Core Viewpoint - The company indicates that terminal demand is trending towards high-end and intelligent development, with emerging fields such as 5G, AI, and automotive electronics becoming the main growth drivers [1] Group 1: Market Trends - The process of domestic substitution is accelerating in multiple sub-sectors [1] - The demand for artificial intelligence computing power is surging, which is rapidly expanding the advanced packaging market [1] - The storage chip sector, including HBM and HBF, is experiencing strong demand, further broadening the market space in the wafer sector [1] Group 2: Technological Advancements - Significant domestic technological breakthroughs in PCB (HDI), SLP, IC substrates, and OLED display fields are gradually entering the high-end market [1] - These advancements provide a clear growth path for the company in expanding electronic chemical products in the broader semiconductor field [1]

资金流向方面，主力资金净流出1120.63万元，特大单买入1156.42万元，占比3.78%，卖出2058.04万 元，占比6.72%；大单买入7667.09万元，占比25.04%，卖出7886.11万元，占比25.76%。 硕贝德今年以来股价涨78.41%，近5个交易日涨3.73%，近20日涨8.39%，近60日跌9.20%。 今年以来硕贝德已经4次登上龙虎榜，最近一次登上龙虎榜为8月7日，当日龙虎榜净买入5.33亿元；买 入总计7.14亿元 ，占总成交额比18.47%；卖出总计1.81亿元 ，占总成交额比4.68%。 资料显示，惠州硕贝德无线科技股份有限公司位于广东省惠州市仲恺高新区东江高新科技产业园惠泽大 道138号，成立日期2004年2月17日，上市日期2012年6月8日，公司主营业务涉及无线通信终端天线的研 发、生产和销售。主营业务收入构成为：天线50.50%，线束及连接件26.34%，智能传感模组13.73%， 散热器件及模组8.86%，其他(补充)0.57%。 12月18日，硕贝德盘中上涨2.01%，截至10:29，报23.39元/股，成交3.06亿元，换手率3.00%，总市值 107.60亿元 ...

Core Viewpoint - Lianrui New Materials experienced a stock price decline of 2.05% on December 18, with a current price of 57.81 yuan per share and a market capitalization of 13.959 billion yuan [1] Group 1: Stock Performance - Year-to-date, Lianrui New Materials' stock price has increased by 17.61%, with a slight decline of 0.05% over the last five trading days, a rise of 4.35% over the last 20 days, and an increase of 6.17% over the last 60 days [2] - As of September 30, 2025, the number of shareholders for Lianrui New Materials reached 11,000, an increase of 42.50% compared to the previous period, while the average circulating shares per person decreased by 29.82% to 22,029 shares [2] Group 2: Financial Performance - For the period from January to September 2025, Lianrui New Materials achieved operating revenue of 824 million yuan, representing a year-on-year growth of 18.76%, and a net profit attributable to shareholders of 220 million yuan, reflecting a year-on-year increase of 19.01% [2] Group 3: Shareholder and Dividend Information - Since its A-share listing, Lianrui New Materials has distributed a total of 381 million yuan in dividends, with 242 million yuan distributed over the past three years [3] - As of September 30, 2025, Hong Kong Central Clearing Limited is the eighth largest circulating shareholder with 1.6654 million shares, while Guoshou Anbao Smart Life Stock A is the ninth largest with 1.3406 million shares, having decreased by 11,000 shares from the previous period [3]

Summary of Tiancheng Technology Conference Call Company Overview - Tiancheng Technology holds approximately 20% market share in the high-end PCB chemical market in mainland China, ranking second in the industry, primarily serving leading clients such as Dongshan Precision and Shengyi Electronics [2][3] Industry Insights - The demand for high-end PCBs is surging due to AI, with the output value of multilayer boards with 18 layers or more expected to grow by 40% year-on-year in 2024, with a compound annual growth rate (CAGR) of 15.7% [2][3] - The global advanced packaging market is projected to reach $80 billion by 2030, increasing the requirements for plating additives [2][5] - The global PCB specialty chemicals market is expected to grow from $7 billion in 2024 to $10 billion by 2032, with production capacity shifting towards mainland China [3] Key Developments - Tiancheng Technology has completed the development of key systems such as TSV and RDL and has passed core certifications, which is expected to open a second growth curve [5] - The company has established a semiconductor division and is advancing R&D projects in glass substrate TGV and wafer-level interconnect systems [5][6] - The company has relocated its headquarters to Zhangjiang, Pudong, Shanghai, and established a core R&D laboratory in Jinqiao, enhancing its integration into the local supply chain [7] Strategic Initiatives - Tiancheng Technology plans to promote products to small and medium-sized clients while collaborating with industry giants to provide comprehensive solutions to top logic and chip manufacturers, aiming for a domestic market share of 10%-15% within the next two to three years, corresponding to revenue of 200-300 million RMB [4][9] - The company is actively participating in a state-owned fund aimed at addressing low domestic production rates and integrating key materials, positioning itself as a platform leader in the industry [8] Production Capacity and Expansion - The company has completed the ODI application and overseas structural setup for a 10,000-ton production base in Thailand, which will serve as an overseas hub [4][9] - Initial products will be produced and exported from the Shanghai factory, with plans to accelerate local production as demand increases [9] Future Outlook - Tiancheng Technology is focused on enhancing its original development capabilities and leveraging AI for efficient iteration of additive molecules to meet new product demands [6] - The company anticipates significant growth in its semiconductor business, driven by its unique ability to independently develop plating additives from scratch [9]

证券日报网讯12月17日，联得装备（300545）在互动平台回答投资者提问时表示，在先进封装领域，公 司有开发针对细间距高密度的高精度驱动芯片键合设备，该设备广泛应用于高端显示芯片封装。 ...

证券日报网讯 12月15日，长电科技在互动平台回答投资者提问时表示，股价波动受多重因素影响。公 司注重投资者回报，持续优化利润分配方案，增加分红频次，通过稳定的现金分红回馈股东。公司目前 处于加速向先进封装转型的阶段，固定资本开支力度和研发投入强度均大幅超过封测行业主要公司。初 期这些投入转化为业绩需要一定的时间，相信未来几年随着先进产品地大量导入，盈利能力会得到逐步 的释放。 （文章来源：证券日报） ...

证券日报网讯12月15日，方邦股份在互动平台回答投资者提问时表示，公司可剥铜主要用于IC载板、类 载板，属于先进封装体系的重要基础材料。 ...

12月15日，汇成股份涨6.56%，成交额12.99亿元，换手率8.94%，总市值146.28亿元。 异动分析 存储芯片+先进封装+芯片概念+人民币贬值受益+专精特新 1、2025年10月14日公司，合肥新汇成微电子股份有限公司举办特定对象调研活动，向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局：公司通过直接与间接投资相结合，拿下合肥鑫丰科技有 限公司（简称 "鑫丰科技"）27.5445% 股权，并与鑫丰科技股东华东科技（苏州）有限公司（简称 "华 东科技"）达成战略合作，共同拓展 3D DRAM 等存储芯片封测业务，瞄准 AI 基建时代下存储芯片的爆 发式需求。 来源：新浪证券-红岸工作室 区间今日近3日近5日近10日近20日主力净流入1873.96万1548.33万488.65万1.35亿6856.45万 主力持仓 主力没有控盘，筹码分布非常分散，主力成交额1.17亿，占总成交额的6.07%。 技术面：筹码平均交易成本为15.74元 2、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是 ...

2026 全球半导体设备：关注存储超级周期、先进逻辑和 国产化机会 20251214 Q&A 2025 年全球半导体行业表现如何？有哪些显著的趋势和数据？ 2025 年，全球科技板块整体表现优于大盘，中国市场表现优于美国市场。具 体到半导体行业，半导体板块跑赢了科技板块，而半导体设备则以超过 70%的 涨幅成为表现最好的子板块。从中美比较来看，这是近年来中国市场首次跑赢 美国市场。 对于 2026 年全球半导体市场的展望如何？ 根据 WSTS 的最新预测，2026 年全球半导体市场将继续加速增长，这在周期 性强的半导体行业中较为罕见。预计存储器领域将增长接近 40%，其中包括 20%的量增和 20%的价格增幅。此外，逻辑芯片也将保持强劲增长。整体来 看，2026 年全球半导体市场有可能接近 1 万亿美元。 2025 年存储板块平均上涨 166%，估值相对合理，2026 年市盈率为 12 倍，市净率为 2.8 倍。三星若能进入英伟达 HBM4 供应链，其估值 将有显著提升。 2025 年中芯国际和华虹股价大幅上涨。目前中芯国际和华虹的市净率 均处于历史较高水平，大约是 3 倍左右。未来，它们能否继续上涨取决 于 ...

兴业证券指出，2025年第三季度全球半导体市场规模达2080亿美元，首次突破2000亿美元大关，环比增 长15.8%，创2009年以来最高季度增速。AI浪潮带动算力需求爆发，服务器、AI芯片、光芯片、存储、 PCB等环节价值量显著提升。未来3年"先进工艺扩产"将成为自主可控主线，国产设备在先进工艺突破 与验证持续推进；CoWoS及HBM卡位AI产业趋势，先进封装重要性凸显。存储价格触底回升，封测环 节稼动率逐渐回升，将受益于AI芯片带动的先进封装需求。消费电子领域，3D打印在折叠机铰链、手 机中框等场景加速渗透，AI手机与端侧硬件（如耳机、眼镜）创新推动换机周期，AI技术正与智能手 机硬件深度融合。半导体设备方面，中国大陆销售额以145.6亿美元居全球首位，SK海力士等巨头持续 加码晶圆厂投资。 （文章来源：每日经济新闻） 消电ETF（561310）跟踪的是消费电子指数（931494），该指数从市场中选取涉及智能手机、家用电 器、个人电脑等消费电子产品制造与销售的上市公司证券作为指数样本，以反映消费电子相关上市公司 证券的整体表现。该指数成分股通常具备较强的技术创新能力和市场竞争力，是观测科技消费领域发展 趋 ...