Core Viewpoint - Huahai Qingshi's stock price has shown fluctuations with a year-to-date increase of 7.20%, while experiencing a recent decline of 7.18% over the past five trading days [1] Group 1: Stock Performance - As of September 5, Huahai Qingshi's stock price reached 116.95 CNY per share, with a trading volume of 6.06 billion CNY and a turnover rate of 1.49%, resulting in a total market capitalization of 41.33 billion CNY [1] - The company has seen a year-to-date stock price increase of 7.20%, a decline of 7.18% over the last five trading days, an increase of 8.18% over the last 20 days, and a 14.97% increase over the last 60 days [1] Group 2: Financial Performance - For the first half of 2025, Huahai Qingshi reported revenue of 1.95 billion CNY, reflecting a year-on-year growth of 30.28%, and a net profit attributable to shareholders of 505 million CNY, which is a year-on-year increase of 16.82% [2] Group 3: Shareholder Information - As of June 30, 2025, the number of Huahai Qingshi's shareholders decreased by 10.00% to 13,600, while the average circulating shares per person increased by 54.75% to 17,452 shares [2] - The company has distributed a total of 271 million CNY in dividends since its A-share listing [3] - Notable institutional shareholders include Huaxia SSE Sci-Tech Innovation Board 50 ETF, E Fund SSE Sci-Tech Innovation Board 50 ETF, and Harvest SSE Sci-Tech Innovation Board Chip ETF, all of which have increased their holdings [3]

证券代码：688120 证券简称：华海清科 华海清科股份有限公司 2025 年第三次临时股东大会会议资料 2025 年 9 月 目 录 | 华海清科股份有限公司 1 | 2025 | 年第三次临时股东大会会议须知 | | | --- | --- | --- | --- | | 华海清科股份有限公司 3 | 2025 | 年第三次临时股东大会会议议程 | | | 华海清科股份有限公司 5 | 2025 | 年第三次临时股东大会会议议案 | | | 议案一：关于取消监事会、变更注册资本并修订《公司章程》的议案 5 | | | | | 议案二：关于修订、制定公司部分治理制度的议案 7 | | | | | 议案三：关于以集中竞价交易方式回购公司股份方案的议案 8 | | | | | 议案四：关于提请股东大会授权董事会及管理层办理公司回购股份相关事宜的议 | | | | | 10 | 案 | | | 华海清科股份有限公司 2025 年第三次临时股东大会会议须知 为了维护华海清科股份有限公司（以下简称"公司"）全体股东的合法权益， 确保股东大会的正常秩序和议事效率，保证大会的顺利进行，根据《中华人民共 和国公司法》《中华 ...

Group 1 - The semiconductor equipment industry is expected to enter a golden development period, with revenue and net profit of companies in this sector showing a continuous growth trend from 2021 to 2024, with revenue growth exceeding 25% and net profit growth exceeding 20% year-on-year [1] - Forecasts indicate that semiconductor equipment companies will maintain revenue growth rates exceeding 25% in 2025 and 2026, with 2025 potentially exceeding 30%, outpacing the overall growth of the semiconductor equipment market in mainland China [1] - A total of 16 companies are predicted to see a significant decline in forward P/E ratios, with net profit growth expected to exceed 10% for 2025 and 2026, and P/E ratios for 2026 forecasted to drop by over 20% compared to the latest rolling P/E [1] Group 2 - Specific companies such as Jing Sheng Co., Zhongke Feicai, and Fuchuang Precision are expected to see their P/E ratios decline by over 75% [1] - The table lists various semiconductor equipment companies along with their year-to-date performance, market capitalization ratios, and projected net profit growth for 2025 and 2026, highlighting significant potential in the sector [2] - For instance, Zhongke Feicai is projected to have a net profit increase of 89.98% in 2026, while Fuchuang Precision is expected to see a 55.68% increase [2]

Core Insights - The strategic value of semiconductor equipment is highlighted, with electronic terminal products accounting for a significant portion of global output, driven by the explosion of industries like big data and AI, which rely on chip manufacturing supported by semiconductor equipment [2] - CMP (Chemical Mechanical Polishing) is identified as one of the five key technologies in integrated circuit manufacturing, essential for flattening wafer surfaces to facilitate subsequent processes like lithography [2] - Current challenges in CMP include achieving nanoscale wafer flattening, cleaning nanoscale contaminants, maintaining precision in rapid polishing, and ensuring efficient operation of the entire system [2] - The global flatness requirement for 12-inch wafers has increased to less than 5nm, with strict limits on the number of fine contaminants above 28nm [2] Opportunities - The demand for CMP in advanced packaging is expected to rise significantly, driven by the rapid development of technologies like TSV and 3D packaging [3] - The transition from multi-wafer polishing to single-wafer polishing in third-generation semiconductors is leading to a sustained increase in demand for CMP equipment [3] - Huahai Qingshi, a leading domestic semiconductor equipment supplier, has evolved from a CMP equipment provider to a platform enterprise covering various equipment and services, including thinning, cutting, wet processing, ion implantation, and edge polishing [3] - The company emphasizes that industry demand and technological iteration will continue to drive progress in the sector, with a commitment to innovation based on years of technical accumulation [3]

Investment Rating - The investment rating for the company is "Buy" and it is maintained [8] Core Views - The company reported a revenue of 1.95 billion yuan for H1 2025, representing a year-on-year increase of 30.28%, with a net profit attributable to shareholders of 505 million yuan, up 16.82% year-on-year [2][5] - In Q2 2025, the company achieved a revenue of 1.037 billion yuan, reflecting a year-on-year growth of 27.05%, and a net profit of 272 million yuan, which is an 18.01% increase year-on-year [2][5] - The company has made significant progress in advanced process equipment, with a high proportion of CMP orders and substantial market share among domestic clients [11] - The platform development is steadily advancing, with various equipment types gaining market recognition, including thinning equipment, cutting equipment, and edge polishing equipment [11] - The company has a strong order backlog and inventory, with contract liabilities reaching 1.755 billion yuan, a 6.9% increase from the end of Q1 2025, and inventory amounting to 3.703 billion yuan, up 6.2% year-on-year [11] - R&D expenses for Q2 2025 were 135 million yuan, with an R&D expense ratio of 13.0%, an increase of 1.6 percentage points year-on-year [11] - The company is expected to achieve net profits attributable to shareholders of 1.3 billion yuan and 1.69 billion yuan for 2025 and 2026, respectively, corresponding to PE ratios of 34 and 26 times [11] Summary by Sections Financial Performance - H1 2025 revenue: 1.95 billion yuan, +30.28% YoY [2] - H1 2025 net profit: 505 million yuan, +16.82% YoY [2] - Q2 2025 revenue: 1.037 billion yuan, +27.05% YoY [2] - Q2 2025 net profit: 272 million yuan, +18.01% YoY [2] Market Position and Product Development - High market share in advanced process CMP equipment among domestic clients [11] - Significant order growth for thinning equipment and successful market entry for various new equipment types [11] - Development of ion implantation machines and other advanced semiconductor equipment [11] R&D and Future Outlook - R&D expenses for Q2 2025: 135 million yuan, 13.0% of revenue [11] - Expected net profits for 2025 and 2026: 1.3 billion yuan and 1.69 billion yuan, respectively [11]

Core Insights - The strategic value of semiconductor equipment is highlighted, with electronic terminal products accounting for a significant portion of global output, driven by the explosion of industries like big data and AI, which rely on chip manufacturing supported by semiconductor equipment [4][5] - CMP (Chemical Mechanical Polishing) is identified as one of the five key technologies in integrated circuit manufacturing, essential for flattening wafer surfaces to facilitate subsequent processes like photolithography [4][5] - Current challenges in CMP include achieving nanoscale wafer flattening, cleaning nanoscale contaminants, maintaining rapid polishing precision, and ensuring efficient and stable operation of the entire machine [4][5] - The demand for CMP equipment is expected to rise significantly due to advancements in packaging technologies such as TSV and 3D packaging, as well as the shift from multi-wafer to single-wafer polishing in third-generation semiconductors [5][6] - Huahai Qingshi, originating from Tsinghua University's State Key Laboratory of Tribology, has evolved from a CMP equipment supplier to a comprehensive platform covering various semiconductor equipment and services, establishing itself as a leading domestic supplier [5][6] - The continuous drive for progress in the industry is fueled by demand and technological iteration, with Huahai Qingshi committed to leveraging its technological expertise to support breakthroughs in China's semiconductor industry [6]

Group 1 - The company, Huahai Qingke, is planning to issue overseas listed shares (H-shares) and list on the Hong Kong Stock Exchange to accelerate its international strategy and enhance its competitiveness and brand image [1] - The H-share listing plan requires approval from the company's board and shareholders, as well as regulatory approval from the China Securities Regulatory Commission and the Hong Kong Stock Exchange, indicating uncertainty in the implementation of the listing [1] - Huahai Qingke was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on June 8, 2022, with a public offering of 26.67 million shares at a price of 136.66 yuan per share [1] Group 2 - The total amount of funds raised by Huahai Qingke was 3.644 billion yuan, with a net amount of 3.489 billion yuan, exceeding the original plan by 2.489 billion yuan [2] - The company initially planned to raise 1 billion yuan for projects related to high-end semiconductor equipment, research and development, and working capital [2] - The issuance costs amounted to 154.37 million yuan, with Guotai Junan Securities receiving 137.90 million yuan in sponsorship and underwriting fees [2]

Investment Rating - The report maintains an "Overweight" rating for the semiconductor sector, driven by AI and domestic substitution [4]. Core Insights - The semiconductor industry is experiencing an upward cycle, with Q2 2025 revenue and net profit showing year-on-year and quarter-on-quarter growth, benefiting from AI-driven demand and ongoing domestic substitution efforts [4][12][26]. Summary by Sections Overall Industry Performance - The semiconductor sector achieved a revenue of 318.609 billion yuan in H1 2025, a year-on-year increase of 15.54%, and a net profit of 24.159 billion yuan, up 32.41% year-on-year. In Q2 2025, revenue reached 170.023 billion yuan, growing 15.17% year-on-year and 14.43% quarter-on-quarter, with net profit at 14.825 billion yuan, reflecting a year-on-year increase of 30.91% and a quarter-on-quarter increase of 58.82% [3][12][26]. Subsector Performance 1. **Semiconductor Equipment** - The semiconductor equipment sector reported H1 2025 revenue of 38.923 billion yuan, up 30.86% year-on-year, and a net profit of 6.306 billion yuan, up 18.84% year-on-year. Q2 2025 revenue was 21.038 billion yuan, a year-on-year increase of 28.80% and a quarter-on-quarter increase of 17.62% [27][32]. 2. **Semiconductor Materials** - The semiconductor materials sector achieved H1 2025 revenue of 22.416 billion yuan, up 11.73% year-on-year, with a net profit of 1.437 billion yuan, up 8.81% year-on-year. Q2 2025 revenue was 11.762 billion yuan, reflecting a year-on-year increase of 12.20% and a quarter-on-quarter increase of 10.40% [39][43]. 3. **Digital Chips** - The digital chip sector saw H1 2025 revenue of 87.129 billion yuan, up 24.72% year-on-year, and a net profit of 9.050 billion yuan, up 35.52% year-on-year. Q2 2025 revenue was 49.163 billion yuan, a year-on-year increase of 28.68% and a quarter-on-quarter increase of 29.49% [52][60]. 4. **Analog Chips** - The analog chip sector reported H1 2025 revenue of 24.502 billion yuan, up 13.16% year-on-year, with a net profit of 5.03 billion yuan, up 280.46% year-on-year. Q2 2025 revenue was 13.582 billion yuan, reflecting a year-on-year increase of 17.66% and a quarter-on-quarter increase of 24.38% [4][39]. 5. **Semiconductor Packaging and Testing** - The semiconductor packaging and testing sector achieved H1 2025 revenue of 45.864 billion yuan, up 18.73% year-on-year, with a net profit of 1.542 billion yuan, up 3.50% year-on-year. Q2 2025 revenue was 23.967 billion yuan, a year-on-year increase of 14.28% and a quarter-on-quarter increase of 9.46% [4][39]. 6. **Integrated Circuit Manufacturing** - The integrated circuit manufacturing sector reported H1 2025 revenue of 55.129 billion yuan, up 19.37% year-on-year, with a net profit of 2.814 billion yuan, up 44.65% year-on-year. Q2 2025 revenue was 27.857 billion yuan, reflecting a year-on-year increase of 16.14% and a quarter-on-quarter increase of 2.14% [4][39].

Summary of Huahai Qingshi's Conference Call Company Overview - **Company**: Huahai Qingshi - **Period**: First half of 2025 - **Revenue**: 1.95 billion CNY, up 30.28% YoY - **Net Profit**: 505 million CNY, up 16.28% YoY - **Key Products**: Equipment sales (1.678 billion CNY), wafer foundry, service, maintenance, and consumables (over 200 million CNY) [2][6][7] Core Insights and Arguments - **Production Capacity**: New factory in Beijing has commenced operations, focusing on core equipment such as thinning and wet processing, with capacity gradually being released [2][5][21] - **Expansion Plans**: Accelerated expansion of the wafer regeneration project in Kunshan, aiming for a monthly capacity of 400,000 wafers by Q3 2026 [3][16] - **Strategic Investments**: Completed strategic investment in Suzhou Bohongyuan to build an integrated platform [2][5] - **H Share Issuance**: Actively planning H share issuance to optimize capital structure and accelerate internationalization [2][5][23] Market Performance - **Customer Segmentation**: Increased proportion of new orders from storage clients (54%) compared to logic clients (41%) in advanced packaging [2][10][11] - **Product Development**: Successful batch orders for high-end CMP equipment and other key devices, indicating strong market acceptance [3][12] - **Market Potential**: Anticipated significant growth in the advanced packaging market, with ongoing joint R&D with storage and advanced packaging manufacturers [3][13][15] Financial Performance - **Revenue Composition**: Approximately 1.678 billion CNY from equipment sales, with the remainder from wafer foundry and services [7] - **Profit Margins**: Gross margin target set between 35% to 45% for wafer regeneration projects [3][16] - **Order Growth Outlook**: Management maintains a cautiously optimistic outlook for order growth, aiming for an increase over last year's 5 billion CNY [9] Additional Important Insights - **R&D Investments**: Increased R&D spending in ion implantation and thinning technologies, leading to a rise in operational costs [19] - **International Market Strategy**: Plans to promote CMP equipment in Southeast Asia and Europe, with ongoing efforts to establish a presence in these regions [23][24][25] - **Future Development Strategy**: Focus on maintaining a competitive edge through continuous innovation and strategic acquisitions to enhance product offerings and market share [20][28]

Summary of Hwatsing (688120.SS) Conference Call Company Overview - **Company**: Hwatsing (688120.SS) - **Industry**: Semiconductor Equipment Key Financial Performance - **2Q25 Revenue**: Rmb1.0 billion, representing a **27% YoY** and **14% QoQ** growth, in line with Goldman Sachs estimates [1][4] - **Contract Liabilities**: Increased to **Rmb1.8 billion** in 2Q25, indicating a solid order uptrend [2][4] - **Net Income**: Rmb272 million, reflecting an **18% YoY** and **17% QoQ** increase, consistent with estimates [4][10] - **Gross Margin**: Declined to **45.8%**, slightly below the expected **46.7%** [4][10] - **Operating Income**: Rmb290 million, up **56% YoY** and **11% QoQ** [4][10] Market and Product Insights - **Semiconductor Capex**: Positive outlook due to increasing semiconductor capital expenditures in China, particularly driven by AI chip demand [1] - **Product Expansion**: Diversification into thinning, dicing, polishing, and cleaning tools, with notable growth in the **12'' wafer thinning tool** and **Ion implantation tools** [1][11] - **Future Demand**: Anticipated increase in demand for advanced chip packaging technologies, which will require more CMP and related equipment [1] Valuation and Ratings - **Current P/E Ratio**: Trading at **28x** 2026E P/E, with a target multiple of **32x** based on peer comparisons [1][15] - **Price Target**: Raised by **10%** to **Rmb148.0**, indicating a potential upside of **22.8%** from the current price of **Rmb120.50** [15][24] - **Investment Rating**: Maintained at **Neutral** due to limited upside compared to other semiconductor companies [1][15] Earnings Revisions - **Net Income Estimates**: Revised up by **0%/1%/+2%** for 2025E-27E, reflecting a better product mix [12] - **EPS Revisions**: Adjusted down by **-2%/-1%/0%** for 2025E-27E due to an increase in share count [12] Risks and Considerations - **Key Risks**: Variability in semiconductor capex expansion, order gains from clients, and the pace of new product introductions [22] Additional Insights - **Operational Efficiency**: Operating expenses remained flat at **17.9%** of revenue, contributing to improved operating income [4][10] - **Long-term Potential**: Despite current valuation concerns, the long-term growth potential remains strong due to market trends and product innovations [1][15]