% successful exits [4] - The methodology is grounded in a deep understanding of industry trends and development directions, supported by continuous engagement with key industry players and entrepreneurs [4] Group 6: Exit Strategy - The firm employs a multi-dimensional framework for determining IPO exit timing, ensuring that exits are strategically timed to avoid market downturns, with over 80% of IPO projects from the Phase I fund successfully capitalizing on favorable market conditions [5] - For projects not meeting IPO conditions, the team utilizes its industrial ecosystem network to facilitate strategic mergers and acquisitions, achieving favorable exit returns [5] Group 7: AI Investment Strategy - In the context of the AI era, Changshi Capital is focusing on three investment lines: AI infrastructure, embodied intelligence, and innovations in AI application layers and interactions [6] - The firm has already invested in several companies within the AI infrastructure space, which is considered foundational for the entire AI industry [6]
五角大楼东施效颦“中国模式”,国内先掐起来了
Guan Cha Zhe Wang· 2025-07-18 09:18
Core Viewpoint - The U.S. government, under the Trump administration, has made a significant investment in MP Materials, the largest rare earth producer in the U.S., aiming to reduce China's dominance in the global rare earth market. This move has raised concerns among industry executives about potential market disruption and unfair advantages for MP Materials [1][6]. Group 1: Investment and Government Support - The Pentagon has agreed to invest $400 million in MP Materials, becoming its largest shareholder, and has set a minimum procurement price for rare earths that is nearly double the current market price [1][5]. - The U.S. Department of Defense has established a procurement price of $110 per kilogram for two commonly used rare earths, neodymium and praseodymium, which is significantly higher than the current market price of approximately $63 [5][6]. Group 2: Industry Reactions and Concerns - Several mining executives and former government officials have expressed concerns that the government's actions favor MP Materials, potentially leading to market distortion and harming long-term competitiveness in the U.S. [1][2]. - Critics argue that the government's approach mirrors China's industrial policies, which they previously criticized, and that it unfairly selects winners and losers in the industry [1][4]. Group 3: Market Dynamics and Future Challenges - MP Materials has not yet achieved commercial-scale magnet production, but the government has committed to purchasing approximately 7,000 tons of magnets annually for the next decade, which exceeds current defense needs [5][6]. - The company relies heavily on sales to Shenghe Resources, a Chinese partner, for processing rare earths, raising questions about its ability to independently supply critical materials [7][8]. - Industry experts indicate that Western countries will require several years to develop sufficient rare earth processing capabilities, highlighting the challenges ahead in establishing a self-sufficient supply chain [8].
第五届RISC-V中国峰会隆重开幕!中国领航全球开放算力新时代
Guan Cha Zhe Wang· 2025-07-18 09:09
Core Insights - The fifth RISC-V China Summit was held in Shanghai, attracting numerous industry leaders and experts to discuss the theme of "openness, collaboration, and implementation" over two days [1] - Shanghai's Vice Mayor Chen Jie emphasized the city's significant role in the global RISC-V ecosystem and called for collaboration among domestic and international enterprises and talents to drive RISC-V technology innovation [3] - The Ministry of Industry and Information Technology's representative, Shi Huikang, highlighted three main directions for RISC-V development in China: deepening collaboration, accelerating transformation, and maintaining openness [5][6] Industry Developments - RISC-V has emerged as a crucial driver of global industrial innovation, particularly in the AI-driven era, with its open and flexible architecture [3] - Shanghai has established a complete industrial chain from chip design to application, with initiatives like the China RISC-V Industry Alliance and the Shanghai Open Processor Industry Innovation Center [3][4] - The global shipment of RISC-V-based chips is projected to exceed 10 billion units in 2024, with China contributing over 50% of this volume, particularly in high-value sectors like AI and high-performance computing [6] Future Outlook - Shanghai plans to deepen cooperation with the RISC-V International Foundation to enhance standard systems and software infrastructure, aiming to create a unified open platform for developers [4] - Shi Huikang expressed hopes for collaboration among core industry units to build a prosperous ecosystem, accelerate the application of RISC-V in high-value scenarios, and encourage participation in global RISC-V initiatives [7] - Tenstorrent's CEO Jim Keller announced plans to develop an open ecosystem centered on RISC-V architecture, aiming to lower barriers for developers and students in high-performance computing and AI [11][13] Educational Initiatives - The Shanghai Open Processor Industry Innovation Center is focusing on talent development, with plans to launch a course on RISC-V design and practice across 17 universities, attracting 900 graduate students [10] - The RISC-V Industry Alliance has organized competitions and forums to promote domestic RISC-V chip development and engage students in embedded software development [9]
推动RISC-V芯片设计革命,第五届RISC-V中国峰会EDA分论坛干货满满
Guan Cha Zhe Wang· 2025-07-18 09:09
Core Insights - The fifth RISC-V China Summit will be held from July 16 to 19, 2025, in Shanghai, featuring a main forum, nine vertical sub-forums, five workshops, and a 4,500 square meter technology exhibition area, attracting hundreds of companies, research institutions, and open-source technology communities [1] Group 1: Siemens EDA and Debugging Solutions - Siemens EDA introduced Tessent UltraSight-V, a debugging and tracing solution specifically designed for RISC-V systems, addressing inefficiencies and high costs associated with traditional debugging methods [4] - Tessent UltraSight-V offers comprehensive end-to-end debugging and tracing capabilities, supporting various communication interfaces and mainstream development environments, significantly enhancing debugging efficiency [4][5] - Key features include efficient debugging functions, advanced tracing capabilities, scalability for single-core to multi-chip designs, and integration with UVM verification environments [5] Group 2: Chipmunk Technology and Simulation Optimization - Chipmunk Technology presented the "Near Cycle Model," a SystemC-based CPU modeling technology aimed at optimizing the simulation accuracy and performance of RISC-V processors [7] - The model integrates cycle information into simulations, significantly improving accuracy and enabling precise software performance evaluations, addressing limitations of traditional RISC-V simulation tools [7][8] - The technology supports seamless integration with third-party virtual platforms, allowing users to customize and deploy simulation configurations quickly [8] Group 3: Andes Technology and Custom Instruction Development - Andes Technology showcased the ACE framework and AndesCycle simulator to accelerate the development of custom instructions for RISC-V architecture [9] - The ACE framework simplifies the design process by allowing developers to generate hardware RTL code from two design files, enhancing development efficiency [11] - The AndesCycle simulator provides detailed instruction cycle analysis, helping developers identify and optimize performance bottlenecks, with real-world applications demonstrating significant performance improvements [12]
“星际访客”新图像公布,天文学家:可能比太阳系更古老
Guan Cha Zhe Wang· 2025-07-18 08:23
Core Viewpoint - Astronomers have observed a new interstellar object, 3I/ATLAS, which is the third such "interstellar visitor" discovered to date, traveling through the solar system at high speed [1][5]. Group 1: Discovery and Characteristics - The ATLAS telescope, funded by NASA, first reported the discovery of 3I/ATLAS on July 1, 2023, initially marking it as object A11pl3Z before officially naming it [3]. - The calculated orbital eccentricity of 3I/ATLAS is 6.2, indicating it originates from outside the solar system, with a speed exceeding 60 kilometers per second as it traverses the solar system [3]. - Current observations suggest that 3I/ATLAS exhibits characteristics typical of comets, although its exact size remains undetermined, with estimates suggesting a diameter of around 20 kilometers [3]. Group 2: Scientific Implications - A research team led by Matthew Hopkins from Oxford University posits that 3I/ATLAS may be an older celestial body than those in the solar system, potentially originating from the galactic thick disk, which contains older stars [4]. - The likelihood that 3I/ATLAS is older than the solar system is estimated at two-thirds, with the possibility that it has been drifting in interstellar space for a significant period [4]. Group 3: Future Observations - As of now, 3I/ATLAS is located approximately 465 million kilometers from Earth and 600 million kilometers from the Sun, expected to reach its closest point to the Sun at about 210 million kilometers around October 30, 2023 [5]. - The interstellar object is projected to come closest to Earth in December 2023, at a distance of approximately 270 million kilometers, posing no threat to Earth [5].
新车看点 | 首批搭载华为乾崑智驾ADS 4,猛士M817开启预售
Guan Cha Zhe Wang· 2025-07-18 08:02
Core Viewpoint - The launch of the Mengshi M817 marks a significant entry into the rugged SUV market, emphasizing high intelligence and advanced technology through collaboration with Huawei, positioning it against competitors like the Land Rover Defender and Tank 700 [3][4]. Group 1: Product Features - The Mengshi M817 is priced between 329,900 and 359,900 yuan, with a robust design featuring dimensions of 5100mm in length, 1998mm in width, and 1899mm in height, along with a wheelbase of 3005mm [4]. - It is equipped with Huawei's HarmonyOS 5 and features a 10.25-inch instrument screen, a 15.6-inch central control screen, and a W-HUD head-up display, enhancing the user experience with a rich application ecosystem [6]. - The vehicle boasts a hybrid power system with a total power output of 505kW and a torque of 848N·m, achieving a comprehensive range of 1300km and a fuel consumption of 7.24L/100km [9]. Group 2: Advanced Technology - The Mengshi M817 incorporates VMC intelligent chassis control technology, allowing for coordinated control across multiple dimensions, and features adjustable air suspension and a maximum wading depth of 900mm [9][11]. - It offers nine driving modes and is equipped with advanced features such as the intelligent off-road all-terrain system, smart E-lock, and 6D IMU body posture perception technology [11]. - The vehicle's intelligent driving capabilities include Huawei ADS 4, which supports parking assistance across 500,000 parking lots and advanced navigation for various road scenarios [11].
参加《问政山东》直播后,济宁市市长连夜召开整改会议
Guan Cha Zhe Wang· 2025-07-18 07:39
Group 1: Industry Challenges - Jining's high-end manufacturing enterprises face development bottlenecks due to a weak local industrial chain, relying heavily on external collaboration for core components, leading to high costs and long cycles [3][4] - The local government acknowledges that if the local industrial chain's support reaches over 60%, companies could save over 2 million yuan annually [3] - The Jining Industrial and Information Technology Bureau plans to address gaps in the industrial chain to enhance local manufacturing capabilities [3] Group 2: Agricultural Sector Issues - Jining, a major producer of毛木耳 (hairy wood ear mushrooms), lacks deep processing enterprises, resulting in low added value and limited farmer income [4] - The local agricultural bureau recognizes the need for better planning and support for deep processing but admits that current efforts have not yielded significant results [4][5] Group 3: Transportation and Compliance - The Jining Transportation Bureau is addressing ongoing issues with illegal driving schools that do not comply with national standards, including the use of unlicensed instructors [4] - The bureau plans to enhance offline inspections, online monitoring, and the identification of illegal activities to ensure compliance [4] Group 4: Public Services and Community Feedback - Concerns have been raised about the early closing times of children's parks, which has led to public dissatisfaction [7] - The Jining City Investment Holding Group is working on a plan to extend the opening hours of children's parks during summer to better meet community needs [7]
“雪糕刺客”钟薛高:从高端狂飙到破产收场
Guan Cha Zhe Wang· 2025-07-18 07:15
Core Viewpoint - The company Zhong Xue Gao, known as the "ice cream assassin," has been filed for bankruptcy due to its inability to pay off debts and insufficient assets to cover liabilities, highlighting the risks of relying solely on marketing without sustainable business practices [1][7][10] Company Overview - Zhong Xue Gao was established in March 2018 in Shanghai, targeting the high-end ice cream market with products priced over 50 yuan, aiming to reshape the industry through unique ingredients and aggressive marketing strategies [2][3] - The brand gained notoriety for its high-priced products, such as the 66 yuan "Ecuador Pink Diamond" ice cream, which sold 20,000 units in 15 hours during the 2018 Double 11 shopping festival [2] Market Positioning and Strategy - The initial strategy of positioning itself as a premium brand led to a decline in market share as it failed to meet the actual demand of a broader consumer base [2][3] - In March 2023, Zhong Xue Gao attempted to pivot to a more affordable product line with the Sa'Saa series, priced at 3.5 yuan, but consumer reception was mixed, with many expressing skepticism about the brand's intentions [5][6] Financial Troubles - By October 2023, reports emerged of unpaid wages to employees, leading to restrictions on the company's operations and a significant decline in its business activities [7][8] - The company faced multiple legal disputes with suppliers and service providers, resulting in forced executions of debts amounting to millions [9] Bankruptcy Filing - The recent bankruptcy filing reflects the culmination of financial mismanagement and the inability to adapt to market demands, serving as a cautionary tale for other emerging brands in the consumer sector [1][10]
曹梦侠:香山系列高性能RISC-V多核处理器验证方法学创新实践
Guan Cha Zhe Wang· 2025-07-18 05:43
Core Insights - The fifth RISC-V China Summit will be held from July 16 to 19, 2025, in Shanghai, featuring a main forum, nine vertical sub-forums, five workshops, and a 4,500 square meter technology exhibition area, attracting hundreds of companies, research institutions, and open-source technology communities [1] - The presentation by the market director of Hanjian Software highlighted the challenges and innovations in verifying high-performance RISC-V multi-core processors, laying a solid foundation for the proliferation and development of RISC-V processors [3] Development Stages of Xiangshan Processors - The Xiangshan processor series has undergone three significant development phases: - Yanqi Lake (First Generation): Focused on architecture exploration and foundational technology, successfully implementing out-of-order execution architecture [3] - Nanhu (Second Generation): Achieved a performance leap, benchmarking against ARM Cortex-A76, recognized as a high-performance RISC-V processor core [3] - Kunming Lake (Third Generation): Targets data centers and high-performance computing, benchmarking against ARM Neoverse N2, supporting 64-core large-scale high-performance SoC system architecture [3] Key Technologies in Kunming Lake - Multi-core scalability: Architecture supports expansion from 64 to 256 cores to meet future technological demands [4] - High-speed interconnect bus: Utilizes new high-bandwidth, low-latency NoC technology for efficient data exchange [4] - Strong consistency memory system: Introduces large-scale multi-level cache and directory-based cache coherence protocols to ensure system stability [4] Challenges in Multi-core CPU Verification - The verification process faces three key challenges: - Large scale: Multi-core systems involve complex buses, multi-level caches, and peripheral interfaces, requiring FPGA resources far exceeding traditional platforms [4] - High performance requirements: Aiming for a target operating speed of 10 MHz on FPGA to support OS operation and hardware-software co-verification [4] - Debugging difficulties: Ensuring cache coherence, bus integrity, and scheduling optimization poses significant debugging challenges, with deep-rooted bugs in cross-core interactions being hard to locate [4] Verification Methodology - A systematic four-step verification methodology was proposed: - Design porting and adaptation: Automating the adaptation from ASIC to FPGA, including clock tree, storage model, and interface IP conversion [5] - Compilation and resource optimization: Balancing resource usage and efficient compilation in large-scale designs [6] - Progressive bring-up strategy: Gradually expanding from single-core to multi-core systems to reduce debugging complexity [6] - Hardware-software co-debugging technology: Utilizing hardware emulation and backdoor loading techniques for rapid fault localization and kernel loading speed breakthroughs [6] Future Directions - The Xiangshan team aims to deepen verification efficiency, explore larger-scale device cascading, and encourage EDA vendors to develop more features supporting multi-core system verification, such as low-power verification and dynamic power analysis [6][7] - The development of Xiangshan processors signifies significant progress in China's high-performance RISC-V processor field, providing replicable and scalable standardized verification methods for the industry [7]
徐易难:SVM——基于硬件的高效RISC-V处理器验证方法
Guan Cha Zhe Wang· 2025-07-18 05:38
第五届RISC-V中国峰会于2025年7月16至19日在上海张江科学会堂隆重举办,本届峰会设置1场主论 坛、9场垂直领域分论坛、5场研习会、11项同期活动,以及4,500平方米未来科技展览区,汇聚数百家 企业、研究机构及开源技术社区参会。 在7月18日的EDA分论坛上,中国科学院计算技术研究所特别研究助理,北京开源芯片9研究院特别研 究助理徐易难带来了主题为"SVM:可用综合方法实现RISC-V处理器的高效验证"的演讲。 随着芯片设计日益复杂,处理器验证成为了芯片开发中的瓶颈问题。徐易难详细阐述了处理器验证的现 状、挑战和创新方法,提出SVM作为一种高效的硬件验证方法,能够大幅提升RISC-V处理器验证的效 率。 REF电路代码实现:现有的参考模型(REF)通常以软件模拟器的形式存在,设计简单且可靠,但缺乏 高效的硬件实现方式。如何将现有的软件REF高效地迁移到硬件中,是SVM面临的首要问题。 硬件REF执行效率:由于DUT设计复杂且微结构丰富,而REF则需要设计得简单以保证功能可靠,因此 如何提升硬件REF的执行效率,成为SVM的一大挑战。 调试和可追溯性问题:硬件环境缺乏对传统软件调试工具的支持(如断言、 ...