近日，前彭博社记者合著的荷兰语新书《世界上最重要的机器》引发关注。对此 ASML 发布声明，称不认可该书内容，出版前就书面告知作者书中多处 陈述严重不实且损害其声誉，并保留进一步行动权利。ASML 强调书中有关其提 "代政府行事" 提议、有意违反多国相关协议等说法均不实，其始终依法 合规经营。 ASML始终遵守所有适用于其业务经营的法律法规，并在相关出口管制规定范围内开展业务。 来源： 芯 榜 加入"中国IC独角兽联盟"，请点击进入 是说芯语转载，欢迎关注分享 ASML声明全文如下： 对于某近期出版的新书的声明 ASML注意到近期一本以荷兰语出版、聚焦公司内容的新书引发了媒体关注。ASML不认可该书的内容。 在该书出版前，我们已通过书面形式明确告知作者，书中多处陈述存在严重不实，并对ASML声誉造成损害。我们保留采取进一步行动的权利。 书中任何关于ASML曾向任何政府提出"代其行事"的所谓提议，均与事实不符并具有严重误导性。同样，任何声称ASML有意或曾经有意违反荷兰、美国 或任何其他政府相关协议的说法，也均不属实。 ...

Core Viewpoint - The article discusses the evolution and commercialization of Extreme Ultraviolet (EUV) lithography technology, highlighting the geopolitical implications and the significant contributions from various research institutions, particularly in the U.S. and the eventual dominance of ASML in the market [1][22][23]. Group 1: Semiconductor Lithography Technology - Moore's Law indicates that the number of transistors on integrated circuits doubles approximately every two years, largely due to advancements in lithography technology [1]. - The latest advancement in lithography is EUV technology, which uses light with a wavelength of 13.5 nanometers to create patterns on chips [1][22]. - The development of EUV technology involved significant investment and research from U.S. institutions like DARPA, Bell Labs, and IBM, amounting to hundreds of millions of dollars over decades [1][22]. Group 2: Historical Context of Lithography Techniques - Early semiconductor lithography used mercury lamps emitting light at 436 nanometers, but diffraction limited the ability to create smaller features [2][4]. - Alternative methods like electron beam lithography and X-ray lithography were explored, but they faced challenges such as slow processing speeds and the complexity of X-ray sources [4][5][6]. - Optical lithography continued to evolve through techniques like immersion lithography and phase-shifting masks, delaying the need to transition to new technologies [6][8]. Group 3: Development of EUV Technology - The transition to EUV technology began in the 1990s, with significant contributions from various research labs and companies, including NTT and Bell Labs [9][16]. - The technology faced skepticism initially, but advancements in multilayer mirrors capable of reflecting X-rays led to successful demonstrations of soft X-ray lithography [10][12]. - The name "Extreme Ultraviolet Lithography" was adopted in 1993 to distinguish it from earlier X-ray techniques [15]. Group 4: Commercialization and Market Dynamics - Despite initial funding cuts in 1996, Intel continued to invest in EUV technology, forming the EUV-LLC alliance to support research and development [18][19]. - ASML emerged as a key player in the EUV market, gaining access to technology and support from major semiconductor companies like Intel, TSMC, and Samsung [19][23]. - By 2013, ASML delivered its first production EUV equipment, marking a significant milestone in the commercialization of this technology [23].

知识星球-材料汇(1300+份报告) ,链接如下 (网址复制到浏览器打开) : https://t.zsxq.com/WNpPc 或者扫一扫一下二维码 加入知识星球后,还可加入材料汇VIP群 材料汇 微信扫码加入星球 C 知识量 班 #石英制品 #硅上绝缘体 #托盘 #静电卡盘 #碳化硅CVD #半导体零部件 #晶圆制造工艺 41882 三、新能源#新能源 知识星球材料汇文章标签汇总 一、投资 #新材料投资 #投资笔记 1884 二、半导体 25 4188 #半导体 #半导体材料 #光刻胶 #电子特气 #靶材 #硅片 #湿电子化学品 #CMP #掩膜版 #先进封装 #封装基板 #封装材料 #玻璃通孔TGV #晶圆清洗材料 #凸点 #硅通孔TSV #芯 片黏接材料 #光敏绝缘介质材料 #PSPI #BCB #玻璃基板 #电镀液 #重布线层RDL #环氧塑 封料 #硅微粉 #金刚线 #HBM #封装设备 #底部填充料 #固晶胶 #热界面材料 #陶瓷基板 #半导体设备 #光刻机 #蚀刻机 #薄膜沉积 #离子注入 #DUV #涂胶显影设备 #量测设备 #第三代半导体 #碳化硅 #氮化鎵 #第四代半导体 #氧化鎵 #光 ...

Group 1: Investment Opportunities - The article emphasizes the importance of understanding the investment landscape in new materials, particularly in sectors like semiconductors, renewable energy, and advanced manufacturing [4][6][9]. - It highlights various investment strategies based on the maturity stage of companies, from seed rounds to pre-IPO stages, indicating that risk and potential returns vary significantly across these stages [8]. Group 2: Industry Trends - The document outlines key trends in the semiconductor industry, including advancements in materials and technologies such as FinFET and GAA architectures, which are crucial for future developments [13]. - It discusses the growing significance of new energy materials, particularly in lithium batteries and solid-state technologies, as the demand for sustainable energy solutions increases [4][5]. Group 3: Company Profiles - The article lists notable companies in the new materials sector, including ASML, TSMC, and Tesla, which are recognized for their innovation and market leadership [6]. - It mentions the role of companies in driving technological advancements and their contributions to achieving carbon neutrality and lightweight solutions in various industries [6][9].

Core Insights - Investor focus is currently on a select group of mega-cap AI companies that are leading the recent market rally [1] Group 1 - The market rally is primarily driven by a few dominant AI leaders [1]

Group 1 - Semiconductor stocks in the US experienced a broad decline on Friday [1] - Notable declines included Nanowire Semiconductor (NVTS.US) down over 4%, AMD (AMD.US) down over 3%, and TSMC (TSM.US) down nearly 3% [1] - Micron Technology (MU.US) and ASML (ASML.US) also saw declines of over 2% [1]

格隆汇11月21日｜阿斯麦周四在美国亚利桑那州凤凰城成立技术学院，专门培训工程师维修及保养其高 度复杂的芯片制造设备。新设施邻近凤凰城机场，目标每年培训逾1000名工程师，以支援美国迅速扩张 的先进芯片产能。阿斯麦副总裁Clayton Patch表示，其DUV及EUV设备复杂程度可媲美F-35等战机，最 先进EUV设备造价约4亿美元，运送亦需多架747货机。他称具军机维修背景的退伍军人极为合适，亦 是公司最属意的招聘对象。 ...

Core Insights - ASML has launched a technical academy in Phoenix to train engineers for servicing its complex chipmaking machines [1] Company Summary - The new technical academy aims to enhance the skill set of engineers specifically for ASML's advanced chipmaking technology [1]

Core Viewpoint - The article emphasizes the significant technological gap between ASML's advanced lithography machines and domestic Chinese alternatives, highlighting the complexities involved in semiconductor manufacturing and the need for realistic assessments of China's capabilities in this field [3][4][10]. Summary by Sections ASML's Technology Showcase - ASML showcased its advanced DUV lithography machines, TWINSCAN XT:260 and TWINSCAN NXT:870B, at the China International Import Expo, with the XT:260 being particularly noted for its dual exposure capabilities aimed at advanced packaging [1][3]. Technical Complexity of Lithography Machines - The complexity of lithography machines extends beyond resolution metrics, involving a sophisticated integration of optics, mechanics, electronics, software, and materials, with ASML's EUV machines containing over 100,000 components from more than 5,000 suppliers [4][5]. Challenges in Domestic Development - Domestic lithography machines face significant challenges, including the need for extensive debugging and optimization, which typically requires 6-12 months post-assembly to achieve stable production [6][7]. Importance of Local Collaboration - For domestic lithography machines to achieve sustainable industrial capabilities, collaboration with local customers is essential, as real-world operational data is crucial for performance optimization and stability [6][7]. Market Dynamics and ASML's Position - ASML's market share in China is expected to decrease from a peak of 46% to around 20% by 2025, not due to domestic alternatives but rather a normalization of demand as existing orders are fulfilled [8][10]. Misinterpretation of Industry Signals - Claims of a strong domestic semiconductor industry based on increased chip exports are misleading, as these exports primarily consist of mature process chips that do not require advanced lithography technology [9][10]. Realistic Assessment of Progress - The article argues for a realistic acknowledgment of the technological gap in the semiconductor industry, stressing that genuine progress requires a grounded understanding of current capabilities rather than optimistic narratives [10][14]. Future Outlook - The future of the semiconductor industry will belong to those who face reality, invest continuously, and accumulate knowledge, with a call for a pragmatic approach to technological development in China [14][15].

Core Viewpoint - The article emphasizes the significant technological gap between ASML's advanced lithography machines and domestic Chinese alternatives, highlighting the complexities involved in semiconductor manufacturing and the need for realistic assessments of China's capabilities in this field [3][4][10]. Summary by Sections ASML's Technology Showcase - ASML showcased its advanced DUV lithography solutions, particularly the TWINSCAN XT:260 and TWINSCAN NXT:870B, at the 2025 China International Import Expo [1]. - The XT:260, designed for advanced packaging, features dual exposure capabilities and is based on the XT4 platform [3]. Technical Complexity of Lithography Machines - Modern lithography machines are intricate systems that integrate multiple disciplines, including optics, mechanics, electronics, software, and materials [4]. - ASML's EUV lithography machine consists of over 100,000 components from more than 5,000 suppliers, requiring precise coordination at the nanometer level [4][5]. Challenges in Domestic Development - The transition from assembling a lithography machine to achieving stable mass production typically requires a 6-12 month debugging period, emphasizing the importance of real-world data and experience [6]. - For domestic lithography machines to achieve sustainable industrial capabilities, collaboration with local customers is essential for performance optimization and long-term support [6][7]. Market Dynamics and Demand - ASML's recent orders totaled €2.6 billion in Q3 2024, with €1.4 billion for EUV machines, indicating strong demand primarily from companies like TSMC and Intel, rather than from China [10]. - ASML's market share in China is expected to decrease from 46% to around 20% by 2025, not due to domestic alternatives but because of fulfilled demand and a recovering global market [8]. Misinterpretations and Realities - Claims of a significant increase in Chinese semiconductor exports are misleading, as they primarily involve mature process chips that do not require advanced lithography technology [9]. - The article critiques the tendency to conflate advancements in packaging technology with breakthroughs in manufacturing technology, stressing the need for a clear understanding of the distinctions [5][10]. Future Outlook - The future of the semiconductor industry will belong to those who face reality, invest continuously, and accumulate knowledge over time [14]. - The article concludes that while China has made progress in certain areas of the semiconductor industry, the gap in lithography technology remains significant, and acknowledging this gap is crucial for realistic development strategies [10][15].