WLCSP(603005)
Search documents
光刻机概念下跌2.11%,6股主力资金净流出超亿元
Zheng Quan Shi Bao Wang· 2025-08-21 08:53
Group 1 - The lithography machine concept sector experienced a decline of 2.11%, ranking among the top declines in concept sectors, with companies like Tongfei Co., Tengjing Technology, and Haili Co. showing significant drops [1][2] - Among the concept stocks, 31 experienced net outflows of main funds, with a total outflow of 1.647 billion yuan, and 6 stocks saw outflows exceeding 100 million yuan [2][3] - The leading stocks in terms of net outflow included Zhangjiang Hi-Tech with 267 million yuan, followed by Dazhu Laser and Haili Co. with 266 million yuan and 145 million yuan respectively [2][3] Group 2 - The top gainers in the lithography machine concept included *ST and Ke, Sitai Technology, and Huaya Intelligent, with increases of 5.01%, 3.01%, and 1.99% respectively [1][2] - The overall market showed a mixed performance with sectors like combustible ice and digital currency gaining 3.12% and 2.38% respectively, while the lithography machine and PCB concepts faced declines [2] - The main fund inflows were observed in stocks such as Sudaview, Taijing Technology, and Electric Science Digital, with inflows of 31.798 million yuan, 28.513 million yuan, and 19.208 million yuan respectively [2][3]
晶方半导体取得封装结构及芯片专利,提高了封装结构的可靠性
Jin Rong Jie· 2025-08-16 04:12
Company Overview - Suzhou Jingfang Semiconductor Technology Co., Ltd. was established in 2005 and is located in Suzhou, primarily engaged in the manufacturing of computers, communications, and other electronic devices [2] - The company has a registered capital of 652.171706 million RMB [2] - Suzhou Jingfang has made investments in 7 companies and participated in 13 bidding projects [2] Patent Acquisition - The company has obtained a patent titled "Packaging Structure and Chip," with the authorization announcement number CN223230341U, applied for on August 2024 [1] - The patent describes a packaging structure that includes a substrate with a first and second surface, through-holes, and multiple insulation layers designed to enhance reliability by reducing stress on the contact points between the metal layer and the pads [1] - The innovative design of the insulation layers aims to protect the first insulation layer from stress concentration, thereby improving the overall reliability of the packaging structure [1]
晶方科技(603005)8月15日主力资金净流入1029.27万元
Sou Hu Cai Jing· 2025-08-15 10:02
金融界消息 截至2025年8月15日收盘,晶方科技(603005)报收于30.68元,上涨1.99%,换手率 5.45%,成交量35.55万手,成交金额10.82亿元。 资金流向方面,今日主力资金净流入1029.27万元,占比成交额0.95%。其中,超大单净流出535.04万 元、占成交额0.49%,大单净流入1564.31万元、占成交额1.45%,中单净流出流出1538.77万元、占成交 额1.42%,小单净流入509.50万元、占成交额0.47%。 晶方科技最新一期业绩显示,截至2025一季报,公司营业总收入2.91亿元、同比增长20.74%,归属净利 润6535.68万元,同比增长32.73%,扣非净利润5499.89万元,同比增长39.70%,流动比率8.219、速动比 率7.944、资产负债率9.20%。 天眼查商业履历信息显示,苏州晶方半导体科技股份有限公司,成立于2005年,位于苏州市,是一家以 从事计算机、通信和其他电子设备制造业为主的企业。企业注册资本65217.1706万人民币,实缴资本 10284.9766万人民币。公司法定代表人为王蔚。 通过天眼查大数据分析,苏州晶方半导体科技股份有限 ...
半导体行业二季度缓慢复苏 设备板块一枝独秀
Xin Hua Wang· 2025-08-12 05:54
Core Viewpoint - The semiconductor industry in A-shares is experiencing a downturn due to the cyclical nature of the sector and slow recovery in consumer electronics demand, leading to widespread declines in net profits among listed companies. However, some leading firms have shown signs of recovery in the second quarter, driven by sectors like artificial intelligence, automotive electronics, and power grids. Group 1: Semiconductor Design Companies - Chip design companies are accelerating inventory reduction, with many reporting a decline in performance in the first half of the year, but some have stabilized and shown growth in the second quarter [2][3] - Rockchip, a leader in AIoT chips, expects revenue of approximately 858 million yuan, a year-on-year decrease of about 31%, but a sequential growth of around 60% in the second quarter [2] - GigaDevice, a leader in Nor Flash memory, anticipates a net profit of about 340 million yuan, down over 70% year-on-year, but with a nearly 30% increase from the first quarter [2] Group 2: Fingerprint Recognition and Wireless Chip Companies - Goodix, a leader in fingerprint recognition chips, expects revenue of about 2.02 billion yuan, a year-on-year increase of approximately 10.5%, but a net loss of about 137 million yuan [3] - Broadcom Integrated anticipates a net loss of between 64.8 million and 43.3 million yuan for the first half of 2023, with some improvement in the second quarter [3] - Zhaoxin Microelectronics, heavily reliant on the mobile market, expects a revenue decline of 25.48% year-on-year, with a net profit decrease of 50.01% to 55.06% [3] Group 3: Packaging and Testing Companies - Packaging and testing companies are showing significant sequential growth, with Tongfu Microelectronics reporting revenue of approximately 9.909 billion yuan, a year-on-year increase of 3.58%, but a net loss of 17 to 19.8 million yuan [7] - Longji Technology, a leading packaging and testing company, expects a net profit of 446 to 546 million yuan, a year-on-year decrease of 64.65% to 71.08%, but a significant increase in the second quarter [8] - Crystal Technology anticipates a net profit of 70 to 80 million yuan, a year-on-year decline of 58.11% to 63.35%, but expects to double its profit in the second quarter compared to the first [9] Group 4: Equipment Companies - Despite the overall semiconductor sector being in a downturn, equipment companies are experiencing rapid growth, with North Huachuang reporting revenue of 7.82 to 8.95 billion yuan, a year-on-year increase of 43.65% to 64.41% [10] - Zhongwei Company, a leader in etching equipment, expects revenue of approximately 2.527 billion yuan, a year-on-year increase of about 28.13%, with a net profit increase of 109.49% to 120.18% [11] - Wan Ye Enterprises is increasing its focus on integrated circuits, expecting a net profit of about 118 million yuan, a year-on-year increase of approximately 316% [12]
9.01亿主力资金净流入,光刻机概念涨2.64%
Zheng Quan Shi Bao Wang· 2025-08-06 08:39
截至8月6日收盘,光刻机概念上涨2.64%,位居概念板块涨幅第9,板块内,32股上涨,洪田股份、海 立股份等涨停,炬光科技、中船特气、新莱应材等涨幅居前,分别上涨16.21%、8.21%、7.78%。跌幅 居前的有富创精密、百傲化学、芯碁微装等,分别下跌1.02%、1.00%、0.83%。 今日涨跌幅居前的概念板块 | 概念 | 今日涨跌幅(%) | 概念 | 今日涨跌幅(%) | | --- | --- | --- | --- | | PEEK材料 | 5.97 | 辅助生殖 | -1.60 | | 中船系 | 5.26 | 细胞免疫治疗 | -1.55 | | 兵装重组概念 | 4.66 | 肝炎概念 | -1.54 | | MLOps概念 | 3.60 | 流感 | -1.41 | | 国产航母 | 3.35 | CRO概念 | -1.38 | | 人形机器人 | 3.31 | 医药电商 | -1.38 | | 减速器 | 2.91 | 仿制药一致性评价 | -1.30 | | 工业母机 | 2.69 | 减肥药 | -1.27 | | 光刻机 | 2.64 | 创新药 | -1.27 | | 成飞概念 ...
晶方科技(603005)8月6日主力资金净流入2.47亿元
Sou Hu Cai Jing· 2025-08-06 07:22
天眼查商业履历信息显示,苏州晶方半导体科技股份有限公司,成立于2005年,位于苏州市,是一家以 从事计算机、通信和其他电子设备制造业为主的企业。企业注册资本65217.1706万人民币,实缴资本 10284.9766万人民币。公司法定代表人为王蔚。 通过天眼查大数据分析,苏州晶方半导体科技股份有限公司共对外投资了7家企业,参与招投标项目13 次,知识产权方面有商标信息26条,专利信息397条,此外企业还拥有行政许可18个。 来源:金融界 金融界消息 截至2025年8月6日收盘,晶方科技(603005)报收于30.35元,上涨5.6%,换手率11.76%, 成交量76.69万手,成交金额23.01亿元。 资金流向方面,今日主力资金净流入2.47亿元,占比成交额10.72%。其中,超大单净流入2.68亿元、占 成交额11.64%,大单净流出2107.91万元、占成交额0.92%,中单净流出流出14398.26万元、占成交额 6.26%,小单净流出10271.41万元、占成交额4.46%。 晶方科技最新一期业绩显示,截至2025一季报,公司营业总收入2.91亿元、同比增长20.74%,归属净利 润6535.68万元 ...
晶方科技获融资买入0.59亿元,近三日累计买入1.82亿元
Jin Rong Jie· 2025-08-02 01:12
Group 1 - On August 1, the financing buy-in amount for Jingfang Technology was 0.59 billion yuan, ranking 296th in the two markets [1] - On the same day, the financing repayment amount was 1.19 billion yuan, resulting in a net sell of 59.9768 million yuan [1] - Over the last three trading days, the financing buy-in amounts were 0.63 billion yuan, 0.60 billion yuan, and 0.59 billion yuan respectively [1] Group 2 - On the same day, the short selling amount was 0.09 thousand shares, while the net buying was 0.93 thousand shares [1]
晶方科技(603005)7月29日主力资金净流出1154.77万元
Sou Hu Cai Jing· 2025-07-29 13:28
Core Points - The stock price of Jingfang Technology (603005) closed at 29.23 yuan on July 29, 2025, with an increase of 0.76% and a turnover rate of 4.19% [1] - The company reported a total revenue of 291 million yuan for Q1 2025, representing a year-on-year growth of 20.74%, and a net profit attributable to shareholders of 65.36 million yuan, up 32.73% year-on-year [1] - The company has a current ratio of 8.219, a quick ratio of 7.944, and a debt-to-asset ratio of 9.20% [1] Financial Data - The net outflow of main funds today was 11.55 million yuan, accounting for 1.45% of the transaction amount [1] - The company experienced a net outflow of 6.15 million yuan from large orders, which is 0.77% of the transaction amount, and a net outflow of 5.39 million yuan from big orders, accounting for 0.68% [1] - The company’s non-recurring net profit was 54.99 million yuan, reflecting a year-on-year increase of 39.70% [1] Company Background - Suzhou Jingfang Semiconductor Technology Co., Ltd. was established in 2005 and is located in Suzhou, primarily engaged in the manufacturing of computers, communications, and other electronic devices [2] - The company has made investments in 7 enterprises and participated in 13 bidding projects [2] - It holds 26 trademark registrations and 397 patent registrations, along with 18 administrative licenses [2]
A股光刻机概念股午后拉升,张江高科涨停,茂莱光学、富乐德、富创精密、晶方科技、凯美特气等跟涨。
news flash· 2025-07-25 06:10
Group 1 - The A-share photolithography concept stocks experienced a surge in the afternoon, with Zhangjiang Hi-Tech reaching the daily limit [1] - Other companies such as Maolai Optical, Fulede, Fuchuang Precision, Jingfang Technology, and Kaimete Gas also saw significant increases [1]
爱集微:2024年封测行业上市公司收入同比增长21% 先进封装迎发展机遇
Zheng Quan Shi Bao Wang· 2025-07-21 14:38
Group 1 - The report by Aijimi highlights the growth of the semiconductor packaging and testing industry, projecting a total revenue of 87.056 billion yuan for listed companies in 2024, representing a year-on-year increase of 20.69% with a gross margin of approximately 15.67% [1] - The top three companies by total revenue in the packaging and testing sector are Changdian Technology (35.962 billion yuan), Tongfu Microelectronics (23.882 billion yuan), and Huatian Technology (14.462 billion yuan) [1] - The report indicates that the R&D expenditure as a percentage of revenue is highest for Liyang Chip (15.95%), Jingfang Technology (14.12%), and Weicai Technology (13.22%) [1] Group 2 - The advanced packaging market is expected to generate total revenue of $51.9 billion in 2024, with a year-on-year growth of 10.9%, and is projected to reach $78.6 billion by 2028, with a compound annual growth rate (CAGR) of 10.05% from 2022 to 2028 [2] - The global semiconductor packaging market is forecasted to grow from $65.04 billion in 2020 to $118.6 billion in 2027, with a CAGR of 6.6%, while advanced packaging is expected to surpass traditional packaging in market size by 2027 [2] Group 3 - The domestic packaging and testing industry is performing well, with Chinese companies leading in brand strength, diverse teams, international operations, technical capabilities, quality assurance, production scale, and operational efficiency [3] - In 2023, capital expenditure in the advanced packaging sector reached $9.9 billion, primarily from major semiconductor companies and leading OSAT firms, with an expected increase to $11.5 billion in 2024 [3] - The report emphasizes that the growth of the semiconductor packaging market is driven by emerging technologies such as AI, IoT, cloud computing, and big data, which are increasing the demand for chips [3] Group 4 - The global Chiplet market is projected to grow from approximately $3.1 billion in 2023 to around $107 billion by 2033, with a CAGR of 42.5% from 2024 to 2033 [4] - Companies like Intel and TSMC have mature Chiplet technologies, while domestic firms such as Changdian Technology and Tongfu Microelectronics are also advancing in this area [4] - The 2.5D/3D packaging market is expected to expand from $9.4 billion in 2022 to $22.5 billion by 2028, with a CAGR of 15.6%, driven by high-performance computing and AI technologies [4]