Summary of Conference Call Records Industry Overview - The conference call primarily discusses the **NAND Flash** and **DRAM** memory markets, focusing on price trends, demand drivers, and competitive dynamics among manufacturers, particularly in Taiwan and mainland China. Key Points Price Trends and Market Dynamics - **NOR Flash Market**: In Q3 2025, NOR Flash prices are expected to rise, with large capacity products increasing by over **15%** and medium/small capacity products by over **20%**, driven by demand from AI servers and automotive electronics [1][4][5] - **DDR4 and DDR3 Prices**: DDR4 contract prices fell in the first half of 2025 but began to recover in Q2, with a projected increase of over **20%** in Q3. DDR3 prices rose by over **10%** in Q2, with expectations of a **15%** increase in Q3 and **10%** in Q4, leading to an annual increase exceeding **30%** [2][8][35] - **Overall Market Performance**: The niche storage market is supported by growth in AI servers, automotive electronics, and industrial control sectors, despite a decline in traditional consumer electronics [5][12] Demand Drivers - **AI Server Demand**: The demand for AI servers, particularly products like AMD's MI300 series, has significantly influenced price increases. The domestic AI server market is expected to see a rise in domestic manufacturers' market share from **20%** in the first half of 2025 to over **30%** in the second half, with long-term projections exceeding **80%** [1][23] - **Emerging Consumer Electronics**: New consumer electronics such as TWS headphones and AI glasses are driving demand in the niche storage market, contrasting with the declining traditional consumer electronics market [1][12] Manufacturer Strategies - **Taiwanese Manufacturers**: Taiwanese manufacturers initially planned a **10%** price increase in Q2 2025, but actual increases were lower. They are now focusing on the mainland market for SLC products, leading to intensified competition [6][15] - **Production Capacity**: Taiwanese manufacturers are expanding their DRAM production capacity, particularly for DDR4 and DDR5, while maintaining a cautious approach to increasing NAND Flash capacity due to current market conditions [14][30][31] Competitive Landscape - **Market Share Dynamics**: The top three Taiwanese manufacturers dominate the market, holding over **75%** of the market share. However, the growth potential for NAND Flash revenue is limited due to a lack of new applications [16][18] - **Mainland Competitors**: Mainland Chinese companies are gradually entering the server market, gaining some market share but still lagging behind established Taiwanese firms in terms of product stability and performance [20][23] Future Outlook - **Price Stabilization**: While prices are expected to rise in the short term, there may be a stabilization or easing of price increases by late August or early September 2025 due to a lack of large-scale follow-up orders [5][19] - **Long-term Growth**: The DDR4 market is projected to exceed **$6 billion** by 2026, driven by increasing demand for high-capacity products [37][38] Additional Insights - **H20 Orders Impact**: H20's additional orders have increased demand in the Taiwanese market, particularly for 1TB capacity products, but this demand is not expected to be sustained [18][19] - **Profit Margins**: High-margin products like large capacity No Flash can achieve margins over **80%**, making them highly profitable despite the overall market challenges [25][26] This summary encapsulates the key insights from the conference call, highlighting the current state and future outlook of the NAND Flash and DRAM markets, along with the competitive dynamics among manufacturers.

Group 1: TCM Model and Competitive Advantage - The company has established a TCM model collaboration with storage wafer manufacturers, showcasing its leading capabilities in chip control, firmware development, and packaging manufacturing, which enhances profitability and creates higher technical and service value [3] - The company is one of the few in China capable of designing and supplying "eSSD+RDIMM" products, with a complete enterprise-level product line that meets the high-performance demands of AI servers [3] Group 2: Development Progress and Market Position - The company has been investing in self-developed control chips for several years, resulting in significant performance and power consumption advantages over mainstream market products, with UFS4.1 products achieving sequential read/write speeds of 4350MB/s and 4200MB/s, and random read/write speeds of 630K IOPS and 750K IOPS [4] - The company's revenue in the enterprise storage sector has seen over 200% growth in Q1 2025, indicating substantial potential for future revenue growth as it captures more market share in high-end storage [5] Group 3: Market Trends and Price Movements - The company anticipates continued upward momentum in storage prices for Q3, driven by inventory demands from server OEM customers and cautious capacity control strategies from storage wafer manufacturers [6]

Core Viewpoint - Hybrid bonding technology is rapidly transitioning from laboratory to mass production, becoming a new pillar in storage chip manufacturing, particularly in the context of advanced packaging technologies like 3D NAND and HBM [2][3]. Group 1: Hybrid Bonding Technology - Hybrid bonding eliminates size limitations and parasitic effects associated with traditional bump structures, resulting in shorter signal transmission paths, lower power consumption, and higher speeds [3]. - In 3D NAND, hybrid bonding is expected to replace some existing structures, enabling stable manufacturing at higher stacking layers (e.g., over 300 layers) [3][7]. - Leading companies like Micron, SK Hynix, and Samsung are actively investing in hybrid bonding technology for HBM4 and next-generation CUBE architectures, highlighting its strategic importance [3][5]. Group 2: Samsung's Initiatives - Samsung has shown a strong commitment to hybrid bonding, recognizing its necessity for manufacturing 16-layer HBM [4][5]. - The company plans to produce HBM4 samples by 2025, with mass production expected in 2026, and has already tested a 16-layer HBM sample using hybrid bonding technology [5][6]. - Samsung is also preparing for a custom HBM business, responding to demand from major tech companies like Google and NVIDIA for tailored HBM products [6][7]. Group 3: SK Hynix's Developments - SK Hynix is also pursuing hybrid bonding technology, planning to mass-produce 16-layer HBM4 by 2026 and exploring the potential for over 20 layers [9][10]. - The company aims to implement hybrid bonding for its NAND products, targeting 400-layer NAND flash production by 2025 [10][11]. Group 4: Micron's Position - Micron has been relatively quiet about hybrid bonding but has begun delivering HBM4 samples, which feature a capacity of 36 GB and a bandwidth of up to 2 TB/s [13][14]. - The company is focusing on optimizing existing technologies and may adopt hybrid bonding later than its competitors [14]. Group 5: Equipment Manufacturers - Equipment manufacturers like BESI and Applied Materials are leading the hybrid bonding equipment market, with BESI having developed systems for high-precision bonding since 2019 [15][16]. - Applied Materials has integrated its hybrid bonding platform with wafer processing data, emphasizing system-level integration [16][17]. - Other companies, including ASMPT and Korean firms like Hanmi Semiconductor and Hanwha, are also entering the hybrid bonding equipment market, with various development stages and partnerships [18][19][20]. Group 6: Future Outlook - The semiconductor industry is increasingly focused on hybrid bonding as a key technology to overcome traditional packaging limitations and achieve higher performance integration [25]. - As Moore's Law slows, hybrid bonding is expected to play an irreplaceable role in advancing the industry towards greater integration and performance [25].

Market Overview - The US stock market experienced significant declines on the first trading day of August, with the Dow Jones falling by 1.23%, the S&P 500 by 1.6%, and the Nasdaq by 2.24% [2] - The US non-farm payrolls for July increased by only 73,000, which was significantly below the economists' forecast of 100,000 [2] - Federal Reserve Chairman Jerome Powell indicated a cautious approach to interest rate cuts, affecting market sentiment [2] - Former President Trump announced adjustments to tariffs, with new rates ranging from 10% to 41%, adding further pressure to market sentiment [2] Commodity Market - International gold prices surged, with London gold rising by 2.22% and COMEX gold increasing by 2.01% [3] Company News: China Shenhua - China Shenhua announced it received a notification from its controlling shareholder, China Energy Investment Corporation, regarding a potential major asset acquisition involving coal and related assets [4] - The transaction will involve issuing shares and cash to acquire coal, pithead coal power, and other related assets, with specific details to be confirmed in future announcements [8] - China Shenhua's latest market capitalization is approximately 722.455 billion, with a projected net profit for the first half of the year between 23.6 billion and 25.6 billion [9] Upcoming Stock Unlocking - A total of 32 stocks will face unlocking next week, with a combined market value of 91.974 billion [11] - Notable unlockings include Runze Technology with 1.076 billion shares and a market value of 51.821 billion, and Jiangbolong with 155 million shares and a market value of 13.649 billion [12][13] - The average stock price of the unlocking stocks has increased by 3.01% since July, with Xicetest seeing a significant rise of 30.19% [16][17] Institutional Research - Several companies facing unlocking have recently been subject to institutional research, including Jiangbolong and Huayuan Pharmaceutical, which focus on high-tech pharmaceutical development [17][18] - Jiangbolong reported that the semiconductor storage market is expected to recover gradually starting from the second half of 2025, driven by demand from server OEMs and mobile storage capacity increases [18]

Group 1 - Jiangbolong announced that 300 million restricted shares (accounting for 71.57% of total share capital) will be released for circulation on August 5 [1] - The controlling shareholder and actual controllers have voluntarily committed not to reduce their holdings for 12 months starting from the release date, significantly reducing the potential sell-off pressure [1] - The overall sellable share ratio will decrease from 71.57% to 28.30%, and the number of shares from 300 million to 11.9 million, alleviating market concerns [1] Group 2 - The employee stock ownership platform, as a concerted actor of the actual controller, holds 16.53% of shares (0.69 million shares) and will adhere to the same strict reduction requirements [2] - This further reduces the overall sellable scale by 57.98%, indicating a strong commitment to maintaining share value [2] - Jiangbolong is focusing on high-end, overseas, and brand development to enhance its competitiveness in the semiconductor storage industry, achieving significant breakthroughs in enterprise-level storage and high-end consumer storage [2]

Group 1 - The company Jiangbolong (301308) announced that 300 million restricted shares (accounting for 71.57% of total shares) will be released for circulation starting August 5 [2] - The controlling shareholder and actual controller, along with certain directors, voluntarily committed not to reduce their holdings for 12 months starting from the release date, significantly reducing the potential sell-off pressure [2][3] - The overall sellable share ratio will decrease from 71.57% to 28.30%, and the number of shares from 300 million to 11.9 million, alleviating market concerns about concentrated unlock pressure [2] Group 2 - The employee stock ownership platform, as a concerted actor of the actual controller, holds 16.53% of shares (0.69 million shares) and will adhere to the same strict reduction requirements, further decreasing the overall sellable scale by 57.98% [3] - Analysts indicate that such voluntary non-reduction commitments typically serve as a positive signal in the capital market, enhancing investor confidence [3] - Jiangbolong is advancing its business layout focusing on industry, high-end, overseas, and branding, aiming to build an internationally competitive semiconductor storage brand [3]

最近两个月，深圳迎来多家公司冲击IPO，包括北芯生命、惠科股份、承泰科技、华大北斗、创智芯联、大族数控、 乐动机器人、基本半导体等，其中有不少是半导体公司。 近期，又有一家来自深圳的半导体公司寻求A股上市。 格隆汇获悉，深圳大普微电子股份有限公司（简称"大普微电子"）不久前向创业板递交了招股书，由国泰海通证券股 份有限公司担任保荐人。 大普微电子是一家半导体存储产品提供商，专注于数据中心企业级SSD（固态硬盘）领域。 公司业绩受半导体周期影响较为明显，目前尚未盈利，这也是创业板首家获受理的未盈利企业。 01 高通前员工在深圳龙岗创业，专注于数据中心企业级SSD领域 大普微电子成立于2016年4月，2023年9月变更为股份有限公司，其总部位于深圳市龙岗区龙城街道。 公司的创始人是杨亚飞，他目前通过大普海德、大普海聚合计控制公司66.74%的表决权。 大普微电子的主要机构投资者包括盈富泰克、龙岗基金、中科国控、招华招证、海通创新等；2024年12月，公司最后 一轮完成增资，当时的估值为68.1亿元。 杨亚飞今年46岁，博士研究生学历，目前在公司担任董事长兼总经理一职。创业之前，他在美国高通公司工作过多 年，先后任 ...

Core Viewpoint - The announcement of the lifting of the lock-up period for 300 million shares of Jiangbolong (accounting for 71.57% of total shares) on August 5 is expected to have limited liquidity impact, as the controlling shareholders and executives have committed to not reducing their holdings for 12 months, enhancing market confidence in the company's future development and investment value [1][2][5] Group 1: Share Lock-up and Reduction - The lifting of the lock-up period will see the reducible share scale drop significantly from 71.57% to 28.30%, translating to a decrease from 300 million shares to 119 million shares [2] - The employee shareholding platform, holding 16.53% of shares (0.69 million shares), will also adhere to the same strict reduction requirements, further reducing the overall reducible scale by 57.98% [2] - The voluntary commitment not to reduce holdings is viewed positively in the capital market, enhancing investor confidence and reflecting the company's fundamental value [2] Group 2: Business Development and Market Position - Jiangbolong is focusing on high-end, overseas, and brand development to establish itself as a competitive semiconductor storage brand, achieving significant breakthroughs in enterprise storage, high-end consumer storage, and main control chips [3] - The company has transformed into a comprehensive semiconductor storage brand, becoming one of the few in China capable of supplying "eSSD+RDIMM" products, with multiple enterprise-level storage products launched [3] - Jiangbolong ranks as the second-largest independent memory company globally and the largest in China, with its FORESEE brand ranking fifth in B2B revenue and Lexar brand second in B2C revenue globally [3] Group 3: Financial Performance - In 2023, Jiangbolong achieved revenue of 10.125 billion yuan, marking its first time surpassing the 10 billion yuan threshold, with a projected revenue of 17.464 billion yuan in 2024, representing a year-on-year growth of 72.48% [4] - The company is benefiting from a pricing cycle in storage and the domestic substitution trend in high-end storage, which is expected to drive high revenue growth in the short term [4] - Jiangbolong's innovative business models, such as PTM and TCM, are providing industrial support for business breakthroughs, enhancing its differentiated product capabilities and overall service capacity [4]

大普微电子是一家半导体存储产品提供商，专注于数据中心企业级SSD（固态硬盘）领域。 公司业绩受半导体周期影响较为明显，目前尚未盈利，这也是创业板首家获受理的未盈利企业。 最近两个月，深圳迎来多家公司冲击IPO，包括北芯生命、惠科股份、承泰科技、华大北斗、创智芯联、大族数控、 乐动机器人、基本半导体等，其中有不少是半导体公司。 近期，又有一家来自深圳的半导体公司寻求A股上市。 格隆汇获悉，深圳大普微电子股份有限公司（简称"大普微电子"）不久前向创业板递交了招股书，由国泰海通证券股 份有限公司担任保荐人。 01 高通前员工在深圳龙岗创业，专注于数据中心企业级SSD领域 大普微电子成立于2016年4月，2023年9月变更为股份有限公司，其总部位于深圳市龙岗区龙城街道。 公司的创始人是杨亚飞，他目前通过大普海德、大普海聚合计控制公司66.74%的表决权。 大普微电子的主要机构投资者包括盈富泰克、龙岗基金、中科国控、招华招证、海通创新等；2024年12月，公司最后 一轮完成增资，当时的估值为68.1亿元。 杨亚飞今年46岁，博士研究生学历，目前在公司担任董事长兼总经理一职。创业之前，他在美国高通公司工作过多 年，先后任 ...

Core Insights - Tongyuan Investment conducted a survey on Jiangbolong, revealing significant revenue growth in the enterprise storage business, with over 600% growth in 2024 and over 200% growth in Q1 2025 [1] - The company is actively promoting the TCM model and has established partnerships with multiple Tier 1 clients, enhancing visibility in supply and demand, and improving profitability [1] - Jiangbolong has strong capabilities in 'eSSD+RDIMM' product design and supply, with recognition from various well-known clients across multiple industries [1] - The company’s self-developed main control chip shows superior performance, with UFS4.1 products outperforming mainstream market products, and a significant increase in shipment scale expected for 2025 [1] - Jiangbolong has established a comprehensive semiconductor storage R&D system, obtaining multiple patents and technology licensing agreements [1] - Market prices for storage products are rising, with expectations of continued upward momentum in Q3 for server and mobile storage products [1] - The company collaborates deeply with wafer foundries and end-market applications, acting as a crucial bridge between upstream and downstream, providing higher added value [1]