甬矽电子（宁波）股份有限公司 证券代码：688362 证券简称：甬矽电子 公告编号：2025-030 2024 年 10 月 28 日，甬矽电子（宁波）股份有限公司（以下简称"公司"）召 开第三届董事会第十次会议，审议通过了《关于以集中竞价交易方式回购公司股 份方案的议案》，同意使用招商银行股份有限公司宁波分行提供的专项贷款及公 司自有资金通过上海证券交易所交易系统以集中竞价交易方式回购公司已发行的 部分人民币普通股（A 股）股票。本次回购价格不超过人民币 32.44 元/股（含）， 回购股份的总金额不低于人民币 7,000 万元（含），不超过人民币 9,000 万元（含）。 本次回购的股份将在未来适宜时机拟用于员工持股计划及/或股权激励计划，或用 于转换上市公司发行的可转换为股票的公司债券。回购期限为自董事会审议通过 本次回购股份方案之日起 12 个月内。具体内容详见公司于 2024 年 10 月 29 日、 2024 年 11 月 9 日披露在上海证券交易所网站(www.sse.com.cn)的《甬矽电子（宁 波）股份有限公司关于以集中竞价交易方式回购公司股份方案的公告》（公告编 号：2024-070）、 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 2025势银异质异构集成封装产业大会 将于 4月29日 在浙江宁波 · 甬江实验室举办。 会议议程 ⊙ 09:00 - 12:00 专题论坛： 异构集成研究中心成立仪式 09:00 09:10 相关领导 主办方、联合主办方致辞 09:10 09:20 相关领导 混合键合在异构集成先进封装中的应用 09:20 钟飞 主任助理、信息材料与微纳器件制备 09:40 平台负责人 爵江实验室 Chiplet EDA全流程:设计空间探索,物 理实现及多物理验证 09:40 吴晨 项目总监 10:00 芯粒CAD和制造浙江省工程研究中心/深圳 市比昂芯科技有限公司 聚焦2.5D/3D先进封装EDA平台,探索后 10:00 端全流程设计、仿真与验证协同创新模式 10:20 赵毅 创始人兼首席科学家 珠海硅芯科技有限公司 空部 10:20 1 ...

Summary of Earnings Call for 永熙公司 Company Overview - **Company**: 永熙公司 - **Industry**: Semiconductor Key Points Financial Performance - In Q1 2025, 永熙公司 achieved a revenue growth of 30% year-on-year, turning profitable due to the release of Phase II capacity, deepening core customer relationships, and expanding overseas clients, particularly with two new clients in Taiwan contributing significantly [2][3] - For 2024, the company experienced over 50% revenue growth, benefiting from the end of the global semiconductor inventory cycle and breakthroughs in AI application scenarios [3] Market Dynamics - The U.S. has exempted tariffs on the semiconductor sector, while China's countermeasures cover all tariffs, positively impacting demand for some U.S. competitors [2][4] - Customer demand continues to grow, but inventory stocking effects should be monitored [5] Product Development and Capacity Expansion - The 2.5D/3D packaging production line was completed in Q4 2024, with product validation ongoing with high-end domestic clients, expecting substantial validation by late 2025 [2][7] - The company maintains a capital expenditure plan of approximately 2 to 2.5 billion yuan for 2025, focusing on expanding production capacity, particularly for automotive CIS [2][10][11] Customer Segmentation and Profitability - Revenue from overseas clients is expected to account for 15%-20% in 2024, with gross margins aligned with the company's overall margins. As more complex products are introduced, gross margins for overseas clients are anticipated to improve, aiming for a 30% revenue share in the long term [2][8][9] - The automotive electronics and computing product segments are experiencing significant growth, with automotive electronics revenue increasing over 100% in 2024 [4][15] Strategic Initiatives - The "local for local" strategy is driving demand growth among Taiwanese and European clients, with expectations for continued upward trends in 2025 [2][6] - The company is focusing on advanced packaging technologies and plans to maintain R&D spending at around 6% of revenue [27] Challenges and Risks - The company anticipates potential price fluctuations if production capacity becomes tight, although no significant changes in pricing are expected in the near term [4][13] - The impact of tariffs on domestic clients' export demands remains unclear, with no significant demand loss observed [12] Long-term Outlook - The company plans to complete its total investment of 11 billion yuan over the next few years, with expectations of achieving monthly revenues of 30-40 million yuan at full capacity for wafer-level packaging [30] - The company is also expanding its global footprint with new subsidiaries in Singapore and Malaysia, focusing on overseas client needs and domestic clients' international expansion [31][32] Shareholder Dynamics - Recent announcements indicate some financial investors have exited, but the overall reduction pressure is considered manageable due to long-term holdings by other shareholders [21] Conclusion - 永熙公司 is positioned for continued growth in the semiconductor industry, leveraging strategic expansions, product innovations, and a focus on high-margin segments while navigating market challenges and global dynamics.

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 2024 年，随着全球终端消费市场出现回暖，产业链去库存周期基本结束，叠加AI 应用场景不断涌现，集成电路行业整体景气度回升明显。根据 美国半导体行业协会（SIA）数据，2024年全球半导体销售额达到 6,276 亿美元，同比增长 19.1%，首次突破 6,000 亿美元大关。 近日，甬矽电子（宁波）股份有限 公司 发布了 2024年年度报告，报告显示，2024年甬矽电子 实现营业收入 360,917.94 万元，同比增长 50.96%；实现归属于母公司所有者的净利润 6,632.75 万元，较上年同期增长 15,971.54 万元，实现扭亏为盈。 | | | | | 甲V: 九 | | --- | --- | --- | --- | --- | | 主要会计数据 | 2024年 | 2023年 | 本期比上 年同期增 | ...

2025 年 04 月 24 日 甬矽电子 (688362) —— 持续布局先进封装，大客户及应用领域拓展取得重 大突破 报告原因：有业绩公布需要点评 买入（维持） | 市场数据： 2025 年 04 月 23 日 | | | --- | --- | | 收盘价（元） | 28.85 | | 一年内最高/最低（元） | 38.83/16.24 | | 市净率 | 4.7 | | 息率（分红/股价） | - | | 流通 A 股市值（百万元） | 8,037 | | 上证指数/深证成指 3,296.36/9,935.80 | | | 注："息率"以最近一年已公布分红计算 | | | 基础数据: | 2025 年 03 月 31 日 | | --- | --- | | 每股净资产（元） | 6.19 | | 资产负债率% | 71.03 | | 总股本/流通 A 股（百万） | 408/279 | | 流通 B 股/H 股（百万） | -/- | 一年内股价与大盘对比走势： 04-23 05-23 06-23 07-23 08-23 09-23 10-23 11-23 12-23 01-23 02-23 03-2 ...

Group 1 - The article discusses significant growth projections for the years 2024 to 2027, indicating a potential increase in revenue from 36.09 billion to 66.05 billion [1][2] - A notable increase of 171.02% is reported for a specific metric in Q1 2025, suggesting strong performance compared to previous periods [1] - The data indicates a consistent upward trend in percentages, with a 30.12% increase noted in Q1 2025, reflecting positive market conditions [1] Group 2 - The article highlights a projected revenue of 45.11 billion in 2025, with further growth anticipated to 55.04 billion in 2026 and 66.05 billion in 2027 [2] - There is a mention of a specific percentage change of +6.75% in one of the metrics, indicating improvements in operational efficiency or market share [1] - The document includes various percentage changes across different metrics, showcasing a dynamic and evolving market landscape [1][2]

Investment Rating - The investment rating for the company is "Buy-A" with a target price of 35.38 CNY per share, maintaining the rating [5][11]. Core Insights - The company achieved a turnaround in profitability, with a significant increase in revenue and net profit for the fiscal year 2024, reporting a revenue of 3.609 billion CNY, up 50.96% year-on-year, and a net profit of 66 million CNY, up 171.02% year-on-year [1][2]. - In Q1 2025, the company continued to show growth with a revenue of 945 million CNY, up 30.12% year-on-year, and a net profit of 25 million CNY, up 169.4% year-on-year [1][2]. - The company is expanding its one-stop service capabilities, particularly in wafer-level packaging and automotive electronics, which has led to a rapid increase in customer base and production scale [3]. Financial Performance - The overall gross margin for 2024 was 17.33%, an increase of 3.42 percentage points year-on-year, while the net profit margin improved to 1.09%, up 6.75 percentage points year-on-year [2]. - For Q1 2025, the gross margin was 14.19%, slightly down by 0.04 percentage points year-on-year, with a net profit margin of 0.96%, up 7.65 percentage points year-on-year [2]. Growth Strategy - The company is actively investing in advanced packaging technologies, including fan-out and 2.5D/3D packaging, and has achieved product validation with several clients [4]. - The company has established a product matrix covering automotive electronics, RF communication, and AIoT, which is expected to support sustained revenue growth [3]. Revenue Projections - Revenue projections for 2025 to 2027 are 4.511 billion CNY, 5.504 billion CNY, and 6.605 billion CNY, respectively, with net profits expected to reach 206 million CNY, 356 million CNY, and 497 million CNY [11][12].

Investment Rating - The investment rating for the company is "Buy-A" with a target price of 35.38 CNY per share, maintaining the rating [5][11]. Core Insights - The company achieved a turnaround in profitability, with a significant increase in revenue and net profit for 2024, reporting a revenue of 3.609 billion CNY, up 50.96% year-on-year, and a net profit of 66 million CNY, up 171.02% year-on-year [1][2]. - In Q1 2025, the company continued to show growth with a revenue of 945 million CNY, up 30.12% year-on-year, and a net profit of 25 million CNY, up 169.4% year-on-year [1][2]. - The company is expanding its one-stop service capabilities, particularly in wafer-level packaging and automotive electronics, which has led to a rapid increase in customer base and production scale [3]. Financial Performance - The overall gross margin for 2024 was 17.33%, an increase of 3.42 percentage points year-on-year, while the net profit margin improved to 1.09%, up 6.75 percentage points year-on-year [2]. - The company expects continued revenue growth, projecting revenues of 4.511 billion CNY, 5.504 billion CNY, and 6.605 billion CNY for 2025, 2026, and 2027 respectively [11][12]. Advanced Packaging Development - The company is actively investing in advanced packaging technologies, including fan-out and 2.5D/3D packaging, with ongoing product validation with clients [4]. - The company has established a strong product matrix across various fields, including automotive electronics, RF communication, and AIoT, which supports sustained revenue growth [3].

| 301053 | 远信工 | 0.5900 | 4835.74 | 164.10 | 61638.28 | 26.31 | | --- | --- | --- | --- | --- | --- | --- | | | 业 | | | | | | | 301116 | 益客食 | 0.2200 | 10016.94 | 158.59 | 2083727.00 | -4.80 | | | 品 | | | | | | | 300473 | 德尔股 | 0.2200 | 3242.75 | 151.73 | 451348.48 | 4.98 | | | 份 | | | | | | | 300135 | 宝利国 | 0.0240 | 2230.22 | 149.91 | 196947.19 | -8.23 | | | 际 | | | | | | | 688076 | 诺泰生 | 1.8800 | 40439.00 | 148.19 | 162480.19 | 57.21 | | | 物 | | | | | | | 688118 | 普元信 | 0.0710 | 654.66 | 141.79 | 41983.35 ...

Core Viewpoint - The company, Yongxi Electronics, reported significant growth in revenue and net profit for the year 2024, driven by increased market demand and the introduction of new product lines. The company has also decided not to distribute cash dividends for the year due to its strategic development plans and capital needs. Company Overview - Yongxi Electronics primarily engages in integrated circuit packaging and testing, providing solutions for integrated circuit design companies. Its packaging products include various advanced packaging types such as FC, SiP, Bumping, QFN/DFN, and MEMS [5][6][7]. - The company was established in November 2017 and has focused on advanced packaging in the semiconductor testing industry, achieving notable technological advantages in various advanced packaging forms [6][7]. Business Model - The company's main business model involves customized packaging solutions based on client requirements, where clients provide unprocessed wafers for packaging and testing [8]. - The production model emphasizes high-end packaging and testing products, utilizing advanced automated production equipment and a flexible production approach to enhance efficiency and yield [8][9]. - The sales model is primarily direct sales to chip design companies, with some products in the cryptocurrency sector sold through agency models to manage operational risks [10]. Industry Situation - The integrated circuit packaging and testing industry has evolved into a specialized sector within the semiconductor industry, with significant market share concentrated in the Asia-Pacific region [12][13]. - The global packaging market is projected to reach $89.9 billion in 2024, with advanced packaging accounting for 49% of this market. The demand for advanced packaging is driven by applications in AI, 5G, and IoT [14][15]. - The industry is experiencing a shift towards advanced packaging technologies, such as Chiplet, which are expected to enhance chip performance as traditional scaling approaches face limitations [20][21]. Financial Performance - For the year 2024, Yongxi Electronics achieved a revenue of 3.609 billion yuan, a year-on-year increase of 50.96%. The net profit attributable to shareholders was 66.33 million yuan, reflecting a significant increase compared to the previous year [23]. - The company reported a net cash flow from operating activities driven by revenue growth, indicating improved operational efficiency [23]. Future Development Trends - The company plans to continue focusing on advanced packaging technologies and expanding its product lines, including Bumping and 2.5D packaging, to enhance its competitive edge [55]. - The overall semiconductor industry is expected to grow, with a forecasted global market valuation of $697 billion by 2025, driven by advancements in logic and memory sectors [21][22].