Group 1 - On July 30, Tongfu Microelectronics executed a block trade of 2.51 million shares, with a transaction value of 62.93 million yuan, accounting for 3.71% of the total trading volume for the day [1] - The transaction price was 25.07 yuan, representing a discount of 10.08% compared to the market closing price of 27.88 yuan [1]

| 688120 | 华海清 | 5 | 1.08 | 4.02 | 5.15 | | --- | --- | --- | --- | --- | --- | | | 科 | | | | | | 300203 | 聚光科 | 6 | 0.99 | 4.90 | 6.41 | | | 技 | | | | | | 688503 | 聚和材 | 5 | 0.98 | 5.57 | 9.57 | | | 料 | | | | | | 600730 | 中国高 | 5 | 0.95 | 7.96 | 16.52 | | | 科 | | | | | | 300870 | 欧陆通 | 5 | 0.90 | 3.85 | 3.84 | | 600038 | 中直股 | 5 | 0.85 | 4.87 | 1.76 | | | 份 | | | | | | 002637 | 赞宇科 | 5 | 0.84 | 5.61 | 7.78 | | | 技 | | | | | | | 申菱环 | | | | | | 301018 | 境 | 5 | 0.80 | 4.91 | 9.67 | | 000708 | 中信特 | 5 | 0.75 ...

Group 1 - The millimeter-wave radar concept sector rose by 2.23%, ranking 9th among concept sectors, with 90 stocks increasing in value [1] - Notable gainers in the sector included ShuoBeide with a 20% limit up, Junya Technology also hitting the limit up, and other significant increases from Kexiang Co., Shengyi Technology, and Jingwang Electronics, which rose by 12.23%, 8.52%, and 8.37% respectively [1][2] - The sector experienced a net inflow of 1.781 billion yuan from main funds, with 57 stocks receiving net inflows, and 7 stocks exceeding 100 million yuan in net inflow, led by ShuoBeide with 833 million yuan [1][2] Group 2 - The top three stocks by net inflow ratio were ShuoBeide at 26.89%, Junya Technology at 16.49%, and Huali Chuantong at 13.21% [2][3] - The trading volume for ShuoBeide was significant, with a turnover rate of 39.04% and a main fund flow of approximately 832.71 million yuan [2] - Other stocks with notable performance included Huadian Technology and Dongfang Precision, with net inflows of 418.07 million yuan and 183.24 million yuan respectively [1][2]

Core Viewpoint - Tongfu Microelectronics has achieved significant growth, becoming a leading player in the semiconductor packaging and testing industry, which has attracted attention from major global companies like AMD [1][11]. Company Development - The history of China's semiconductor packaging industry reflects a struggle against foreign dominance, with early companies relying heavily on imports and facing skepticism about their capabilities [3][5]. - The establishment of Jiangfeng Electronics by Dr. Yao Lijun marked a turning point, as the company successfully produced high-purity sputtering targets, a critical material for chip manufacturing, overcoming significant technological barriers [9][11]. Market Position - Tongfu Microelectronics is now ranked third in China and tenth globally in the semiconductor packaging sector, with AMD entrusting 90% of its CPU packaging business to the company, indicating a strong level of trust in its technological capabilities [11][13]. - More than half of the world's top twenty semiconductor companies are clients of Tongfu Microelectronics, showcasing its growing influence in the industry [13]. Industry Trends - The success of Tongfu Microelectronics and other Ningbo-based companies highlights a broader trend of rapid advancement in China's high-tech sector, with significant achievements in various fields, including hydraulic pumps and nuclear reactor components [15]. - The emergence of Chiplet technology is seen as a potential opportunity for Chinese semiconductor companies to leapfrog traditional manufacturing limitations, allowing for innovative chip designs that can compete with advanced processes [15][16]. Conclusion - The narrative of Tongfu Microelectronics illustrates a shift in perception regarding China's capabilities in semiconductor manufacturing, emphasizing resilience and innovation in the face of international challenges [16].

关于变更高级管理人员的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 一、高级管理人员离任情况 证券代码：002156 证券简称：通富微电 公告编号：2025-033 通富微电子股份有限公司 通富微电子股份有限公司（以下简称"公司"）董事会于 2025 年 7 月 25 日 收到公司财务总监陶翠红女士递交的辞职报告，因个人原因陶翠红女士辞去公司 财务总监职务，辞职报告自送达董事会之日起生效。辞职后陶翠红女士将根据公 司安排，继续在财务中心其他岗位任职，其辞职不会影响公司相关工作的正常运 行。 截止本公告披露日，陶翠红女士未持有公司股票。 二、高级管理人员聘任情况 公司于 2025 年 7 月 25 日召开了第八届董事会第十二次会议，审议通过了 《关于变更高级管理人员的议案》。根据《公司法》《深圳证券交易所股票上市规 则》《深圳证券交易所上市公司自律监管指引第 1 号—主板上市公司规范运作》 和《公司章程》等有关法律法规的规定，经公司总裁石磊先生提名，经公司董事 会提名委员会审查、董事会审计委员会审议通过，公司董事会同意聘任廖洪森先 生为公司财务总监，任期 ...

证券代码：002156 证券简称：通富微电 公告编号：2025-032 通富微电子股份有限公司 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 通富微电子股份有限公司（以下简称"公司"）于 2025 年 7 月 25 日召开了 第八届董事会第十二次会议，审议通过了《关于选举非独立董事的议案》。 公司董事会于近日收到董事杨卓先生、杨柳先生的书面辞职申请。杨卓先生、 杨柳先生因工作原因辞去公司第八届董事会董事、第八届董事会战略委员会委员 职务。在公司召开股东大会，选举新的董事就任前，杨卓先生、杨柳先生仍将依 照法律、法规和《公司章程》的规定，履行董事及战略委员会委员职责，辞去上 述职务后，其将不再担任公司其他职务。杨卓先生、杨柳先生未持有公司股票， 亦不存在应当履行而未履行的承诺事项。 经公司董事会提名委员会审核，现提名袁训先生、张昊玳女士为公司董事会 非独立董事候选人，任期自股东大会选举产生之日起至第八届董事会任期届满之 日止。袁训先生、张昊玳女士个人简历详见附件。 此提名获股东大会审议通过后，袁训先生、张昊玳女士将接替杨卓先生、杨 柳先生担任第八届董事会战略委 ...

证券代码：002156 证券简称：通富微电 公告编号：2025-034 通富微电子股份有限公司 关于召开 2025 年第一次临时股东大会的通知 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 根据《公司法》与《通富微电子股份有限公司章程》的有关规定，决定于 2025 年 8 月 11 日召开通富微电子股份有限公司 2025 年第一次临时股东大会。 一、 召开会议的基本情况 1．股东大会届次：通富微电子股份有限公司 2025 年第一次临时股东大会。 现场会议召开时间：2025 年 8 月 11 日 下午 14：30； 网络投票时间：通过深圳证券交易所交易系统进行网络投票的时间为 2025 年 8 月 11 日的交易时间，即上午 9:15-9:25、9:30-11:30 和下午 13:00-15:00； 通过深圳证券交易所互联网投票系统投票的时间为 2025 年 8 月 11 日上午 9:15- 下午 15:00 期间的任意时间。 5．会议的召开方式：本次股东大会采用现场表决与网络投票相结合的方式 召开。公司股东应选择现场投票、网络投票中的一种方式进行表决。同一表 ...

证券代码：002156 证券简称：通富微电 公告编号：2025-031 通富微电子股份有限公司 1、审议通过了《关于选举非独立董事的议案》 具体内容详见巨潮资讯网（http://www.cninfo.com.cn）披露的《关于选举 非独立董事的公告》。 本议案需要提交公司股东大会审议。 表决结果：8 票同意；0 票反对；0 票弃权。 2、审议通过了《关于变更高级管理人员的议案》 第八届董事会第十二次会议决议公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 一、 董事会会议召开情况 通富微电子股份有限公司（以下简称"公司"）第八届董事会第十二次会议， 于 2025 年 7 月 16 日以邮件等方式发出会议通知，各位董事已知悉与所议事项相 关的必要信息，公司第八届董事会第十二次会议于 2025 年 7 月 25 日以通讯表决 方式召开。公司全体 8 名董事均行使了表决权，会议实际有效表决票 8 票。会议 召开符合有关法律、行政法规、部门规章、规范性文件和公司章程的规定。 二、 董事会会议审议情况 表决结果：8 票同意；0 票反对；0 票弃权。 三、备查文件 通 ...

Group 1 - The AI PC concept sector experienced a decline of 1.27%, ranking among the top losers in the market, with notable declines from companies such as Jingwang Electronics, Demingli, and Bomin Electronics [1][2] - Among the AI PC concept stocks, five companies saw price increases, with Haopeng Technology leading at a rise of 10.00%, followed by Siquan New Materials at 4.91% and Feirongda at 0.73% [1][2] - The AI PC concept sector faced a net outflow of 1.958 billion yuan in capital, with 30 stocks experiencing net outflows, and five stocks seeing outflows exceeding 100 million yuan, led by Shenghong Technology with a net outflow of 604 million yuan [2][3] Group 2 - The top gainers in the market included the Yaxia Hydropower concept with a rise of 11.77%, while the MLOps concept saw a decline of 1.80% [2] - The capital inflow leaders among AI PC concept stocks were Tongfu Microelectronics, Haopeng Technology, and Siquan New Materials, with net inflows of 43.67 million yuan, 40.42 million yuan, and 36.73 million yuan respectively [2][3] - The AI PC concept sector's outflow list included Shenghong Technology, Lingyi Technology, and Ruantong Power, with respective net outflows of 603.89 million yuan, 190.72 million yuan, and 124.92 million yuan [2][3]

Group 1 - The report by Aijimi highlights the growth of the semiconductor packaging and testing industry, projecting a total revenue of 87.056 billion yuan for listed companies in 2024, representing a year-on-year increase of 20.69% with a gross margin of approximately 15.67% [1] - The top three companies by total revenue in the packaging and testing sector are Changdian Technology (35.962 billion yuan), Tongfu Microelectronics (23.882 billion yuan), and Huatian Technology (14.462 billion yuan) [1] - The report indicates that the R&D expenditure as a percentage of revenue is highest for Liyang Chip (15.95%), Jingfang Technology (14.12%), and Weicai Technology (13.22%) [1] Group 2 - The advanced packaging market is expected to generate total revenue of $51.9 billion in 2024, with a year-on-year growth of 10.9%, and is projected to reach $78.6 billion by 2028, with a compound annual growth rate (CAGR) of 10.05% from 2022 to 2028 [2] - The global semiconductor packaging market is forecasted to grow from $65.04 billion in 2020 to $118.6 billion in 2027, with a CAGR of 6.6%, while advanced packaging is expected to surpass traditional packaging in market size by 2027 [2] Group 3 - The domestic packaging and testing industry is performing well, with Chinese companies leading in brand strength, diverse teams, international operations, technical capabilities, quality assurance, production scale, and operational efficiency [3] - In 2023, capital expenditure in the advanced packaging sector reached $9.9 billion, primarily from major semiconductor companies and leading OSAT firms, with an expected increase to $11.5 billion in 2024 [3] - The report emphasizes that the growth of the semiconductor packaging market is driven by emerging technologies such as AI, IoT, cloud computing, and big data, which are increasing the demand for chips [3] Group 4 - The global Chiplet market is projected to grow from approximately $3.1 billion in 2023 to around $107 billion by 2033, with a CAGR of 42.5% from 2024 to 2033 [4] - Companies like Intel and TSMC have mature Chiplet technologies, while domestic firms such as Changdian Technology and Tongfu Microelectronics are also advancing in this area [4] - The 2.5D/3D packaging market is expected to expand from $9.4 billion in 2022 to $22.5 billion by 2028, with a CAGR of 15.6%, driven by high-performance computing and AI technologies [4]