Group 1 - The core viewpoint of the article highlights a decline in the ChiNext 50 index, which has dropped by 2.01% over a 30-day period [1] - Among the constituent stocks, Lanke Technology experienced the largest decline at 8.92% [1] - Longxin Zhongke and Zhongkong Technology also saw significant drops of 4.80% and 4.78% respectively [1] - Baiwei Storage recorded a decrease of 3.79% [1]

Market Overview - The A-share market opened lower with the Shanghai Composite Index down 0.08%, the Shenzhen Component down 0.39%, and the ChiNext Index down 0.80% [3][4] - The Hong Kong market also opened lower, with the Hang Seng Index down 0.14% and the Hang Seng Tech Index down 0.87% [5][6] Sector Performance - The storage chip sector experienced significant declines, with companies like Deep Kangjia A hitting the daily limit down, and others such as Puran, Lanke Technology, Baiwei Storage, and Shannon Chip also opening lower [2] - The AI computing power industry chain saw a downturn, particularly in the storage and CPO sectors, while semiconductor and consumer electronics themes were among the hardest hit [4] - Conversely, gold, basic metals, and oil and gas sectors showed signs of rebound [4]

Group 1 - Northern Huachuang is a leading domestic semiconductor equipment manufacturer, covering core process equipment such as etching machines, thin film deposition equipment, and cleaning machines, which are essential for memory chip manufacturing [1] - The company is expected to benefit from the growth in equipment orders driven by the expansion and technological upgrades of domestic memory manufacturers during the memory chip price increase cycle [1] - Northern Huachuang has made breakthroughs in advanced process equipment for 3D NAND and HBM, establishing a core competitive advantage in the global memory equipment market [1] Group 2 - Hua Hong Semiconductor is a leading domestic specialty process manufacturer with mature memory chip foundry capabilities, focusing on NOR Flash, eMMC, and SPI NAND [2] - The company is expected to benefit from the rising demand for memory chip foundry services as domestic memory manufacturers expand production [2] - Hua Hong's layout in automotive-grade memory chip foundry will further enhance its resilience against economic cycles [2] Group 3 - Zhongwei Company is a core supplier of etching equipment, with its 5nm etching machine already integrated into the supply chain of memory manufacturers [3] - The demand for high-end equipment is expected to grow due to the trend of upgrading memory chips to advanced processes like 3D NAND and HBM [3] - Zhongwei's layout in thin film deposition equipment enhances its service capabilities for memory manufacturers [3] Group 4 - Lanke Technology is a global leader in memory interface chips, with its products widely used in servers and PCs, holding a leading share in the DDR5 interface chip market [4] - The demand for DDR5 interface chips is expected to surge due to the explosion in AI server and high-end PC demand during the memory chip price increase cycle [4] - Lanke's breakthroughs in HBM interface chips will further open up growth opportunities [4] Group 5 - GigaDevice is a leading domestic memory chip design company, focusing on NOR Flash while also expanding into NAND Flash and DRAM [5] - The company is expected to benefit from the price increase of NOR Flash products driven by the recovery of consumer electronics and AI terminal demand [5] - GigaDevice's layout in automotive-grade memory chips will further expand its downstream application space [5] Group 6 - Shengyi Technology is a leading domestic copper-clad laminate manufacturer, with its products being core raw materials for memory chip packaging [6][7] - The growth in demand for copper-clad laminates is expected to be driven by the expansion of memory manufacturers and the increase in packaging needs during the memory chip price increase cycle [6][7] - Shengyi's breakthroughs in high-frequency and high-speed copper-clad laminates will adapt to the upgrade demands of memory chips [6][7] Group 7 - Shenzhen South Circuit is a leading domestic PCB manufacturer, with its high-end PCB products being core carriers for storage servers and modules [8] - The demand for high-end PCBs is expected to grow due to the explosion in AI server demand and the expansion of memory manufacturers during the memory chip price increase cycle [8] - Shenzhen South Circuit's layout in storage packaging substrates further enhances its position in the memory industry chain [8] Group 8 - Jiangbolong is a leading domestic storage module manufacturer, focusing on the development and manufacturing of storage modules for various applications [9] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [9] - Jiangbolong's layout in automotive-grade storage modules will further open up downstream application spaces [9] Group 9 - Xi'an Yicai is a core enterprise in semiconductor materials, focusing on silicon-based materials essential for memory chip manufacturing [10] - The demand for silicon-based materials is expected to grow due to the expansion and technological upgrades of memory manufacturers during the memory chip price increase cycle [10] - Xi'an Yicai's breakthroughs in 300mm large silicon wafers will adapt to the advanced process needs of domestic storage [10] Group 10 - Tuojing Technology is a leading domestic thin film deposition equipment manufacturer, with its PECVD and ALD equipment being core process equipment for memory chip manufacturing [11] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the upgrade of 3D NAND technology during the memory chip price increase cycle [11] - Tuojing's layout in HBM-related equipment will further adapt to the upgrade demands driven by AI [11] Group 11 - Maiwei Co. is a core domestic semiconductor equipment enterprise, with its equipment already integrated into the supply chain of leading domestic memory manufacturers [12] - The growth in equipment orders is expected to be driven by the expansion of memory manufacturers and the increase in advanced packaging demand during the memory chip price increase cycle [12] - Maiwei's breakthroughs in HBM packaging equipment will adapt to the upgrade demands driven by AI [12] Group 12 - Shengmei Shanghai is a leading domestic semiconductor cleaning equipment manufacturer, with its single-wafer cleaning equipment integrated into the supply chain of leading memory manufacturers [13] - The demand for cleaning equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [13] - Shengmei's breakthroughs in 3D NAND cleaning technology will adapt to the technical iteration needs of memory chips [13] Group 13 - Changdian Technology is a leading domestic packaging and testing enterprise, covering the packaging and testing of various memory chip types [14] - The growth in packaging orders is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [14] - Changdian's breakthroughs in advanced packaging will adapt to the needs of high-end memory chips [14] Group 14 - Changchuan Technology is a leading domestic semiconductor testing equipment manufacturer, with its testing equipment covering memory and logic chips [15] - The demand for testing equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [15] - Changchuan's breakthroughs in DDR5 and HBM testing technologies will adapt to the upgrade demands driven by AI [15] Group 15 - Baiwei Storage is a leading domestic storage chip design and module manufacturer, focusing on various storage modules for different applications [16] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [16] - Baiwei's layout in automotive-grade storage will further open up downstream application spaces [16] Group 16 - China Resources Microelectronics is a leading domestic power semiconductor and storage chip manufacturer, focusing on NOR Flash and eMMC [17] - The company is expected to benefit from the recovery in consumer electronics and industrial control demand during the memory chip price increase cycle [17] - China Resources' layout in automotive-grade storage chips will enhance its resilience against economic cycles [17] Group 17 - Tongfu Microelectronics is a core domestic packaging enterprise, covering the packaging of various memory chip types [18] - The growth in packaging orders is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [18] - Tongfu's breakthroughs in advanced packaging will adapt to the needs of high-end memory chips [18] Group 18 - Yitang Co. is a core domestic semiconductor equipment enterprise, focusing on thin film deposition and rapid thermal processing equipment [19] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [19] - Yitang's breakthroughs in 3D NAND-related equipment will adapt to the technical iteration needs of memory chips [19] Group 19 - Jingsheng Mechanical and Electrical is a leading domestic semiconductor silicon wafer equipment manufacturer, with its equipment integrated into the supply chain of leading memory manufacturers [20] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the increase in silicon wafer demand during the memory chip price increase cycle [20] - Jingsheng's breakthroughs in 300mm large silicon wafer equipment will adapt to the advanced process needs of domestic storage [20] Group 20 - Xichuang Data is a leading domestic storage module and smart terminal manufacturer, focusing on various storage modules for different applications [21] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [21] - Xichuang's layout in automotive-grade storage will further open up downstream application spaces [21] Group 21 - Shannon Chip is a leading domestic storage chip distribution and solution provider, focusing on distribution and technical services for storage chips [22] - The growth in distribution revenue is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [22] - Shannon's layout in storage module solutions will enhance customer stickiness [22] Group 22 - Hushi Silicon Industry is a leading domestic semiconductor silicon wafer manufacturer, covering various specifications essential for memory chip manufacturing [23] - The demand for silicon wafers is expected to grow due to the expansion and technological upgrades of memory manufacturers during the memory chip price increase cycle [23] - Hushi's breakthroughs in 300mm large silicon wafers will adapt to the advanced process needs of domestic storage [23] Group 23 - Unisoc is a leading domestic security chip and storage chip manufacturer, focusing on eMMC and UFS [24] - The company is expected to benefit from the recovery in consumer electronics and the growth in security storage demand during the memory chip price increase cycle [24] - Unisoc's layout in automotive-grade storage chips will enhance its resilience against economic cycles [24] Group 24 - Fudan Microelectronics is a leading domestic FPGA and storage chip manufacturer, covering various storage chip types [25] - The growth in demand for storage products is expected to be driven by the increase in industrial control demand and the acceleration of domestic substitution during the memory chip price increase cycle [25] - Fudan's layout in automotive-grade storage chips will further open up downstream application spaces [25] Group 25 - Zhongke Feicai is a leading domestic semiconductor testing equipment manufacturer, covering testing equipment for memory and logic chips [26] - The demand for testing equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [26] - Zhongke's breakthroughs in 3D NAND testing technology will adapt to the technical iteration needs of memory chips [26] Group 26 - Huahai Qingke is a leading domestic chemical mechanical polishing (CMP) equipment manufacturer, with its CMP equipment integrated into the supply chain of leading memory manufacturers [27] - The demand for CMP equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [27] - Huahai's breakthroughs in 3D NAND polishing technology will adapt to the technical iteration needs of memory chips [27]

格隆汇2月3日丨澜起科技(688008.SH)公布，截至2026年1月31日，公司已通过集中竞价交易方式累计回 购公司A股股份166.20万股，占公司总股本的比例为0.14%，购买的最高价为147.88元/股，最低价为 115.00元/股，支付的金额总额约为人民币22,023.74万元（不含佣金、过户费等交易费用）。 ...

格隆汇2月3日丨澜起科技(688008.SH)公布，截至2026年1月31日，公司已通过集中竞价交易方式累计回 购公司A股股份166.20万股，占公司总股本的比例为0.14%，购买的最高价为147.88元/股，最低价为 115.00元/股，支付的金额总额约为人民币22,023.74万元（不含佣金、过户费等交易费用）。 ...

注：以上指公司 2025 年第二次回购股份方案（公告编号：2025-037）的回购进展。 公司 2025 年第一次回购股份方案于 2025 年 9 月 19 日实施完毕，共计回购公司股份 233.90 万股，回购资金总额约为 20,048.60 万元（不含佣金、过户费等交易费用）。具体内容详见 公司于 2025 年 9 月 20 日在上海证券交易所网站（www.sse.com.cn）披露的《关于 2025 年第一次回购 A 股股份方案回购实施结果的公告》（公告编号：2025-053）。 证券代码：688008 证券简称：澜起科技 公告编号：2026-008 澜起科技股份有限公司 关于 2025 年第二次回购 A 股股份方案 回购股份进展的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2025/6/21 | | | | | | --- | --- | --- | --- | --- | --- | | 回购方案实施期限 | 2025 年 7 月 8 7 | 日~2026 | 年 ...

Core Viewpoint - The data indicates significant outflows of capital from various stocks, with notable amounts leaving the communication equipment and precious metals sectors [1][2][3] Group 1: Stock Performance and Capital Outflow - Zhongji Xuchuang experienced a capital outflow of 1.647 billion, with a slight increase in stock price of 0.37% [2] - Xinyi Sheng saw a capital outflow of 1.169 billion, with a decline in stock price of 1.7% [2] - BlueFocus Media had a capital outflow of 1.067 billion, with a stock price increase of 2.48% [2] - Industrial Fulian faced a capital outflow of 1.022 billion, with a decrease in stock price of 0.32% [2] - Zijin Mining reported a capital outflow of 0.844 billion, with a stock price increase of 3.88% [2] - Western Materials had a capital outflow of 0.747 billion, with a notable stock price increase of 7.73% [2] Group 2: Sector Analysis - The communication equipment sector is facing significant capital outflows, with Zhongji Xuchuang and Xinyi Sheng leading the outflows [1][2] - The precious metals sector, including companies like Shandong Gold and Zijin Mining, is also experiencing notable capital outflows [1][3] - The automotive sector, represented by BYD, has a capital outflow of 0.396 billion, with a slight decrease in stock price of 0.25% [3]

Group 1 - The semiconductor leading ETF, 工银 (159665), opened with a gain of 1.46%, priced at 2.010 yuan [1] - Key holdings in the ETF include 中芯国际 (up 1.39%), 海光信息 (up 1.94%), 寒武纪 (up 1.05%), 北方华创 (up 1.05%), 兆易创新 (up 3.75%), 中微公司 (up 2.41%), 澜起科技 (up 3.86%), 豪威集团 (up 1.49%), 拓荆科技 (up 2.02%), and 长电科技 (up 2.40%) [1] - The ETF's performance benchmark is the 国证半导体芯片指数收益率, managed by 工银瑞信基金管理有限公司, with a return of 97.89% since its inception on December 22, 2022, and a return of 10.68% over the past month [1]

Group 1 - The company, Lanqi Technology, plans to set the upper limit of its IPO price range, with a maximum offering price of HKD 106.89, aiming to raise up to HKD 7.04 billion [1] - The IPO will take place from January 30 to February 4, with 65.89 million H-shares being issued, 10% for public offering in Hong Kong and the remainder for international placement, along with a maximum of 15% over-allotment option [1] - Lanqi Technology is a leading fabless integrated circuit design company, focusing on innovative, reliable, and high-efficiency interconnect solutions for cloud computing and AI infrastructure, projected to be the largest memory interconnect chip supplier globally by revenue in 2024, with a market share of 36.8% [1] Group 2 - The company offers a full range of memory interface chips from DDR2 to DDR5, including supporting chips such as SPD, temperature sensors, and power management ICs, with its DDR5 memory interface chips being critical for stable data transmission between CPUs and DRAM modules in servers [2] - New interconnect chips launched by the company aim to enhance the reliability and efficiency of data transmission in AI servers and personal computers [2] - The company has two main product lines: interconnect chips and Zindai products, with interconnect chips including memory interface chips, supporting chips, PCIe/CXL interconnect chips, and clock chips [2]

Core Viewpoint - The company, Lianqi Technology, plans to price its IPO at the upper limit of the offering range, aiming to raise up to HKD 7.04 billion through the issuance of 65.89 million H-shares, with a maximum offer price of HKD 106.89 per share [1] Group 1: Company Overview - Lianqi Technology is a leading fabless integrated circuit design company focused on providing innovative, reliable, and high-efficiency interconnect solutions for cloud computing and AI infrastructure [1] - According to Frost & Sullivan, Lianqi Technology is projected to be the largest supplier of memory interconnect chips globally by 2024, holding a market share of 36.8% based on revenue [1] Group 2: Product Offerings - The company offers a full range of memory interface chips from DDR2 to DDR5, including supporting chips such as SPD (Serial Presence Detect), TS (Temperature Sensor), and PMIC (Power Management Integrated Circuit) [2] - Lianqi Technology's DDR5 memory interface chips serve as critical interconnect components between CPUs and DRAM modules in servers, enabling stable transmission of high-speed data [2] - The newly launched interconnect chips, including MRCD/MDB, CKD (Clock Driver), PCIe Retimer, and CXL MXC (Memory Expansion Controller), aim to enhance the reliability and efficiency of data transmission in AI servers and personal computers [2]