证券代码：300476 证券简称：胜宏科技 公告编号：2025-108 胜宏科技（惠州）股份有限公司 关于使用部分闲置募集资金进行现金管理的公告 本公司及董事会全体成员保证信息披露的内容的真实、准确、完整，没有虚假记载、误 导性陈述或重大遗漏。 胜宏科技（惠州）股份有限公司（以下简称"公司"）于 2025 年 9 月 30 日召 开第五届董事会第十次会议，审议通过了《关于使用部分闲置募集资金进行现金 管理的议案》，同意公司在确保不影响募投项目投资计划正常进行和募集资金安 全的情况下，公司拟使用不超过人民币 150,000 万元（含本数）闲置募集资金进 行现金管理，用于购买安全性高、流动性好的银行等金融机构的现金管理类产品， 使用期限为自公司董事会审议通过之日起 12 个月，在上述使用期限及额度范围 内，资金可循环滚动使用。具体情况如下： 一、募集资金的基本情况 根据中国证券监督管理委员会于 2025 年 8 月 28 日出具的《关于同意胜宏科 技（惠州）股份有限公司向特定对象发行股票注册的批复》（证监许可〔2025〕 1856 号），公司向特定对象发行人民币普通股（A 股）7,660,672 股，每股发行 价 ...

胜宏科技（惠州）股份有限公司 胜宏科技（惠州）股份有限公司章程 章 程 二零二五年九月 | | | | 第一章 | 总则 4 | | | --- | --- | --- | | 第二章 | 经营宗旨和范围 5 | | | 第三章 | 股份 5 | | | 第一节 | 股份发行 5 | | | 第二节 | 股份增减和回购 7 | | | 第三节 | 股份转让 9 | | | 第四章 | 股东和股东会 | 9 | | 第一节 | 股东 | 10 | | 第二节 | 控股股东和实际控制人 13 | | | 第三节 | 股东会的一般规定 14 | | | 第四节 | 股东会的召集 18 | | | 第五节 | 股东会的提案与通知 20 | | | 第六节 | 股东会的召开 22 | | | 第七节 | 股东会的表决和决议 25 | | | 第五章 | 董事会 | 30 | | 第一节 | 董事 | 30 | | 第二节 | 董事会 | 33 | | 第三节 | 独立董事 38 | | | 第四节 | 董事会专门委员会 41 | | | 第六章 | 总裁及其他高级管理人员 | 43 | | 第七章 | 财务会计制度、利 ...

胜宏科技（惠州）股份有限公司（以下简称"公司"）依据《中华人民共和国 公司法》《中华人民共和国证券法》《深圳证券交易所创业板股票上市规则》和 《深圳证券交易所上市公司自律监管指引第 2 号——创业板上市公司规范运作》 等有关规定，对《公司章程》进行修订，该议案已经公司第五届董事会第十次会 议审议通过，具体修订情况如下： 胜宏科技（惠州）股份有限公司 《公司章程》修订对照表 | 序号 | | 修订前 | | | | | | | 修订后 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 1 | 第 六 条 公 | 司 注 册 资 | | | 本 | 为 人 | 民 | 币 | 第六条 公司注册资本为人民币 | | | | 862,688,641元。 | | | | | | | 870,349,313元。 | | 2 | 第二十条 | | | 公司已发行的股份数为 | | | | | 第二十条 公司已发行的股份数为 | | | | | 862,688,641股，均为人民币普通股。 | | | | | | 870,349,313股，均为 ...

国信证券股份有限公司 根据中国证券监督管理委员会于 2025 年 8 月 28 日出具的《关于同意胜宏科 技（惠州）股份有限公司向特定对象发行股票注册的批复》（证监许可〔2025〕 1856 号），公司向特定对象发行人民币普通股（A 股）7,660,672 股，每股发行价 格为人民币 248.02 元，募集资金总额为人民币 1,899,999,869.44 元；扣除发行费 用后实际募集资金净额为人民币 1,876,386,754.11 元，截至 2025 年 9 月 16 日止， 上述资金已全部到位。立信会计师事务所（特殊普通合伙）对公司本次向特定对 象发行股票的资金到位情况进行了审验，并于 2025 年 9 月 17 日出具了《验资报 告》（信会师报字〔2025〕第 ZC10405 号）。 募集资金到账后，公司已将募集资金存放于本次发行开立的募集资金专项账 户，公司已与保荐人、存放募集资金的商业银行签署了《募集资金三方监管协议》， 共同监督募集资金的使用情况。 根据 2025 年 8 月 29 日披露的《胜宏科技（惠州）股份有限公司 2024 年度 向特定对象发行股票募集说明书》，公司募集资金拟投资于以下项 ...

一、公司注册资本变更情况 证券代码：300476 证券简称：胜宏科技 公告编号：2025-109 胜宏科技（惠州）股份有限公司 关于变更注册资本、修改《公司章程》并办理工商变更登记的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记载、误导 性陈述或重大遗漏。 胜宏科技（惠州）股份有限公司（以下简称"公司"）于 2025 年 9 月 30 日 召开第五届董事会第十次会议，审议通过了《关于变更注册资本、修改<公司章 程>并办理工商变更登记的议案》，现将有关情况公告如下： 胜宏科技（惠州）股份有限公司 根据中国证券监督管理委员会于 2025 年 8 月 28 日出具的《关于同意胜宏科 技（惠州）股份有限公司向特定对象发行股票注册的批复》（证监许可〔2025〕 1856 号），公司向特定对象发行人民币普通股（A 股）7,660,672 股，每股发行价 格为人民币 248.02 元，募集资金总额为人民币 1,899,999,869.44 元；扣除发行费 用后实际募集资金净额为人民币 1,876,386,754.11 元，截至 2025 年 9 月 16 日止， 上述资金已全部到位。立信会计师事 ...

Core Insights - The HDI board market is experiencing significant growth driven by global digital transformation and the trend towards electric and intelligent vehicles. China, as a major manufacturing and consumption market, is seeing rapid development in the HDI board industry, with a projected market size of 45.568 billion yuan in 2024, reflecting a year-on-year increase of 16.5% [1][6]. - The market is expected to continue expanding, reaching 50.908 billion yuan by 2025, with an 11.7% year-on-year growth [1][6]. Industry Overview - HDI boards, or High-Density Interconnect boards, utilize micro-blind buried hole technology and lamination processes to enhance circuit density, catering to the miniaturization and high-speed signal transmission needs of electronic products. They are primarily used in mobile phone motherboards, digital devices, and automotive electronics [3][4]. - The HDI board industry can be categorized into three types based on lamination complexity: low-end HDI (single lamination), high-end HDI (two or more laminations), and any-layer HDI (most complex) [3]. Market Size and Growth - The global HDI board market is projected to reach 12.8 billion USD in 2024, with a year-on-year increase of 15.3%, and is expected to grow to approximately 14.3 billion USD by 2025 [5][6]. Competitive Landscape - The HDI board industry is dominated by overseas and Taiwanese manufacturers, while mainland Chinese companies are rapidly catching up. Key players in mainland China include companies like Fangzheng Technology, Bomin Electronics, and Shenghong Technology, which are increasing their R&D investments and expanding high-end production capacities [7][8]. Development Trends - The HDI board market is shifting towards higher-end products, driven by the demand for advanced mobile devices and the adoption of AnyLayer HDI motherboards in Android smartphones. The trend indicates a growing need for high-layer HDI boards as high-end smartphone sales increase [9]. - The application fields for HDI boards are expanding, particularly in the rising electric vehicle sector, which requires stable and reliable circuit connections for various systems [10]. Additionally, the medical device sector is also a growing market for HDI boards due to the demand for miniaturized and intelligent devices [11]. - Environmental considerations are leading to a trend towards green manufacturing practices in the HDI board industry, with a focus on reducing harmful substances and optimizing production processes [12].

Group 1 - A total of 4,561 listed companies in A-shares were investigated by institutions such as brokerages and insurance funds in the first three quarters of this year [1] - Among these companies, 650 received concentrated research from over 100 institutions, with Zhongkong Technology Co., Ltd. leading at 1,348 institutions [1] - The 650 companies that were concentrated on by over 100 institutions generally performed well in the secondary market, with 569 companies seeing their stock prices rise during the period, accounting for 87.54% [1] Group 2 - Companies like Shenghong Technology, Guangdong Siquan New Materials, and Chengdu Xinyi Communication Technology saw significant stock price increases of 581.06%, 394.08%, and 344.84% respectively [1] - Technological breakthroughs and product volume expansion are key factors driving stock price increases, as seen in Shenghong Technology's advancements in high-density interconnect (HDI) technology and its focus on AI computing power and data center upgrades [2] - Institutions conducting research can obtain detailed information beyond financial reports, such as order progress and technology implementation, which aids in more accurate stock selection [2] Group 3 - The demand for automotive parts has significantly increased due to the ongoing release of demand in the passenger car market and the introduction of new models by major automakers [3] - Automotive parts companies are integrating into the humanoid robot supply chain, leveraging their precision manufacturing and sensor development capabilities to expand profit margins [3] - The general equipment sector is supported by the automation and intelligent upgrades of traditional manufacturing, as well as the rapid development of emerging industries like energy storage and photovoltaics [3]

Core Viewpoint - The recent financing and expansion plans of major PCB companies are primarily driven by the increasing demand for AI technologies and high-end PCB products, indicating a significant shift in the industry towards advanced manufacturing capabilities [1][3][6]. Group 1: Company Expansion Plans - Huadian Co. disclosed a new project for high-end printed circuit boards (PCBs) with an investment of 4.3 billion yuan, which began construction in June 2023 and is expected to start trial production in the second half of 2026 [1]. - Shenghong Technology completed a fundraising round of 1.9 billion yuan, with allocations of 850 million yuan for an AI HDI project in Vietnam and 500 million yuan for a high-layer PCB project in Thailand [1]. - Eight PCB manufacturers have announced new financing and expansion plans since July 25, focusing on enhancing their capabilities in HDI, HLC, and SLP products [1][2]. Group 2: Market Demand and Trends - The demand for high-density and high-layer PCBs is expected to grow significantly due to advancements in AI, satellite communications, and automotive electronics, with the HDI market projected to reach 17.037 billion USD by 2029, reflecting a compound annual growth rate of 6.4% [6]. - The complexity of PCB production processes is increasing, necessitating higher precision and efficiency in manufacturing equipment, particularly in plating and drilling stages [6][7]. - The shift towards high-end PCB products is driving upgrades in core materials such as copper foil, electronic cloth, and resin, which are essential for meeting the demands of high-speed signal transmission [7]. Group 3: Investment Opportunities - The expansion of PCB production is anticipated to create a favorable cycle for the industry, benefiting upstream material and equipment companies as demand for high-end PCBs rises [7]. - The global market for PCB-specific equipment is expected to reach 10.765 billion USD by 2029, with a compound annual growth rate of 8.7% from 2024 to 2029 [6].

Core Insights - The public fund industry has experienced a fruitful year in the structural bull market, with active equity funds making a significant comeback, particularly supported by the AI computing and innovative pharmaceutical sectors [1][2]. Group 1: Fund Performance - A total of 53 funds have achieved over 100% returns year-to-date as of September 30, with 42 of these being active equity funds, showcasing the fund managers' effective strategies in high-growth sectors [2][4]. - The top-performing fund, managed by Ren Jie, achieved a return of 194.49%, heavily investing in the overseas computing industry chain, with significant contributions from stocks like Shenghong Technology, which surged 581% this year [2][3]. - Other notable funds include Zhang Wei's fund with a 155.09% return, focusing on Hong Kong's innovative pharmaceuticals, and Feng Ludan's fund with a 140.86% return, both capitalizing on the AI industry chain [3]. Group 2: Commodity Performance - Gold ETFs have emerged as the standout performers in the commodity fund sector, with all 14 gold ETFs showing gains exceeding 40% year-to-date, driven by rising international gold prices [5][6]. - The highest-performing gold ETFs, managed by Zhao Xu and Rong Ying, reported returns of 41.48% and 41.47%, respectively, reflecting strong long-term investment value [5][6]. Group 3: Market Outlook - Looking ahead to Q4, several fund companies suggest maintaining a focus on growth sectors while also considering cyclical and consumer stocks, as the market has already seen significant gains [7][8]. - The ongoing AI technology innovation is expected to provide a premium valuation for related assets, despite potential short-term volatility [8][9]. - The overall market sentiment remains bullish, with continued optimism for emerging technologies and cyclical financial sectors, particularly in the context of the "anti-involution" policies that may enhance competition in the renewable energy sector [9].

Group 1 - The humanoid robot sector has accelerated in recent years, attracting significant attention from the capital market, with related concept stocks performing exceptionally well [1] - As of September 30, humanoid robot concept stocks have averaged an increase of 83.6% this year, significantly outperforming the Shanghai Composite Index [1] - A total of 25 concept stocks have doubled in value this year, with the top performers including Shangwei New Materials, Shenghong Technology, and Zhenyu Technology [1] Group 2 - Institutions are optimistic about the growth potential of humanoid robot concept stocks, with 27 stocks expected to have a net profit growth rate exceeding 20% in the next two years [1] - Among these high-growth stocks, four have a market capitalization exceeding 100 billion yuan, namely Shenghong Technology, Huichuan Technology, Lingyi Technology, and Huaqin Technology [1] - As of September 30, stocks with relatively low rolling price-to-earnings ratios among the 27 high-growth humanoid robot concept stocks include Zhonglian Heavy Industry, Huaqin Technology, Jihong Co., Shiyun Circuit, and Yihua Da [1]