Core Insights - The Chinese integrated circuit industry has evolved from a technology exploration phase to a stage of partial leadership in emerging fields such as third-generation semiconductors and AI chips [1] Group 1: Industry Overview - Major listed companies in the Chinese integrated circuit industry include companies like Chipone (688521.SH), Cambricon (688256.SH), and SMIC (688981.SH/00981.HK) [1] - The development of integrated circuit technology in China has gone through three main phases: foundational exploration (1950s-1978), technology introduction (1978-2000), and independent breakthroughs (2000-2020) [1] Group 2: Core Production Technologies - The integrated circuit technology system focuses on three core areas: design, manufacturing, and packaging/testing [4] - Key design aspects include EDA tools, chip architecture (RISC-V/ARM), and semiconductor IP [4] - Manufacturing focuses on wafer processes (including EUV lithography) and advanced process nodes (such as 7nm and 5nm) [4] - Packaging/testing emphasizes advanced techniques like Chiplet and 3D stacking [4] Group 3: Current Production Status - Chinese companies lead in production volume but lack sufficient autonomy in technology [7] - The design sector has achieved some autonomy in mature process tools and IP, but high-end EDA and core IP still rely on imports [7] - Manufacturing has sufficient capacity for mature processes but faces limitations in advanced processes due to equipment restrictions [7] - The packaging/testing sector is a strength, with leading companies holding significant global market shares [7] Group 4: Market Segmentation - The low-end market (45nm and above) has a self-sufficiency rate exceeding 75%, with companies like Hua Hong Semiconductor leading [10] - The mid-range market (14-28nm) has a domestic production rate of about 35%, with breakthroughs in memory chips [10] - The high-end market (7nm and below) has a self-sufficiency rate of less than 20%, heavily relying on overseas foundries [10] Group 5: Challenges and Future Outlook - The Chinese integrated circuit industry faces challenges such as low domestic production of high-end technologies, risks to industrial security, and the need for improved product quality [13] - Future strategies include focusing on technological breakthroughs, collaborative ecosystem development, and enhancing talent cultivation to support high-quality industry growth [13]

1月6日，通富微电盘中上涨2.30%，截至13:00，报40.45元/股，成交21.06亿元，换手率3.48%，总市值 613.87亿元。 截至9月30日，通富微电股东户数35.07万，较上期增加27.05%；人均流通股4327股，较上期减少 21.29%。2025年1月-9月，通富微电实现营业收入201.16亿元，同比增长17.77%；归母净利润8.60亿元， 同比增长55.74%。 通富微电今年以来股价涨7.29%，近5个交易日涨7.84%，近20日涨10.55%，近60日跌11.29%。 资料显示，通富微电子股份有限公司位于江苏省南通市崇川开发区崇川路288号，成立日期1994年2月4 日，上市日期2007年8月16日，公司主营业务涉及集成电路的封装和测试。主营业务收入构成为：集成 电路封装测试96.98%，模具及材料销售等3.02%。 通富微电所属申万行业为：电子-半导体-集成电路封测。所属概念板块包括：AIPC概念、封测概念、存 储概念、华为海思、汽车芯片等。 分红方面，通富微电A股上市后累计派现4.54亿元。近三年，累计派现2.33亿元。 机构持仓方面，截止2025年9月30日，通富微电十大流通股 ...

通富微电董事长兼京隆科技副董事长石磊；市委常委、苏州工业园区党工委书记沈觅，市政府秘书长徐本，市有关部门主要负责同志参加。 来源：苏报融媒记者朱琦/文 智能产线。苏报融媒记者 濮建明/摄 吴庆文在致辞时表示，近年来，苏州大力培育集成电路领域新质生产力，已集聚集成电路产业链重点企业超380家，形成了从设计、制造、封测到设备材 料的完整产业布局。通富微电是苏州并肩前行的好伙伴，此次投资建设京隆科技高阶半导体新项目，必将为苏州集成电路产业发展跃升注入新的强劲动 能。期待企业家朋友把更多先进技术、高端项目、优质资源带到苏州。苏州将坚持长期主义，一如既往提供细致周到服务，持续营造市场化、法治化、国 际化一流营商环境，陪伴企业成长，共享发展机遇、共创美好未来。 京隆科技（苏州）有限公司扎根苏州工业园区20余年，已发展成为国内最大的高阶芯片专业测试厂商，构建了全流程芯片封测服务体系。2025年，园区产 业基金联合全球封测龙头企业通富微电，完成京隆科技股权重组。此次投用的新工厂位于独墅湖科教创新区（东区），总投资40亿元，占地68亩，其搭载 的智能产线涵盖人工智能、车规级、工业级等高阶芯片测试领域。预计达产后，将进一步扩大企 ...

Industry Overview - The Chinese integrated circuit industry has seen a significant number of financing events, with over 1,000 events in both 2021 and 2022, indicating a peak period for investment [1] - In 2023, the number of financing events decreased, but the total financing amount increased to 1.15 trillion yuan, while in 2024, the number of events slightly declined, and the total financing amount halved to approximately 562.39 billion yuan [1] - By 2025, the number of financing events is expected to recover slightly to 938, with a total financing amount of approximately 911.05 billion yuan [1] Financing Events Summary - Major financing events in the Chinese integrated circuit industry for 2025 include various rounds of investment across different companies, with amounts often undisclosed [2][5][7] - Notable investments include 100 million yuan in Yanan Weiyan Technology and 1.43 billion yuan in Hongxing Zhixin, showcasing the active investment landscape [5][7] Financing Rounds Analysis - The most common financing round in the integrated circuit industry over the past five years has been the B round, with early-stage rounds like angel, Pre-A, and A rounds significantly outpacing later rounds [8] - Strategic investments have also been prevalent, indicating a strong interest in building long-term industry ecosystems [8] Regional Financing Distribution - Financing activities are heavily concentrated in eastern coastal provinces such as Guangdong, Jiangsu, and Zhejiang, with Jiangsu showing particularly high financing scales [9] - In contrast, provinces like Shandong and Henan have seen a significant decrease in financing events, while regions like Jilin and Tibet have almost no financing activity [9] Sector-Specific Financing Insights - The integrated circuit industry can be segmented into memory, logic chips, microprocessors, and analog chips, with memory leading with 374 financing events, significantly higher than logic chips (113 events), microprocessors (75 events), and analog chips (18 events) [13] - This reflects the strong demand for domestic alternatives in the memory sector and varying levels of investor interest across different segments [13] Representative Companies' Investment Activities - Key companies in the integrated circuit sector, such as Xinyuan Co., have made substantial investments in various startups to enhance their technological capabilities and strengthen their competitive edge [15][16][17][18] - For instance, Xinyuan Co. has invested 500 million yuan in Xinyuan Technology (Shanghai) and 100 million yuan in Xinyuan Microelectronics (Nanjing) [16] Mergers and Acquisitions - The competitive landscape among Chinese integrated circuit companies is characterized by numerous mergers and acquisitions, primarily focusing on horizontal integration to expand market share and achieve technological synergies [19][20] - Recent notable acquisitions include Huadian Co. acquiring 15% of Shengwei Ce Electronics and Xinyuan Co. acquiring 100% of Xinyuan Technology [20] Summary of Investment and M&A Trends - The investment activities in the Chinese integrated circuit industry are showing signs of recovery, with a notable increase in merger and acquisition events, indicating a dynamic market environment [22]

Group 1 - The core point of the article highlights the performance and market position of Tongfu Microelectronics, which saw a stock increase of 1.28% to 37.88 CNY per share, with a total market capitalization of 57.487 billion CNY [1] - Tongfu Microelectronics, established on February 4, 1994, and listed on August 16, 2007, specializes in integrated circuit packaging and testing, with 96.98% of its revenue coming from these services [1] - The company is located in Chongchuan Development Zone, Nantong City, Jiangsu Province, and has a minor revenue contribution of 3.02% from the sales of molds and materials [1] Group 2 - From the perspective of fund holdings, Tongfu Microelectronics is a significant investment for the Huatai-PineBridge Fund, which holds 87,700 shares, representing 0.49% of the fund's net value, ranking it as the tenth largest holding [2] - The Huatai-PineBridge CSI 500 Index (LOF) A fund, established on August 10, 2017, has a current scale of 251 million CNY and has achieved a year-to-date return of 30.14%, ranking 1738 out of 4195 in its category [2] - The fund manager, Wu Zhenxiang, has a tenure of 15 years and 332 days, with the fund's total assets amounting to 19.781 billion CNY, and the best return during his tenure being 202.04% [2]

Group 1 - The core viewpoint of the article is that Tongfu Microelectronics is focusing its external investments around its main business of packaging and testing, as well as related upstream and downstream industry chains, indicating a strong industrial logic [1] - The company will fulfill its information disclosure obligations for external investment projects in accordance with disclosure requirements [1]

与会代表以举手表决的方式审议通过了《关于选举公司第八届董事会职工代 表董事的议案》，同意选举李金健先生为公司第八届董事会职工代表董事，与公 司 2024 年第一次临时股东大会及 2025 年第一次临时股东大会选举产生的其他 8 名股东代表董事及独立董事，共同组成公司第八届董事会，任期自本次职工代表 大会选举产生之日起至第八届董事会任期届满之日止。 李金健先生担任公司职工代表董事后，董事会中兼任公司高级管理人员以 及由职工代表担任的董事人数总计不超过公司董事总数的二分之一，符合相关法 律法规及规范性文件的要求。 李金健先生的简历详见附件。 关于第八届董事会职工代表董事选举结果的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 通富微电子股份有限公司（以下简称"公司"）六届三次职工代表大会于 2025 年 12 月 26 日在公司三楼工会俱乐部召开。根据《公司法》及《公司章程》 的相关规定，公司董事会设职工代表董事一名，由职工代表大会选举产生，经全 体与会职工代表民主讨论，就选举公司第八届董事会职工代表董事作出如下决议： 特此公告。 证券代码：002156 证 ...

Core Viewpoint - The Integrated Circuit ETF (159546) opened with a slight increase of 0.06%, priced at 1.791 yuan, indicating a stable market performance for the fund [1] Group 1: ETF Performance - The Integrated Circuit ETF (159546) has a performance benchmark based on the CSI All-Share Integrated Circuit Index return [1] - Since its establishment on October 11, 2023, the fund has achieved a return of 79.28% [1] - The fund's return over the past month is reported at 7.90% [1] Group 2: Major Holdings Performance - Major holdings within the ETF include: - SMIC (中芯国际) with an increase of 2.17% [1] - Cambrian (寒武纪) with a decrease of 0.08% [1] - Haiguang Information (海光信息) down by 0.24% [1] - Lattice Technology (澜起科技) down by 0.41% [1] - Zhaoyi Innovation (兆易创新) up by 1.21% [1] - Haowei Group (豪威集团) up by 0.10% [1] - Chipone (芯原股份) down by 0.32% [1] - Changdian Technology (长电科技) up by 0.57% [1] - Unisoc (紫光国微) down by 0.12% [1] - Tongfu Microelectronics (通富微电) up by 0.21% [1]

Group 1 - The integrated circuit ETF (562820) opened down 0.88% at 2.148 yuan [1] - Major holdings in the ETF showed mixed performance, with notable declines in stocks like Cambrian (down 1.19%), SMIC (down 0.43%), and Haiguang Information (down 0.99%), while Zhaoyi Innovation increased by 0.65% [1] - The ETF's performance benchmark is the CSI All Share Integrated Circuit Index, managed by Harvest Fund Management, with a return of 117.04% since its inception on April 12, 2024, and a recent one-month return of -0.48% [1]

2024年10月16日，公司与领先半导体签署了《合伙份额转让协议》，公司出 资2亿元受让领先半导体持有的滁州广泰146,722,355.58元出资额（占滁州广泰 合伙份额的31.90%），以间接持有引线框架供应商AAMI股权。具体内容详见公司 于2024年10月17日披露的《关于与专业投资机构共同投资合伙企业的公告》（公 告编号：2024-062）。 股票代码：002156 股票简称：通富微电 公告编号：2025-051 2024年10月23日，公司与至正股份签署了《资产购买协议》，至正股份拟发 行股份购买公司持有的滁州广泰出资额。最终交易价格将以符合《中华人民共和 国证券法》规定的资产评估机构出具的评估报告的评估结果为基础，经交易双方 充分协商确定。相关审计、评估工作完成后，最终交易价格如需要调整的，公司 将与至正股份签署补充协议，对最终交易价格和交易方案进行确认。具体内容详 见公司于2024年10月24日披露的《关于与专业投资机构共同投资合伙企业的进展 公告》（公告编号：2024-063）。 通富微电子股份有限公司 关于与专业投资机构共同投资合伙企业的进展公告 本公司及董事会全体成员保证信息披露的内容真实 ...