半导体封装测试
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甬矽电子:2025年累计新增借款17.71亿元,占净资产70.54%
Xin Lang Cai Jing· 2025-12-25 10:21
甬矽电子公告称,截至2024年12月31日,公司经审计归属于上市公司股东的净资产为25.11亿元,借款 本金余额为54.09亿元。截至2025年12月24日,借款本金余额为71.80亿元,较2024年末增加17.71亿元, 本年度累计新增借款占2024年末经审计净资产的70.54%。新增借款均为银行借款,系宁波宇昌自2025 年起纳入合并报表范围致存量债务增加。公司称新增借款不会对经营和偿债能力产生重大不利影响。 ...
印度芯片,真干成了?
半导体行业观察· 2025-12-20 02:22
Core Viewpoint - India is emerging as a potential player in the semiconductor industry, with significant investments and government support, but challenges remain in manufacturing capabilities and supply chain resilience [1][11][18]. Group 1: Market Growth and Strategic Importance - India's semiconductor market is valued at approximately $38 billion in 2023, expected to grow to $45-50 billion by the end of 2025, and further expand to $100-110 billion by 2030, potentially accounting for about 10% of global consumption [1][11]. - The Indian government launched the Indian Semiconductor Mission (ISM) in December 2021, with a budget of $10 billion to build a self-sufficient semiconductor ecosystem [11][16]. Group 2: Key Developments with Major Companies - Apple is in preliminary discussions with CG Semi for chip packaging and assembly collaboration in India, indicating a shift in its supply chain strategy [2][3]. - Intel is also focusing on India's packaging and manufacturing systems, establishing a strategic alliance with Tata Group to enhance local semiconductor capabilities [5][9]. Group 3: Manufacturing and Infrastructure Initiatives - Major projects under the ISM include a $2.56 billion packaging and testing facility by Micron in Gujarat and a $10.37 billion collaboration between Tata Electronics and PSMC for a foundry [11][12]. - Tata Group plans to invest approximately $14 billion in two semiconductor factories, with one in Gujarat for wafer manufacturing and another in Assam for OSAT [8][9]. Group 4: Challenges and Future Outlook - Over 90% of India's semiconductor demand is currently met through imports, making the country vulnerable to global supply chain disruptions [11]. - While India is making strides in semiconductor packaging, it still faces significant challenges in achieving stable production and supply chain integration, with a timeline of 5-8 years for full-scale wafer production [14][18].
安靠技术:AI与汽车浪潮驱动先进封装腾飞
GUOTAI HAITONG SECURITIES· 2025-12-18 14:22
AI 与汽车浪潮驱动先进封装腾飞 安靠技术(AMKOR) 股票研究 /[Table_Date] 2025.12.18 (AMKR.O) [Table_Industry] 海外信息科技 | | | | 安靠技术(Amkor)首次覆盖报告 | | [Table_Industry] 海外信息科技 | | --- | --- | --- | --- | --- | --- | | [姓名table_Authors] | 电话 | 邮箱 | 登记编号 | [Table_Invest] | | | 秦和平(分析师) | 0755-23976666 | qinheping@gtht.com | S0880523110003 | 评级: | 增持 | | 李潇(分析师) | 021-23183060 | lixiao4@gtht.com | S0880525070003 | | | | 龚浩(研究助理) | 021-23183306 | gonghao2@gtht.com | S0880125090016 | [当前价格 Table_CurPrice] (美元): | 38.87 | 本报告导读: 完备先进封装完整产品谱 ...
蓝箭电子前3季亏 上市即巅峰金元证券保荐净利连降4年
Zhong Guo Jing Ji Wang· 2025-12-17 07:25
中国经济网北京12月17日讯 蓝箭电子(301348.SZ)日前披露了2025年三季度报告。 上市当日,蓝箭电子盘中最高报84.24元,为该股上市以来股价最高点。 蓝箭电子发行募集资金总额为90,400.00万元,扣除发行费用后实际募集资金净额为78,400.56万元。 公司最终募集资金净额比原计划多18,249.83万元。蓝箭电子2023年8月3日披露的招股说明书显示,公司 拟募集资金60,150.73万元,用于半导体封装测试扩建项目、研发中心建设项目。 蓝箭电子发行费用总额为11,999.44万元(发行费用均为不含增值税金额),其中承销及保荐费 9,441.51万元。 2025年6月27日,公司公告以每10股转增2股并税前派息0.6元,股权登记日2025年7月3日,除权除 息日2025年7月4日。 2025年1-9月,公司实现营业收入5.18亿元,同比增长2.55%;归属于上市公司股东的净利润 为-2,650.07万元,上年同期为9.42万元;归属于上市公司股东的扣除非经常性损益的净利润为-2,709.49 万元,上年同期为-322.87万元;经营活动产生的现金流量净额为1.44亿元,同比增长156.74 ...
甬矽电子:公司坚定践行技术创新战略
Zheng Quan Ri Bao· 2025-12-16 13:40
证券日报网讯 12月16日,甬矽电子在互动平台回答投资者提问时表示,公司坚定践行技术创新战略, 以前瞻性布局切入先进封装领域,基于自有的Chiplet技术推出了FH-BSAP(Forehope-Brick-Style Advanced Package)积木式先进封装技术平台。2.5D产品线涵盖基于RDL、硅转接板及硅桥等多种技术 方案,精准适配客户多元化先进封装技术需求。 (文章来源:证券日报) ...
甬矽电子:公司2.5D封装产线于2024年四季度通线
Zheng Quan Ri Bao Wang· 2025-12-05 15:42
Core Viewpoint - Yongxi Electronics announced that its 2.5D packaging production line will be operational in the fourth quarter of 2024, and the company is currently validating products with relevant customers [1] Group 1 - The 2.5D packaging production line is set to commence operations in Q4 2024 [1] - The company is engaged in product validation with related customers [1]
通富微电:封装测试所需主要原材料为引线框架、基板、键合丝和塑封料等
Zheng Quan Ri Bao· 2025-12-05 11:11
Core Viewpoint - Tongfu Microelectronics has stable supply channels for its main raw materials required for packaging and testing, including lead frames, substrates, bonding wires, and encapsulation materials [2] Group 1 - The company sources its main raw materials both domestically and internationally [2] - The company is attentive to policies and industry trends regarding self-sufficiency, domestic substitution, and localization of equipment and materials [2] - The company aims to seize opportunities from these trends to create value for its shareholders [2]
甬矽电子:本次收购的标的公司核心资产为公司正在使用的二期厂房
Mei Ri Jing Ji Xin Wen· 2025-12-03 10:02
Core Viewpoint - The acquisition of a factory is strategically valuable for the company, as it allows for better control over key assets and stabilizes the operating environment, aligning with the company's long-term strategy [2]. Group 1: Acquisition Details - The acquired company's core asset is the second-phase factory, which is part of a larger investment plan totaling 11.1 billion yuan [2]. - The acquisition is seen as a way to enhance the company's operational stability and reduce future uncertainties [2]. Group 2: Strategic Importance - The timing of the acquisition during a period of rapid expansion is justified by its strategic value to the company [2]. - The move is intended to ensure that the company can maintain control over its primary assets, which is crucial for its ongoing operations [2].
蓝箭电子:公司现阶段暂无涉及TPU、GPU等领域的相关业务
Xin Lang Cai Jing· 2025-12-01 07:40
蓝箭电子12月1日在互动平台表示,公司现阶段暂无涉及TPU、GPU等领域的相关业务。公司正结合自 身在封装测试领域的技术与制造能力,持续关注存储领域相关技术创新及应用等情况,积极寻求符合公 司发展方向的业务机会。 ...
研报掘金丨东方证券:维持长电科技“买入”评级,目标价45.12元
Ge Long Hui· 2025-11-26 06:53
Core Viewpoint - Changdian Technology achieved record high revenue in Q3, with significant growth in its computing electronics business [1] Revenue Growth - In the first three quarters of 2025, revenue from computing electronics, industrial and medical electronics, and automotive electronics increased by 70%, 41%, and 31% respectively, contributing over 60% to total revenue [1] Capacity Utilization - The overall capacity utilization rate of the company has been continuously improving from Q1 to Q3 of 2025, with production lines for wafer-level packaging, power device packaging, and power management chip packaging nearing full capacity [1] Market Outlook - The company is positioned in a critical window for the gradual ramp-up of advanced packaging downstream, with expectations for sustained profit recovery as new capacity comes online in 2026 and raw material costs stabilize [1] Valuation - Based on comparable companies' 2025 PE valuation of 47 times, the target price is set at 45.12 yuan, maintaining a "buy" rating [1]