【环球网科技综合报道】5月20日消息，据日本时报报道，三星电子已正式获得任天堂新一代游戏主机Switch 2的芯 片代工订单，将基于其8纳米制程工艺生产英伟达定制的Tegra T239芯片。 尽管任天堂曾考虑台积电7nm/8nm工艺，但最终选择三星8nm制程。行业分析指出，三星在该工艺节点上的良率高 达70%~80%，且无需依赖极紫外光（EUV）设备，生产成本较台积电降低约15%~20%。此外，英伟达Ampere架构 GPU此前已适配三星8nm工艺（如RTX 30系列显卡），技术协同性进一步巩固合作基础。 据彭博社援引知情人士消息，三星的代工能力将助力任天堂在2026年3月财年内实现Switch 2销量超2000万台，较此 前1500万台的预期显著上调。分析认为，三星的产能保障使任天堂无需与其他厂商争夺台积电先进制程资源，同时 8nm工艺的成熟度亦降低了供应链风险。 此外。韩媒指出，三星正计划将5nm工艺用于Switch 2的"性能升级版"，未来或推出搭载OLED屏幕的增强机型。 （青山） 根据供应链消息，Tegra T239芯片采用ARM Cortex-A78C架构的8核CPU，其中6核专为游戏优化，2核预 ...

Core Viewpoint - Nintendo has partnered with Samsung to produce the core chips for the upcoming Switch 2, aiming to significantly increase production and exceed sales expectations of 20 million units by March 2026 [1][3]. Group 1: Nintendo's Strategy and Sales Expectations - Nintendo expects to ship over 20 million units of Switch 2 by March 2026, which is significantly higher than previous estimates [1]. - The company has received 2.2 million pre-orders in Japan alone, indicating strong market demand [3]. - Nintendo's president, Shuntaro Furukawa, stated that the primary goal is to match the initial sales performance of the original Switch, which sold approximately 15 million units in its first 10 months [4]. Group 2: Samsung's Role and Competitive Landscape - Samsung is utilizing 8nm technology to manufacture custom chips for Switch 2, which could enhance its chip foundry's equipment utilization and expand its business [1]. - The collaboration with Nintendo is seen as a significant recognition of Samsung's chip foundry business, which aims to become a major pillar alongside its memory business [1]. - Samsung has historically supplied NAND flash memory and OLED screens to Nintendo and is pushing for continued use of its OLED panels in future updates of Switch 2 [2]. Group 3: TSMC's Competitive Position - TSMC continues to strengthen its leading position in the chip manufacturing sector through ongoing technological upgrades and stable large-scale production, attracting major clients like Apple and Nvidia [2]. - Both TSMC and Samsung are competing fiercely in the chip manufacturing space, particularly in the race for 2nm technology to improve production yield and profitability [2].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文编译自路透社，谢谢。 英特尔首席财务官戴维·津斯纳 (David Zinsner) 周二表示，英特尔使用即将推出的制造技术为外 部客户生产的处理器数量目前"并不大"。 津斯纳在摩根大通于马萨诸塞州波士顿举行的全球技术、媒体和通信会议上表示，英特尔承诺的产 量，即英特尔使用即将推出的制造技术为外部客户生产的芯片数量，目前并不大。 总部位于加州圣克拉拉的英特尔正努力成为芯片代工厂，但其18A和最新的14A芯片制造技术进展 缓慢。 然而，该公司上个月表示，已有几家客户计划为即将推出的工艺制造测试芯片。 " 我 们 拿 到 了 测 试 芯 片 ， 但 有 些 客 户 最 终 放 弃 了 测 试 芯 片 …… 所 以 目 前 承 诺 的 产 量 肯 定 不 大，"Zinsner说道。 据路透社3月份报道，AI芯片领跑者英伟达和定制芯片制造商博通正在与英特尔进行制造测试。 Zinsner补充说，这家名为"代工厂"的代工厂有望在2027年某个时候实现收支平衡，并且需要外部 客户创造数十亿美元的低至中个位数收入才能实现这一目标。 在最近的 Direct Connect 代工 ...

Core Viewpoint - AMD has reportedly abandoned its 4nm orders with Samsung Foundry, likely shifting to TSMC due to Samsung's underperformance in the semiconductor industry [1][2]. Group 1: AMD's Shift in Partnerships - AMD has decided to forgo its 4nm orders with Samsung and is expected to turn to TSMC for production in the U.S. [1] - The specific reasons for this shift have not been disclosed, but it is likely linked to Samsung's poor performance and TSMC's attractive offerings [1]. - AMD's dual-sourcing strategy involved extensive collaboration with Samsung on the SF4X process, covering EPYC server CPUs, Ryzen APUs, and Radeon GPUs [1]. Group 2: Samsung's Market Position - Samsung's foundry business is struggling to gain industry recognition despite its diverse product range and substantial capacity [1]. - The exit of a major partner like AMD is a negative signal for Samsung, which needs to enhance its reputation in the chip industry [1]. - However, there are indications that companies like NVIDIA are interested in Samsung's 2nm process, suggesting potential future opportunities [2]. Group 3: TSMC's Advancements - TSMC's Arizona facility is currently mass-producing 4nm processes, and AMD is likely to enter this field following its agreement with TSMC [2]. - AMD has ordered high-end 2nm "Venice" server CPUs and is producing the Ryzen 9000 series consumer CPUs, indicating a significant shift in its collaboration with TSMC [2]. - AMD is one of the first companies to gain exclusive rights to the 2nm process, highlighting a transformative change in its partnerships [2].

Core Insights - Intel is positioning itself as a leading foundry service provider, focusing on advanced process technologies and packaging solutions to meet the demands of the AI era [1][81] - The company has unveiled its latest technology roadmap, including the upcoming Intel 18A (1.8nm) and Intel 14A (1.4nm) nodes, with plans for mass production and collaboration with major clients [3][39][41] Process Technology Developments - Intel plans to mass-produce the Intel 18A node within this year, with the first products including the Panther Lake CPU for laptops and Clearwater Forest server CPUs [5][39] - The Intel 14A and its variants are expected to enhance performance by 15-20% per watt and increase chip density by 1.3 times compared to Intel 18A [35][43] - The company has invested nearly $90 billion over the past four years, with a significant portion allocated to enhancing its front-end and back-end technology capabilities [30] Advanced Packaging Innovations - Intel has introduced a new advanced packaging roadmap featuring technologies like EMIB-T 2.5D and Foveros Direct 3D, which are touted as optimal solutions for AI applications [7][60] - The Foveros technology allows for vertical stacking of chips, improving integration density and reducing interconnect spacing [70] - New packaging solutions are being developed to meet high bandwidth memory (HBM) demands, with EMIB-T and Foveros-R expected to be available by 2027 [62][70] Ecosystem and Collaboration - Intel is actively collaborating with major EDA companies and semiconductor ecosystem partners to support the design and production of its new nodes [20][24] - The company has established a diverse and flexible global supply chain, which is considered a key strength moving forward [17] - Intel's foundry ecosystem is continuously evolving, with partnerships aimed at providing comprehensive IP, EDA, and design services [24][29] Strategic Vision and Market Positioning - Intel aims to transform its foundry business into a service-oriented company, focusing on customer trust and satisfaction [78][80] - The company is committed to adapting to the AI era by integrating advanced process technologies and packaging solutions into its offerings [11][81] - As the semiconductor market is projected to reach $1 trillion, Intel is positioning itself as a critical player in the industry, leveraging its technological advancements and partnerships [13][81]

如果您希望可以时常见面，欢迎标星收藏哦~ 今天，英特尔举办了晶圆代工大会，会上公司指出，正在与主要客户洽谈即将推出的14A工艺 节点（相当于1.4纳米），该节点是18A工艺节点的后续产品。英特尔已有多家客户计划流片 14A测试芯片。英特尔还透露，公司至关重要的18A节点目前已进入风险生产阶段，并计划于 今年晚些时候实现量产。 英特尔新的18A-P扩展节点（18A节点的高性能变体）目前正在晶圆厂早期生产。此外，该公司正 在开发一种新的18A-PT变体，该变体支持带有混合键合互连的Foveros Direct 3D，使该公司能够 在其最先进的前沿节点上垂直堆叠芯片。 在英特尔的新方案中，Foveros Direct 3D 技术是一项关键的进展，因为它提供了竞争对手台积电 （TSMC）已在生产中使用的功能，最著名的是 AMD 的 3D V-Cache 产品。事实上，英特尔的实 现在关键互连密度测量方面与台积电的产品不相上下。 在成熟节点方面，英特尔代工厂目前已在晶圆厂中完成其首个 16nm 生产流片，并且该公司目前 还在与联华电子合作开发的 12nm 节点吸引客户。 接下来，我们来看一下这家巨头的晶圆代工最新路线图 ...

Core Viewpoint - The potential merger between GlobalFoundries and UMC aims to create a larger American company to enhance chip production capabilities amid increasing competition from China in the mature chip sector [1][2][4]. Group 1: Merger Details - GlobalFoundries and UMC are exploring a merger to establish a company with a broader production footprint across Asia, the U.S., and Europe [1]. - The merger is intended to ensure the U.S. has access to mature chips, especially given the geopolitical tensions between China and Taiwan [1][4]. - The combined entity could potentially rival TSMC, which currently holds significant market shares in both mature and advanced chip markets [1][4]. Group 2: Regulatory and Government Involvement - U.S. government efforts have historically encouraged Taiwanese firms to increase chip production in the U.S., including urging UMC to build or acquire facilities [2]. - The potential merger may face regulatory scrutiny from both Taiwanese and Chinese authorities, as seen in previous cases like Intel's failed acquisition of Tower Semiconductor [2][4]. - Concerns have been raised about the impact of TSMC's $100 billion investment in the U.S. on Taiwan's semiconductor industry [2]. Group 3: Market Context and Competition - Mature chips account for over 70% of global semiconductor demand, crucial for various sectors including infrastructure and defense [4]. - UMC, established in 1980, is smaller than TSMC and employs around 20,000 people globally, serving major clients like Qualcomm and Nvidia [4][5]. - GlobalFoundries reported revenue of $6.75 billion with a net loss of $265 million, while UMC had revenue of NT$232.3 billion (approximately $7.21 billion) and a profit of NT$47.2 billion [5]. Group 4: Strategic Moves - UMC is collaborating with Intel to develop 12nm chips for various applications, aiming to start production in the U.S. by 2027 [5]. - UMC is also diversifying its manufacturing capabilities by expanding operations in Singapore [5]. - UMC's CFO stated that the company is not currently pursuing any merger deals and maintains good communication with all relevant governments, including the U.S. [6][7].

来源丨新智元（ID：AI_era） 消息一出，英特尔股价在盘后交易中，应声上涨12%。 更令人震撼的是，随着陈立武入主英特尔，芯片界三大顶级巨头已全部由华人执掌： 英伟达黄仁勋、 AMD苏姿丰、英特尔陈立武。 芯片行业精英强势集结，俨然开启了一场「华人一统芯片江湖」的新格局。 英特尔迎来新掌门 编辑丨桃子 好困 三个月后，英特尔终于迎来新任CEO！ 刚刚，英特尔官宣一项重大人事变动—— 任陈立武（Lip-Bu Tan）为新任首席执行官，自2025年3月 18日起正式生效。 这项决定，终于结束了3个月前解雇前CEO Pat Gelsinger后的领导层空缺期。 此次，陈立武将接替临时联合首席执行官David Zinsner和Michelle（MJ）Johnston Holthaus，正式执掌英 特尔帅印。 与此同时，他还将在2024年8月从英特尔董事会卸任后，以新身份重新回归董事会。 值得一提的是，原有的管理团队并未「大换血」。 David Zinsner将担任执行副总裁兼CFO，Johnston Holthaus则继续担任英特尔产品部门的首席执行官。 此外，在新CEO搜寻期间担任董事会临时执行主席的Frank ...