证券代码：688249 证券简称：晶合集成 公告编号：2024-048 合肥晶合集成电路股份有限公司 2024年半年度募集资金存放与实际使用情况的 专项报告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、募集资金基本情况 （一）实际募集资金金额、资金到账时间 经中国证券监督管理委员会于 2022 年 5 月 9 日出具的《关于同意合肥晶合 集成电路股份有限公司首次公开发行股票注册的批复》（证监许可〔2022〕954 号） 同意，合肥晶合集成电路股份有限公司（以下简称"公司"）首次向社会公开发 行人民币普通股（A 股）501,533,789 股。公司每股发行价格 19.86 元，募集资金 总额为 9,960,461,049.54 元，扣除发行费用 236,944,589.63 元后，募集资金净额 为 9,723,516,459.91 元。 容诚会计师事务所（特殊普通合伙）对公司本次公开发行的资金到位情况进 行了审验，并于 2023 年 4 月 26 日出具了《验资报告》（容诚验字[2023]230Z0099 号）。 （ ...

证券代码：688249 证券简称：晶合集成 公告编号：2024-047 合肥晶合集成电路股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2023/12/25 | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | | 回购方案实施期限 | 2024 年 3 月 日~2025 年 | 15 | 月 | 14 | 日 | 3 | | | 预计回购金额 | 元~1,000,000,000 500,000,000 | | | | | | 元 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 □用于转换公司可转债 | | | | | | | | | □为维护公司价值及股东权益 | | | | | | | | 累计已回购股数 | 股 54,771,427 | | | | | | | | 累计已回购股数占总股本比例 | 2.73% | | | | | ...

Group 1: Financial Performance - The company expects to achieve a revenue of 450,000.00 million yuan in the first half of the year, representing a year-on-year growth of 44.80% to 51.53% [2] - The net profit attributable to shareholders is projected to be between 15,000.00 million yuan and 22,000.00 million yuan, with a year-on-year increase of 443.96% to 604.47% [2] - Key growth drivers include maintaining full capacity utilization, an increase in the proportion of main business revenue from products, and steady progress in R&D for new products [2] Group 2: Product Development - The company has successfully entered mass production of BSI products, which have become the second major product line [2] - The development of 40nm high-voltage products is progressing steadily, with expectations for continued full capacity in the third quarter [2] - The company has produced its first semiconductor photomask and plans to commence mass production in the fourth quarter of this year [3] Group 3: Market Strategy - The company is gradually introducing products into the aftermarket, with some already in the market [3] - There is a commitment to maximize the use of domestic equipment and materials while ensuring operational needs are met, promoting domestic supply chain substitution [4]

Investment Rating - The investment rating for the company is "Buy" with a previous rating of "Buy" as well [1] Core Views - The company is expected to report a median revenue of 4.4 billion RMB for H1 2024, representing a year-over-year increase of 48%. The net profit attributable to the parent company is forecasted to be 0.93 billion RMB, indicating a turnaround from losses [3][4] - The company has maintained full capacity utilization in Q2 2024, with a utilization rate of 110%, and this high demand is expected to reflect positively in the second half of the year [3][4] - The OLED platform is progressing steadily, and the company is actively expanding its CIS production capacity [4] Summary by Sections Revenue and Profitability - The company forecasts H1 2024 revenue between 4.3 billion and 4.5 billion RMB, with a median of 4.4 billion RMB, showing a year-over-year growth of 48%. The net profit is expected to be between 0.75 billion and 1.10 billion RMB, with a median of approximately 0.93 billion RMB, indicating a return to profitability [4][5] - For Q2 2024, the revenue is projected at 2.172 billion RMB, reflecting a quarter-over-quarter decrease of 3% but a year-over-year increase of 16% [4] Capacity and Production - The company has been operating at full capacity from March to June 2024, with a utilization rate of 110%. Orders have exceeded production capacity, and prices for some products have been adjusted upwards [4][5] - The company anticipates maintaining full capacity in Q3 2024, with production expected to reflect in Q3 and Q4 results due to the typical 2-3 month lead time from wafer production to delivery [4] Product Development - The company has achieved small-scale production of its 40nm high-voltage OLED process, and the 28nm OLED process is under steady development. The automotive-grade DDIC has also begun gradual production [4] - The CIS segment has become the company's second-largest product line, with full capacity in mid-to-high-end CIS production in H1 2024. The company plans to increase its 12-inch capacity by 30,000 to 50,000 wafers per month in 2024 [4][5] Valuation - The estimated EPS for 2024, 2025, and 2026 is projected to be 0.37 RMB, 0.59 RMB, and 0.73 RMB respectively. As of July 15, 2024, the company's market capitalization is approximately 30.2 billion RMB, corresponding to PE ratios of 40.7, 25.7, and 20.6 for the respective years [4][5]

Financial Performance Expectations - The company expects to achieve operating revenue of between 430 million to 450 million CNY for the first half of 2024, representing a year-on-year increase of 44.80% to 51.53%[2]. - The projected net profit attributable to the parent company for the first half of 2024 is between 150 million to 220 million CNY, reflecting a significant year-on-year growth of 443.96% to 604.47%[2]. - The net profit attributable to the parent company after deducting non-recurring gains and losses is expected to be between 75 million to 110 million CNY, indicating a year-on-year increase of 151.30% to 175.24%[2]. Operational Capacity and Product Development - The company has maintained full capacity utilization since March 2024, leading to rapid growth in overall sales and steady improvement in operating revenue and product gross margin[5]. - The company continues to enhance its product structure in the wafer foundry sector, with CIS becoming the second major product line, while DDIC maintains its competitive advantage[5]. - The company has increased its R&D investment, with 55nm mid-to-high-end single-chip and stacked CIS chip technology platforms already in mass production[5]. - The 40nm high-voltage OLED chip technology platform has achieved small-scale production, and the 28nm chip technology platform is progressing steadily[5]. - Some DDIC chips have been applied in the automotive sector, aligning with the demands of the automotive supply chain[5]. Financial Data and Investment Risks - The financial data in the performance forecast has not been audited by a registered accountant and is based on preliminary calculations by the company's finance department[6]. - Investors are advised to pay attention to investment risks as the forecast data is preliminary and the final financial data will be disclosed in the official half-year report[7].

证券简称：晶合集成 证券代码：688249 合肥晶合集成电路股份有限公司 投资者关系活动记录表 编号：2024-006 ☑特定对象调研 □分析师会议 投资者关系活动类 □媒体采访 □业绩说明会 别 □新闻发布会 □路演活动 □现场参观 □电话会议 □其他 （请文字说明其他活动内容） 参与单位名称及人 共36家机构，参会机构名单详见附表。 员姓名 会议时间 2024年7 月2日-2024年7月3日 会议地点 公司会议室 朱才伟 董事、董事会秘书、财务负责人、副总经理 上市公司接待人员 黎翠绫 企业规划协理室协理 姓名 黄凯全 企业规划室部经理 曹宗野 证券事务代表 问题 1、公司目前的产品结构如何？未来计划如何调整 其产品结构和市场策略？ 答复：公司2023年的产品结构中 DDIC 的营收占比约为 85%，CIS 约为 6%、PMIC 约为 6%，DDIC 占比较高的 原因在于2023年DDIC 市场需求复苏相对较为明显，预 ...

证券代码：688249 证券简称：晶合集成 公告编号：2024-044 合肥晶合集成电路股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 上述回购股份符合相关法律法规的规定及公司回购股份方案的规定。 三、 其他事项 公司将严格按照《上市公司股份回购规则》《上海证券交易所上市公司自律监 管指引第 7 号——回购股份》等相关规定，在回购期限内根据市场情况择机做出 回购决策并予以实施，同时根据回购股份事项进展情况及时履行信息披露义务， 敬请广大投资者注意投资风险。 特此公告。 合肥晶合集成电路股份有限公司董事会 | 回购方案首次披露日 | 2023/12/25 | | | | | | | --- | --- | --- | --- | --- | --- | --- | | 回购方案实施期限 | 2024 年 3 月 日~2025 年 | | 15 | 3 月 | 14 | 日 | | 预计回购金额 | 元~1,000,000,000 500,000,000 ...

证券代码：688249 证券简称：晶合集成 公告编号：2024-043 合肥晶合集成电路股份有限公司 2023 年年度股东大会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （一） 股东大会召开的时间：2024 年 6 月 27 日 （二） 股东大会召开的地点：安徽省合肥市新站区合肥综合保税区内西淝河路 88 号公司会议室 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 74 | | --- | --- | | 普通股股东人数 | 74 | | 2、出席会议的股东所持有的表决权数量 | 1,320,720,511 | | 普通股股东所持有表决权数量 | 1,320,720,511 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比例 | 67.3017 | | （%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 67 ...

在线 Call Production Component ING&WODD 上海市徐汇区淮海中路999号 上海环贸广场写字楼一期17层 邮编: 200031 17/F. One ICC. Shanghai ICC 999 Huai Hai Road (M) Shanghai, 200031 P.R. China T +86 21 2412 6000 +86 21 2412 6150 arana kum com 北京市金杜律师事务所上海分所 关于合肥晶合集成电路股份有限公司 2023年年度股东大会 的法律意见书 致：合肥晶合集成电路股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）接受合肥晶合集成电路股份有 限公司(以下简称公司)委托,根据《中华人民共和国证券法》(以下简称《证券 法》）、《中华人民共和国公司法》(以下简称《公司法》)、中国证券监督管理委 员会《上市公司股东大会规则(2022年修订)》(以下简称《股东大会规则》)等中 华人民共和国境内(以下简称中国境内,为本法律意见书之目的,不包括中国香港特 别行政区、中国澳门特别行政区和中国台湾地区）现行有效的法律、行政法规、规章 和规范性文件和现行有 ...

2024年06月19日 公司研究●证券研究报告 晶合集成（ ） 公司快报 688249.SH 电子 | 集成电路Ⅲ 产能满载代工价格上行，高阶产能释放在即 投资评级 买入-A(维持) 股价(2024-06-19) 15.63元 投资要点 产能满载代工价格上行，28/40nm高阶产能释放在即 交易数据 总市值（百万元） 31,355.89 2024年6月18日，公司表示目前产能约为11.5万片/月，自2024年三月至今， 流通市值（百万元） 18,392.31 产能一直处于满载状态，目前产线负荷约为110%，订单已超过公司产能；同时， 总股本（百万股） 2,006.14 公司已根据市场情况对部分产品代工价格进行上调，后续将结合市况及产能利用率 流通股本（百万股） 1,176.73 对代工价格进行相应调整。此外，2024年公司计划扩产3-5万片/月。 12个月价格区间 20.74/12.64 公司55nmTDDI已实现大规模量产且产能利用率维持高位，145nm低功耗高速显 一年股价表现 示驱动平台开发完成。OLED方面，40nm高压OLED显示驱动芯片已成功点亮面 板，将应用于手机终端设备OLED显示屏；28n ...