公众号记得加星标⭐️，第一时间看推送不会错过。 在AI芯片快速发展的浪潮中，GPU、AI ASIC等高性能计算（HPC）核心，以及HBM（高带宽内 存），正成为采用 2.5D/3D 封装技术的高端产品的主力军。先进封装平台对于提升器件的性能和带 宽至关重要，其重要性已使其成为半导体领域最热门的话题，热度甚至超越了以往的尖端工艺节点。 近期，有关英特尔的先进封装技术 EMIB 正被科技巨头苹果和高通评估的消息引发了广泛关注：苹 果在相关招聘信息中，寻求熟悉 CoWoS、EMIB、SoIC、PoP 等技术的 DRAM 封装工程师；高通 也在招募资料中心产品管理总监，要求熟悉英特尔EMIB技术。虽然这些动作尚不意味着两大芯片设 计巨头已正式转向，但它们明确透露出全球顶级自研芯片企业正在积极评估英特尔作为台积电之外的 潜在替代方案。 图片来源：高通公司 而在AI芯片的先进封装领域，台积电、英特尔和三星已经形成了"三强鼎立"的格局。由于自身定位不 同，这三家公司在产业链中也承担着不同的封装角色。据Yole Group的分析，短期来看，2025年第 二季度先进封装收入将超过120亿美元。在人工智能和高性能计算强劲需求的推 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来 源 ： 内容 编译自 eetjp ，谢谢 。 研 究 公 司 SDKI Analytics （ 以 下 简 称 SDKI ） 于 2025 年 11 月 发 布 了 《 芯 片 市 场 研 究 报 告 ： 2026-2035 年预测》。根据该报告，芯片市场规模预计在 2024 年达到 92 亿美元，在 2026 年至 2035 年间以 29.1% 的复合年增长率增长，到 2035 年达到 1454 亿美元。 预计在预测期内，日本芯片市场将以 30.3% 的复合年增长率增长，其驱动因素包括国内物联网生 态系统、人口老龄化导致医疗设备的普及、为促进人工智能应用而开发的机器人基础设施，以及经 济产业省和新能源产业技术综合开发机构 (NEDO) 对数字机构的推动。 芯片组市场正在增长，因为芯片组可以生产小型、独立的功能模块，逐渐成为大型单芯片的替代方 案。大型单芯片需要大量的资本投入，且良率较低。此外，推动芯片组市场增长的其他因素还包 括：对能够执行复杂任务（例如人工智能辅助系统）的处理器的需求不断增长，以及研发投入的增 加。 按处理器类型划分，CPU芯片将作为计算系统的 ...

生益电子表示，公司拟通过本次募集资金扩大经营规模，利用现有行业领先工艺体系、先进的生产管理 经验，进一步提高高端PCB产能、实现技术产业化落地。利用公司作为PCB行业领先企业的技术优势， 打破同质化竞争，不断提升产品的技术含量与品质水平，巩固和扩大竞争优势，推动国内PCB行业向高 端化、高附加值方向发展。 公告显示，人工智能计算HDI生产基地建设项目地点位于广东省东莞市东城街道方中延长线余屋段北 侧，预计建设周期为36个月，第三年开始试生产，至第五年达产，计划总投资为20.32亿元，拟使用本 次向特定对象发行股票募集资金投入10亿元。截至目前，本项目正在办理发改备案、环评批复等相关手 续。 智能制造高多层算力电路板项目地点位于江西省吉安市井冈山经济技术开发区京九大道19号，项目分两 阶段建设，预计建设期合计30个月，第一阶段于第二年开始试生产，至第三年达产，第二阶段于第三年 开始试生产，至第四年达产，项目计划总投资为19.37亿元，拟使用本次向特定对象发行股票募集资金 投入11亿元。截至目前，该项目正在办理发改备案、环评批复等相关手续。 生益电子称，本次募集资金投资项目主要围绕公司主营业务展开，符合国家产业政 ...

Core Insights - The 2025 Global Computing Conference (CGC) hosted the release of the "2025 Annual Global Computing Industry Application Case Compilation (GMVPS)" which serves as an annual benchmark for innovation in the global computing industry [1] - The event featured nearly 60 submitted cases across more than ten industries, highlighting the breadth of innovation in the computing sector [1][8] Group 1: Case Collection and Evaluation - The case collection process, initiated on July 21, received strong support from various communities and attracted numerous submissions from GCC member units and industry partners [8] - The focus areas included intelligent computing, high-performance computing, green computing, and edge computing, covering advanced efficiency, secure computing, and intelligent systems [8] - A committee composed of technical experts, industry leaders, and media representatives conducted multiple rounds of material reviews and evaluations to select benchmark cases in technology innovation and industry application [13] Group 2: Special Recommendations and Recognitions - The newly introduced "Committee Special Recommendation" title emphasizes technological breakthroughs and industry demonstration, with a list of notable cases announced [14] - Selected cases include advanced solutions from companies like China Mobile, Huawei, and Lenovo, showcasing significant contributions to the computing landscape [16][17] Group 3: Ecosystem Development and Future Outlook - The GMVPS case selection activity aims to build bridges for industry innovation, promoting deep integration of computing technology across various sectors [19] - The release of the annual case collection not only showcases outstanding industry practices but also establishes a platform for technical exchange and resource sharing [19] - The alliance plans to continue gathering industry forces to enhance collaborative innovation, focusing on trends like intelligent upgrades and green low-carbon initiatives, thereby driving sustainable growth in the global digital economy [19]

Core Viewpoint - Moore Threads (688795) is set to launch its IPO on November 24, focusing on the development and sales of GPUs and related products, primarily targeting high-performance computing sectors such as AI and digital twins [1] Company Overview - Moore Threads was established in 2020 and specializes in the research, design, and sales of full-featured GPUs [1] - The company aims to provide computing acceleration platforms for high-performance computing applications [1] IPO Details - The IPO will involve a combination of strategic placement to select investors, offline inquiries for qualified investors, and online pricing for public investors holding non-restricted A-shares and depositary receipts [1] - The company plans to issue 70 million shares, with the preliminary inquiry date set for November 19 and the subscription date for both offline and online on November 24 [1] - The pricing mechanism will involve a preliminary inquiry to determine the issue price, with no cumulative bidding for offline inquiries [1] Financial Status - As of the announcement date of the prospectus, Moore Threads has not yet achieved profitability [1] - If the company remains unprofitable at the time of listing, it will be classified under the Sci-Tech Growth tier from the date of listing [1]

越通社11月12日报道，岘港市11月11日通过关于投资计算基础设施以服务芯片半导体设计与人工智能研 发的项目书，总投资额达2000多亿越盾（合人民币5400万元），资金来源为市财政预算。 岘港市人委会称，当前，全球步入人工智能与半导体时代，计算能力正成为决定各国竞争地位关键因 素。岘港市着眼于成为越南中部地区创新与高科技中心，颁布多项人工智能与半导体领域人力资源、基 础设施和企业发展的重要决议和政策。为落实这些决议，需建设足够强大的计算基础设施，即高性能计 算系统。投资此系统不仅是技术项目，更是决定性战略举措，为岘港在半导体和人工智能领域实现突破 奠定基础，助力该市掌握高技术、培育初创企业、吸引投资、解决经济社会难题。 按计划，该项目将设在位于海洲坊第二软件园区ICT大楼二层数据中心区域，工期2025年至2028年。建 成后将有力支持园区创新初创企业、微芯片、半导体以及人工智能企业，并聚合市内各所大学，共同支 持微芯片设计和人工智能研究与培训。 ...

（原标题：意法半导体启动扩建马耳他智能工厂，创马史上最大单笔投资纪录） 《马耳他今日报》11月10日报道，在近日举行的"2025马耳他全球半导体大会"上，意法半导体宣布扩建其位于 马耳他的智能工厂，这项投资将成为马历史上规模最大的单笔投资。此次大会汇聚了行业领袖、政策制定者和 研究人员，共同探讨全球半导体产业发展。 此次扩建将强化马耳他在欧洲半导体产业链中的地位。为支持产业发展，大会同时宣布了多项举措。由欧盟芯 片联合计划共同出资800万欧元，联合马耳他大学及比利时微电子研究中心（IMEC）等机构成立"马耳他半导 体能力中心"，为研究人员和学生提供培训与先进设备；马耳他数字创新中心（DIHUBMT）支持人工智能、网 络安全与高性能计算领域的初创企业和研究者等。 马耳他经济部长西尔维奥·申布里表示："半导体产业证明了马耳他'创新无国界'的理念。我国将继续投资于人才 技能、科研和技术，推动该领域可持续发展。"马耳他企业局首席执行官乔治·格雷戈里指出，马耳他的规模优 势使其成为欧洲半导体技术创新的理想试验平台。 会议期间，意法半导体质量、制造与技术总裁法比奥·古兰德里斯展示了公司首款应用于半导体制造的人形机器 人， ...

Core Insights - Tachyum has announced its new 2nm Prodigy chip, which boasts 1024 cores, a clock frequency of 6GHz, and 1GB of combined cache, positioning it as a competitor to NVIDIA's Rubin Ultra chip [2][6] - The Prodigy 2 chip is claimed to exceed 1000 PFLOPs in inference performance, significantly outperforming NVIDIA's Rubin Ultra, which has a performance of 50 PFLOPs, making it 21 times faster [6][15] - The chip's architecture supports high-performance AI and computing applications, with enhancements in integer performance by up to 5 times, AI performance by up to 16 times, and DRAM bandwidth by 8 times [9][10] Specifications Overview - The Prodigy 2nm chip features a maximum of 1024 64-bit cores, a clock frequency of up to 6GHz, and supports DDR5 memory with speeds up to 17,600 MT/s [10][13] - It can accommodate up to 48TB of DDR5 memory per slot and includes 128 PCIe 7.0 lanes, with a thermal design power (TDP) of up to 1600W [10][13] - The chip integrates 128KB instruction cache, 64KB data cache, and 1GB of L2+L3 cache, with various configurations available ranging from 32 to 1024 cores [13][14] Performance Claims - Tachyum asserts that the Prodigy chip can deliver three times the performance of the best x86 processors and six times that of the highest-performing GPGPU [15][18] - The company emphasizes that its solution will significantly reduce capital and operational expenditures for data centers while providing unprecedented performance and efficiency [15][18] - The Prodigy series is designed for a wide range of applications, including large-scale AI, supercomputing, high-performance computing (HPC), and big data analytics [18][19] Development and Market Position - Tachyum has faced multiple delays in the development of the Prodigy chip, with initial plans for a 2019 release now pushed to 2025 for mass production [45][49] - The company has secured a $220 million investment to support the development of the Prodigy chip, along with a $500 million procurement order for the chip [49] - Tachyum aims to penetrate the market quickly with its competitive pricing and performance, offering a native software ecosystem that supports existing x86 binaries [18][19]

Core Viewpoint - Samsung Electronics aims to achieve profitability in its semiconductor foundry business by 2027, focusing on securing orders from major tech companies like Tesla and Apple, and leveraging its new Taylor wafer fab in the U.S. [2][3] Group 1: Business Goals and Strategies - Samsung has set a management goal to achieve breakeven by 2027 and aims for a 20% market share based on sales in the foundry sector [2][3] - The company is sharing its management goals with partners and discussing future investment plans to ensure stable operations and necessary materials [2][3] - Samsung's foundry business has been characterized as an order-based model, necessitating advance preparation of raw materials and equipment [2] Group 2: Current Performance and Market Position - Since 2022, Samsung's foundry business has been operating at a loss, estimated at 1 trillion to 2 trillion KRW per quarter [3] - Despite significant investments in advanced processes, Samsung has struggled to secure a large number of orders, leading to its foundry being referred to as a "bottomless pit" [3] - In 2023, Samsung has secured contracts from major North American tech giants, indicating a shift in its ability to attract clients due to improved yield rates [3] Group 3: Future Developments - Samsung plans to begin production at its Taylor factory in 2024, with equipment installation expected to be completed by Q2 and full production by Q3 [5] - The company is also preparing a second production line at the Taylor factory, which will be larger than the first [5] - Analysts suggest that Samsung's recovery in the foundry business will depend on its ability to secure next-generation process technologies and maintain stable yields [5]

浙江大学和新加坡南洋理工大学新研究旨在探索空间碳中和数据中心的可行性。太空环境具备两大独特优势：丰富的太阳能可为计算设备提供 清洁稳定的电力；接近绝对零度的深空环境则为服务器废热提供了理想的散热条件。我们提出两种实施方案：一是在遥感卫星上集成AI加速 器，构建「轨道边缘数据中心」，实现数据在采集源头直接处理；二是组建计算卫星星座，形成「轨道云数据中心」，兼具处理太空数据与承 接地面计算任务的能力。同时，我们还建立了太空云数据中心全生命周期碳效率评估体系。 空间技术与信息技术面临着日益凸显的可持续性压力。 一方面，近地轨道正在被大规模卫星星座快速占据，这些卫星在通信、遥感、气象监测等领域持续产生海量的「太空原生数据」，其规模可达每星每日数 十太字节（TB）。 另一方面，人工智能（AI）与高性能计算（HPC）等技术的迅猛发展，驱动着全球范围内能源密集型数据中心的建设浪潮，导致其电力消耗与碳排放足迹 急剧攀升。 传统的「弯管」式数据处理模式，即将所有太空数据下行传输至地面数据中心进行处理，不仅引入了显著的通信延迟，不利于灾害应急响应等实时性要求 高的应用，更关键的是，它进一步加剧了地面数据中心本就沉重的能源与环境负 ...