Core Insights - Nebius Group N.V. (NBIS) is targeting annualized run-rate revenue (ARR) of $750 million to $1 billion and total revenues of $500–$700 million by 2025, following a 385% year-over-year revenue increase in Q1 2025 and a 700% surge in ARR [1][9] - The company reported an ARR of $310 million in April 2025, indicating strong momentum for the second quarter [1] Company Growth and Strategy - Nebius is experiencing solid growth in its core artificial intelligence (AI) business, benefiting from a full-stack approach that includes high-performance GPU cloud infrastructure and AI development tools [2] - The company raised $700 million in funding from notable investors like NVIDIA and Accel in December 2024, which is being used to expand aggressively in North America and Europe [3] - In June 2025, Nebius announced a private placement of $1 billion in convertible notes to capitalize on the AI-infrastructure boom and enhance revenue opportunities in 2026 [3] Market Position and Competition - Nebius holds a minority stake of approximately 28% in ClickHouse, which is reportedly in a fundraising round that may value it at around $6 billion [4] - The global demand for AI-specific infrastructure is increasing, with IDC forecasting AI infrastructure spending to reach $223 billion by 2028, where cloud environments will account for 82% of the market [5] Financial Performance - Nebius shares surged 153.3% over the past year, outperforming the Internet – Software and Services industry's growth of 39.3% [10] - The company's shares are currently trading at a price/book ratio of 3.58X, lower than the industry's 4.07X [11]

Acquisition Details - Snap, Inc. has confirmed the acquisition of Saturn, a calendar app aimed at helping students organize and share their school schedules [1] - The terms of the acquisition were not disclosed, and Saturn will continue to operate as an independent app [1] - Nearly all of Saturn's team, consisting of just under 30 full-time employees, will join Snap as part of the deal [2] Future Plans - Snap has not provided specific details on future plans for Saturn, but intends to integrate Saturn's calendar features into Snapchat in innovative ways [2] Saturn's Features and Popularity - Launched in 2018, Saturn allows high school and college students to connect with classmates and view each other's class schedules, eliminating the need to exchange timetable photos [3] - The app enables users to share class schedules, practice plans, rehearsals, meetings, and games, providing a real-time view of friends' activities [4] - Saturn is widely used, with support in 80% of U.S. high schools, attributed to its engaging and interactive scheduling approach [4] Snap's Broader Initiatives - Snap plans to launch lightweight, immersive AR glasses called Specs in 2026, which will utilize advanced machine learning for various applications [5] - Currently, Snapchat users interact with AR Lenses 8 billion times daily, with over 400,000 developers creating more than 4 million Lenses using Snap's AR tools [5]

RT Tesla Owners Silicon Valley (@teslaownersSV)“Starship is fully reusable, but will have twice the payload to orbit of the next biggest rocket that made it to orbit, which is the Saturn V.In fact, without reusability, Starship would have about 400 tons of payload to orbit.”https://t.co/UPiXLmv30r ...

申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 2024年，HBM成为半导体产业最炙手可热的产品之一。 随着AI大模型和高性能计算的狂飙突进，英伟达等巨头对HBM的需求水涨船高，内存厂的HBM订单早 已售卖一空，尤其是SK海力士，其在HBM市场占有率高达70%，更是赚得盆满钵满。 然而，就在这股浪潮背后，名为"TCB（Thermal Compression Bonding）键合机"的设备，正在悄然决定 HBM产业链的上限，不论是SK海力士，还是美光三星，都在过去一年时间里加大了设备方面的投入， 也让更多设备厂商有机会吃上这波AI红利。 什么是TCB？ 先来了解一下目前HBM芯片的键合技术。在传统的倒装芯片键合中，芯片被"翻转"，以便其焊料凸块 （也称为 C4 凸块）与半导体基板上的接合焊盘对齐。整个组件被放置在回流炉中，并根据焊料材料均 匀加热至 200ºC-250ºC 左右。焊料凸块熔化，在接合和基板之间形成电气互连。 随着互连密度的增加和间距缩小到 50µm 以下，倒装芯片工艺面临一些挑战。由于整个芯片封装都放入 烤箱中，芯片和基板会因热量而以不同的速率膨胀（即不同的热膨胀系数，CTE），从而产 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 2024年，HBM成为半导体产业最炙⼿可热的产品之⼀。 随着AI⼤模型和⾼性能计算的狂飙突进，英伟达等巨头对HBM的需求⽔涨船⾼，内存⼚的HBM订 单早已售卖⼀空，尤其是SK海⼒⼠，其在HBM市场占有率⾼达70%，更是赚得盆满钵满。 然⽽，就在这股浪潮背后，名为"TCB（Thermal Compression Bonding）键合机"的设备， 正在悄然决定HBM产业链的上限，不论是SK海⼒⼠，还是美光三星，都在过去⼀年时间⾥加⼤了 设备⽅⾯的投⼊，也让更多设备⼚商有机会吃上这波AI红利。 什么是TCB？ 先来了解⼀下⽬前HBM芯⽚的键合技术。在传统的倒装芯⽚键合中，芯⽚被"翻转"，以便其焊 料凸块（也称为 C 凸块）与半导体基板上的接合焊盘对⻬。整个组件被放置在回流炉中，并根据 焊料材料均匀加热⾄ ºC-ºC 左右。焊料凸块熔化，在接合和基板之间形成电⽓互连。 随着互连密度的增加和间距缩⼩到 µm 以下，倒装芯⽚⼯艺⾯临⼀些挑战。由于整个芯⽚封装 都放⼊烤箱中，芯⽚和基板会因热量⽽以不同的速率膨胀（即不同的热膨胀系数，CTE），从⽽产 ⽣变形，导致互连出现故障。然后， ...