路维光电(688401) 公司点评 路维光电:业绩稳健增长,半导体掩膜版表现亮眼 投资评级:增持(维持) 报告日期:2025-04-30 | 收盘价(元) | 33.85 | | --- | --- | | 近 12 个月最高/最低（元） | 38.21/18.19 | | 总股本（百万股） | 193 | | 流通股本(百万股) | 116 | | 流通股比例 (%) | 59.86 | | 总市值 (亿元) | 65.44 | | 流通市值 (亿元) | 39.17 | 公司价格与沪深 300 走势比较 分析师:陈耀波 执业证书号：S0010523060001 郎箱: chenyaobo@hazq.com 分析师：李元晨 执业证书号: S0010524070001 邮箱：liyc@hazq.com 相关报告 主要观点: ● 事件点评:路维光电发布 2024年度及 2025 第一季度报告 公司 2024 年实现营业收入约 8.8 亿元,同比增长约 30.2%;实现归母 净利润约 1.9 亿元，同比增长约 28.3%；实现毛利率约 34.8%，同比小 幅下降 0.3 pct。公司 25Q1 实现营业收入约 2 ...

21世纪经济报道记者骆轶琪 广州报道 随着摩尔定律"节奏"放缓，高工艺制程芯片的设计正面临愈发严峻的挑战。而在AI大模型迅猛发展的浪 潮之下，芯片设计难度的指数级攀升，可能会逐步对AI产业发展进程产生影响。 近日，Arm发布的《芯片新思维：人工智能时代的新根基》报告（以下简称"报告"）显示，随着AI工作 负载对计算密集型任务的需求日益增加，能效已跃升为AI计算发展的首要考量因素。芯片设计正在整 合优化的内存层次结构、先进的封装技术以及成熟的电源管理技术，以在降低能源消耗的同时，持续保 持高性能表现。 此外，通过摩尔定律实现半导体缩放的传统方法已达到物理与经济的极限。产业正转向创新的替代方 案，如定制芯片、计算子系统 (CSS) 以及芯粒 (chiplet)，以持续提升性能与能效。 Arm解决方案工程部执行副总裁Kevork Kechichian向21世纪经济报道等记者指出，Arm认为，未来芯片 设计的成功将越来越依赖于：IP提供商、晶圆代工厂与系统集成商之间的紧密合作；计算、内存与电源 传输之间的系统级优化；接口的标准化，以支持模块化设计；针对特定工作负载的专用架构；以及能灵 活应对新兴威胁的强大安全框架。 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 Source：moneyDJ ，谢谢 。 FOPLP(面板级扇出型封装)成为新的先进封装竞逐市场，封测大厂力成(6239)执行长谢永达昨(29) 日于法说会上透露，公司正与一家美国客户合作验证中，即日前宣布投产晶圆代工龙头2奈米制程 的公司(这意指超微AMD)。尽管公司未公布合作细节，供应链则透露，公司技术将应用在PC或游 戏机芯片，最快2027年可以看到产品上市。 国内封测厂多年来一直在推行FOPLP案，至今约莫9年，但一直没有看到有太多终端应用落地，主 要是因为起初因良率问题而迟迟未见显著成效，客户端态度也相对观望。再加上，早前应用层次停 留在RF IC、PMIC等相对成熟领域，如今在台积电(2330)登高一呼下，封测厂也加速转往消费性 电子、AI等更多元的应用场域。 谢永达表示，力成的FOPLP 技术自2016 年量产以来，当时技术相对简单，经过历年来的持续优 化，目前朝异质整合发展，规格主要采510X515 毫米。他也强调，目前全球真正具大规模FOPLP 生产能力的业者仅有公司一家，良率也大幅超出预期，现正与与一家美国客户合作验证中。 关 注 ...

4月28日，光力科技（300480）半导体装备板块全资子公司光力瑞弘电子科技有限公司(ADT)与锐杰微 科技(郑州)有限公司(RMT)签署战略合作协议。双方将围绕先进封装的磨切领域开展深度合作，共同搭 建"需求牵引、技术攻坚、产业验证"的协同创新联盟框架，打造"材料表征-设备优化-工艺验证-应用闭 环"的国产全自动化先进封装研发生产平台。此次合作标志着国内先进封装产业链上下游企业协同创 新、突破技术瓶颈的重要实践迈出实质性步伐。(人民财讯) ...

证 券 研 究 报 告 公司研究 华海清科（688120）2024 年报及 2025 年一季报点评 强推（维持） 经营业绩再创新高，积极推进新产品新业务布局 事项： 半导体设备 2025 年 04 月 30 日 目标价：228 元 当前价：165.50 元 华创证券研究所 证券分析师：耿琛 电话：0755-82755859 邮箱：gengchen@hcyjs.com 执业编号：S0360517100004 证券分析师：岳阳 邮箱：yueyang@hcyjs.com 执业编号：S0360521120002 证券分析师：吴鑫 邮箱：wuxin@hcyjs.com 执业编号：S0360523060001 联系人：张雅轩 评论： 市场表现对比图(近 12 个月) -13% 19% 51% 83% 24/04 24/07 24/09 24/12 25/02 25/04 2024-04-29~2025-04-29 华海清科 沪深300 相关研究报告 《华海清科（688120）2024 半年报点评：业绩稳 健增长，持续深化平台化战略发展》 2024-08-19 《华海清科（688120）2023 年报&2024 年一季报 ...

来源： 硅芯科技官微 硅芯科技自研3Sheng Integration Platform，实现三维堆叠芯片的系统级规划、物理实现与分 析、可测性与可靠性设计等，集成"系统-测试-综合-仿真-验证"五引擎合一，具有统一数据底 座，支持三维异构集成系统的敏捷开发与可定制化的协同设计优化，并在多个功能和性能上具有 独创性。 直面需求 3月在HiPi联盟大会，已听到 多位业内顶级设计专家发声Chiplet和3D IC对设计和EDA挑战。 近年来国内设计三维异构集成芯片的困扰似乎集中于设计出的堆叠结构，却在仿真和验证以后 仍然发现诸多问题！于是 "缺乏架构设计，急需设计协同和优化，设计要素全线左移" 已经成 为了业界对三维芯片堆叠设计的共识！ 要做一个设计，初心始于SoC的迭代，如果没有架构设计，严格说是能融合支持IP划分、工艺 选择、版图探索、前仿真、互连检查与优化、基于电源和热的物理实现、跨Die物理签核的多 点协同设计的架构设计和早期分析工具，那这样的设计通常会南辕北辙。 在近期硅芯科技的行业分享讲座上，创始人赵毅博士 基于业界3D IC设计遇到的问题 做了又 一轮的总结。其中提到：顶层架构对于应用场景、有效探索 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 今天，英特尔举办了晶圆代工大会，会上公司指出，正在与主要客户洽谈即将推出的14A工艺 节点（相当于1.4纳米），该节点是18A工艺节点的后续产品。英特尔已有多家客户计划流片 14A测试芯片。英特尔还透露，公司至关重要的18A节点目前已进入风险生产阶段，并计划于 今年晚些时候实现量产。 英特尔新的18A-P扩展节点（18A节点的高性能变体）目前正在晶圆厂早期生产。此外，该公司正 在开发一种新的18A-PT变体，该变体支持带有混合键合互连的Foveros Direct 3D，使该公司能够 在其最先进的前沿节点上垂直堆叠芯片。 在英特尔的新方案中，Foveros Direct 3D 技术是一项关键的进展，因为它提供了竞争对手台积电 （TSMC）已在生产中使用的功能，最著名的是 AMD 的 3D V-Cache 产品。事实上，英特尔的实 现在关键互连密度测量方面与台积电的产品不相上下。 在成熟节点方面，英特尔代工厂目前已在晶圆厂中完成其首个 16nm 生产流片，并且该公司目前 还在与联华电子合作开发的 12nm 节点吸引客户。 接下来，我们来看一下这家巨头的晶圆代工最新路线图 ...

Investment Rating - The investment rating for the company is "Buy-A" with a target price of 30.65 CNY per share [5]. Core Views - The company reported a revenue of 23.882 billion CNY in 2024, representing a year-on-year increase of 7.24%, and a net profit of 678 million CNY, up 299.9% year-on-year [1]. - In Q1 2025, the company achieved a revenue of 6.092 billion CNY, a year-on-year increase of 15.34%, and a net profit of 101 million CNY, up 2.94% year-on-year [1]. - The overall gross margin for 2024 was 14.84%, an increase of 3.18 percentage points year-on-year, with a net profit margin of 3.31%, up 2.34 percentage points year-on-year [2]. Summary by Sections Financial Performance - The company’s revenue and net profit for 2024 were 238.82 billion CNY and 6.78 billion CNY, respectively, with significant growth in net profit due to improved operational efficiency and cost control [1][2]. - For Q1 2025, the company reported a revenue of 60.92 billion CNY and a net profit of 1.01 billion CNY, indicating a positive trend in financial performance [1]. Market and Industry Trends - The industry is experiencing a recovery driven by demand in data centers, automotive electronics, and consumer electronics, contributing to the company's improved market conditions [2]. - The company has seen a notable increase in revenue from mid-to-high-end products, with a significant rise in capacity utilization and effective cost management [2]. Product and Business Development - The company has diversified its product offerings, achieving a 46% increase in revenue from high-end mobile SOCs and a 70% increase in revenue from RF products [3]. - The automotive sector has shown exceptional growth, with revenue from power devices, MCUs, and smart cockpit products surging over 200% [3]. - The company’s Memory business grew by 40% due to enhanced collaboration with original manufacturers, and the display driver business successfully introduced advanced cutting processes [3]. Capacity Expansion and Acquisitions - The company is accelerating its global capacity expansion, with ongoing projects in various locations aimed at enhancing high-end packaging capacity [8]. - The acquisition of a 26% stake in Jinglong Technology is expected to strengthen the company's position in the high-end IC testing sector, providing stable financial returns [8].

Investment Rating - The report maintains a "Recommended" investment rating for the company [1][5][13] Core Views - The demand for advanced packaging-related products is increasing, leading to stable growth in the company's performance. In 2024, the company achieved a revenue of 432 million yuan, a year-on-year increase of 20.04%, and a net profit attributable to shareholders of 33.48 million yuan, up 2.51% year-on-year [4][5] - The company's revenue growth is supported by the overall recovery in industry demand, particularly for advanced packaging products, and the company's technological advantages in core products such as electroplating solutions and photoresists [5][8] - The company is expanding its market share in the advanced packaging sector and has made significant investments in R&D, with R&D expenses increasing by 40.42% year-on-year, which has impacted profit margins [5][8] Financial Performance Summary - In 2024, the company reported a revenue of 432 million yuan, with a gross margin of 26.42% and a net margin of 7.75%. The revenue for Q1 2025 was 126 million yuan, reflecting a year-on-year growth of 54.13% [4][5][6] - The company's revenue structure shows that sales of electroplating solutions and related reagents reached 196 million yuan in 2024, a 9.67% increase year-on-year, while photoresists saw a 37.68% increase in sales to 95 million yuan [8] - The company is positioned as a leading supplier in the domestic traditional packaging sector and is expanding into other application areas, including passive components, PCBs, advanced packaging, and wafer manufacturing [8] Future Projections - The company is projected to achieve revenues of 573 million yuan in 2025, 735 million yuan in 2026, and 926 million yuan in 2027, with corresponding net profits of 47 million yuan, 72 million yuan, and 106 million yuan respectively [6][11] - The expected EPS for 2025, 2026, and 2027 are 0.53 yuan, 0.82 yuan, and 1.20 yuan, respectively, indicating a positive growth trajectory [6][11] Market Position and Strategy - The company is focusing on expanding its product line in the advanced packaging sector and has successfully launched several products for mass production, which are widely used in various processes [8] - The company aims to enhance its market share in the advanced packaging and wet electronic chemicals market, driven by the expansion wave among domestic manufacturers [8][11]

Investment Rating - The report maintains a "Buy" rating for the company with a target price of 46.74 RMB [4][7][8] Core Views - The company reported a revenue of 9.335 billion RMB in Q1 2025, representing a year-on-year growth of 36.44% but a quarter-on-quarter decline of 15.01%. The gross margin was 12.63%, up 0.43 percentage points year-on-year but down 0.71 percentage points quarter-on-quarter. The net profit attributable to shareholders was 203 million RMB, a year-on-year increase of 50.39% but a quarter-on-quarter decrease of 61.86% [1][2] - The growth in revenue and profit is primarily attributed to the consolidation of Shengdi Semiconductor and an increase in orders from the advanced packaging market both domestically and internationally. The company is optimistic about future performance driven by new capacity releases and the ramp-up of advanced packaging business [1][2][3] Summary by Sections Financial Performance - In Q1 2025, the company focused on advanced technologies and key application markets, achieving significant revenue growth in computing electronics (92.9%), automotive electronics (66.0%), and industrial and medical electronics (45.8%). This optimization in business structure contributed to a gross margin increase [2] - The company completed the acquisition of Shengdi Semiconductor, which reported a revenue of 799 million RMB and a net profit of 94 million RMB in Q4 2024. The consolidation of Shengdi has positively impacted the company's Q1 2025 performance [2] Market Outlook - The global semiconductor market is expected to grow by 19% to 627 billion USD in 2024, which will drive an 8% growth in the global packaging and testing market to 82 billion USD. The report is optimistic about the recovery of the semiconductor market and structural growth in AI-related fields [3] - The company is actively expanding its production capacity, with a new automotive electronics packaging production base in Shanghai expected to commence operations in the second half of 2025. The company is also set to benefit from high-performance computing, AI, and automotive electronics demand [3] Valuation Metrics - The report forecasts net profits for 2025, 2026, and 2027 to be 2.04 billion RMB, 2.38 billion RMB, and 2.90 billion RMB respectively, with corresponding EPS of 1.14 RMB, 1.33 RMB, and 1.62 RMB. The company is assigned a 2025 PE ratio of 41.0x, which is a premium compared to the industry average of 33.5x due to its leading position in advanced packaging technologies [4][6]