Industry Overview - The storage chip market, particularly NOR Flash, is experiencing rapid growth driven by advancements in technologies such as artificial intelligence and the Internet of Things, despite a lackluster performance last year due to supply and demand factors [2] - In the first half of this year, the market showed signs of recovery with significant inventory reduction and gradual demand restoration, particularly in industrial markets and supported by long-term demand from AI and high-performance computing [2] - Starting from the third quarter, overall storage demand is rebounding, with prices showing an upward trend, indicating a positive outlook for the second half of the year [2] Company Performance - In the first half of the year, the revenue rankings among storage chip manufacturers are as follows: Zhaoyi Innovation (4150.31 million), Beijing Junzheng (2249.11 million), Fudan Microelectronics (1838.85 million), Puran Co. (906.70 million), Jucheng Co. (574.86 million), Dongxin Co. (342.99 million), and Hengshuo Co. (174.28 million) [3] - Zhaoyi Innovation leads in net profit with 575.48 million, followed by Jucheng Co. (205.15 million) and Beijing Junzheng (203.12 million), while Dongxin Co. and Hengshuo Co. reported losses of 110.97 million and 70.78 million respectively [4] - In terms of gross margin, Jucheng Co. has the highest at 60.25%, followed by Fudan Microelectronics at 56.80%, and Zhaoyi Innovation at 37.21% [5] Inventory Management - Fudan Microelectronics holds the highest inventory at 3088.98 million, followed by Beijing Junzheng (2773.43 million) and Zhaoyi Innovation (2400.65 million) [6] - Inventory turnover days are highest for Fudan Microelectronics at 705 days, with Dongxin Co. at 596 days and Hengshuo Co. at 355.66 days, while Zhaoyi Innovation has the lowest at 163.95 days [7] - In terms of inventory impairment provisions, Fudan Microelectronics has the highest at 548.26 million, followed by Zhaoyi Innovation (287.39 million) and Beijing Junzheng (263.53 million) [7]

集微网消息（文/罗叶馨梅）9月19日，捷捷微电（300623）在投资者互动平台回答投资者提问时表示，公司的PC电源框架采用模块化设计理念，能够完美适 配Intel® 800系列芯片组及最新处理器架构。 公司方面指出，将持续以创新技术赋能PC电源设计，通过更高效、更智能的功率解决方案，助力客户打造下一代高性能计算平台。 随着AI算力与高性能计算需求提升，PC电源设计正朝着模块化、高效率方向发展。捷捷微电相关方案有望进一步提升在PC与计算机电源领域的市场竞争 力。 ...

Core Viewpoint - Glass is gaining attention as the next-generation packaging substrate material due to its numerous advantages over organic substrates, including lower thermal expansion, improved flatness, and reduced transmission loss for high-frequency applications [1][2][3]. Group 1: Advantages of Glass Substrates - Glass substrates are significantly flatter and have a lower thermal expansion coefficient compared to organic substrates, simplifying lithography processes [2]. - The warpage issues associated with multi-chip packaging have been notably improved with glass substrates, allowing for better chip bonding and alignment [2]. - Glass substrates provide extremely low transmission loss for high-frequency devices, making them suitable for applications like 6G communications [3][4]. Group 2: Manufacturing Challenges - The cutting of glass substrates can lead to micro-cracks, which pose a significant manufacturing challenge [3][17]. - The process of creating through-glass vias (TGV) is complex, with challenges in achieving high yield rates due to the need for precise laser etching and filling techniques [6][12]. - Despite the challenges, companies like Intel continue to invest heavily in glass substrate technology, indicating a strong belief in its potential for high-performance computing and AI applications [3][12]. Group 3: Innovations in Glass Processing - Recent advancements in laser-induced deep etching (LIDE) technology have improved the manufacturing process for TGVs, allowing for smaller and more precise vias [6][10]. - The use of automated systems for wet etching processes has been developed to enhance the efficiency and yield of glass substrate production [7][10]. - New methods, such as embedding cut glass substrates in organic resin for edge protection, are being explored to mitigate issues related to cracking during processing [19][20]. Group 4: Future Outlook - The glass ecosystem is preparing for the ongoing growth in chip and substrate sizes for advanced multi-chip packaging, with significant progress being made in the industry [22]. - The potential for direct laser etching using excimer lasers is being considered as a more environmentally friendly alternative to traditional methods, provided it can meet the requirements for subsequent copper filling [22]. - Continued research into polymer retraction techniques before cutting may help prevent micro-cracking, indicating a focus on improving manufacturing processes for glass substrates [22].

公众号记得加星标⭐️，第一时间看推送不会错过。 预计到 2034 年，全球微处理器芯片制造市场规模将从 2024 年的1146 亿美元增至约2615 亿美元， 在 2025 年至 2034 年的预测期内以8.6%的复合年增长率增长。2024年，亚太地区 占据主导地位， 占有超过61.4% 的份额，收入为703 亿美元。 微处理器芯片制造市场是指从事设计、制造和供应微处理器单元（MPU）的行业，微处理器单元是 计算设备的中央处理单元。微处理器是在电子系统中执行算术、逻辑、控制和输入/输出操作的集成 电路。 市场驱动力来自对高性能计算日益增长的需求、互联设备的日益普及以及云基础设施的扩展。人工智 能、机器学习和高级数据分析的发展需要强大的处理器，从而推动了微处理器设计的创新。随着电动 汽车和自动驾驶的兴起，汽车行业对专用芯片的需求也显著增加。 来源 ： 内容 编译自 market 。 消费电子产品的需求最为强劲，尤其是智能手机、笔记本电脑、平板电脑和游戏机，这些领域构成了 微处理器的最大市场。数据中心和云服务提供商也是主要的消费市场，需要强大的芯片来处理海量工 作负载。随着汽车集成先进的驾驶辅助系统、信息娱乐和互 ...

The big story is these Bitcoin miners are getting that bid from the HPC scene. This is not going away – it’s only getting stronger. Where a lot of people thought this was going to cool off, we’re interested to see on the ground level how this plays out. What portion of these facilities are going to be Bitcoin mining versus HPC? Are they going to do that hybrid model, or completely scrap and go towards HPC?We saw some major breakouts in the market this week. Cipher Mining was up 39% this week to $10.32. Bitf ...

Core Viewpoint - Glass is transitioning from a background consumable to a core component in semiconductor packaging, providing essential substrates and dielectric materials for advanced applications [2][4]. Group 1: Glass in Semiconductor Manufacturing - Glass substrates are increasingly used in modern wafer fabs, supporting silicon wafers and forming sealed MEMS caps [2]. - The demand for higher bandwidth and power density in AI and high-performance computing (HPC) is driving the need for advanced packaging solutions, where glass can offer better performance than traditional organic laminates and silicon interposers [3][4]. Group 2: Market Potential and Applications - The low dielectric loss and optical transparency of glass make it a significant growth driver beyond computing packaging, particularly in photonic applications [6]. - Co-packaged optical devices (CPO) are being developed to simplify fiber connections, leveraging glass's capabilities to support electrical redistribution layers and low-loss waveguides [6]. Group 3: Supply Chain Insights - The transition from pilot lines to mass production for glass substrates hinges on advancements in laser drilling, copper filling, and panel processing technologies [8]. - Understanding the competitive landscape with silicon and improved organic materials is crucial, as foundries push for mixed wafer-level redistribution, which may diminish glass's advantages [8].

Company Overview - Tongfu Microelectronics is an integrated circuit packaging and testing service provider, offering one-stop services from design simulation to packaging testing for global clients [2][3] - The company covers various fields including AI, high-performance computing, big data storage, 5G, IoT, automotive electronics, and industrial control [2][3] - Major shareholder is Nantong Huada Microelectronics Group, with stable equity structure [2] Financial Performance - Revenue for 2022, 2023, 2024, and the first half of 2025: CNY 21.429 billion, CNY 22.269 billion, CNY 23.882 billion, and CNY 13.038 billion respectively [3] - Net profit for the same periods: CNY 0.502 billion, CNY 0.169 billion, CNY 0.678 billion, and CNY 0.412 billion [3] - 2024 revenue growth of 7.24% and net profit growth of 299.90% [6] - 2025 H1 revenue growth of 17.67% and net profit growth of 27.72% [6] Industry Situation - Global semiconductor market reached USD 346 billion in H1 2025, a year-on-year growth of 18.9% [4] - Forecast for 2025 global semiconductor market size is USD 728 billion, up 15.4% from 2024 [4] - Expected market size for 2026 is USD 800 billion, with a further growth of 9.9% [4] Key Trends in Semiconductor Market - AI-driven growth continues; Asia-Pacific IC design market expected to grow by 15% in 2025 [5] - TSMC maintains dominance in wafer foundry; strong demand for advanced processes [5] - 2025 is a critical year for 2nm wafer manufacturing technology [5] Business Performance in Specific Fields - In H1 2025, the company increased market share in mobile, home appliance, and automotive sectors [9] - Focus on AI and high-performance products, with successful integration of Suzhou and Penang factories [9] Technology Development - Significant progress in large-size FCBGA development, with mass production initiated [11] - Breakthroughs in optical-electrical hybrid packaging technology [11] - Over 1,700 patent applications, with nearly 70% being invention patents [8] Future Outlook - Continued growth expected in AI and new energy vehicle sectors in H2 2025 [10] - Chinese IC packaging and testing industry is anticipated to transition from "catching up" to "keeping pace" and potentially "leading" [10]

每经记者｜王晶 每经编辑｜文多 封面图片来源：视觉中国-VCG211478193393 9月16日，联发科方面宣布，公司首款采用台积电2纳米制程的旗舰系统单芯片（SoC）已成功完成设计 流片，预计将于明年底进入量产。"流片"是半导体研发过程中一个关键节点，它标志着芯片设计阶段基 本完成，进入到真正的制造验证环节。 在半导体产业中，纳米数越小，代表晶体管的体积更小、密度更高，芯片性能越强。目前，台积电、三 星、英特尔等均在竞逐更小制程，因为2纳米制程不仅意味着手机处理器性能和能效的进一步跃升，它 还能为端侧大模型、生成式AI、高性能计算等应用提供保障。 具体来看，台积电的2纳米制程技术首次采用纳米片电晶体结构，能够带来更优异的性能、功耗与良 率。联发科方面表示："台积电增强版2纳米制程技术与现有的N3E（台积电3纳米制程工艺升级版）制 程相比，逻辑密度增加1.2倍，在相同功耗下性能提升高达18%，并能在相同速度下功耗减少约36%。" 尽管台积电在技术方面取得突破，但高昂的制造成本仍然是行业面临的一大考验。有消息称，一枚2纳 米制程晶圆的成本约为3万美元，包括苹果、英伟达等在内的厂商需要在"性能"与"成本"之间进 ...

根据协议条款，英伟达承诺在2025年至2032年4月13日期间，承担购买CoreWeave未被客户使用的剩余 产能的义务，前提是CoreWeave满足交付及服务可用性等条件。这一安排不仅有助于CoreWeave提高产 能利用率，也为英伟达在人工智能及高性能计算领域提供了更多算力支持。 CoreWeave(CRWV.US)股价走高，截至发稿，该股涨超5%，报118.1美元。CoreWeave宣布与英伟达 (NVDA.US)在2023年4月10日签署的协议基础上，达成一份新的订单协议，初始价值高达63亿美元。该 协议旨在为CoreWeave客户提供预留的云计算容量，并在客户未完全使用其数据中心产能时，由英伟达 购买剩余的闲置产能。 ...

智通财经APP获悉，CoreWeave(CRWV.US)股价走高，截至发稿，该股涨超5%，报118.1美元。 CoreWeave宣布与英伟达(NVDA.US)在2023年4月10日签署的协议基础上，达成一份新的订单协议，初 始价值高达63亿美元。该协议旨在为CoreWeave客户提供预留的云计算容量，并在客户未完全使用其数 据中心产能时，由英伟达购买剩余的闲置产能。 根据协议条款，英伟达承诺在2025年至2032年4月13日期间，承担购买CoreWeave未被客户使用的剩余 产能的义务，前提是CoreWeave满足交付及服务可用性等条件。这一安排不仅有助于CoreWeave提高产 能利用率，也为英伟达在人工智能及高性能计算领域提供了更多算力支持。 ...