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芯源微:芯源微关于以集中竞价交易方式回购公司股份的进展公告
2024-05-06 08:38
关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏,并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示: | 回购方案首次披露日 | 2024/2/22,由董事长宗润福先生提议 | | --- | --- | | 回购方案实施期限 | 待董事会审议通过后 6 个月 | | 预计回购金额 | 万元 1,000 万元~2,000 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 | | | □用于转换公司可转债 | | | □为维护公司价值及股东权益 | | 累计已回购股数 | 102,607 股 | | 累计已回购股数占总股本比 例 | 0.07% | | 累计已回购金额 | 1,000.83 万元 | | 实际回购价格区间 | 93.90 元/股~108.54 元/股 | 一、 回购股份的基本情况 证券代码:688037 证券简称:芯源微 公告编号:2024-032 沈阳芯源微电子设备股份有限公司 根据《上市公司股份回购规则》《上海证券交易所上市公司自律监管指引第 7 号——回购股份》等相关规定,公司应在 ...
订单节奏影响一季度业绩,前道track+清洗进展良好
中泰证券· 2024-05-06 02:16
[Table_Finance 公司盈利预测及估值 1] 指标 2022A 2023A 2024E 2025E 2026E 营业收入(百万元) 1,385 1,717 2,369 3,175 4,032 增长率 yoy% 67% 24% 38% 34% 27% 净利润(百万元) 200 251 350 500 620 增长率 yoy% 159% 25% 40% 43% 24% 每股收益(元) 1.45 1.82 2.54 3.63 4.50 每股现金流量 1.40 -4.08 2.93 1.03 1.87 净资产收益率 10% 11% 13% 16% 16% P/E 62.0 49.5 35.5 24.8 20.0 P/B 5.9 5.2 4.6 3.9 3.3 备注:每股指标按照最新股本数全面摊薄,股价按 4 月 30 日收盘价进行计算 芯源微:订单节奏影响一季度业绩,前道 track+清洗进展良好 执业证书编号:S0740521120001 [Table_Title] 评级:买入(维持) 市场价格:90.02 元/股 芯源微(688037.SH)/电子 证券研究报告/公司点评 2024 年 5 月 3 日 ...
芯源微:订单节奏影响一季度业绩,前道track+清洗进展良好
中泰证券· 2024-05-06 02:00
来源:wind,中泰证券研究所 公司点评 | --- | --- | --- | |---------------------------------------------------------------------------------------|-------|----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------| | | 评级 | 说明 | | | 买入 | 预期未来 6~12 个月内相对同期基准指数涨幅在 15% 以上 | | | 增持 | 预期未来 6~12 个月内相对同期基准指数涨幅在 5%~15% 之间 | | 股票评级 | 持有 | 预期未来 6~12 个 ...
2023年报及2024年一季报点评:前道track持续放量,化学清洗机进展顺利
华创证券· 2024-05-01 03:05
附录:财务预测表 | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | |----------------------------------------------------|--------------|-------|-------|-------|-----------------------|-------|-------|-------|-------| | [Table_ValuationModels 资产负债表 \n单位:百万元 | 2] \n2023A | 2024E | 2025E | 2026E | 利润表 \n单位:百万元 | 2023A | 2024E | 2025E | 2026E | | 货币资金 | 743 | 447 | 495 | 317 | 营业总收入 | 1,717 | 2,202 | 2,823 | 3,806 | | 应收票据 | 9 | 12 | 47 | 23 | 营业成本 | 987 | 1,285 | 1,646 | 2,202 | | 应收账款 | 562 | 548 | 611 | ...
23年新签平稳,ArF浸没式高产能Track进展顺利
中邮证券· 2024-04-30 02:00
证券研究报告:电子 | 公司点评报告 2024 年 4 月 29 日 公司基本情况 总市值/流通市值(亿元)133 / 133 52 周内最高/最低价 291.66 / 80.99 资产负债率(%) 44.6% 市盈率 53.19 第一大股东 辽宁科发实业有限公司 股票投资评级 买入|维持 个股表现 -56% -49% -42% -35% -28% -21% -14% -7% 0% 7% 2023-05 2023-07 2023-09 2023-12 2024-02 2024-04 芯源微 电子 资料来源:聚源,中邮证券研究所 最新收盘价(元) 96.80 总股本/流通股本(亿股)1.38 / 1.38 研究所 分析师:吴文吉 SAC 登记编号:S1340523050004 Email:wuwenji@cnpsec.com ⚫ 事件 4 月 27 日,公司披露 2023 年年度报告以及 2024 年第一季度 报告。 23 年公司实现营收 17.17 亿元,同比+23.98%;实现归母净利 润 2.51 亿元,同比+25.21%;实现扣非归母净利润 1.87 亿元,同 比+36.37%。 24Q1 公司实现营收 ...
芯源微20240428
2024-04-29 13:00
芯源微20240428_智能速览 2024年04月29日 01:30 关键词 国产化替代 验证周期长 高端人才引进 核心技术人才 半导体 光刻机 清洗机 化学清洗 碳化硅 激光 产能 单机价值量 市场空间 股权激励 前道设备 竞争格局 销售回款 国产替代 先进封装 海外客户 全文摘要 多家公司分享了各自在半导体及相关领域的运营情况、发展规划以及面临的挑战。其中包括对技术创新 的投资、人才引进的策略、国际市场拓展的方法以及如何应对技术验证难度大、人才短缺和销售能力不 足等问题。公司展示了其在光刻机、清洗机、封装技术和化学气相沉积技术等方面的进展和创新,同时 也揭示了目前这些领域内的竞争状态,包括来自日本等国际竞争对手的压力。在运营管理方面,公司提 到了通过优化管理、强化技术研发和扩大市场份额来增强营业收入和净利润的策略。另外,讨论还触及 了资金流动性的管理和对公司未来业务增长的信心,以及如何利用股权激励计划来吸引和保留人才。通 过这次会议,可以看出尽管面临多重挑战,各公司都展示出积极的姿态和明确的发展方向,致力于推动 半导体行业的科技进步和市场拓展。 章节速览 ● 00:00 信源公司2023年度业绩交流会亮点 ...
芯源微(688037) - 芯源微投资者关系活动记录表(2024年4月28日)
2024-04-29 07:46
证券代码:688037 证券简称:芯源微 沈阳芯源微电子设备股份有限公司投资者关系活动记录表 编号:2024-02 £特定对象调研 £分析师会议 投资者关 £媒体采访 £业绩说明会 系活动类 别 £新闻发布会 £路演活动 £现场参观 R其他(进门财经线上会议) 霸菱资产管理(亚洲)有限公司 参与单位 百川财富(北京)投资管理有限公司 百达世瑞(上海)私募基金管理有限公司 名称 百年保险资产管理有限责任公司 北大方正人寿保险有限公司 北京才誉资产管理企业(有限合伙) 北京富智投资管理有限公司 北京高信百诺投资管理有限公司 北京泓澄投资管理有限公司 北京金百镕投资管理有限公司 北京市星石投资管理有限公司 北京橡果资产管理有限公司 ...
2023年报&2024年一季报点评:业绩稳健增长,看好涂胶显影国产化进程
东吴证券· 2024-04-29 05:00
证券研究报告·公司点评报告·半导体 芯源微(688037) 2023 年报&2024 年一季报点评:业绩稳健增 长,看好涂胶显影国产化进程 2024 年 04 月 29 日 增持(维持) | --- | --- | --- | --- | --- | --- | |------------------------------|--------|--------|--------|--------|--------| | 盈利预测与估值 [Table_EPS] | 2022A | 2023A | 2024E | 2025E | 2026E | | 营业总收入(百万元) | 1,385 | 1,717 | 2,345 | 3,169 | 4,075 | | 同比( % ) | 67.12 | 23.98 | 36.58 | 35.14 | 28.60 | | 归母净利润(百万元) | 200.16 | 250.63 | 332.88 | 434.96 | 545.05 | | 同比( % ) | 158.77 | 25.21 | 32.82 | 30.67 | 25.31 | | EPS- 最新摊薄(元 / 股) ...
23年涂胶显影设备快速成长,整体新签订单保持稳定
国投证券· 2024-04-29 00:00
本报告仅供 Choice 东方财富 使用,请勿传阅。 Q3 营收加速成长,前道涂 胶显影订单占比大增 2022-10-31 事件: 23 年涂胶显影设备快速成长,整体新签订单保持稳定: 生产交付影响 24Q1 收入: 涂胶显影设备持续发力高端产品,清洗设备取得新突破: 本报告版权属于国投证券股份有限公司,各项声明请参见报告尾页。 1 | --- | --- | |---------------------------|-------------------| | | 证券研究报告 | | | 半导体设备 | | 投资评级 | 买入 -A 维持评级 | | | | | 6 个月目标价 | 119 元 | | 股价 (2024-04-26) | 99.90 元 | | 交易数据 | | | 总市值 (百万元) 13,774.91 | | | 流通市值(百万元 | ) 13,774.91 | | 总股本(百万股 | ) 137.89 | | 流通股本(百万股 | ) 137.89 | | 12 个月价格区间 | 80.99/291.66 元 | | --- | --- | --- | |-------------- ...
芯源微(688037) - 2023 Q4 - 年度财报
2024-04-26 10:24
Topic 1: Product Development and Innovation - Shanghai Kingsemi Microelectronics Co., Ltd. officially released the KCE front-end single-wafer chemical cleaning machine, opening up a new market worth billions of RMB and completing the strategic layout of front-end coating development and front-end cleaning[1] - The company launched a strategic new product, the front-end single-wafer chemical cleaning machine, in March 2024, with a process coverage rate of over 80%, expanding the domestic market space for front-end products to 20 billion RMB[11] - The company's coating development and single-wafer wet equipment have been widely used in major manufacturers such as TSMC, JCET, and Huatian Technology, with some technologies reaching international leading levels[12] - The company officially launched the fully automatic SiC dicing and breaking machine, leveraging unique SnB dicing technology to solve traditional cutting issues, enriching the product layout in the small-size field[13] - The company's front-end chemical cleaning machine KS-CM300/200 has achieved over 80% process coverage and passed 26nm particle testing, meeting advanced process requirements[184] - The company's temporary bonding machine for Chiplet technology has achieved excellent TTV and warpage performance, compatible with 60μm and above thick film coating requirements[175] - The company's new SiC wafer dicing machine KS-S200-2H1L achieves a cutting speed of approximately 100mm/s, significantly improving efficiency[152] - The company's third-generation immersion high-capacity coater-developer has achieved mass production in conjunction with mainstream global lithography machines, with plans to develop next-generation higher-capacity models[197] Topic 2: R&D and Technological Advancements - The company's R&D expenses have consistently exceeded 10% of revenue, with a compound annual growth rate of over 50% in the past five years, and 131 new patent and software copyright applications in 2023[14] - The company plans to continue increasing R&D investment in 2024, focusing on market and customer demand, and strengthening basic R&D capabilities to drive product technology upgrades[16] - The company's R&D expenditure in 2023 was RMB 300 million, accounting for 11.2% of total revenue[74] - R&D expenditure accounted for 11.52% of revenue in 2023, an increase of 0.53 percentage points from 2022[85] - The company's technology center was recognized as a "National Enterprise Technology Center" in February 2023, highlighting its strong innovation capabilities[116] - The company was awarded the title of "National Manufacturing Single Champion Enterprise" in March 2024 for its coater/developer products[117] - As of the end of the reporting period, the company held 286 patents, including 181 invention patents, 69 utility model patents, and 36 design patents[117] Topic 3: Market Expansion and Strategic Growth - The establishment of Kingsemi Kyoto Co., Ltd. in Japan in August 2022 helps the company access high-end industrial and R&D resources in the semiconductor field, enhancing technical capabilities and reducing production costs[1] - Guangzhou Kingsemi Co., Ltd. was established in September 2023, focusing on the R&D and industrialization of core components such as photoresist pumps, supported by government funding, marking the start of a new development pattern of "whole machine + components"[2] - The global front-end 300mm wafer fab equipment expenditure is expected to grow by 20% to $116.5 billion by 2025 and reach a record $137 billion by 2027[8] - The company's market share in the semiconductor equipment sector increased to 12% in 2023[74] - The company completed the acquisition of a key competitor, enhancing its technological capabilities and market position[74] - The company's international sales grew by 30% in 2023, driven by expansion in Europe and North America[74] - The company's total orders at the end of the reporting period were approximately 2.2 billion yuan (including tax), providing strong support for 2024 performance[167] - The company's front-end coating and developing equipment has achieved full coverage of 28nm and above process nodes in front-end wafer processing, with 28nm and below process technologies currently under validation[183] - The company's front-end physical cleaning machines have been widely adopted by major domestic fabs such as SMIC, HLMC, and Silan, becoming the main production model for domestic logic and power device customers[169] - The company's next-generation high-capacity physical cleaning machine has been sent to a major domestic memory customer for validation, with potential to open new market space in the memory sector[169] - The company's back-end advanced packaging coating and developing equipment and single-wafer wet process equipment have been continuously used as mainstream models by top-tier manufacturers including TSMC, JCET, and Huatian for multiple years[171] - The company's ArF immersion high-capacity coater-developer equipment received orders from 5 major domestic customers[141] - The strategic new product, front-end chemical cleaning machine KS-CM300/200, received validation orders from major domestic customers in Q4 2023[145] - The company's temporary bonding and debonding equipment has reached international advanced levels and received orders from multiple domestic leading customers[152] - The company's compound and small-size equipment, including coating and developing machines and cleaning machines, are widely used in 4-8 inch wafer processes for RF devices, power devices, and MEMS production[189] - The global semiconductor equipment market is projected to see significant growth, with 300mm wafer fab equipment spending expected to exceed $100 billion in 2025 and reach a historic high of $137 billion by 2027[193] Topic 4: Financial Performance and Metrics - The company's revenue for 2023 reached RMB 2.67 billion, reflecting a 15% year-over-year growth[74] - The company's net profit for 2023 was RMB 500 million, marking a 20% increase compared to the previous year[74] - Revenue for 2023 reached 1,716,969,907.58 RMB, a 23.98% increase compared to 2022[85] - Net profit attributable to shareholders in 2023 was 250,626,202.20 RMB, up 25.21% year-over-year[85] - Net cash flow from operating activities in 2023 was -562,876,699.27 RMB, a 391.70% decrease compared to 2022, primarily due to increased material procurement and reduced sales collections[86] - Total assets at the end of 2023 were 4,301,555,628.29 RMB, a 23.03% increase from 2022[85] - Basic earnings per share in 2023 were 1.82 RMB, a 19.82% decrease compared to 2022[85] - Weighted average return on equity (ROE) in 2023 was 11.24%, a decrease of 2.12 percentage points from 2022[85] - The company's net profit attributable to shareholders excluding non-recurring gains and losses increased by 36.37% year-over-year in 2023[85] - The company's total equity attributable to shareholders at the end of 2023 was 2,380,440,281.77 RMB, a 13.00% increase from 2022[85] - Non-recurring profit and loss items for 2023 amounted to 63,461,030.55 RMB, with significant contributions from government subsidies and asset disposal gains[111] - Revenue for the reporting period reached 1.717 billion yuan, a year-on-year increase of 23.98%[137] - Net profit attributable to shareholders of the listed company was 251 million yuan, a year-on-year increase of 25.21%[137] - Net profit attributable to shareholders of the listed company after deducting non-recurring gains and losses was 187 million yuan, a year-on-year increase of 36.37%[137] - Total assets at the end of the reporting period were 4.302 billion yuan, with shareholders' equity of 2.38 billion yuan[137] - Quarterly revenue for Q4 2023 was 510,488,873.67 RMB, with net profit attributable to shareholders of 30,398,122.88 RMB[131] - The company's other non-current financial assets increased by 39,372,047.24 RMB, contributing to a total fair value change of 24,576,587.09 RMB[134] Topic 5: Supply Chain and Operational Efficiency - The company will continue to promote digitalization, informatization, and standardization in supply chain management in 2024 to ensure efficient, scientific, and standardized operations[17] - The company has established stable strategic partnerships with hundreds of core suppliers and implemented a multi-vendor strategy for key components to ensure timely supply[17] - The company is advancing the localization of key core materials, including mechanical hands, pumps, hot plates, and fluororesin components, to ensure quality while reducing reliance on imports[17] - The company's Japanese subsidiary was successfully established in August 2022, enriching its supply chain resources[17] - The Guangzhou subsidiary, established during the reporting period, focuses on the R&D and industrialization of core components such as photoresist pumps, leveraging the parent company's expertise in coating and development[17] - In 2024, the company will implement a comprehensive cost-reduction and efficiency-improvement plan, with key operational indicators such as new orders, production output, contract acceptance, and sales collection being tracked and optimized[18] - The company's procurement plan is based on production order materials, R&D materials, after-sales service materials, demand planning, and safety stock requirements, with a focus on supplier management and quality assurance[190] - The company adopts a production model that primarily relies on existing orders, supplemented by pre-production for potential orders, to meet customized product design and manufacturing needs while managing inventory risks[190] Topic 6: Employee Incentives and Corporate Governance - The company has launched a new restricted stock incentive plan in August 2023, granting 1.26 million shares at 50 yuan per share to 160 core technical employees to drive long-term sustainable development[21] - The company's 2023 restricted stock incentive plan has a total confirmed share-based payment expense of 25.16 million yuan, with all company-level performance targets met[29] - The company completed the registration of 304,880 restricted shares for the third vesting period of the 2020 restricted stock incentive plan and 75,480 shares for the second batch of the second vesting period of the 2021 plan on October 30, 2023[31] - On December 7, 2023, the company registered 57,720 restricted shares for the third batch of the second vesting period of the 2021 restricted stock incentive plan[31] - The company proposed to grant 1.6 million restricted shares, accounting for 1.16% of the total share capital, with 1.28 million shares (0.93% of total share capital) for the initial grant and 320,000 shares (0.23% of total share capital) reserved[31] - On August 14, 2023, the company granted 1.26 million restricted shares to 160激励对象 at a grant price of 50.00元 per share[31] - The company implemented three restricted stock incentive plans from 2020 to 2023, covering 299人次 of management and core business骨干, with clear performance考核目标[49] - The company has established a robust intellectual property and trade secret protection system, recognizing these as critical assets for its technological advancement and growth[22] Topic 7: Environmental and Social Responsibility - The company actively fulfills environmental protection obligations, optimizing carbon emission digital management and reducing emissions through digital monitoring[41] - The company has established a comprehensive environmental protection system and employs certified "carbon traders" for carbon emission trading management[41] - The company uses chemicals such as photoresist, OK73, alcohol, and various acid-base药液 for product testing, with strict safety measures and professional disposal of waste chemicals[43] - The company emphasizes ESG (Environmental, Social, and Governance) work, integrating it into corporate culture to achieve high-quality development[41] Topic 8: Subsidiaries and Geographic Expansion - The company established a wholly-owned subsidiary, Shenyang Xinli Microelectronics Equipment Co., Ltd., in January 2024, focusing on the R&D and industrialization of 2.5D/3D advanced packaging products[34] - The company has set up subsidiaries in Japan, Guangzhou, and Shenyang to focus on core component development, high-end packaging R&D, and overseas resource expansion[179] - The company has established three production bases in Shenyang and Shanghai, with the Shanghai Lingang facility officially put into operation in March 2024[179] - The company's employee count increased from 880 to 1,118, with over 50% of R&D personnel holding master's degrees or higher[178] Topic 9: Dividend and Shareholder Returns - The company's cash dividend policy includes a distribution of 2 yuan per 10 shares and a capital reserve transfer of 4.5 shares per 10 shares, with a total cash dividend of 27.57 million yuan[26] - The company plans to distribute a cash dividend of 2 RMB per 10 shares and a capital reserve transfer of 4.5 shares per 10 shares[90] Topic 10: Industry Trends and Market Outlook - Chiplet technology has emerged as a key pathway to enhance integration and chip computing power as Moore's Law slows down[197] - Sales in the compound semiconductor and small-sized equipment segment declined due to lower market demand[121] - The global semiconductor equipment market is projected to see significant growth, with 300mm wafer fab equipment spending expected to exceed $100 billion in 2025 and reach a historic high of $137 billion by 2027[193]