Core Viewpoint - Shanghai Taosheng Electronics Technology Co., Ltd. has officially submitted its application for listing on the Sci-Tech Innovation Board, aiming to raise 1.058 billion yuan for the construction of a semiconductor testing interface and probe production base, R&D of wafer testing probe cards, and working capital supplementation, to strengthen its leading position in high-end chip testing hardware and accelerate the domestic substitution process [1] Group 1: Company Overview - Taosheng Technology is one of the earliest companies in China to independently develop chip testing interfaces and achieve large-scale production [1] - The company focuses on the semiconductor testing interface field, with products including chip testing interfaces and probe cards, which are critical for ensuring chip quality [1] - The company has developed over 4,000 chip testing interface technology solutions and possesses independent R&D and manufacturing capabilities for high-speed, high-frequency testing probes [2] Group 2: Market Position and Achievements - According to Yole, Taosheng Technology is projected to rank first in chip testing interface revenue in China and 11th globally in 2024 [2] - The company has built a broad customer ecosystem covering the entire semiconductor industry chain, serving over 700 clients, including leading companies in AI chips and autonomous driving [2] - Taosheng Technology has developed the first domestic DSA testing interface supporting parallel testing of 512 chips for Yangtze Memory Technologies, aiding the localization of the storage industry [2] Group 3: Technological Advancements - The company is expanding into the more technically challenging wafer testing probe card field, with its MEMS probe cards already commercialized for AI chip clients [3] - Taosheng Technology has achieved breakthroughs in the storage sector, with 2D MEMS products receiving orders and 2.5D MEMS products passing stringent certifications from Yangtze Memory Technologies [3] - The company is also conducting pre-research on 3D MEMS probe card technology to cover high-end storage testing scenarios [3] Group 4: Future Outlook - Taosheng Technology aims to focus on national strategic needs, pursuing high-end and large-scale development [3] - The company plans to increase R&D investment to tackle core key technologies in high-end testing interfaces, break overseas monopolies, and accelerate the domestic substitution process [3] - The goal is to further expand market share and solidify its leading position in the industry, aspiring to become a leading brand in the global semiconductor testing interface field [3]

12月30日，上海证券交易所正式受理了长鑫科技集团股份有限公司（简称"长鑫科技"）的科创板上市申请。作为我国规模最 大、技术最先进、布局最全的DRAM（动态随机存取存储器）研发设计制造一体化企业，长鑫科技此次IPO拟募集资金高达295 亿元，主要用于存储器晶圆制造量产线技术升级改造项目、DRAM存储器技术升级项目，以及动态随机存取存储器前瞻技术研 究与开发项目，标志着国产DRAM产业发展进入新的关键阶段。 目前，长鑫科技在合肥、北京两地拥有3座12英寸DRAM晶圆厂，产能规模位居中国第一。公司高度重视研发创新，截至2025年 6月30日，已在全球范围内拥有超过5500项专利，其中境内发明专利2348项。根据世界知识产权组织数据，公司2023年国际专利 申请公开数量位列全球第22位，展现出强劲的技术创新实力。 在产业链协同方面，公司已与阿里云、字节跳动、腾讯、小米、荣耀、OPPO、vivo等众多行业头部客户建立深度合作，并积极 联动半导体设备、材料、设计及模组等上下游企业，共同推动国产DRAM产业生态的完善与安全可控。 本次IPO募集资金将重点投向制造技术升级、DRAM技术迭代及前沿技术研发等领域。长鑫科技表示 ...

Core Viewpoint - Jiangsu Gaokai Precision Fluid Technology Co., Ltd. (referred to as "Gaokai Technology") has officially submitted its application for listing on the Sci-Tech Innovation Board, aiming to raise approximately 1.5 billion yuan for high-end semiconductor equipment component R&D, R&D center construction, and working capital supplementation [1][4]. Company Overview - Established in 2013, Gaokai Technology focuses on the R&D, production, and sales of key control components and related equipment in the precision fluid control field [3]. - The company has developed three core business segments: flow control series, dispensing packaging series, and precision coating series, with applications in semiconductor, consumer electronics, automotive electronics, and new energy sectors [3]. Market Position and Achievements - Gaokai Technology is one of the few domestic suppliers capable of mass production and application of key fluid control components in advanced semiconductor processes, including products used in 7nm and below logic chip manufacturing [3]. - The company's products have been validated by well-known domestic manufacturers, achieving stable mass production supply [3]. - In the semiconductor equipment fluid control sector, Gaokai's self-developed products are widely used in wafer manufacturing processes such as etching, thin film deposition, and cleaning, serving several leading domestic semiconductor equipment companies [3]. Recent Developments - This is Gaokai Technology's second attempt to list on the Sci-Tech Innovation Board, having previously been accepted in June 2021 but terminating the review in December of the same year [4]. - The renewed application reflects the company's commitment to the precision fluid control field and significant progress in core technology breakthroughs and market expansion [4]. Industry Outlook - Analysts note that the demand for precision fluid control is continuously growing due to the accelerated localization of semiconductor equipment and the rapid development of the new energy industry [4]. - Successful listing on the Sci-Tech Innovation Board would provide Gaokai Technology with more substantial financial support, potentially solidifying its leading position in the key components of semiconductor equipment and promoting the realization of more core technologies being self-controlled [4].

国内半导体测试设备领域迎来一家新的上市后备军。12月30日，证监会官网披露，深圳市辰卓科技有限公司（以下简称"辰卓科 技"）已在深圳证监局办理上市辅导备案登记，正式启动A股IPO进程，辅导机构为中信建投证券。 辰卓科技成立于2013年5月，是一家专注于以SoC（系统级芯片）测试机为核心的半导体测试设备供应商。公司主营业务包括 CIS（图像传感器）测试机、通用数字测试机、DDIC（显示驱动芯片）测试机等设备的研发、生产、销售与技术服务。2024 年，公司凭借其技术实力和市场表现，成功获评国家级专精特新"小巨人"企业。 成立至今，辰卓科技已累计服务超过200家国内外芯片客户，其中包括多家行业龙头企业。2024年，其SoC测试机在客户端实现 稳定量产运行超过400台，在半导体测试领域积累的知识产权已超过100项，展现出扎实的技术功底与市场竞争力。 目前，公司已实现CIS测试机与通用数字测试机的规模量产与商用，并推出了应用于显示驱动芯片测试的高性能DDIC测试机。 面向未来，辰卓科技计划进一步推出适用于AI、CPU、GPU、FPGA及通信等复杂SoC芯片测试的高端测试设备，持续拓展产品 线。 公开信息显示，辰卓科技已 ...

瀚博半导体是一家专注于GPU芯片研发的高科技企业，致力于为人工智能核心算力、图形渲染及内容生成提供全栈式芯片解决 方案。在人工智能与图形技术快速发展的背景下，市场对高性能GPU的需求持续强劲，为公司带来了广阔的发展空间。 12月30日，证监会网站披露了中信证券关于瀚博半导体（上海）股份有限公司（以下简称"瀚博半导体"）首次公开发行股票并 上市辅导工作的完成报告，标志着这家专注于GPU芯片研发的公司已正式完成上市辅导，向A股IPO迈出关键一步。 公司表示，此次启动IPO旨在抓住行业战略机遇，通过登陆资本市场进一步拓宽融资渠道。所募资金将主要用于加大研发投入、 扩大生产规模、加强市场拓展，以巩固并提升在高性能计算及图形处理领域的市场地位，满足下游应用场景不断增长的需求。 完成上市辅导是企业在A股上市进程中的重要环节。此次辅导工作的顺利结束，意味着瀚博半导体在公司规范治理、合规运作等 方面已符合监管要求，为后续提交IPO申请奠定了坚实基础。 分析指出，若瀚博半导体成功上市，不仅能为自身发展注入强劲资本动力，加速产品迭代与技术突破，也有望提升其在全球 GPU市场的品牌影响力与综合竞争力。同时，作为国内GPU领域的重要 ...

此外，在设备更新方面，政策支持范围也在总体延续的基础上，增加了老旧小区加装电梯、养老机构、 消防救援、检验检测以及线下消费商业设施等与民生和安全密切相关的领域，体现出政策对提升社会整 体福祉与安全水平的关切。 汽车以旧换新：由定额补贴调整为按新车销售价格的一定比例给予补贴，补贴上限保持不变。 家电以旧换新：补贴标准明确为对个人消费者购买上述6类家电中1级能效或水效标准的产品，按 销售价格的15% 给予补贴，每位消费者每类产品限补1件，每件补贴不超过1500元。 数码及智能产品购新：补贴标准保持按产品销售价格的15%执行，每位消费者每类产品限补1件， 每件补贴上限为500元。 邹蕴涵表示，此次优化旨在更好地结合市场内生需求与政策效力，为民生需求"解渴"，为消费升级提供 助力，推动明年消费平稳向好。 为保障政策及时落地见效，满足元旦、春节等传统消费旺季的需求，国家已于近日向地方提前下达2026 年第一批625亿元超长期特别国债资金，专项用于支持消费品以旧换新。各地将结合本地实际，尽快组 织落实，以提升政策效能。 国家发展改革委、财政部于12月30日联合发布关于2026年实施大规模设备更新和消费品以旧换新政策的 通 ...

Group 1 - The chairman of Zotye Auto, Li Lizhong, has resigned due to personal family reasons, and the company has nominated Han Biwen as a candidate for a non-independent director of the ninth board of directors [2] - Li Lizhong submitted a written resignation report to the board, resigning from all positions including chairman, director, and committee roles, and will no longer hold any position in the company [2] - As of the announcement date, Li Lizhong does not hold any shares in the company and has no unfulfilled commitments [2] Group 2 - Han Biwen, born in April 1978, has extensive experience in the automotive industry, having held various positions at Chery Automobile Co., Ltd. and other companies [3] - Han Biwen does not hold any shares in Zotye Auto and has no relationships with shareholders or other board members [3] - The nomination of Han Biwen as a non-independent director is set to take effect from the date of approval by the shareholders' meeting until the end of the ninth board's term [2]

Core Viewpoint - Great Wall Motors has signed a revised framework agreement with Beam Automobile, establishing the upper limit for daily related transactions for 2026, which is part of an ongoing collaboration that began in 2020 [2][3] Group 1: Transaction Details - From January 1 to November 30, 2025, Great Wall Motors engaged in various related transactions with Beam Automobile, including sales of parts and molds amounting to 1.193 billion yuan, vehicle and parts procurement around 12 million yuan, R&D services totaling 79.1193 million yuan, consulting services amounting to 7.6339 million yuan, procurement of R&D services at 51.1515 million yuan, IT-related services worth 4.2577 million yuan, and logistics services totaling 190.019 million yuan [2] - From 2020 to November 30, 2025, Great Wall Motors provided factory construction management and production process development services to Beam Automobile, with a cumulative amount of 137 million yuan [2] Group 2: Agreement Terms - The revised agreement specifies the upper limits for daily related transactions for 2026, although specific amounts were not disclosed in the announcement [2] - The previously agreed cumulative transaction limit for factory construction management and production process development services from 2020 to 2027 is set at 200 million yuan, with 137 million yuan already utilized as of November 30, 2025 [2] Group 3: Company Background - Beam Automobile was established in December 2019 with a registered capital of 1.7 billion yuan, jointly owned by Great Wall Motors and BMW (Netherlands) Holding Company, each holding a 50% stake [3] - The executive director and deputy general manager of Great Wall Motors, Zhao Guoqing, serves as a director of Beam Automobile, indicating that Beam Automobile is a related party [3]

公告显示，本次交易的主要交易对方包括南昌建恩半导体产业投资中心（有限合伙）、北京广盟半导体产业投资中心（有限合伙）、天津瑞芯半导体产业投 资中心（有限合伙）等，紫光国微已与上述三方签署《收购意向协议》，拟同步收购其他股东所持瑞能半导股份以确定最终交易对方范围。交易定价将以具 有证券从业资格的评估机构出具的评估报告为依据，由交易各方协商确定。 瑞能半导成立于2015年8月，注册资本3.62亿元，注册地址位于江西省南昌市南昌县，经营范围包括半导体产品和设备、零部件的研发、设计、生产、销售 及技术服务等。近期该公司完成管理层调整，选举庞俊成担任第三届董事会董事长及法定代表人，注册地址及法定代表人变更的工商登记手续尚未办理完 毕。 主要交易对方均为有限合伙企业，执行事务人均为北京建广资产管理有限公司：南昌建恩成立于2015年1月，出资额2.4亿元；北京广盟成立于2015年8月， 出资额2.04亿元；天津瑞芯成立于2017年11月，出资额2.26亿元，三者均聚焦半导体产业投资相关业务。 12月29日，紫光国微发布停牌公告，宣布正在筹划发行股份及支付现金购买资产并募集配套资金事项，拟收购瑞能半导体科技股份有限公司（以下简 ...

Core Viewpoint - Qiangyi Semiconductor (Suzhou) Co., Ltd. has successfully listed on the STAR Market, becoming the only domestic company to enter the global top ten semiconductor probe card manufacturers, with a significant stock price increase of 176.15% since its IPO [2][3]. Company Overview - Founded in 2015, Qiangyi Semiconductor is a high-tech enterprise focused on the research, design, production, and sales of probe cards, which are essential hardware for wafer testing in semiconductor design and manufacturing [2][6]. - The company has developed proprietary MEMS probe manufacturing technology, enabling it to mass-produce and sell MEMS probe cards, thus breaking the monopoly of foreign manufacturers in this field [2][6]. Market Position - According to Yole data, Qiangyi Semiconductor ranked ninth in the global semiconductor probe card industry in 2023 and sixth in 2024, making it the only domestic company to achieve a position in the top ten in recent years [4][6]. - The company serves a diverse range of clients, including major chip design firms and wafer foundries, indicating a strong market presence and customer base [4][5]. Future Outlook - Qiangyi Semiconductor plans to continue advancing its probe card technology, enhancing product diversity, performance, and quality [6]. - Novartis Capital, which invested in Qiangyi Semiconductor, aims to leverage its industry resources to support the company's product development and process optimization [6].