华天科技（002185）公告，公司拟由全资子公司华天科技(江苏)有限公司、华天科技(昆山)电子有限公 司及全资下属合伙企业华天先进壹号(南京)股权投资合伙企业共同出资，设立全资子公司南京华天先进 封装有限公司。拟新设公司注册资本总额20亿元，其中华天江苏认缴出资10亿元，占比50%，华天昆山 认缴出资6.65亿元，占比33.25%，先进壹号认缴出资3.35亿元，占比16.75%。该投资旨在加强在先进封 装领域的竞争能力，满足未来战略发展需要。 ...

[Table_Title] 研究报告 Research Report 31 Jul 2025 中国电子 China (Overseas) Technology 全球科技业绩快报：Lam Research 4Q25 FY2025 Global Tech Earnings Snapshot: Lam Research 4Q25 姚书桥 Barney Yao barney.sq.yao@htisec.com [Table_yemei1] 热点速评 Flash Analysis [Table_summary] (Please see APPENDIX 1 for English summary) 事件 Lam Research 2025 年 4Q 业绩表现强劲，营收达 51.7 亿美元，较 3Q 的 47.2 亿美元环比增长约 9.5%，且处于此前指 引区间上限。盈利端同样亮眼，非 GAAP 每股收益（EPS）达 1.33 美元，较 3Q 的 1.04 美元显著提升，创历史新高， 毛利率突破 50%，晶圆厂及设备升级业务收入均刷新纪录。年度维度上，2025 财年营收达 184.4 亿美元，较 2024 财年的 149 ...

来源：新浪证券-红岸工作室 7月31日，汇成股份跌1.63%，成交额4.73亿元，换手率7.38%，总市值91.25亿元。 异动分析 先进封装+芯片概念+OLED+人民币贬值受益+专精特新 1、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是Chiplet的基础之一。在研发端，公司将以客户需求为导 向，基于凸块制造技术，纵向拓展技术边界，积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 2、合肥新汇成微电子股份有限公司的主营业务是集成电路高端先进封装测试服务。公司的主要产品是 集成电路封装测试。 主力没有控盘，筹码分布非常分散，主力成交额1.78亿，占总成交额的4.85%。 技术面：筹码平均交易成本为10.22元 3、2024年7月3日公司投资者关系活动记录表：公司目前OLED客户主要包括联咏、瑞鼎、奕力、云英 谷、集创北方、芯颖、傲显、昇显微、晟合微等。 4、根据2024年年报，公司海外营收占比为54.15%，受益于人民币贬值。 5、专精特新"小巨人"企业是全国中小企业评定工作中最 ...

Group 1 - The core viewpoint is that 3D printing is accelerating its penetration in the consumer electronics sector, marking the beginning of a new era for applications such as foldable device hinges and watch/mobile phone frames [1] - AI training and inference costs are decreasing, leading to a boom in applications, with significant potential in edge AI, particularly through devices like headphones and glasses [1] - SEMI forecasts that global semiconductor equipment sales will reach a new high of $125.5 billion in 2025, a year-on-year increase of 7.4%, with expectations to reach $138.1 billion by 2026 driven by advanced logic, memory, and technology migration [1] Group 2 - The demand for computing power is surging due to the AI wave, significantly increasing the value in segments such as servers, AI chips, optical chips, storage, and PCBs [1] - The importance of advanced packaging is highlighted, with CoWoS and HBM positioning themselves to capitalize on AI industry trends [1] - There is a recovery trend in upstream sectors such as passive components, digital SoCs, RF, and storage, with storage prices rebounding from their lows and testing capacity gradually recovering [1] Group 3 - The Consumer Electronics ETF (561310) tracks the Consumer Electronics Index (931494), which selects listed companies involved in the manufacturing of consumer electronics products and related industries, covering areas like smartphones, home appliances, and personal computers [1] - This index reflects the integration of technology and consumption, showcasing the development trends and market dynamics of related industries [1]

Core Viewpoint - The article emphasizes the investment value of significant events, industry chain companies, and key policy interpretations, highlighting the importance of timely and professional information analysis in the market [1] Group 1: Company Overview - The company specializes in advanced packaging and storage chips, ranking among the top three globally in its niche [1] - High-performance advanced packaging technology has entered mass production, indicating a strong operational capability [1] - The company provides packaging and testing services for various storage chip products, showcasing its versatility in the semiconductor industry [1] Group 2: Technological Capabilities - Multiple packaging technologies are applicable to end products such as drones and smart robots, reflecting the company's innovation in catering to emerging markets [1] - Automotive power modules have received automotive-grade certification, demonstrating the company's commitment to quality and industry standards [1] Group 3: Production Capacity - The company has established eight major production bases across three countries, indicating a robust global manufacturing footprint [1]

Core Viewpoint - The advanced packaging concept sector has shown a positive performance with a 1.91% increase, ranking 10th among concept sectors, driven by significant gains in several stocks [1][2]. Group 1: Stock Performance - 98 stocks within the advanced packaging concept rose, with Fangbang Co., Ltd. hitting a 20% limit up, while other notable gainers included Zhengye Technology (17.49%), Tianfu Communication (13.83%), and Tiancheng Technology (12.32%) [1]. - Conversely, stocks such as Zhongqi New Materials, Dazhu Laser, and Xingye Co., Ltd. experienced declines of 2.44%, 2.24%, and 1.53% respectively [1]. Group 2: Capital Flow - The advanced packaging concept saw a net outflow of 918 million yuan from major funds, with 53 stocks receiving net inflows, and 12 stocks attracting over 50 million yuan each [2]. - Tianfu Communication led the net inflow with 439 million yuan, followed by Changdian Technology (160 million yuan), and Saiwei Electronics (153 million yuan) [2]. Group 3: Capital Inflow Ratios - Stocks such as *ST Huamei, Woge Optoelectronics, and Guoxin Technology had the highest net inflow ratios at 39.39%, 23.41%, and 12.02% respectively [3]. - The advanced packaging concept's capital inflow rankings highlighted Tianfu Communication with a 6.64% net inflow ratio, followed by Changdian Technology (6.76%) and Saiwei Electronics (8.69%) [3][4].

Group 1 - The core viewpoint of the report is that the company, ChipMOS Technologies (688630.SH), is rated as a buy due to its leading position in direct-write lithography and its significant exposure to the PCB and semiconductor sectors [2] - The first logic supporting the rating is the PCB business, which is expected to benefit from increased capital expenditures driven by AI infrastructure, along with the expansion of production capacity in the second phase to enhance performance [2] - The second logic is related to the semiconductor business, where the acceleration of equipment industrialization and multi-faceted layout is expected to create new growth trajectories [2]

Investment Rating - The investment rating for the company is "Buy" [9] Core Views - The company benefits from the expansion of PCB equipment and the acceleration of semiconductor equipment layout, maintaining a "Buy" rating. Despite a downward revision of the company's annual profit forecast due to limited capacity in the first phase of the factory, the company is expected to benefit from downstream PCB manufacturers' expansion and the upcoming production of the second-phase factory, leading to a positive mid-term performance release. Long-term, the company's semiconductor business is gradually constructing multiple growth drivers, with projected revenues of 1.5 billion, 2.2 billion, and 2.7 billion yuan for 2025, 2026, and 2027 respectively, and net profits of 300 million, 516 million, and 709 million yuan for the same years [5][6][9]. Company Overview - The company is a leading manufacturer of direct imaging lithography equipment, primarily serving the PCB and semiconductor sectors. Its products include direct imaging equipment for PCB and semiconductor applications, covering various processes from microns to nanometers. The company has a complete range of LDI equipment for PCB manufacturing, including IC substrates, HDI, and flexible printed circuits [6][15]. PCB Business - The PCB business is driven by high-end demand from AI infrastructure, with optimistic capital expenditure guidance from PCB manufacturers. The company has maintained a full order book since Q2 2024, but growth has been limited by capacity constraints. The gradual production of the second-phase factory is expected to release capacity and positively impact order growth [6][15]. Semiconductor Business - The semiconductor business is accelerating its industrialization process, with multiple layouts constructing a new growth curve. The company is focusing on advanced packaging technologies and has successfully completed product validation for several advanced packaging customers. The company is also making steady progress in the general semiconductor field, benefiting from the long-term trend of domestic substitution [7][36]. Financial Summary and Valuation Metrics - The company's revenue has shown steady growth, with a projected revenue of 1.467 billion yuan in 2025, representing a year-on-year increase of 53.8%. The net profit is expected to reach 300 million yuan, with a year-on-year growth of 86.7%. The gross margin is projected to be 39.9% in 2025, with a net margin of 20.4% [8][34]. Market Position - The company has established a strong market position with a complete range of products covering various PCB types and processes. It has successfully penetrated the high-end PCB market and is positioned to benefit from the ongoing expansion in the semiconductor sector [6][15].

| 概念板块 | 板块涨跌 | 相对大盘涨跌 | 板块主力资金 | 领涨股 | 涨跌幅 | 主力资金（万 | | --- | --- | --- | --- | --- | --- | --- | | | （%） | （%） | （亿元） | | （%） | 元） | | 共封装光学 | 5.30 | 5.19 | 31.77 | 仕佳光 | 24.59 | 21301.22 | | (CPO) | | | | 子 | | | | AI PC | 5.31 | 5.20 | 26.24 | 景旺电 子 | 24.40 | 19367.88 | | 中国AI 50 | 2.64 | 2.53 | 26.11 | 寒武纪 | 18.42 | 78499.66 | | 先进封装 | 5.30 | 5.19 | 21.70 | 方邦股 份 | 46.86 | 7583.98 | | 仿制药一致性 评价 | 3.70 | 3.59 | 19.99 | 亚太药 业 | 28.98 | 41461.29 | | 5G | 3.45 | 3.34 | 19.48 | 方邦股 份 | 46.86 | 7583.98 | | F ...

Group 1 - The article highlights the importance of weekly announcements from Sunday to Thursday, which include significant stock market updates such as suspensions, increases or decreases in holdings, investment wins, acquisitions, earnings reports, unlocks, and high transfers [1] - It emphasizes the need for investors to identify investment hotspots and prevent various black swan events by having sufficient time to analyze and find suitable listed companies [1] Group 2 - The first company mentioned is a leading enterprise in the field of direct-write lithography equipment in China, focusing on PCB concepts, lithography machines, advanced packaging, and third-generation semiconductors [1] - The second company specializes in high-frequency and high-speed copper cable connections, primarily supplying Amphenol, and is involved in sectors such as robotics, data centers, Huawei, and photovoltaics [1] - The third company is engaged in innovative drugs, including weight loss medications and medical aesthetics, with multiple innovative drug indications receiving clinical trial approvals this year [1]