证券代码：688262 证券简称：国芯科技 公告编号：2024-056 苏州国芯科技股份有限公司 关于调整第二届董事会审计委员会委员的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 苏州国芯科技股份有限公司（以下简称"公司"）于 2024 年 9 月 6 日召开第二 届董事会第二十三次会议，审议通过《关于调整第二届董事会审计委员会委员的 议案》。根据中国证券监督管理委员会发布的《上市公司独立董事管理办法》第 五条"审计委员会成员应当为不在上市公司担任高级管理人员的董事，其中独立 董事应当过半数，并由独立董事中会计专业人士担任召集人"的规定，为保障公 司董事会审计委员会规范运作，结合公司实际情况，鉴于现董事会审计委员会委 员匡启和先生同时担任公司副总经理，公司董事会对第二届董事会审计委员会委 员进行了调整，调整前后的具体情况如下： | 一、 调整前 | | --- | | 委员会 | 召集人 | 其他成员 | | --- | --- | --- | | 审计委员会 | 张薇女士（独立董事、会计 | 肖波先生（独立董事） ...

证券代码：688262 证券简称：国芯科技 公告编号：2024-054 苏州国芯科技股份有限公司 关于自愿披露公司研发的汽车电子集成化门区驱动控制芯 片新产品内部测试成功的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 1 一、 新产品的基本情况 公司本次内部测试成功的集成化门区驱动控制芯片产品CCL1100B是用于汽 车电子门区驱动控制专用芯片，集成的功能主要包括：1、多达6路直流电机驱动， 其中5路内置功率管，用于后视镜调节、折叠及门锁驱动等功能，极大减低了客 户端应用成本，另外1路是内置预驱的H桥马达控制模块，用于升降窗功能；2、 多达10路高边驱动器(可驱动灯泡，LED和防眩光元件)，所有高边驱动均支持高 输入电容的LED模组恒流模式；3、集成后视镜加热驱动；4、反眩光控制；5、丰 富的物理通讯接口，包括CAN FD和LIN；6、丰富的电源模块，为系统MCU和外部 负载(如传感器)提供电源；为了满足绿色应用需求，该芯片支持两种低功耗模式， 具有可编程的本地和远程唤醒能力。该芯片还内置强大的热管理模块，满足各种 ...

国泰君安证券股份有限公司 关于苏州国芯科技股份有限公司 2024 年半年度持续督导跟踪报告 国泰君安证券股份有限公司（以下简称"国泰君安"或"保荐人"）作为苏 州国芯科技股份有限公司（以下简称"国芯科技"或"公司"）首次公开发行股 票并在科创板上市的保荐人，根据《证券发行上市保荐业务管理办法》《上海证 券交易所科创板股票上市规则》《上海证券交易所上市公司自律监管指引第 11 号——持续督导》《上海证券交易所科创板上市公司自律监管指引第 1 号——规 范运作》等相关法律法规的规定，负责国芯科技上市后的持续督导工作，并出 具本持续督导跟踪报告。 | 序号 | 工作内容 | 持续督导情况 | | --- | --- | --- | | | 建立健全并有效执行持续督导工作制 | 保荐人已建立健全并有效执行了持续 | | 1 | 度，并针对具体的持续督导工作制定相 | 督导工作制度，并制定了相应的工作 | | | 应的工作计划。 | 计划。 | | | 根据中国证监会相关规定，在持续督导 工作开始前，与上市公司或相关当事人 | 保荐人已与国芯科技签订《持续督导 | | | | 协议》，该协议明确了双方在持续督 | | ...

Financial Performance - The company's gross margin for the first half of 2024 was 20.21%, a decrease of 3.55 percentage points year-on-year. The gross margin for Q2 was 39.26%, an increase of 27.88 percentage points compared to Q1 [2] - As of June 30, 2024, the total contract liabilities amounted to 633 million CNY, representing a 79.41% increase compared to December 31, 2023, and a 132.14% increase year-on-year [2] Research and Development - The total R&D expenditure reached 144.13 million CNY by June 30, 2024, with Q1 spending at 71.74 million CNY and Q2 at 72.39 million CNY, reflecting a quarter-on-quarter growth of 0.92% [3] - Management expenses for the first half of 2024 totaled 22.63 million CNY, a year-on-year decrease of 7.90%, primarily due to cost-cutting measures [3] Automotive Electronics - By June 30, 2024, the number of projects based on the company's automotive electronic chips reached 126, a year-on-year increase of 125%. The number of mass production projects was 26, up 100% year-on-year [3] - Revenue from automotive electronic chips in the first half of 2024 was 30.01 million CNY, achieving a year-on-year growth of 42.6% [4]

Financial Performance - The company reported a significant increase in revenue for the first half of 2024, achieving a total of 500 million CNY, representing a 25% growth compared to the same period last year[1]. - The company reported a revenue of RMB 500 million for the first half of 2024, representing a 20% increase compared to the same period last year[10]. - The company has provided a revenue guidance of RMB 1.2 billion for the full year 2024, which reflects a projected growth of 25% year-over-year[10]. - The company reported a significant increase in revenue, achieving a total of 500 million CNY for the first half of 2024, representing a 25% year-over-year growth[12]. - The total revenue for the first half of 2024 reached 14,413.02 million, with a net profit of 2,464.07 million, indicating a strong financial performance[64]. - The company’s operating revenue for the first half of the year increased by 5.34% year-on-year, reaching ¥261,397,564.69, driven by a 11.16% growth in self-developed chip and module revenue[18]. - The net profit attributable to shareholders decreased by ¥82,559,943.63, compared to a loss of ¥35,412,488.26 in the same period last year[18]. - The overall gross margin declined from 23.76% to 20.21%, resulting in a decrease in gross profit of ¥6,121,400[20]. - The company reported a net loss of approximately CNY 166.46 million for the period, compared to a net loss of CNY 83.90 million in the previous period[187]. - The total comprehensive loss for the first half of 2024 was approximately ¥82.56 million, compared to a loss of ¥35.41 million in the same period of 2023[194]. User Growth and Market Expansion - User data indicates a growing customer base, with active users increasing by 15% year-over-year, reaching 1.2 million users[1]. - User data indicates a growth in active users by 15%, reaching a total of 1.2 million users by June 30, 2024[10]. - The company is expanding its market presence, targeting new regions in Southeast Asia, which is anticipated to increase market share by 10%[1]. - The company is expanding its market presence in Southeast Asia, targeting a 10% market share by the end of 2025[10]. - Market expansion plans include entering two new international markets by Q4 2024, aiming for a 15% increase in market share[12]. - The company has established partnerships with major automotive manufacturers, including BYD, Chery, and Geely, achieving mass application of its automotive electronic chips in various vehicle models[84]. Research and Development - Research and development investments have increased by 30%, totaling 150 million CNY, aimed at enhancing product innovation and technology[1]. - Research and development expenses increased by 18%, totaling RMB 80 million, focusing on advanced semiconductor technologies[10]. - The company is investing heavily in R&D, with an allocation of 50 million CNY for the development of new semiconductor technologies[12]. - R&D expenses for the reporting period reached CNY 144.13 million, a year-on-year increase of 30.95%[56]. - The total R&D investment accounted for 55.14% of operating revenue, up by 10.78 percentage points from the previous year[56]. - The company has applied for 6 patents during the reporting period, with a total of 146 valid patents as of June 30, 2024[54]. - The company has developed a series of CPU microarchitecture designs based on the RISC-V instruction set, including CRV0, CRV4, CRV5, and CRV7, which are comparable to ARM's Cortex series[49]. - The company has developed high-performance security chips CCP917T and CCRD3304 for cloud security applications, with the latter being a domestic leader and aimed at replacing international competitors[59]. Product Development and Innovation - New product launches are expected to contribute an additional 100 million CNY in revenue, with a focus on advanced semiconductor technologies[1]. - New product launches include a next-generation integrated circuit expected to enhance processing speed by 30%[10]. - The company has successfully developed over 40 CPU cores based on the "PowerPC", "RISC-V", and "M*Core" instruction sets, enhancing its capabilities in embedded CPU technology[66]. - The company has launched a series of automotive body and gateway control chips, including CCFC2002BC, CCFC2010BC, and CCFC2011BC, which are designed to replace foreign counterparts and are used in various applications such as vehicle control and airbag systems[30]. - The company has developed the CCL1600B chip for automotive electronics, which can replace foreign products and supports multiple safety features[69]. - The company is developing automotive electronic MCU and SoC chip design technologies that meet AEC-Q100 reliability standards and ISO26262 functional safety level ASIL D[51]. Strategic Acquisitions and Partnerships - The company has completed a strategic acquisition of a smaller tech firm for 200 million CNY, expected to enhance its product offerings and capabilities[1]. - The company is exploring potential mergers and acquisitions to enhance its technology portfolio and market reach[10]. - A strategic partnership with a leading semiconductor firm is expected to accelerate product development timelines by 15%[10]. - The company has established strategic partnerships with leading customers in the automotive engine field to jointly define new products and achieve domestic substitution[27]. Risks and Challenges - The management has identified potential risks, including supply chain disruptions, which could impact future performance[1]. - The company faces risks related to the loss of key R&D personnel and potential leakage of core technologies, which could adversely affect its market competitiveness[116]. - The company is exposed to international trade risks, particularly due to ongoing trade tensions that could affect its supply chain and operational activities[116]. - The company is facing competitive risks from ARM and emerging RISC-V architectures, which may impact market share and operational performance[113]. Governance and Compliance - There are no significant governance issues reported, ensuring compliance with regulatory standards[1]. - The company has committed to avoiding competition with its controlling shareholders and related parties[152]. - The company has made commitments regarding the accurate disclosure of shareholder information in its prospectus[153]. - The company has not reported any non-operating fund occupation by controlling shareholders or related parties[154]. Financial Management and Shareholder Relations - The company has no plans for dividend distribution in the current reporting period, focusing instead on reinvestment for growth[1]. - The company did not distribute dividends or increase capital reserves, with no shares or cash dividends declared for every 10 shares[132]. - The company has committed to compensating investors for any losses caused by false statements or omissions in its IPO documents[153]. - The company will publicly disclose any failure to fulfill profit distribution commitments and compensate investors for losses incurred[151].

证券代码：688262 证券简称：国芯科技 公告编号：2024-047 苏州国芯科技股份有限公司 第二届董事会第二十二次会议决议公告 （一）以 9 票同意、0 票反对、0 票弃权的表决结果审议通过《关于<2024 年 半年度报告>及摘要的议案》 董事会认为公司 2024 年半年度报告及摘要的编制和审议程序符合相关法律 法规及《公司章程》等内部规章制度的规定；公司 2024 年半年度报告的内容与 格式符合相关规定，公允地反映了公司 2024 年半年度的财务状况和经营成果等 事项；2024 年半年度报告编制过程中，未发现公司参与半年度报告编制和审议 的人员有违反保密规定的行为；董事会全体成员保证公司 2024 年半年度报告披 露的信息真实、准确、完整，不存在任何虚假记载、误导性陈述或重大遗漏，并 对其内容的真实性、准确性和完整性依法承担法律责任。 本议案已经公司第二届董事会审计委员会第八次会议审议通过。 具体内容详见公司同日刊登于《中国证券报》《上海证券报》《证券日报》《证 1 券时报》以及上海证券交易所网站（www.sse.com.cn）的《2024 年半年度报告摘 要》，《2024 年半年度报告》同日刊登于上 ...

证券代码：688262 证券简称：国芯科技 公告编号：2024-046 苏州国芯科技股份有限公司 公司对上述芯片产品具有完全的自主知识产权，该产品可以广泛用于工业控 制和消费电子等需要轻量级 AI 算力需求的应用领域，该产品的研发成功对公司 未来在该领域的市场拓展和业绩成长性预计都将产生积极的影响。 关于自愿披露公司研发的基于 RISC-V 架构的边缘侧 苏州国芯科技股份有限公司（以下简称"公司"）研发的基于 RISC-V 架构的 边缘侧 AI MCU 新产品"CCR4001S"于近日在公司内部测试中获得成功。现将相 关事项公告如下： 一、 新产品的基本情况 公司本次内部测试成功的基于 RISC-V 架构的边缘侧 AI MCU 新产品 CCR4001S 是基于公司自主 RISC-V 架构 C*Core CPU 内核研发的 AI MCU 芯片， 适用于工业控制和消费电子等应用，采用 MCU+AI 的方式可以更好地满足客户广 泛的边缘侧 AI 应用需求。 该芯片采用的 CRV4H CPU 核支持 RV32IMCB 指令，且基于扩展指令实现 了 DSP 指令集和 SMID 指令，DhryStone 指标 2.67D ...

证券代码：688262 证券简称：国芯科技 公告编号：2024-045 苏州国芯科技股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 二、 回购股份的进展情况 根据《上市公司股份回购规则》《上海证券交易所上市公司自律监管指引第 7 号——回购股份》等相关规定，公司在回购股份期间，应于每个月的前 3 个交易日 内公告截至上月末的回购进展情况，现将公司回购股份进展情况公告如下： 2024 年 7 月，公司通过集中竞价交易方式回购股份 779,956 股，占公司总股 本的比例为 0.232130%，购买的最高价为 16.02 元/股、最低价为 15.50 元/股，支付 的金额为 12,382,143.60 元（含印花税、交易佣金等交易费用）。 截至 2024 年 7 月 31 日，公司通过上海证券交易所交易系统以集中竞价交易 方式已累计回购公司股份 1,690,876 股，占公司总股本的比例为 0.503237%，回购 成交的最高价为 20.14 元/股， ...

证券代码：688262 证券简称：国芯科技 公告编号：2024-044 苏州国芯科技股份有限公司 关于自愿披露公司研发的新一代汽车电子高性能 MCU 该芯片基于 40nm eFlash 工艺开发和生产，内嵌 10 个运算 CPU 核 C3007，其 中包括 6 个主核和 4 个锁步核，该 CPU 核流水线采用双发射，DMIPS 性能达到 2.29/MHz，相比同系列的 CCFC3007PT 芯片单个内核性能提升了 20%。该芯片 内嵌硬件安全 HSM 模块，支持 Crypto/SM2/AES/SM4 等国际和国密算法，可以 支持安全启动和 OTA；芯片内嵌多种独立的汽车标准通讯接口，主要包括：支持 TSN 协议 100M/1000M 以太网接口（1 路）、FlexRay（2 路）、Lin（12 路，支持 LIN和 UART）、CANFD(12路）以及对外控制接口 eMIOS（32通道）、最新版 本的通用时序处理单元 GTM4（96 通道）、串行通讯接口 DSPI（22 路，支持 4 路 MSC），该芯片还配置了较大容量的存储空间，其中程序存储 Flash 最高配置 可达16.5M字节，数据存储最高配置Flas ...