Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, promoting collaboration among experts and industry representatives to enhance the domestic semiconductor industry's capabilities [36][35][34]. Group 1: Conference Overview - The conference will take place on July 9-10, 2025, at the Sheraton Hotel in Hefei, Anhui [30][5]. - It will feature over 20 speakers from the lithography industry, covering advanced lithography technologies, photoresists, and wet electronic chemicals [27][26]. - The event aims to foster deep interaction between upstream and downstream sectors of the industry, providing a platform for resource integration and collaboration [29][35]. Group 2: Key Topics and Discussions - Discussions will include the latest research and application prospects of extreme ultraviolet lithography (EUV), electron beam lithography, and nanoimprint technologies [26]. - The conference will analyze the current state of domestic photoresist production, technical bottlenecks, and the need for innovation to improve self-sufficiency and quality [34][35]. - Key issues regarding the localization of lithography equipment and the challenges faced in the domestic semiconductor manufacturing process will be highlighted [34][35]. Group 3: Featured Speakers and Sessions - Wei Ran, head of the semiconductor product line at Hefei Chip Microelectronics Equipment Co., will present on the industrialization of laser direct-write lithography equipment [7][1]. - The agenda includes specialized forums on advanced lithography technology and the development trends of photoresists and wet electronic chemicals [14][11]. - A roundtable discussion will feature industry leaders discussing the integration of scientific data-driven innovations in new materials [17][26]. Group 4: Company and Industry Background - Hefei Chip Microelectronics Equipment Co., established in June 2015, specializes in the research and production of direct imaging equipment based on micro-nano direct-write lithography technology [7]. - The company has over 200 intellectual property rights and has received multiple awards, including the "National High-tech Enterprise" designation [7]. - The lithography technology is crucial for semiconductor manufacturing, directly impacting chip performance, integration, and production costs [34].

Core Viewpoint - Chipone Microelectronics (芯碁微装) plans to initiate the process for issuing H-shares and listing on the Hong Kong Stock Exchange to enhance its international strategy and brand recognition [1][2]. Group 1: H-Share Listing Plans - The company's board approved the proposal to start preparations for the H-share issuance and listing on June 27, 2025, with a 12-month authorization period [1]. - The H-share listing aims to strengthen the company's capital strength and overall competitiveness [1]. - Specific details regarding the H-share listing are yet to be finalized, and the company will consult with relevant intermediaries [1]. Group 2: Previous Fundraising Activities - Chipone Microelectronics was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on April 1, 2021, raising a total of 460 million yuan, with a net amount of 416 million yuan after expenses [2][3]. - The company initially planned to raise 473 million yuan, with allocations for various projects including high-end PCB laser imaging equipment and wafer-level packaging [3]. - The total fundraising from the IPO and subsequent private placement amounts to 1.258 billion yuan [5]. Group 3: Recent Capital Increases - As of July 25, 2023, the company issued 10,497,245 shares at a price of 75.99 yuan per share, raising approximately 797.69 million yuan, with a net amount of about 789.36 million yuan after expenses [4].

Core Viewpoint - The lithography machine concept sector has shown a positive performance with a 2.34% increase, ranking 8th among concept sectors, driven by significant gains in several stocks [1][2]. Group 1: Stock Performance - Within the lithography machine sector, 29 stocks experienced gains, with notable performers including: - Kaimeite Gases and Haili Shares both hitting the daily limit up, with increases of 10.00% and 9.99% respectively [1][3]. - Xuguang Electronics rose by 9.97% [3]. - Other significant gainers included Blue Ying Equipment (up 14.60%), Jiuri New Materials (up 5.93%), and Zhongci Electronics (up 4.55%) [1][2]. - Conversely, the sector also saw declines in stocks such as Tengjing Technology (down 3.29%), Electronic Science and Technology Digital (down 1.20%), and Fuchuang Precision (down 1.11%) [1]. Group 2: Capital Flow - The lithography machine sector attracted a net inflow of 825 million yuan from main funds, with 23 stocks receiving net inflows [2]. - Xuguang Electronics led the net inflow with 312 million yuan, followed by Haili Shares (290 million yuan) and Kaimeite Gases (58.84 million yuan) [2][3]. - The net inflow ratios for key stocks were as follows: - *ST and Ke, Xuguang Electronics, and Haili Shares had net inflow ratios of 41.92%, 20.54%, and 18.75% respectively [3].

Core Viewpoint - Chipbond Microelectronics (芯碁微装) plans to accelerate its internationalization strategy and overseas business layout by issuing H-shares and listing on the Hong Kong Stock Exchange, aiming to enhance its brand image, capital strength, and overall competitiveness [1][2][3]. Company Overview - Chipbond Microelectronics specializes in the research, development, manufacturing, and sales of direct imaging equipment and related maintenance services, focusing on micro-nano direct writing lithography technology [3]. - The company was listed on the STAR Market in April 2021, raising approximately 4.16 billion yuan after expenses for projects related to wafer-level packaging direct writing lithography equipment [3]. Financial Performance - In 2024, Chipbond Microelectronics achieved a revenue of 9.54 billion yuan, a year-on-year increase of 15.09%, but net profit decreased by 10.38% to 1.61 billion yuan due to high expenses related to overseas market strategies and talent development [5]. - The company reported a significant increase in overseas revenue, reaching 188 million yuan in 2024, a growth of 212.32% year-on-year, with Southeast Asia contributing nearly 20% to total revenue [1][4]. Market Position and Strategy - The global PCB industry is experiencing steady growth driven by artificial intelligence, high-speed networks, and electric vehicles, providing opportunities for Chipbond Microelectronics to strengthen its market position [6]. - The company has established strategic partnerships with international clients and is focusing on high-end market validation and delivery of its equipment [4][6]. Recent Developments - In the first quarter of 2025, Chipbond Microelectronics reported a revenue of 242 million yuan, a year-on-year increase of 22.31%, with net profit rising by 30.45% to 51.87 million yuan [5]. - The company signed contracts worth 146 million yuan for LDI exposure equipment, which is expected to positively impact future operating performance [6].

Core Viewpoint - The recent trend of A-share companies planning to list in Hong Kong continues, with 14 companies disclosing their intentions to issue H-shares and list on the Hong Kong Stock Exchange in June 2023 [1][2]. Group 1: Companies Planning to List - Chipone Microelectronics announced on June 27 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Daikin Heavy Industries disclosed on June 24 its intention to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Lattice Semiconductor announced on June 20 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Shanjin International authorized its management on June 19 to initiate preparations for issuing H-shares and listing in Hong Kong [2]. - Wolong Electric Drive announced on June 18 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Lakala disclosed on June 16 its plan to list on the Hong Kong Stock Exchange [2]. - Sandam Membrane announced on June 16 its intention to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Kute Intelligent disclosed on June 10 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - EVE Energy announced on June 9 its intention to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Chaohongji disclosed on June 9 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - BlueFocus Communication Group announced on June 6 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Stone Technology disclosed on June 6 its intention to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Jinjiang Hotels announced on June 4 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Estun Automation disclosed on June 4 its intention to issue H-shares and list on the Hong Kong Stock Exchange [2].

Core Viewpoint - The company plans to issue H-shares and list on the Hong Kong Stock Exchange to accelerate its international strategy and enhance its brand image and competitiveness [1] Group 1: Company Actions - The company's board approved the proposal to authorize management to initiate preparations for the overseas issuance of H-shares [1] - The authorization period for the management to start the H-share listing preparations is set for 12 months from the board's approval date [1] - The company intends to discuss specific progress with relevant intermediaries regarding the H-share listing [1] Group 2: Regulatory and Approval Process - The H-share listing plan requires approval from the company's board and shareholders, as well as regulatory approvals from the China Securities Regulatory Commission, Hong Kong Stock Exchange, and the Securities and Futures Commission of Hong Kong [1] - There is significant uncertainty regarding the final implementation of the H-share listing [1]

为加快公司的国际化战略及海外业务布局，打造国际化资本运作 平台，进一步提升公司品牌形象及知名度，提高公司的资本实力和综 合竞争力，根据公司总体发展战略及运营需要，公司拟在境外发行股 份（H 股）并在香港联合交易所有限公司（以下简称"香港联交所"） 上市（以下简称"本次 H 股上市"）。公司董事会同意授权公司管理层 启动本次 H 股上市的前期筹备工作，授权期限为自董事会审议通过之 日起 12 个月内。公司计划与相关中介机构就本次 H 股上市的具体推 进工作进行商讨，关于本次 H 股上市的具体细节尚未最终确定。 根据《中华人民共和国公司法》《中华人民共和国证券法》《上海 1 证券代码：688630 证券简称：芯碁微装 公告编号：2025-023 合肥芯碁微电子装备股份有限公司 关于授权公司管理层启动公司境外发行股份（H 股） 并在香港联合交易所有限公司上市相关筹备工作的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假 记载、误导性陈述或者重大遗漏，并对其内容的真实性、准确性 和完整性依法承担法律责任。 合肥芯碁微电子装备股份有限公司（以下简称"公司"）第二届 董事会第二十次会议于 2025 年 6 月 2 ...

Investment Rating - The report maintains a "Buy" rating for the company, with a market price of RMB 79.15 and a sector rating of "Outperform" [1][3]. Core Views - The company has signed a significant new contract worth RMB 146 million, which is expected to boost its revenue for 2024 by approximately 15% [3][7]. - The AI infrastructure boom is driving investment in PCB, and the company is likely to benefit from the expansion efforts of PCB manufacturers [3][7]. - The report adjusts the company's earnings forecasts for 2025 and 2026, with EPS estimates revised to RMB 2.09 and RMB 2.75 respectively, while projecting an EPS of RMB 3.37 for 2027 [7]. Financial Summary - The company's projected revenue for 2023 is RMB 829 million, increasing to RMB 1,377 million by 2025, reflecting a growth rate of 44.3% [6]. - EBITDA is expected to rise from RMB 155 million in 2023 to RMB 277 million in 2025 [6]. - The net profit attributable to the parent company is forecasted to grow from RMB 179 million in 2023 to RMB 276 million in 2025, with a growth rate of 71.7% [6]. - The company’s P/E ratios for 2025, 2026, and 2027 are projected to be 37.8, 28.8, and 23.5 respectively [7].

Investment Rating - The report maintains an "Outperform" rating for the company [2] Core Views - The company signed seven significant sales contracts totaling RMB 146 million, which is expected to positively impact future operating performance [7] - The demand for AI computing power is driving the need for high-end equipment, leading to full order backlogs and an optimistic business outlook [7] - The company has advanced packaging equipment with technological advantages across multiple products in the semiconductor field [7] - The profit forecasts for 2025-2027 are maintained, with expected net profits of RMB 285 million, RMB 411 million, and RMB 503 million respectively [7] Financial Data and Profit Forecast - Total revenue projections for 2025 are RMB 1,411 million, with a year-on-year growth rate of 47.9% [6] - The net profit for 2025 is projected at RMB 285 million, reflecting a year-on-year increase of 77.4% [6] - The earnings per share for 2025 is estimated at RMB 2.16, with a projected PE ratio of 37 [6] - The gross margin is expected to be 39.9% in 2025, with a return on equity (ROE) of 12.1% [6]

Group 1 - The company, Hefei Chip Microelectronics Equipment Co., Ltd., has signed a total of 7 equipment purchase contracts with a total amount of RMB 146 million (including tax), which is expected to have a positive impact on the company's future operating performance [1][2] - The total contract amount represents approximately 15% of the company's audited operating income for the year 2024, indicating a significant contribution to revenue if successfully implemented [2] - The contracts are classified as daily operational contracts and do not require approval from the board of directors or shareholders, as the company has completed the necessary internal approval procedures [2] Group 2 - The counterparties involved in the contracts are not disclosed due to exemption, but they are identified as related transactions [2] - The contracts include clear provisions regarding payment terms, confidentiality, contract changes and termination, liability for breach, dispute resolution, and effective dates [2]