关于股份回购进展暨2025年半年度权益分派实施后调 整回购股份价格上限的公告 证券代码：688183 证券简称：生益电子 公告编号：2025-056 生益电子股份有限公司 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2025/4/19 | | | | | | | --- | --- | --- | --- | --- | --- | --- | | 回购方案实施期限 | 年 月 2025 5 12 4 | 日~2026 | 年 | 月 | 17 | 日 | | 预计回购金额 | 5,000万元~10,000万元 | | | | | | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 □用于转换公司可转债 | | | | | | | | □为维护公司价值及股东权益 | | | | | | | 累计已回购股数 | 0万股 | | | | | | | 累计已回购股数占总股本比例 | 0% | | | | | | | 累计已回购金额 | 0万元 | | | | | | | ...

Core Viewpoint - The company has adjusted its share repurchase plan due to the impact of the 2025 interim dividend distribution, lowering the maximum repurchase price from 42.77 yuan to 42.47 yuan per share [1] Summary by Relevant Sections - **Share Repurchase Plan** The company initially planned to repurchase shares worth between 50 million to 100 million yuan for implementing equity incentives or employee stock ownership plans [1] The maximum repurchase price was set at 42.77 yuan per share, which has now been revised to 42.47 yuan per share [1] - **Dividend Distribution Impact** The adjustment in the repurchase price is based on the cash dividend distribution plan approved at the 2025 first extraordinary general meeting, which involves a cash dividend of 3 yuan (including tax) for every 10 shares [1] - **Implementation Status** As of September 30, 2025, the company has not yet executed the share repurchase and will proceed based on market conditions [1]

Core Insights - The HDI board market is experiencing significant growth driven by global digital transformation and the trend towards electric and intelligent vehicles. China, as a major manufacturing and consumption market, is seeing rapid development in the HDI board industry, with a projected market size of 45.568 billion yuan in 2024, reflecting a year-on-year increase of 16.5% [1][6]. - The market is expected to continue expanding, reaching 50.908 billion yuan by 2025, with an 11.7% year-on-year growth [1][6]. Industry Overview - HDI boards, or High-Density Interconnect boards, utilize micro-blind buried hole technology and lamination processes to enhance circuit density, catering to the miniaturization and high-speed signal transmission needs of electronic products. They are primarily used in mobile phone motherboards, digital devices, and automotive electronics [3][4]. - The HDI board industry can be categorized into three types based on lamination complexity: low-end HDI (single lamination), high-end HDI (two or more laminations), and any-layer HDI (most complex) [3]. Market Size and Growth - The global HDI board market is projected to reach 12.8 billion USD in 2024, with a year-on-year increase of 15.3%, and is expected to grow to approximately 14.3 billion USD by 2025 [5][6]. Competitive Landscape - The HDI board industry is dominated by overseas and Taiwanese manufacturers, while mainland Chinese companies are rapidly catching up. Key players in mainland China include companies like Fangzheng Technology, Bomin Electronics, and Shenghong Technology, which are increasing their R&D investments and expanding high-end production capacities [7][8]. Development Trends - The HDI board market is shifting towards higher-end products, driven by the demand for advanced mobile devices and the adoption of AnyLayer HDI motherboards in Android smartphones. The trend indicates a growing need for high-layer HDI boards as high-end smartphone sales increase [9]. - The application fields for HDI boards are expanding, particularly in the rising electric vehicle sector, which requires stable and reliable circuit connections for various systems [10]. Additionally, the medical device sector is also a growing market for HDI boards due to the demand for miniaturized and intelligent devices [11]. - Environmental considerations are leading to a trend towards green manufacturing practices in the HDI board industry, with a focus on reducing harmful substances and optimizing production processes [12].

Core Viewpoint - The recent financing and expansion plans of major PCB companies are primarily driven by the increasing demand for AI technologies and high-end PCB products, indicating a significant shift in the industry towards advanced manufacturing capabilities [1][3][6]. Group 1: Company Expansion Plans - Huadian Co. disclosed a new project for high-end printed circuit boards (PCBs) with an investment of 4.3 billion yuan, which began construction in June 2023 and is expected to start trial production in the second half of 2026 [1]. - Shenghong Technology completed a fundraising round of 1.9 billion yuan, with allocations of 850 million yuan for an AI HDI project in Vietnam and 500 million yuan for a high-layer PCB project in Thailand [1]. - Eight PCB manufacturers have announced new financing and expansion plans since July 25, focusing on enhancing their capabilities in HDI, HLC, and SLP products [1][2]. Group 2: Market Demand and Trends - The demand for high-density and high-layer PCBs is expected to grow significantly due to advancements in AI, satellite communications, and automotive electronics, with the HDI market projected to reach 17.037 billion USD by 2029, reflecting a compound annual growth rate of 6.4% [6]. - The complexity of PCB production processes is increasing, necessitating higher precision and efficiency in manufacturing equipment, particularly in plating and drilling stages [6][7]. - The shift towards high-end PCB products is driving upgrades in core materials such as copper foil, electronic cloth, and resin, which are essential for meeting the demands of high-speed signal transmission [7]. Group 3: Investment Opportunities - The expansion of PCB production is anticipated to create a favorable cycle for the industry, benefiting upstream material and equipment companies as demand for high-end PCBs rises [7]. - The global market for PCB-specific equipment is expected to reach 10.765 billion USD by 2029, with a compound annual growth rate of 8.7% from 2024 to 2029 [6].

Market Overview - On September 30, the component sector declined by 1.03%, with Shengyi Electronics leading the drop [1] - The Shanghai Composite Index closed at 3882.78, up 0.52%, while the Shenzhen Component Index closed at 13526.51, up 0.35% [1] Stock Performance - Notable gainers in the component sector included: - Zhongfu Circuit (300814) with a closing price of 53.41, up 11.36% and a trading volume of 187,900 shares, totaling 976 million yuan [1] - Fangzheng Technology (600601) closed at 11.36, up 8.92% with a trading volume of 5,150,500 shares, totaling 5.632 billion yuan [1] - Fangbang Co., Ltd. (688020) closed at 68.50, up 6.78% with a trading volume of 51,300 shares, totaling 34.6 million yuan [1] - Major decliners included: - Shengyi Electronics (688183) closed at 78.50, down 3.37% with a trading volume of 196,900 shares, totaling 1.557 billion yuan [2] - Yuandiwei (832491) closed at 34.27, down 2.78% with a trading volume of 74,100 shares, totaling 256 million yuan [2] - Dongshan Precision (002384) closed at 71.50, down 2.58% with a trading volume of 523,100 shares, totaling 376.8 million yuan [2] Capital Flow - The component sector experienced a net outflow of 1.335 billion yuan from institutional investors, while retail investors saw a net inflow of 1.108 billion yuan [2][3] - Notable net inflows from retail investors included: - Fangzheng Technology (600601) with a net inflow of 668.9 million yuan [3] - Zhongfu Circuit (300814) with a net inflow of 181 million yuan [3] - Conversely, significant net outflows from institutional investors were observed in: - Nanya New Materials (688519) with a net outflow of 572 million yuan [3] - Yibotech (301366) with a net outflow of 1.640 million yuan [3]

Investment Highlights - PCB technology is evolving in materials, processes, and architecture, driving continuous value growth. The demand from AI servers, high-speed communication, and automotive electronics is pushing PCB technology upgrades across these three dimensions [2][3][9] - The upstream high-end materials are in short supply, and cost increases are being passed down to downstream PCB manufacturers. The core materials for copper-clad laminates (CCL) include copper foil, resin, and fiberglass cloth, with cost shares of 39%, 26%, and 18% respectively [4][6][46] - The PCB market is on an upward cycle, driven by AI, with both volume and price increasing across various sectors. The global PCB market is expected to reach $94.7 billion by 2029, with a CAGR of 5.2% from 2024 to 2029 [7][8] PCB Technology Evolution - The evolution of PCB technology is driven by high line density and electrical performance. PCBs serve as critical interconnects in electronic products, supporting various components and providing electrical connections [10][11] - The PCB production technology is continuously updated in materials, processes, and architecture, with significant advancements in high-density interconnects and high-performance materials [18][19][20] Upstream Materials - The core materials for CCL are copper foil, resin, and fiberglass cloth, which significantly influence signal transmission speed and loss. The CCL accounts for 40% of the total PCB cost [39][46] - The global CCL industry is highly concentrated, with a CR10 of 77% in 2024, indicating a strong oligopoly in the market [41] - The demand for high-end HVLP copper foil and ultra-thin copper foil is surging, with Japanese and Taiwanese manufacturers dominating the high-end market [60][62][63] Market Dynamics - The PCB industry is experiencing a shift towards Southeast Asia, with China's share of the global PCB market expected to be around 50% by 2029. The industry has matured, with significant competition and a fragmented market [17] - The demand for special fiberglass cloth is increasing due to AI and high-speed communication, leading to upgrades in low-dielectric and quartz cloth [66][70] Future Outlook - The PCB market is expected to benefit from the ongoing technological advancements and increasing demand from AI and high-speed communication sectors. The integration of advanced packaging technologies like CoWoP and embedded power chips is anticipated to further enhance PCB value [23][32][34]

记者丨杨期鑫 实习生钟宸 编辑丨李振 PCB（印制电路板），是现代电子产品的核心组件，PCB与芯片、面板并称电子信息产业三大 元器件，主要作用是实现电子元器件之间的相互连接，实现信号传输，因此也被称为"电子产 品之母"。 Prismark数据显示，2024年全球PCB市场产值为735.65亿美元，同比增长5.8%；而中国以 412.13亿美元的产值领跑全球，同比增速高达9.0%。 数据来源：Prismark 制图：杨期鑫 而在这场产业竞逐中，城市间的角力尤为激烈—— 作为中国PCB产业核心区域，广东PCB产 能占全国约60%，拥有超万亿市值的上市企业集群，以及深圳、惠州、东莞等城市形成的城 市集群；与此同时，中西部城市如江西信丰、安徽广德正借势产业转移东风强势崛起 。 广东P C B板块市值已超万亿 从一开始的一穷二白到如今全球最大的PCB生产国，中国PCB产业发展并非一帆风顺。 1936年，奥地利人保罗·爱斯勒（Paul Eisler）发明了世界上第一块PCB，并于50年代初开始 大规模应用。 但是由于西方的技术封锁，直到1956年，中国第一块PCB在北京一间简陋的实验室内诞生。 上世纪60—70年代，中国 ...

（文章来源：每日经济新闻） 每经AI快讯，9月25日，电路板指数盘中跌幅扩大至2.01%，成分股普遍走弱。东山精密跌6.24%、胜宏 科技跌6.12%、景旺电子跌5.86%、英诺激光跌5.03%、生益电子跌4.27%跌幅居前。 ...

A股复盘 | 炒股当如小登 / 2025.09.24 "924"行情一周年，A股取得了瞩目的成绩，放过去我想都不敢想！沪指累计涨超40%，深成指累计涨超65%，创业板指累计涨超108%， 科创50累计涨126.5%。这是小登的时代。 | | "小登股"代表个股 | | | "老登股"代表个股 | | | --- | --- | --- | --- | --- | --- | | 证券代码 | 证券名称 | 年涨幅(%) | 证券代码 | 证券名称 | 年涨幅(%) | | 688521.SH | 芯原股份 | 292.90 | 603288.SH | 海天味业 | -12.68 | | 688183 SH | 生益电子 | 131.45 | 000858.SZ | 五根液 | -8.68 | | 688256.SH | 寒武纪-U | 105.22 | 601628.SH | 中国人寿 | -8.44 | | 688506.SH | 百利天恒 | 90.64 | 000651.SZ | 格力电器 | -6.96 | | 688008.SH | 澜起科技 | 86.96 | 600690.SH | 海尔智家 | ...

Group 1 - The CPO and PCB sectors, which are part of the computing hardware industry, experienced a decline in stock prices [1] - Guangku Technology saw a drop of over 10% in its stock price [1] - Jingwang Electronics approached the limit down, indicating significant selling pressure [1] Group 2 - Tianfu Communication's stock fell by over 6% [1] - Shenghong Technology and Simi Electronics both experienced declines of over 5% [1] - Multiple stocks, including Zhongji Xuchuang and Xinyi Sheng, dropped by over 4% [1]