Core Viewpoint - The article discusses the anticipated trends in the DRAM market for Q1 and Q2 of 2025, highlighting price adjustments and supply chain dynamics influenced by international conditions and demand shifts across various sectors [1][4][5]. Summary by Sections DRAM Price Trends - In Q1 2025, prices for various DRAM types are expected to decline significantly, with Conventional DRAM projected to drop by 8% to 13%. For Q2 2025, the decline is expected to narrow to 0% to 5% for Conventional DRAM, while HBM prices are anticipated to increase by 3% to 8% due to the ramp-up of HBM3e 12hi [2][4]. Supply Chain Dynamics - Major PC OEMs are increasing assembly volumes to reduce DRAM inventory levels. This is expected to lead to higher procurement from DRAM manufacturers in Q2 2025, particularly for those with low inventory levels [4][5]. - Samsung's HBM product certification is lagging, while SK hynix is focusing on Server and Mobile DRAM production, limiting the supply of PC DDR5 [4][5]. Mobile and Graphics DRAM - Mobile DRAM prices are expected to stabilize or increase slightly due to rising demand from high-end smartphones and other sectors. LPDDR5X is projected to see a price increase of 0% to 5%, while LPDDR4X may decline by 0% to 5% [6][7]. - Graphics DRAM demand is shifting towards GDDR7, with GDDR6 prices expected to decline by 3% to 8% due to increased demand from new models [6][7]. Consumer DRAM Outlook - The demand for Consumer DRAM is expected to gradually increase due to new projects like 4G/5G base station expansions. DDR4 prices are projected to rise by 0% to 5% in Q2 2025, while DDR3 prices are expected to remain stable [7].

Core Insights - NVIDIA is expected to launch the GB300 chip ahead of schedule in Q2 2025, with improvements in computing performance, memory capacity, network connectivity, and power management compared to the GB200 chip [1] - The GB300 chip and Compute Tray are projected to begin production in May 2025, with ODMs starting initial engineering sample designs [1] - The demand for specialized products in the Chinese market has significantly increased due to the DeepSeek effect [1] Summary by Sections GB300 Specifications - The GB300 NVL72 features upgraded networking specifications to meet higher bandwidth requirements, enhancing overall computing performance [2] - The TDP for the GB300 system is expected to rise to between 135KW and 140KW, with most manufacturers continuing to use liquid cooling methods to ensure effective heat dissipation [2] Cooling Component Design - The cooling plate design for the GB300 will shift from an integrated module to individual chip installations, increasing the value of the cooling plates in the Compute Tray [3] - The change in design will lead to a significant increase in the usage of quick disconnects (QDs), with more suppliers expected to join the market for GB300 [3] Market Dynamics - The GB200 and GB300 Rack solutions' market performance will be influenced by several factors, including the ongoing impact of the DeepSeek effect and potential shifts in customer preferences towards self-developed ASICs or simpler, cost-effective AI server solutions [3]

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