证券代码：688469 证券简称：芯联集成 公告编号：2025-053 芯联集成电路制造股份有限公司 关于拟申请新型政策性金融工具事项及全资子公司为公司 担保的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 重要内容提示： 一、公司申请新型政策性金融工具及全资子公司为公司担保情况概述 公司及公司控股子公司芯联先锋集成电路制造（绍兴）有限公司（以下简称 "芯联先锋"）均为国家高新技术企业，同时芯联先锋承接的"三期 12 英寸集 成电路数模混合芯片制造项目"制造生产的功率模组应用配套所需各类芯片，是 人工智能、物联网、新能源汽车等众多战略性新兴产业的基础，高度契合数字化、 智能化发展方向，精准匹配科技自立自强、发展壮大战略性新兴产业的政策导向。 基于新型政策性金融工具的落实和推进的契机，为了保障"三期 12 英寸集 成电路数模混合芯片制造项目"的持续实施，公司拟向国家开发银行全资子公司 国开新型政策性金融工具有限公司申请不超过人民币 18 亿的政策性金融工具， 期限为 5 年。新型政策性金融工具资金将通过权益性资金注入 ...

Group 1 - Company plans to increase capital by RMB 1.8 billion to its subsidiary, ChipLink Pioneer, to support the ongoing implementation of the "Phase III 12-inch integrated circuit analog and mixed-signal chip manufacturing project" [1] - After the capital increase, the registered capital of ChipLink Pioneer will not be less than approximately RMB 13.292 billion, with other shareholders waiving their preemptive rights [1] - The company will maintain a shareholding ratio of no less than 50.85% in ChipLink Pioneer after the capital increase [1] Group 2 - For the year 2024, the company's revenue composition is projected to be 96.42% from the integrated circuit industry and 3.58% from other businesses [1] - The current market capitalization of ChipLink Integrated is RMB 55.2 billion [2]

Core Viewpoint - Company plans to increase capital by 1.8 billion RMB to its subsidiary, ChipLink Pioneer, to support the ongoing implementation of a 12-inch integrated circuit analog-digital mixed chip manufacturing project, indicating confidence in the market for power module application chips and the importance of new policy financial tools [1] Group 1 - The total investment for the 12-inch integrated circuit project is expected to reach 22.2 billion RMB, with a production capacity of 100,000 wafers per month [1] - After the capital increase, the registered capital of ChipLink Pioneer will not be less than 13.292 billion RMB, and the company will maintain a shareholding ratio of no less than 50.85% [1] - The project is anticipated to have applications in various sectors, including new energy, automotive, industrial control, and consumer electronics [1] Group 2 - The production line has completed preliminary construction, and all process platforms have entered the stage of mass production [1]

| 交易日 | 融资净买入(元) | 融资余额(元) | 占流通市值比 | | --- | --- | --- | --- | | 2025-10-15 | 88.24万 | 13.90亿 | 4.67% | | 2025-10-14 | 1891.26万 | 13.89 Z | 4.68% | | 2025-10-13 | 1833.44万 | 13.70亿 | 4.36% | | 2025-10-10 | 1.12亿 | 13.52亿 | 4.57% | | 2025-10-09 | 5668.28万 | 12.39亿 | 3.81% | 融券方面，当日融券卖出5.26万股，融券偿还15.98万股，融券净买入10.72万股，融券余量270.27万股， 近20个交易日中有13个交易日出现融券净卖出。 | 交易日 | 融券冷卖出(股) | 融券会重(股) | 融券余额(元) | | --- | --- | --- | --- | | 2025-10-15 | -10.72万 | 270.27万 | 1816.20万 | | 2025-10-14 | 18.84万 | 280.99万 | 1882.60万 | ...

Core Points - In September 2025, A-share listed companies in China executed 15 private placements, marking a 200% year-on-year increase, with total funds raised amounting to approximately 144.71 billion yuan, a staggering 10,359% increase year-on-year [1][2] - A total of 33 private placement proposals were disclosed in September 2025, with a proposed fundraising scale of approximately 32.6 billion yuan, reflecting a 37.45% year-on-year increase [1][7] Company Summaries - China Shipbuilding ranked first in actual fundraising, raising 114.77 billion yuan by issuing 3.053 billion shares at a price of 37.59 yuan per share, with funds intended for the merger with China Shipbuilding Industry Corporation [4][5] - ChipLink Integrated raised 5.307 billion yuan through the issuance of approximately 1.314 billion shares at 4.04 yuan per share, with the funds aimed at acquiring 72.33% equity in ChipLink Integrated Circuit Manufacturing (Shaoxing) Co., Ltd. [4][5] - Guosen Securities raised 5.192 billion yuan by issuing shares at 8.25 yuan per share, with the net proceeds intended for the acquisition of 96.08% of Wanhe Securities [4][5] Industry Analysis - The industrial sector led the private placements with 5 instances, raising a total of approximately 122.44 billion yuan, followed by the information technology sector with 4 placements, and the materials sector with 2 placements [6][7] - The information technology and industrial sectors each disclosed 8 private placement proposals in September 2025, with the information technology sector proposing a total fundraising amount exceeding 6.9 billion yuan [14][15]

Core Insights - The collaboration between ChipLink Integrated and Li Auto has reached a significant milestone with the mass production of silicon carbide (SiC) products, marking a new phase in their strategic partnership [2] - The SiC products are expected to enhance the efficiency and range of Li Auto's electric vehicles, particularly in the i-series models [2] - ChipLink Integrated has reported over 1 billion yuan in SiC revenue for 2024, reflecting a year-on-year growth of over 100% [3] Group 1 - The partnership event between ChipLink Integrated and Li Auto signifies the successful implementation of their strategic cooperation in the SiC product domain [2] - The mass production of SiC products is a critical component of Li Auto's pure electric strategy [2] - The SiC products demonstrate superior performance in terms of conduction resistance and application junction temperature compared to mainstream market products [2] Group 2 - ChipLink Integrated has established the first domestic 8-inch SiC MOSFET production line, achieving mass production with industry-leading performance metrics [3] - The company has completed customer validation for China's first integrated DrMOS 55nm BCD chip, with mass production expected in the second half of the year [3] - ChipLink Integrated anticipates that revenue from AI-related projects will reach double digits as several projects, including server power chips and robotic laser radar chips, are expected to ramp up production by 2026 [3]

Core Viewpoint - ChipLink Integrated has shown significant stock price growth this year, with a notable increase in trading activity and institutional holdings, indicating strong market interest and potential for future growth [1][2][3] Group 1: Stock Performance - As of October 13, ChipLink Integrated's stock price increased by 2.10%, reaching 6.82 CNY per share, with a trading volume of 2.90 billion CNY and a turnover rate of 0.98%, resulting in a total market capitalization of 571.70 billion CNY [1] - Year-to-date, the stock price has risen by 32.94%, with a 6.07% increase over the last five trading days, 19.86% over the last 20 days, and 41.79% over the last 60 days [2] Group 2: Company Overview - ChipLink Integrated Circuit Manufacturing Co., Ltd. was established on March 9, 2018, and went public on May 10, 2023. The company specializes in wafer foundry and module packaging testing in the MEMS and power device sectors, providing one-stop system foundry solutions [2] - The revenue composition of ChipLink Integrated includes 85.96% from integrated circuit wafer manufacturing foundry, 9.24% from module packaging, 3.58% from other services, and 1.21% from research and development services [2] Group 3: Financial Performance - For the period from January to June 2025, ChipLink Integrated reported a revenue of 34.95 billion CNY, reflecting a year-on-year growth of 21.38%. However, the net profit attributable to shareholders was -1.70 billion CNY, showing a year-on-year increase of 63.82% in losses [2] Group 4: Institutional Holdings - As of June 30, 2025, the largest shareholder of ChipLink Integrated is the Huaxia SSE Sci-Tech Innovation Board 50 ETF, holding 266 million shares, an increase of 27.72 million shares from the previous period. Other significant shareholders include the E Fund SSE Sci-Tech Innovation Board 50 ETF and the Southern CSI 500 ETF, with new entries from the Guolian An CSI All-Index Semiconductor Products and Equipment ETF [3]

Core Viewpoint - The company, ChipLink Integration, confirmed that its MEMS sensors and power chips can be utilized in humanoid robots for various applications such as voice interaction, posture recognition, motion capture, robotic manipulation, environmental perception, and navigation [1] Product Applications - The company's products include microphones, inertial sensors, pressure sensors, as well as laser radar light sources and scanning mirrors, which are essential for humanoid robot functionalities [1]

【导读】上证指数盘中突破3900点，续创10年新高 | 上证指数 | 深证成指 | | 北证50 | | | --- | --- | --- | --- | --- | | 3908.28 | 13677.13 | | 1525.15 | | | +25.50 +0.66% | +150.62 +1.11% | | -3.48 -0.23% | | | 科创50 | 创业板指 | | 万得全A | | | 1559.66 | 3273.72 | | 6406.42 | | | +64.38 +4.31% | +35.55 +1.10% | | +57.48 +0.91% | | | 沪深300 | 中证500 | | 中证A500 | | | 4688.12 | 7493.63 | | 5679.31 | | | +47.43 +1.02% | +81.26 +1.10% | | +60.60 +1.08% | | | 中证1000 | 深证100 | | 中证红利 | | | 7629.64 | 6024.45 | | 5450.78 | | | +54.67 +0.72% | +65.92 +1.11% ...

Group 1 - The stock price of ChipLink Integrated-U reached a historical high, increasing by 9.42% to 7.20 yuan, with a trading volume of 93.06 million shares and a transaction amount of 643 million yuan, resulting in a turnover rate of 2.10% [2] - The latest total market capitalization of the company in A-shares is 60.36 billion yuan, with a circulating market capitalization of 31.90 billion yuan [2] - The electronic industry, to which ChipLink Integrated-U belongs, has an overall increase of 2.83%, with 387 stocks rising and 4 stocks hitting the daily limit, while 90 stocks declined [2] Group 2 - As of September 30, the latest margin trading balance for ChipLink Integrated-U is 1.19 billion yuan, with a financing balance of 1.18 billion yuan, reflecting a recent increase of 150 million yuan, a 14.56% month-on-month growth [2] - The company's semi-annual report indicates that it achieved an operating income of 3.495 billion yuan in the first half of the year, representing a year-on-year growth of 21.38%, while the net profit was -170 million yuan, showing a year-on-year increase of 63.82% [2] - The basic earnings per share for the company is -0.0200 yuan [2]