半导体封测

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封测行业市场需求稳步提升 华天科技上半年盈利2.26亿元
Shang Hai Zheng Quan Bao· 2025-08-18 13:53
Group 1 - The semiconductor industry is experiencing an overall recovery, leading to increased market demand in the packaging and testing sector, resulting in steady growth in orders and operating performance for the company, which achieved a net profit of 226 million yuan in the first half of 2025 [1] - In the first half of 2025, the company reported operating revenue of 7.78 billion yuan, a year-on-year increase of 15.81%, and a net profit of 226 million yuan, a year-on-year increase of 1.68% [1] - The second quarter saw significant growth in both revenue and net profit, with the company achieving operating revenue of 4.21 billion yuan, an increase of 643 million yuan from the first quarter, marking a record high for a single quarter [1] Group 2 - The company has completed the development of ePoP/PoPt high-density memory and automotive-grade FCBGA packaging technology for smart cockpits and autonomous driving applications in the first half of the year [2] - The company has also initiated the research and development of CPO packaging technology, with key unit process development currently underway, and completed product validation for various clients in FOPLP packaging [2] - The shareholder structure has seen changes, with the Huaxia Guozheng Semiconductor Chip ETF increasing its holding from 1.38% to 1.39%, and the CSI 500 ETF purchasing 5.099 million shares, raising its holding from 1.03% to 1.18% [2]
华天科技上半年实现营收77.8亿元,净利润同比增长15.81%
Ju Chao Zi Xun· 2025-08-18 10:18
Group 1 - The core viewpoint of the article highlights the steady growth in the company's orders and operating performance due to the overall recovery in the semiconductor industry and the increasing market demand in the packaging and testing sector [2] - In the first half of 2025, the company achieved operating revenue of 7.78 billion yuan, representing a year-on-year increase of 15.81% [3] - The net profit attributable to shareholders of the listed company was 226 million yuan, showing a year-on-year growth of 1.68% [3] - The net profit after deducting non-recurring gains and losses was -8.13 million yuan, which is a significant improvement of 77.36% year-on-year [3] Group 2 - In Q2 2025, the company achieved operating revenue of 4.21 billion yuan, an increase of 6.43 billion yuan compared to Q1, marking a record high for a single quarter [2] - The net profit attributable to shareholders in Q2 was 2.45 billion yuan, which is an increase of 2.64 billion yuan from Q1 [2] - The company completed the development of ePoP/PoPt high-density memory and automotive-grade FCBGA packaging technology for smart cockpits and autonomous driving applications during the reporting period [4] - The company has obtained 11 authorized patents during the reporting period, including 10 invention patents [4] - The company is expanding its advanced packaging industry scale and optimizing its industrial layout through the gradual release of production capacity from its Jiangsu and Shanghai projects [4]
20亿!华天科技又上新项目
Xin Hua Ri Bao· 2025-08-17 21:24
Core Viewpoint - Huada Technology is establishing Nanjing Huada Advanced Packaging Co., Ltd. with a registered capital of 2 billion yuan, integrating its three core segments to capitalize on the explosive growth in the global advanced packaging market [1] Company Summary - Huada Technology is consolidating its subsidiaries, Huada Jiangsu, Huada Kunshan, and Huada Advanced No. 1 Fund, to form a new entity focused on advanced packaging [1] - The company is adopting a "cash + heavy asset" investment model, with Huada Jiangsu contributing land, real estate, and machinery, while Huada Kunshan and the Advanced No. 1 Fund provide cash support [1] - The establishment of Nanjing Huada Advanced is expected to create new business growth opportunities for the company and positively impact the semiconductor packaging and testing industry [1] Industry Summary - The global advanced packaging market is experiencing explosive growth, with major players like TSMC, Intel, and Samsung increasing their investments [1] - It is predicted that by 2027, the advanced packaging market will surpass traditional packaging for the first time [1] - The development of Nanjing Huada Advanced is anticipated to enhance domestic 2.5D/3D advanced packaging testing technology and contribute to the overall competitiveness of China's semiconductor industry [1]
公司连亏三年半!一家三口齐上阵,包揽1.59亿定增
中国基金报· 2025-08-15 00:48
Core Viewpoint - The company, Qipai Technology, has announced a plan to raise no more than 159 million yuan through a private placement, primarily to supplement its working capital, amidst ongoing financial losses over the past three and a half years [2][5]. Group 1: Fundraising Details - Qipai Technology plans to issue shares at a price of 20.11 yuan per share, with a total of no more than 7.9 million shares to be issued [5]. - The issuance will be fully subscribed by the actual controllers, Liang Dazhong, Bai Ying, and their son Liang Huate, indicating their strong support and confidence in the company's future [5][8]. - The funds raised will be used entirely to improve the company's liquidity, which is crucial given the capital-intensive nature of the semiconductor packaging and testing industry [8]. Group 2: Financial Performance - The company has reported continuous losses, with net profits of -58.57 million yuan in the first half of 2025, which is a deterioration of 18.07 million yuan compared to the same period last year [11]. - Revenue for the first half of 2025 was 326 million yuan, reflecting a year-on-year growth of 4.09% [11]. - The company has experienced a significant stock price rebound since April, with an overall increase of over 21% year-to-date, although it faced a decline of 3.90% on August 14, closing at 26.38 yuan per share [9][11]. Group 3: Company Background and Industry Position - Qipai Technology is a leading domestic semiconductor packaging and testing company in South China, having been listed on the STAR Market in June 2021 [10]. - The company has developed several core technologies in semiconductor packaging, including GaN RF power amplifier packaging technology and high-density matrix integrated circuit packaging technology, which provide it with a competitive edge in the industry [10]. - Despite its technological advancements, the company has struggled financially, with projected revenues of 540 million yuan, 554 million yuan, and 667 million yuan for 2022, 2023, and 2024, respectively, alongside increasing net losses [10].
2025年甬矽电子(宁波)股份有限公司向不特定对象发行可转换公司债券跟踪评级获“A+”评级
Sou Hu Cai Jing· 2025-08-13 02:24
2025年8月12日,中诚信国际公布评级报告,2025年甬矽电子(宁波)股份有限公司向不特定对象发行可 转换公司债券跟踪评级获"A+"评级。 本次跟踪维持主体及债项上次评级结论,主要基于甬矽电子(宁波)股份有限公司(以下简称"甬矽电 子"或"公司")在技术实力及产业化能力方面具有一定竞争实力,并与境内外核心芯片企业建立长期合 作关系,客户粘性较强,且跟踪期内公司产销量和收入规模大幅增长,经营获现能力持续表现良好等因 素对公司信用水平起到的支撑作用;但中诚信国际也关注到公司产能规模与头部企业仍有一定差距,晶 圆级封测产线仍处产能扩张期间,毛利承压明显,未来需关注晶圆级产品毛利转正情况,公司持续开展 二期工厂的项目建设,投资资金依赖于外部融资,财务杠杆处于较高水平等因素可能对公司经营和整体 信用状况造成的影响。 中诚信国际认为,甬矽电子(宁波)股份有限公司信用水平在未来12~18个月内将保持稳定。 来源:金融界 ...
日月光,斥巨资买厂
半导体行业观察· 2025-08-12 00:52
Core Viewpoint - The semiconductor packaging leader, ASE Technology Holding Co., announced a significant acquisition to enhance its advanced packaging capacity, driven by strong demand from high-performance computing (HPC) clients and the growing need for advanced packaging solutions [2][4]. Group 1: Acquisition and Expansion Plans - ASE Technology plans to acquire a facility from Win Semiconductors for NT$6.5 billion (approximately US$215 million) to expand its advanced packaging capacity in Kaohsiung [2]. - The new facility acquisition is expected to contribute NT$19.39 billion (approximately US$640 million) in profits, translating to a pre-tax earnings contribution of NT$4.57 per share [2]. - ASE's new K28 plant is set to begin construction in October 2024 and is expected to be completed by 2026, focusing on CoWoS advanced packaging capacity [2][3]. Group 2: Financial Performance and Projections - ASE's revenue for the third quarter is projected to increase by 12% to 14% in USD terms, with a corresponding increase of 6% to 8% in New Taiwan Dollar terms, despite a slight decline in gross margin due to currency appreciation [3][4]. - The advanced packaging and testing business is expected to contribute an additional US$1 billion in revenue compared to 2024, representing a 10% annual growth rate for the packaging segment [3][4]. - The company anticipates that the demand for high-end packaging, particularly 2.5D and 3D packaging, will continue to rise, necessitating the expansion to alleviate capacity constraints [3][4]. Group 3: Market Outlook and Strategic Positioning - ASE is optimistic about the recovery of the global semiconductor market by 2026, leveraging its technological leadership and capacity advantages to solidify its market position [4]. - The company aims to enhance its turnkey services, integrating advanced packaging and testing, with testing revenue growth expected to outpace packaging revenue growth this year [3][4]. - ASE's revenue for July reached NT$51.542 billion, marking a 4.1% month-over-month increase and a 7.95% year-over-year increase for the first seven months of the year [4].
颀中科技: 关于合肥颀中科技股份有限公司向不特定对象发行可转换公司债券申请文件的审核问询函回复
Zheng Quan Zhi Xing· 2025-08-04 16:47
Core Viewpoint - Hefei Qizhong Technology Co., Ltd. is applying for the issuance of convertible bonds to raise funds for specific projects, including advanced packaging and testing technology upgrades, which align with the company's strategic growth in the semiconductor industry [1][2][3]. Group 1: Fundraising and Project Overview - The funds raised will be used for two main projects: the high-footprint micro-sized bump packaging and testing project, and the advanced power and flip-chip packaging technology upgrade project [2][3]. - The total planned investment for the advanced power and flip-chip packaging technology upgrade project is approximately 851.11 million yuan, with 850 million yuan sourced from the raised funds [4][5]. - Previous fundraising projects included the advanced packaging testing production base project and high-density micro-sized bump packaging technology upgrades, which have been completed [4][32]. Group 2: Market Trends and Demand - The global display driver chip packaging market is expected to grow significantly, with a projected market size of 3.24 billion USD by 2028, driven by increasing demand for high-performance display technologies [19][20]. - The demand for advanced packaging solutions is rising due to the shift towards cost-effective materials like copper-nickel-gold bumps, which are gaining traction in high-end applications such as AMOLED displays [19][20]. - The Chinese mainland's display driver chip market is projected to reach 44.1 billion yuan in 2024, reflecting a growth rate of 13.4% year-on-year, indicating a robust demand for display technologies [27][28]. Group 3: Company Positioning and Strategy - Hefei Qizhong Technology has established itself as a leading provider of advanced packaging and testing services, particularly in the display driver chip sector, where it ranks among the top three globally [7][8]. - The company aims to enhance its service capabilities and market competitiveness through the implementation of the new projects, which are aligned with industry trends and customer demands [16][24]. - The focus on non-display chip packaging is part of a broader strategy to diversify and strengthen the company's market position in the semiconductor industry [9][24].
颀中科技: 天职国际会计师事务所(特殊普通合伙)关于合肥颀中科技股份有限公司向不特定对象发行可转换公司债券申请文件的审核问询函回复
Zheng Quan Zhi Xing· 2025-08-04 16:47
向不特定对象发行可转换公司债券 申请文件的审核问询函回复 天职业字[2025]35779号 目 录 关于合肥颀中科技股份有限公司向不特定对象发行可转换公司债券 申请文件的审核问询函回复 1 关于合肥颀中科技股份有限公司 向不特定对象发行可转换公司债券申请文件的审核问询函回复 天职业字[2025]35779 号 上海证券交易所: 根据贵所于 2025 年 7 月 7 日出具的上证科审(再融资)〔2025〕73 号《关 于合肥颀中科技股份有限公司向不特定对象发行可转换公司债券申请文件的审 核问询函》(以下简称"问询函")的要求,天职国际会计师事务所(特殊普通 合伙)(以下简称"申报会计师")作为合肥颀中科技股份有限公司(以下简称 "颀中科技"、"发行人"或"公司")本次向不特定对象发行可转换公司债券的 申报会计师,本着勤勉尽责、诚实守信的原则,就问询函所提问题逐项进行认 真讨论、核查与落实,并逐项进行了回复说明。具体回复内容附后。 关于回复内容释义、格式及补充更新披露等事项的说明: 有限公司向不特定对象发行可转换公司债券募集说明书》(以下简称"募集说明 书")一致; 舍五入所致; | 问询函所列问题 | | 黑体 ...
蓝箭电子(301348.SZ):暂无PCB方面的封测服务
Ge Long Hui· 2025-07-30 08:45
格隆汇7月30日丨蓝箭电子(301348.SZ)在互动平台表示,公司暂无PCB方面的封测服务。 ...
爱集微:2024年封测行业上市公司收入同比增长21% 先进封装迎发展机遇
Zheng Quan Shi Bao Wang· 2025-07-21 14:38
Group 1 - The report by Aijimi highlights the growth of the semiconductor packaging and testing industry, projecting a total revenue of 87.056 billion yuan for listed companies in 2024, representing a year-on-year increase of 20.69% with a gross margin of approximately 15.67% [1] - The top three companies by total revenue in the packaging and testing sector are Changdian Technology (35.962 billion yuan), Tongfu Microelectronics (23.882 billion yuan), and Huatian Technology (14.462 billion yuan) [1] - The report indicates that the R&D expenditure as a percentage of revenue is highest for Liyang Chip (15.95%), Jingfang Technology (14.12%), and Weicai Technology (13.22%) [1] Group 2 - The advanced packaging market is expected to generate total revenue of $51.9 billion in 2024, with a year-on-year growth of 10.9%, and is projected to reach $78.6 billion by 2028, with a compound annual growth rate (CAGR) of 10.05% from 2022 to 2028 [2] - The global semiconductor packaging market is forecasted to grow from $65.04 billion in 2020 to $118.6 billion in 2027, with a CAGR of 6.6%, while advanced packaging is expected to surpass traditional packaging in market size by 2027 [2] Group 3 - The domestic packaging and testing industry is performing well, with Chinese companies leading in brand strength, diverse teams, international operations, technical capabilities, quality assurance, production scale, and operational efficiency [3] - In 2023, capital expenditure in the advanced packaging sector reached $9.9 billion, primarily from major semiconductor companies and leading OSAT firms, with an expected increase to $11.5 billion in 2024 [3] - The report emphasizes that the growth of the semiconductor packaging market is driven by emerging technologies such as AI, IoT, cloud computing, and big data, which are increasing the demand for chips [3] Group 4 - The global Chiplet market is projected to grow from approximately $3.1 billion in 2023 to around $107 billion by 2033, with a CAGR of 42.5% from 2024 to 2033 [4] - Companies like Intel and TSMC have mature Chiplet technologies, while domestic firms such as Changdian Technology and Tongfu Microelectronics are also advancing in this area [4] - The 2.5D/3D packaging market is expected to expand from $9.4 billion in 2022 to $22.5 billion by 2028, with a CAGR of 15.6%, driven by high-performance computing and AI technologies [4]