Topic 1: Product Development and Innovation - Shanghai Kingsemi Microelectronics Co., Ltd. officially released the KCE front-end single-wafer chemical cleaning machine, opening up a new market worth billions of RMB and completing the strategic layout of front-end coating development and front-end cleaning[1] - The company launched a strategic new product, the front-end single-wafer chemical cleaning machine, in March 2024, with a process coverage rate of over 80%, expanding the domestic market space for front-end products to 20 billion RMB[11] - The company's coating development and single-wafer wet equipment have been widely used in major manufacturers such as TSMC, JCET, and Huatian Technology, with some technologies reaching international leading levels[12] - The company officially launched the fully automatic SiC dicing and breaking machine, leveraging unique SnB dicing technology to solve traditional cutting issues, enriching the product layout in the small-size field[13] - The company's front-end chemical cleaning machine KS-CM300/200 has achieved over 80% process coverage and passed 26nm particle testing, meeting advanced process requirements[184] - The company's temporary bonding machine for Chiplet technology has achieved excellent TTV and warpage performance, compatible with 60μm and above thick film coating requirements[175] - The company's new SiC wafer dicing machine KS-S200-2H1L achieves a cutting speed of approximately 100mm/s, significantly improving efficiency[152] - The company's third-generation immersion high-capacity coater-developer has achieved mass production in conjunction with mainstream global lithography machines, with plans to develop next-generation higher-capacity models[197] Topic 2: R&D and Technological Advancements - The company's R&D expenses have consistently exceeded 10% of revenue, with a compound annual growth rate of over 50% in the past five years, and 131 new patent and software copyright applications in 2023[14] - The company plans to continue increasing R&D investment in 2024, focusing on market and customer demand, and strengthening basic R&D capabilities to drive product technology upgrades[16] - The company's R&D expenditure in 2023 was RMB 300 million, accounting for 11.2% of total revenue[74] - R&D expenditure accounted for 11.52% of revenue in 2023, an increase of 0.53 percentage points from 2022[85] - The company's technology center was recognized as a "National Enterprise Technology Center" in February 2023, highlighting its strong innovation capabilities[116] - The company was awarded the title of "National Manufacturing Single Champion Enterprise" in March 2024 for its coater/developer products[117] - As of the end of the reporting period, the company held 286 patents, including 181 invention patents, 69 utility model patents, and 36 design patents[117] Topic 3: Market Expansion and Strategic Growth - The establishment of Kingsemi Kyoto Co., Ltd. in Japan in August 2022 helps the company access high-end industrial and R&D resources in the semiconductor field, enhancing technical capabilities and reducing production costs[1] - Guangzhou Kingsemi Co., Ltd. was established in September 2023, focusing on the R&D and industrialization of core components such as photoresist pumps, supported by government funding, marking the start of a new development pattern of "whole machine + components"[2] - The global front-end 300mm wafer fab equipment expenditure is expected to grow by 20% to $116.5 billion by 2025 and reach a record $137 billion by 2027[8] - The company's market share in the semiconductor equipment sector increased to 12% in 2023[74] - The company completed the acquisition of a key competitor, enhancing its technological capabilities and market position[74] - The company's international sales grew by 30% in 2023, driven by expansion in Europe and North America[74] - The company's total orders at the end of the reporting period were approximately 2.2 billion yuan (including tax), providing strong support for 2024 performance[167] - The company's front-end coating and developing equipment has achieved full coverage of 28nm and above process nodes in front-end wafer processing, with 28nm and below process technologies currently under validation[183] - The company's front-end physical cleaning machines have been widely adopted by major domestic fabs such as SMIC, HLMC, and Silan, becoming the main production model for domestic logic and power device customers[169] - The company's next-generation high-capacity physical cleaning machine has been sent to a major domestic memory customer for validation, with potential to open new market space in the memory sector[169] - The company's back-end advanced packaging coating and developing equipment and single-wafer wet process equipment have been continuously used as mainstream models by top-tier manufacturers including TSMC, JCET, and Huatian for multiple years[171] - The company's ArF immersion high-capacity coater-developer equipment received orders from 5 major domestic customers[141] - The strategic new product, front-end chemical cleaning machine KS-CM300/200, received validation orders from major domestic customers in Q4 2023[145] - The company's temporary bonding and debonding equipment has reached international advanced levels and received orders from multiple domestic leading customers[152] - The company's compound and small-size equipment, including coating and developing machines and cleaning machines, are widely used in 4-8 inch wafer processes for RF devices, power devices, and MEMS production[189] - The global semiconductor equipment market is projected to see significant growth, with 300mm wafer fab equipment spending expected to exceed $100 billion in 2025 and reach a historic high of $137 billion by 2027[193] Topic 4: Financial Performance and Metrics - The company's revenue for 2023 reached RMB 2.67 billion, reflecting a 15% year-over-year growth[74] - The company's net profit for 2023 was RMB 500 million, marking a 20% increase compared to the previous year[74] - Revenue for 2023 reached 1,716,969,907.58 RMB, a 23.98% increase compared to 2022[85] - Net profit attributable to shareholders in 2023 was 250,626,202.20 RMB, up 25.21% year-over-year[85] - Net cash flow from operating activities in 2023 was -562,876,699.27 RMB, a 391.70% decrease compared to 2022, primarily due to increased material procurement and reduced sales collections[86] - Total assets at the end of 2023 were 4,301,555,628.29 RMB, a 23.03% increase from 2022[85] - Basic earnings per share in 2023 were 1.82 RMB, a 19.82% decrease compared to 2022[85] - Weighted average return on equity (ROE) in 2023 was 11.24%, a decrease of 2.12 percentage points from 2022[85] - The company's net profit attributable to shareholders excluding non-recurring gains and losses increased by 36.37% year-over-year in 2023[85] - The company's total equity attributable to shareholders at the end of 2023 was 2,380,440,281.77 RMB, a 13.00% increase from 2022[85] - Non-recurring profit and loss items for 2023 amounted to 63,461,030.55 RMB, with significant contributions from government subsidies and asset disposal gains[111] - Revenue for the reporting period reached 1.717 billion yuan, a year-on-year increase of 23.98%[137] - Net profit attributable to shareholders of the listed company was 251 million yuan, a year-on-year increase of 25.21%[137] - Net profit attributable to shareholders of the listed company after deducting non-recurring gains and losses was 187 million yuan, a year-on-year increase of 36.37%[137] - Total assets at the end of the reporting period were 4.302 billion yuan, with shareholders' equity of 2.38 billion yuan[137] - Quarterly revenue for Q4 2023 was 510,488,873.67 RMB, with net profit attributable to shareholders of 30,398,122.88 RMB[131] - The company's other non-current financial assets increased by 39,372,047.24 RMB, contributing to a total fair value change of 24,576,587.09 RMB[134] Topic 5: Supply Chain and Operational Efficiency - The company will continue to promote digitalization, informatization, and standardization in supply chain management in 2024 to ensure efficient, scientific, and standardized operations[17] - The company has established stable strategic partnerships with hundreds of core suppliers and implemented a multi-vendor strategy for key components to ensure timely supply[17] - The company is advancing the localization of key core materials, including mechanical hands, pumps, hot plates, and fluororesin components, to ensure quality while reducing reliance on imports[17] - The company's Japanese subsidiary was successfully established in August 2022, enriching its supply chain resources[17] - The Guangzhou subsidiary, established during the reporting period, focuses on the R&D and industrialization of core components such as photoresist pumps, leveraging the parent company's expertise in coating and development[17] - In 2024, the company will implement a comprehensive cost-reduction and efficiency-improvement plan, with key operational indicators such as new orders, production output, contract acceptance, and sales collection being tracked and optimized[18] - The company's procurement plan is based on production order materials, R&D materials, after-sales service materials, demand planning, and safety stock requirements, with a focus on supplier management and quality assurance[190] - The company adopts a production model that primarily relies on existing orders, supplemented by pre-production for potential orders, to meet customized product design and manufacturing needs while managing inventory risks[190] Topic 6: Employee Incentives and Corporate Governance - The company has launched a new restricted stock incentive plan in August 2023, granting 1.26 million shares at 50 yuan per share to 160 core technical employees to drive long-term sustainable development[21] - The company's 2023 restricted stock incentive plan has a total confirmed share-based payment expense of 25.16 million yuan, with all company-level performance targets met[29] - The company completed the registration of 304,880 restricted shares for the third vesting period of the 2020 restricted stock incentive plan and 75,480 shares for the second batch of the second vesting period of the 2021 plan on October 30, 2023[31] - On December 7, 2023, the company registered 57,720 restricted shares for the third batch of the second vesting period of the 2021 restricted stock incentive plan[31] - The company proposed to grant 1.6 million restricted shares, accounting for 1.16% of the total share capital, with 1.28 million shares (0.93% of total share capital) for the initial grant and 320,000 shares (0.23% of total share capital) reserved[31] - On August 14, 2023, the company granted 1.26 million restricted shares to 160激励对象 at a grant price of 50.00元 per share[31] - The company implemented three restricted stock incentive plans from 2020 to 2023, covering 299人次 of management and core business骨干, with clear performance考核目标[49] - The company has established a robust intellectual property and trade secret protection system, recognizing these as critical assets for its technological advancement and growth[22] Topic 7: Environmental and Social Responsibility - The company actively fulfills environmental protection obligations, optimizing carbon emission digital management and reducing emissions through digital monitoring[41] - The company has established a comprehensive environmental protection system and employs certified "carbon traders" for carbon emission trading management[41] - The company uses chemicals such as photoresist, OK73, alcohol, and various acid-base药液 for product testing, with strict safety measures and professional disposal of waste chemicals[43] - The company emphasizes ESG (Environmental, Social, and Governance) work, integrating it into corporate culture to achieve high-quality development[41] Topic 8: Subsidiaries and Geographic Expansion - The company established a wholly-owned subsidiary, Shenyang Xinli Microelectronics Equipment Co., Ltd., in January 2024, focusing on the R&D and industrialization of 2.5D/3D advanced packaging products[34] - The company has set up subsidiaries in Japan, Guangzhou, and Shenyang to focus on core component development, high-end packaging R&D, and overseas resource expansion[179] - The company has established three production bases in Shenyang and Shanghai, with the Shanghai Lingang facility officially put into operation in March 2024[179] - The company's employee count increased from 880 to 1,118, with over 50% of R&D personnel holding master's degrees or higher[178] Topic 9: Dividend and Shareholder Returns - The company's cash dividend policy includes a distribution of 2 yuan per 10 shares and a capital reserve transfer of 4.5 shares per 10 shares, with a total cash dividend of 27.57 million yuan[26] - The company plans to distribute a cash dividend of 2 RMB per 10 shares and a capital reserve transfer of 4.5 shares per 10 shares[90] Topic 10: Industry Trends and Market Outlook - Chiplet technology has emerged as a key pathway to enhance integration and chip computing power as Moore's Law slows down[197] - Sales in the compound semiconductor and small-sized equipment segment declined due to lower market demand[121] - The global semiconductor equipment market is projected to see significant growth, with 300mm wafer fab equipment spending expected to exceed $100 billion in 2025 and reach a historic high of $137 billion by 2027[193]

证券代码：688037 证券简称：芯源微 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 公司负责人、主管会计工作负责人及会计机构负责人（会计主管人员）保证季度报告中财务信息 的真实、准确、完整。 一、 主要财务数据 1 / 13 (二)非经常性损益项目和金额 2024 年第一季度报告 (三)主要会计数据、财务指标发生变动的情况、原因 2024 年第一季度报告 2024 年第一季度报告 5 / 13 四、 季度财务报表 | --- | --- | --- | --- | --- | |-------|-------|---------------|--------------|-------------------------------| | | | 单位：元 | 币种: | 人民币 审计类型：未经审计 | | | 项目 | 2024 年 3 | 月 31 日 | 2023 年 12 月 31 日 | 2024 年第一季度报告 公司负责人：宗润福 主管会计工作负责人：张新超 会计机构负责人：张新超 | --- | --- ...

RSM 容诚 审计报告 沈阳芯源微电子设备股份有限公司 容诚审字[2024]110Z0007 号 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://acc.mof.gov.cn） 书生编码:京2 目 录 | 序号 | 内 容 | 页码 | | --- | --- | --- | | 1 | 审计报告 | 1-6 | | 2 | 合并资产负债表 | 7 | | 3 | 合并利润表 | 8 | | 4 | 合并现金流量表 | 9 | | 5 | 合并所有者权益变动表 | 10-11 | | 6 | 母公司资产负债表 | 12 | | 7 | 母公司利润表 | 13 | | 8 | 母公司现金流量表 | 14 | | 9 | 母公司所有者权益变动表 | 15-16 | | 10 | 财务报表附注 | 17-132 | 审计报告 容诚会计师事务所 (特殊普通合伙) 中国·北京 容诚审字[2024]110Z0007 号 沈阳芯源微电子设备股份有限公司全体股东: 一、审计意见 我们审计了沈阳芯源微电子设备股份有限公司(以下简称芯源微公司)财务报 表,包括 2023年 12 月 31 日的合并及母公司 ...

关于沈阳芯源微电子设备股份有限公司 非经营性资金占用及其他关联资金往来情况 汇总表的专项审计报告 目 录 1、 专项审计报告 2、 附表 委托单位：沈阳芯源微电子设备股份有限公司 审计单位：容诚会计师事务所（特殊普通合伙） 联系电话：024-86688037 非经营性资金占用及其他关联资金 往来情况专项说明 沈阳芯源微电子设备股份有限公司 容诚专字[2024]110Z0002 号 RSM 容诚 容诚会计师事务所(特殊普通合伙) 中国 · 北京 您可使用手机"扫一扫"减进入"在哪个在线体育在线进一直营平台（bapp/facebookigasco）"进行了 "这个是 关于沈阳芯源微电子设备股份有限公司 非经营性资金占用及其他关联资金往来情况专项说明 容诚专字[2024]110Z0002 号 沈阳芯源微电子设备股份有限公司全体股东: 我们接受委托,依据中国注册会计师审计准则审计了沈阳芯源微电子设备股 份有限公司(以下简称芯源微公司)2023年12月31日的合并及母公司资产负债 表,2023年度的合并及母公司利润表、合并及母公司现金流量表和合并及母公司 所有者权益变动表以及财务报表附注,并于 2024年 4 月 26 ...

证券代码：688037 证券简称：芯源微 公告编号：2024-019 沈阳芯源微电子设备股份有限公司 关于使用部分超募资金永久补充流动资金的公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： ● 沈阳芯源微电子设备股份有限公司（以下简称"公司"）于 2024 年 4 月 26 日召开第二届董事会第二十次会议及第二届监事会第十九次会议，审议通 过了《关于使用部分超募资金永久性补充流动资金的议案》，同意公司在保证募 集资金投资项目建设的资金需求和募集资金项目正常进行的前提下，为满足公司 流动资金需求，提高募集资金的使用效率，降低财务成本，进一步提升公司盈利 能力，维护上市公司和股东的利益，使用部分超募资金人民币 3,830 万元用于永 久补充流动资金。本次使用部分超募资金永久补充流动资金仅在与主营业务相关 的生产经营中使用；在本次超募资金永久补充流动资金后的 12 个月内，不进行 高风险投资或对外提供财务资助。 ● 公司保荐机构中国国际金融股份有限公司（以下简称"保荐机构"）对 本事项出具了同意的核查意见。 一 ...

沈阳芯源微电子设备股份有限公司 董事会审计委员会 2023 年度履职报告 根据中国证监会《上市公司治理准则》《上海证券交易所上市公司自律监管 指引第 1 号——规范运作》《上海证券交易所科创板股票上市规则》等法律、法 规、规范性文件，以及《沈阳芯源微电子设备股份有限公司章程》（以下简称《公 司章程》）和《沈阳芯源微电子设备股份有限公司董事会审计委员会议事规则》 等有关规定，沈阳芯源微电子设备股份有限公司（以下简称"公司"）董事会审 计委员会本着勤勉尽责的原则，认真履行了审计监督职责。现将公司董事会审计 委员会 2023 年度履职情况汇报如下： 二、报告期内审计委员会召开会议情况 报告期内，公司董事会审计委员会共召开 4 次会议，全体委员均亲自出席了 全部会议，具体如下： | 召开日期 | 会议名称 | 会议内容 | | --- | --- | --- | | | | 1、《审计委员会 年度工作总结与 年度 2022 2023 工作计划》 | | 2023/4/17 | 第二届董事会 审计委员会第 | 2、《关于公司<2022 年年度报告>及摘要的议案》 3、《关于公司<2022 年财务决算报告>的议案》 | ...

RSM 容诚 募集资金存放与实际使用情况 鉴证报告 沈阳芯源微电子设备股份有限公司 容诚专字|2024|110Z0001 号 容诚会计师事务所(特殊普通合伙) 中国 · 北京 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://www.flw.cn）" 进行 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http:///w 报告编码:.京240PTZRR 目 录 | 序号 | 内 容 | 页码 | | --- | --- | --- | | | 募集资金存放与实际使用情况鉴证报告 | 1-2 | | 2 | 募集资金存放与实际使用情况的专项报告 | 3-14 | I 募集资金存放与实际使用情况鉴证报告 容诚专字[2024]110Z0001 号 沈阳芯源微电子设备股份有限公司全体股东: 我们审核了后附的沈阳芯源微电子设备股份有限公司(以下简称芯源微公司) 董事会编制的 2023 年度《募集资金存放与实际使用情况的专项报告》。 一、对报告使用者和使用目的的限定 本鉴证报告仅供芯源微公司年度报告披露之目的使用,不得用作任何其他目的。 我们同意将本鉴证报告作为芯源微公司年度报告必备的文 ...

募集资金管理制度 第一章 总则 第一条 为了规范沈阳芯源微电子设备股份有限公司（以下简称"公司"）募 集资金的管理和使用，保护投资者的权益，依照《中华人民共和国公司法》（以 下简称"《公司法》"）、《中华人民共和国证券法》（以下简称"《证券法》"） 《上海证券交易所科创板股票上市规则》（以下简称"《上市规则》"）、《上 海证券交易所上市公司自律监管指引第 1 号——规范运作》等有关法律法规及规 范性文件的规定，结合公司实际情况，特制定本办法。 第二条 本办法所称募集资金，是指公司通过向不特定对象发行证券（包括 首次公开发行股票、配股、增发、发行可转换公司债券、发行分离交易的可转换 公司债券等）以及向特定对象发行证券募集的资金，但不包括公司实施股权激励 计划募集的资金。 第三条 公司董事会应当负责建立募集资金存储、使用和管理的内部控制制 度，对募集资金存储、使用、变更、监督和责任追究以及募集资金使用的申请、 分级审批权限、决策程序、风险控制措施及信息披露程序等内容进行明确规定。 沈阳芯源微电子设备股份有限公司 公司的董事、监事和高级管理人员应当勤勉尽责，督促公司规范使用募集资 金，自觉维护公司募集资金安全，不得 ...

沈阳芯源微电子设备股份有限公司 2024 年度"提质增效重回报"行动方案 为践行以"投资者为本"的发展理念，维护公司全体股东利益，基于对公司 未来发展前景的信心、对公司价值的认可以及切实履行社会责任，沈阳芯源微电 子设备股份有限公司（以下简称"公司"）制定 2024 年度"提质增效重回报"行 动方案，以进一步提升公司运营效率，增强市场竞争力，保障投资者权益，树立 良好的资本市场形象。主要措施如下： 一、聚焦经营主业，持续巩固和增强核心竞争力 自成立以来，公司始终专注于半导体专用设备的研发、生产和销售，产品包 括光刻工序涂胶显影设备和单片式湿法设备，广泛应用于国内各大晶圆厂、先进 封装厂、化合物半导体等厂商。作为国内涂胶显影设备细分领域龙头企业，目前 公司已实现在前道晶圆加工领域 28nm 及以上工艺节点的全覆盖，并在后道先进 封装、化合物半导体等领域长期保持行业领先地位。 2024 年，公司将继续锚定国家重大战略需求，紧跟全球半导体装备技术发 展前沿，围绕国产自主可控这一核心战略目标，持续推进技术研发及产品迭代， 大力培育新业务增长点，加快形成和巩固新质生产力，实现公司高质量发展，以 良好的业绩回报广大投资者 ...

证券代码：688037 证券简称：芯源微 公告编号：2024-015 沈阳芯源微电子设备股份有限公司 第二届董事会第二十次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、董事会会议召开情况 沈阳芯源微电子设备股份有限公司（以下简称"公司"）于 2024 年 4 月 26 日在公司会议室以现场和通讯相结合的方式召开了第二届董事会第二十次会议 （以下简称"本次会议"）。本次会议的通知于 2024 年 4 月 16 日送达全体董事。 会议应出席董事 9 人，实际出席董事 9 人。会议的召集和召开程序符合有关法律、 行政法规、部门规章、规范性文件和公司章程的规定，会议决议合法、有效。 二、董事会会议审议情况 本次会议由董事长宗润福先生主持，经与会董事审议，形成决议如下： （一）审议通过《关于公司<2023年度董事会工作报告>的议案》 根据相关法律、法规、规范性文件、公司章程、《董事会议事规则》等规定， 公司董事会编制了《沈阳芯源微电子设备股份有限公司2023年度董事会工作报 告》。 表决结果：9票同意，0票反对， ...