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联瑞新材2023年业绩快报点评:Q4业绩持续向好,高端产能加速布局
证 券 研 究 报 告 请务必阅读正文之后的免责条款部分 公 司 更 新 报 告 [Table_Range] 52 周内价格范围 30.61-87.58 市值(百万元) 7,671 请务必阅读正文之后的免责条款部分 2 of 4 2024E 945 541 9 13 52 277 0 7 1 292 37 0 255 369 54 0 822 83 1,963 235 132 1,596 1,626 242 85 -80 -232 15 254 -225 -71 -42 32.6% 47.4% 45.2% 42.8% 29.4% 27.0% 16.0% 13.0% 14.9% 69.9 91.5 758.2 1.0 24.6% 18.7% 23.0% 30.03 4.81 21.09 8.12 0.9% [Table_Page] 联瑞新材(688300) 本公司具有中国证监会核准的证券投资咨询业务资格 作者具有中国证券业协会授予的证券投资咨询执业资格或相当的专业胜任能力,保证报告所采用的数据均来自合规渠道,分析 逻辑基于作者的职业理解,本报告清晰准确地反映了作者的研究观点,力求独立、客观和公正,结论不受任何第 ...
联瑞新材:联瑞新材关于自愿披露签订战略合作协议的公告
2024-02-20 10:10
证券代码:688300 证券简称:联瑞新材 公告编号:2024-001 对上市公司当年业绩的影响 本次签订的协议为双方基于合作意向而达成的战略框架性约定,为双方推进 具体项目合作奠定了基础。旨在表达双方合作意向,确定双方战略合作伙伴关系, 不涉及具体金额,预计对公司 2024 年业绩不构成重大影响,不会导致公司主营 业务、经营范围发生变化。 相关风险提示: 本次签订的战略合作协议为意向性协议,尚存在不确定性。本协议所涉及的 具体合作事项需双方履行审批程序及另行签订相关正式合作协议,以双方另行签 订的项目投资协议为准。 协议履行过程中可能存在因国家政策及市场环境变化等因素,在具体合作方 向上存在偏差,后续具体情况,公司将根据《上海证券交易所科创板股票上市规 则》等相关法律法规、规范性文件及《公司章程》的规定及时履行相应的审议程 序及信息披露义务。敬请广大投资者注意投资风险。 江苏联瑞新材料股份有限公司 关于自愿披露签订战略合作协议的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示: 2024 年 2 月 1 ...
电子信息制造业生产向好,算力提升带动先进封装需求
Shanxi Securities· 2024-02-06 16:00
证券研究报告 资料来源:最闻 消费电子生产向好,上游材料厂商有望受益。根据工信部发布数据,2023 年电子信息产品中,手机产量 15.7 亿台,同比增加 6.9%,其中智能手机产 量 11.4 亿台,同比增加 1.9%;微型计算机设备产量 3.31 亿台,同比减少 17.4%;集成电路产量 3514 亿块,同比增加 6.9%。2023 年我国电子信息制 造业生产恢复向好,出口降幅收窄,效益逐步恢复,投资平稳增长,多区域 营收降幅收窄。随着国内消费电子行业景气度不断修复,将进一步带动半导 体封装材料需求。 资料来源:最闻 算力需求高涨,拉动电子级粉体材料需求增加。AI 算力升级带动服务 器的 CPU 迭代并提升 GPU 需求,推动了 HBM 等新型存储器与功率半导体 市场,带来 EMC 等上游材料的增量需求。据 TrendForce 数据,预计 2024 年智能手机、服务器、笔电 DRAM 单机平均搭载容量年成长率分别为 14.1%、 17.3%、12.4%;NAND Flash 单机平均搭载容量年成长率分别为 9.3%、13.2%、 9.7%。同时,PCB 需求提质增量,有望带来高频高速覆铜板等需求增长,从 ...
长期积累构筑领先优势,专注型龙头发展加速
ZHONGTAI SECURITIES· 2024-02-05 16:00
Investment Rating - The report does not explicitly state an investment rating for the company Core Insights - The company is positioned to benefit from the high-end demand and recovery in the electronic-grade filler market, particularly in the fields of EMC and CCL applications [3][9][18] - The demand for packaging fillers is expected to reach 370,000 tons by 2025, driven by advanced packaging technologies [9][18] - The company focuses on electronic-grade fillers, aiming for high-quality growth through stable supply and long-term accumulation of competitive advantages [56] Summary by Sections Electronic-grade Fillers - Electronic-grade silicon micro-powder exhibits excellent performance, with EMC and CCL as the main downstream application areas [3] - The report highlights the importance of silicon micro-powder in epoxy molding compounds, where it can account for 60%-90% of the filler content, addressing critical issues like thermal expansion [9][10] Market Demand Projections - By 2025, the global demand for packaging fillers is projected to reach 370,000 tons, with advanced packaging driving the growth of mid-to-high-end fillers [9][18] - The demand for CCL fillers is expected to reach 270,000 tons by 2025, benefiting from the recovery in consumer electronics and downstream high-end applications [18][39] Product Performance and Cost Structure - The report discusses the cost structure of angular and spherical powders, noting that angular powders account for over 60% of raw material costs, while spherical powders are significantly influenced by natural gas prices [6][7] - Spherical silicon micro-powder is preferred for high-performance applications due to its superior properties, despite a higher price point compared to angular powders [7][14] Advanced Packaging Trends - The advanced packaging market is expected to account for 50% of the total packaging market by 2025, contributing significantly to market growth [17] - The report indicates that the demand for high-end packaging fillers, particularly for HBM applications, is projected to reach 980 tons by 2030 [24][29] Competitive Landscape - The high-end electronic filler market is characterized by high concentration, with leading Japanese companies dominating the global market share [46] - The company aims to enhance its overseas customer supply share, leveraging the rapid development of the domestic electronic industry and the growing demand for high-quality materials [52]
联瑞新材(688300) - 联瑞新材投资者关系活动记录表
2023-11-30 10:40
证券代码:688300 证券简称:联瑞新材 江苏联瑞新材料股份有限公司投资者关系活动记录表 编号:2023-007 | --- | --- | --- | --- | |----------------|----------------------------------------|------------------------------------------------|-------------------------------------------------------------------------------------------------------------------------------------------------------------| | | | | | | 投资者关系活动 | ■特定对象调研 | ■分析师会议 | | | 类别 | □媒体采访 | □业绩说明会 | | | | □新闻发布会 | □路演活动 | | | | ■现场参观 | | | | | £ 其他 | | | | 参与单位名称及 | | | 开源证券、山西证券、财通证券、中银证券、嘉和 ...
联瑞新材:联瑞新材关于召开2023年第三季度业绩说明会的公告
2023-11-26 07:36
证券代码:688300 证券简称:联瑞新材 公告编号:2023-037 江苏联瑞新材料股份有限公司 关于召开 2023 年第三季度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示: 投资者可于 2023 年 11 月 29 日(星期三)至 12 月 05 日(星期二)16:00 前 登 录 上 证 路 演 中 心 网 站 首 页 点 击 " 提 问 预 征 集 " 栏 目 或 通 过 公 司 邮 箱 novoinfo@novoray.com 进行提问。公司将在说明会上对投资者普遍关注的问题进 行回答。 江苏联瑞新材料股份有限公司(以下简称"公司")已于 2023 年 10 月 26 日 发布公司 2023 年第三季度报告,为便于广大投资者更全面深入地了解公司 2023 年第三季度经营成果、财务状况,公司计划于 2023 年 12 月 06 日(星期三)上午 10:00-11:00 举行 2023 年第三季度业绩说明会,就投资者关心的问题进行交流。 一、 说明会类型 本次投资者说明会以网络互动形式召 ...
联瑞新材(688300) - 联瑞新材投资者关系活动记录表
2023-11-17 10:36
证券代码:688300 证券简称:联瑞新材 江苏联瑞新材料股份有限公司投资者关系活动记录表 编号:2023-006 投资者关系活动 ■特定对象调研 ■分析师会议 类别 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 □现场参观 £其他 参与单位名称及 富国基金、中泰证券、德邦证券等共5家机构,具体名单详见 人员姓名 附件。 时间 2023年11月16日—11月17日 地点 联瑞新材会议室 上市公司接待人 董事会秘书:柏林 员姓名 证券事务代表:李欣安 第一部分 公司基本情况介绍 公司 39 年始终致力于无机填料和颗粒载体行业产品的研 发、制造和销售,是国内行业龙头企业,拥有在功能性陶瓷粉 体材料领域独立自主的系统化知识产权。公司是国家高新技术 企业、国家首批专精特新“小巨人”企业、国家制造业单项冠 军示范企业、国家知识产权优势企业。 投资者关系活动 ...
联瑞新材(688300) - 联瑞新材投资者关系活动记录表
2023-11-08 10:02
证券代码:688300 证券简称:联瑞新材 江苏联瑞新材料股份有限公司投资者关系活动记录表 编号:2023-005 投资者关系活动 ■特定对象调研 ■分析师会议 类别 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 □现场参观 £其他 参与单位名称及 中泰证券、湘财基金、朱雀基金、开源证券、国联证券等共8 人员姓名 家机构,具体名单详见附件。 时间 2023年11月7日 地点 联瑞新材会议室 上市公司接待人 董事长:李晓冬 员姓名 董事会秘书:柏林 财务部部长:范莉 证券事务代表:李欣安 第一部分 公司基本情况介绍 公司 39 年始终致力于无机填料和颗粒载体行业产品的研 发、制造和销售,是国内行业龙头企业,拥有在功能性陶瓷粉 体材料领域独立自主的系统化知识产权。公司是国家高新技术 ...
联瑞新材(688300) - 2023 Q3 - 季度财报
2023-10-25 16:00
Financial Performance - The net profit attributable to shareholders of the listed company for the third quarter is ¥51,795,785.12, representing a 32.66% increase compared to the same period last year[4]. - The net profit attributable to shareholders after deducting non-recurring gains and losses is ¥45,501,644.30, which is a 45.45% increase year-on-year[4]. - The total revenue for the third quarter is ¥196,746,291.83, reflecting a 43.43% increase compared to the same quarter last year[17]. - Net profit attributable to shareholders for the reporting period rose by 32.66%, driven by revenue growth[24]. - Net profit attributable to shareholders after deducting non-recurring gains and losses increased by 45.45%, attributed to revenue growth, net profit increase, and a reduction in non-recurring gains and losses[24]. - Basic earnings per share for the reporting period increased by 33.33%, reflecting revenue and net profit growth[24]. - Diluted earnings per share for the reporting period also rose by 33.33%, consistent with revenue and net profit growth[24]. - Operating profit for the first three quarters of 2023 was RMB 139,241,038.60, down from RMB 148,690,673.07 in 2022, indicating a decrease of approximately 9.8%[33]. - Net profit for the first nine months of 2023 was approximately ¥124.83 million, down from ¥131.27 million in the same period last year, representing a decrease of about 4.0%[52]. - The company reported a total profit of approximately ¥141.21 million for the first nine months of 2023, down from ¥150.36 million in the same period last year[52]. Revenue and Sales Growth - Revenue for the reporting period increased by 43.43%, primarily due to increased sales in the semiconductor packaging and thermal management industry[24]. - Total operating revenue for the first three quarters of 2023 reached RMB 510,853,030.37, an increase from RMB 487,821,064.08 in the same period of 2022, reflecting a growth of approximately 4.2%[33]. Expenses and Costs - Research and development expenses totaled ¥13,596,454.25, marking a 69.56% increase year-on-year[4]. - Total operating costs increased to RMB 390,121,591.78 in 2023 from RMB 354,919,956.02 in 2022, representing a rise of about 9.9%[33]. - The company’s research and development expenses rose to RMB 34,775,869.59 in 2023, compared to RMB 28,469,346.13 in 2022, reflecting an increase of approximately 22.3%[33]. - The company’s tax expenses decreased to RMB 16,377,265.19 in 2023 from RMB 19,087,436.94 in 2022, a reduction of approximately 14.2%[34]. Assets and Liabilities - The total assets at the end of the reporting period are ¥1,657,471,090.12, which is a 7.79% increase from the end of the previous year[4]. - Total assets as of September 30, 2023, amounted to approximately 1.66 billion, up from 1.54 billion at the end of 2022[29]. - Total liabilities increased to approximately 359.53 million from 307.59 million at the end of 2022[30]. - Total current assets reached approximately ¥848.03 billion, with significant components including accounts receivable of ¥165.88 billion and inventory of ¥77.08 billion[41]. - Non-current assets totaled approximately ¥689.59 billion, with fixed assets accounting for ¥553.70 billion[41]. - The company's equity attributable to shareholders was approximately ¥1,230.03 billion, remaining stable compared to the previous period[41]. - Total liabilities amounted to $307.59 million, with current liabilities at $175.39 million[58]. - Non-current liabilities totaled $132.20 million, including lease liabilities of $28.62 million and deferred income of $65.10 million[58]. - The total current liabilities represent approximately 57% of total liabilities, indicating a significant short-term obligation[58]. Cash Flow - The cash flow from operating activities is not applicable for this quarter, but it was ¥125,191,031.00 in the previous year, showing a decrease of 23.29%[4]. - Net cash flow from operating activities for the first three quarters of 2023 was RMB 125,191,031.00, compared to RMB 163,190,998.69 in the same period of 2022, a decline of about 23.3%[35]. - Cash flow from investment activities showed a net outflow of RMB 117,185,978.56 in 2023, compared to a net outflow of RMB 89,787,528.85 in 2022, indicating an increase in investment expenditures[36]. - Cash and cash equivalents at the end of the third quarter of 2023 totaled RMB 111,213,750.86, down from RMB 155,782,519.59 at the end of the same period in 2022, a decrease of approximately 28.6%[36]. Shareholder Information - The number of ordinary shareholders at the end of the reporting period was 4,348[24]. - The largest shareholder, Guangdong Shengyi Technology Co., Ltd., holds 23.26% of the shares[24]. - The company has implemented a capital reserve conversion to share capital plan in June 2023, affecting the calculation of earnings per share for the current and previous periods[19].
联瑞新材:联瑞新材关于投资集成电路用电子级功能粉体材料建设项目的公告
2023-10-25 11:31
证券代码:688300 证券简称:联瑞新材 公告编号:2023-036 江苏联瑞新材料股份有限公司 关于投资集成电路用电子级功能粉体材料建设项目的 公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示: 一、项目投资概述 (一)项目投资的基本情况 电子材料是电子信息技术的基础和先导,是电子信息领域孕育新技术、新产品、 新装备的"摇篮"。随着 5G 通讯、AI、HPC 等新兴技术发展,5G 通讯用高频高速基 板、IC 载板、高端芯片封装等市场迎来了良好的发展机遇。同时对集成电路用到 的电子级功能粉体材料提出了小粒径、低杂质、大颗粒控制、高填充等不同特性要 求。为了优化升级及淘汰现有部分产能,提升自动化智能化制造水平及生产效能以 及更好满足客户多品种小批量订单的需求,公司拟投资人民币 12,800 万元建设集 1 投资标的名称:江苏联瑞新材料股份有限公司(以下简称"公司")集成 电路用电子级功能粉体材料建设项目。 投资金额:约人民币 12,800 万元(最终投资总额以实际投资为准)。 项目选址:建设地点位于江苏省 ...