Summary of the Conference Call Company Overview - **Company**: 华天科技 (Hua Tian Technology) - **Industry**: Semiconductor Packaging Key Financial Highlights - **Revenue**: For the first nine months of 2025, total revenue reached 12.38 billion CNY, a 17.55% increase from 10.5 billion CNY in the same period last year [3][4] - **Net Profit**: Net profit for the same period was 540 million CNY, up 51.98% from 357 million CNY year-on-year [3][4] - **Gross Margin**: Gross margin slightly increased to 12.34% from 12.29% [3][4] Performance by Production Base 1. **Tianshui Base**: - Revenue: 3.26 billion CNY, up 21.99% from 2.67 billion CNY [4] - Net Profit: 200 million CNY, down 48.96% from 390 million CNY [5] - Gross Margin: Decreased to 11.86% from 13.68% [5] 2. **Xi'an Base**: - Revenue: 2.777 billion CNY, up 12.26% from 2.468 billion CNY [6] - Net Profit: 210 million CNY, up 52.4% from 140 million CNY [6] - Gross Margin: Increased to 17.81% from 16.46% [6] 3. **Nanjing Base**: - Revenue: 2.596 billion CNY, up 19.66% from 2.17 billion CNY [7] - Net Profit: 55 million CNY, down from 590 million CNY [7] 4. **Kunshan Base**: - Revenue: 1.51 billion CNY, up 10.7% from 1.367 billion CNY [8] - Net Profit: 88 million CNY, up 6.55% from 82 million CNY [8] - Gross Margin: Stable at 18% [8] 5. **Unisime Base**: - Revenue: 2.33 billion CNY, up 28% from 1.82 billion CNY [9] - Net Profit: 57 million CNY, down 28.23% from 79 million CNY [9] 6. **Jiangsu Base**: - Revenue: 290 million CNY, a significant increase from 73 million CNY last year [10] Production Capacity and Utilization - Overall capacity utilization across the five major production bases is approximately 85% [11] - Xi'an and Nanjing bases are operating at full capacity, contributing to revenue growth [11][12] Market Trends and Pricing - **Market Growth**: Notable growth in storage and automotive electronics sectors [14] - **Raw Material Prices**: Significant price increases in substrates, with a rise of 20%-30% noted [15][16] - **Pricing Mechanism**: The company has a pricing mechanism in place to pass on raw material cost increases to customers [16][17] Capital Expenditure - **2025 Capital Expenditure**: Expected to reach around 45 billion CNY, up from the initial estimate of 30-35 billion CNY due to better-than-expected market conditions [20][21] - **2026 Outlook**: Anticipated capital expenditure for 2026 is estimated at 30-40 billion CNY [22] Advanced Packaging Developments - **2.5D/3D Packaging**: A new subsidiary focused on advanced packaging has been established, with production lines completed and currently in the verification phase [24][27] - **Future Revenue Contribution**: Expected to contribute revenue, but the amount is anticipated to be modest initially [26] M&A Activity - **Acquisition of Huayi Electronics**: The acquisition is expected to enhance revenue and profit, with projected sales of approximately 1.078 billion CNY and net profit of around 54-55 million CNY for the first eight months of the year [37][41][42] Future Outlook - **Q4 2025 Expectations**: Anticipated to at least match Q3 performance, with more clarity on 2026 projections expected after customer visits in late 2025 [44][46] Additional Insights - The company is navigating challenges posed by geopolitical tensions affecting technology transfer and market access [27][28] - The focus remains on domestic markets due to restrictions on foreign orders [27][28] This summary encapsulates the key points discussed during the conference call, providing a comprehensive overview of the company's performance, market conditions, and future outlook.

摘要 存算自主可控追赶加速，重视上游设备材料产业链 20250926 中芯国际和华虹在 7 纳米以下先进制程上持续扩产，以满足国产算力需 求，尤其华虹 8 厂扩产超预期，预计 2026 年将有新产线布局，但中芯 国际部分设备订单有所延后。 长鑫存储和长存两大存储厂商在 2026 年将迎来确定性的边际向上变化， 长存三期主体已成立，重点布局 300 多层产品，单万片设备投资额提升 约 30%，长鑫存储也在积极扩产，并预计 2026 年加速 IPO 进程。 国产 HBM 预计在 2026 年实现从 0 到 1 的产业化突破，长鑫存储上海 厂区规划 3D 封装及 HBM 生产线，可能带来新的扩产需求，头部设备公 司有望受益。 HBM 产业链扩产优先关注封测端，因涉及市值较小公司，弹性较大，相 关设备包括 CMP 设备、电镀设备、薄膜电镀设备和清洗设备，建议关注 精智达、芯源微和交城超声。 预计 2026 年半导体行业资本开支将保持两位数增长，受益于国产化率 提升和结构性变化，设备公司订单增速有望达 30%以上，甚至 40%- 50%，主要增长点集中在算力逻辑产线、长存和长鑫口径。 Q&A 近期自主可控板块表现如何？ ...

如果您希望可以时常见面，欢迎标星收藏哦~ 自半导体工业诞生以来，集成电路就一直被封装在封装件中。最初的想法主要是保护内部脆 弱的硅片不受外部环境的影响，但在过去的十年中，封装的性质和作用发生了巨大的变化。 虽然芯片保护仍然重要，但它已成为封装中最不引人关注的作用。 本文探讨了封装领域最大的变化，即通常所说的先进封装。先进的含义并没有明确的定义。相反， 该术语广泛涵盖了多种可能的封装方案，所有这些方案都比传统的单芯片封装复杂得多。先进封装 通常封装了多个元件，但组装方式却千差万别。 在这种讨论中，经常会提到 2.5D 或 3D 封装，这些描述指的是内部元件的排列方式。 本文首先讨论了从外部观察到的封装类型，然后向内讨论了高级封装所集成的基本组件。之后，将 更详细地探讨每个组件。大部分讨论将涉及高级软件包的各种组装过程。文章最后探讨了任何技术 讨论都必须涉及的四个主题--工程师如何设计先进封装、如何对其进行测试、先进封装的总体可靠 性影响以及任何安全影响。 文章还简要讨论了两个相关的广泛话题。首先是键合。虽然这是封装的一个必要组成部分，但它本 身也是一个很大的话题，在此不作详细讨论。其次是不属于集成电路但可能包含 ...