Group 1: Company Overview and Performance - The company achieved a revenue of 6.718 billion CNY in the first half of 2024, representing a year-on-year increase of 32.02% [2] - The net profit attributable to shareholders was 223 million CNY, with a significant year-on-year growth of 254.23% [3] - In Q2 2024, the net profit reached 166 million CNY, showing a quarter-on-quarter increase of 190.53% [3] Group 2: Production Bases and Product Lines - The main production bases include Tianshui, Xi'an, Kunshan, Nanjing, Shaoguan, and newly established facilities in Jiangsu and Shanghai [2] - Tianshui focuses on lead frame products, while Xi'an specializes in substrate products such as QFN and DFN [2] - The Jiangsu facility produces advanced packaging products like Bumping and WLCSP, and the Shanghai facility is engaged in wafer testing and finished product testing [2] Group 3: Industry Trends and Future Outlook - The global semiconductor market is experiencing a recovery, with sales expected to reach 611.2 billion USD in 2024 and 687.4 billion USD in 2025 [3] - The semiconductor industry in China is growing rapidly, driven by demand in consumer electronics, automotive electronics, and AI applications [3] - The packaging and testing segment is becoming increasingly competitive and is expected to achieve full domestic substitution [3] Group 4: Research and Development - The company invests over 5% of its revenue in R&D, with 4.23 billion CNY allocated in the first half of 2024, accounting for 6.29% of revenue [3] - Key R&D focuses include advanced packaging technologies such as Fan-Out and automotive electronics [3] Group 5: Financial Health and Capital Expenditure - The company is experiencing a recovery in gross margin, with significant improvements noted in Q1 and Q2 of 2024 [4] - Capital expenditures for the first half of 2024 exceeded 2 billion CNY, primarily for advanced packaging investments, expected to total around 3.5 billion CNY for the year [4] - The company is actively seeking acquisition opportunities to enhance packaging technology and optimize customer structure [4]

Financial Performance - The company's operating revenue for the first half of 2024 was CNY 6,718,197,240.22, representing a year-on-year increase of 32.02% compared to CNY 5,088,913,477.69 in the same period last year[12]. - The net profit attributable to shareholders for the first half of 2024 was CNY 222,733,881.47, a significant increase of 254.23% from CNY 62,878,628.32 in the previous year[12]. - The net cash flow from operating activities reached CNY 1,225,432,401.36, up 61.58% from CNY 758,426,812.98 in the same period last year[12]. - The company achieved a basic earnings per share of CNY 0.0695, reflecting a 254.59% increase compared to CNY 0.0196 in the previous year[12]. - The total assets at the end of the reporting period were CNY 36,675,185,869.03, an increase of 8.66% from CNY 33,751,820,450.19 at the end of the previous year[12]. Operational Risks - The company reported a significant reliance on the semiconductor industry's economic conditions, indicating potential operational risks due to industry fluctuations[2]. - Rising production costs were highlighted as a concern, particularly due to changes in raw material prices and increasing labor costs[2]. - The report outlines various risks, including those related to market expansion and competition in the integrated circuit packaging and testing industry[2]. - The acquisition of Unisem in January 2019 may lead to goodwill impairment risks if future performance does not meet expectations, influenced by macroeconomic conditions and industry competition[2]. - The company faces risks related to the semiconductor industry's cyclical nature and rising production costs, which may impact operational performance[54][55]. Research and Development - The company emphasized the necessity for continuous technological research and new product development to meet market demands, with risks associated with potential failures in these areas[2]. - The company received 11 authorized patents during the reporting period, including 9 invention patents, highlighting its commitment to technological innovation[21]. - Research and development expenses increased by 42.38% to ¥422,808,168.66 from ¥296,963,984.38 year-on-year[26]. - The company plans to enhance its R&D capabilities and product development to mitigate risks associated with technological advancements and market demands[56]. Investment and Financing - The company plans not to distribute cash dividends or issue bonus shares, indicating a focus on reinvestment[2]. - The company is advancing its fundraising investment projects, with production preparations completed for its Jiangsu and Shanghai facilities, entering the production phase[21]. - The company raised a total of ¥5,099,999,996.52 through a non-public stock issuance in 2021, with a net amount of ¥5,047,580,675.01 after expenses[42]. - The company has established strict approval and supervision procedures for the use of raised funds to ensure dedicated usage[43]. Environmental Compliance - The company is classified as a key pollutant discharge unit and adheres to various environmental protection laws and standards[64]. - The total discharge of COD was 232.45 tons, with a concentration of 162.5 mg/L, complying with electronic industry water pollution standards[66]. - The company has implemented a wastewater reuse treatment system, significantly reducing freshwater consumption[71]. - The company has undergone ISO14001:2015 environmental management system certification[80]. Shareholder and Governance - The management team, including key figures like CEO Xiao Shengli, is committed to ensuring the accuracy and completeness of the financial report[2]. - The company has not experienced any changes in its board of directors, supervisors, or senior management during the reporting period[62]. - The company has a shareholder meeting scheduled for April 26, 2024, with an investor participation ratio of 28.86%[60]. - The company has maintained strict compliance with its commitments regarding shareholding increases, with no reductions planned during the specified periods[84]. Market Development - The company plans to further enhance its domestic and international market development efforts to sustain rapid growth[24]. - The semiconductor industry showed signs of recovery in the second half of 2023, with a projected global semiconductor sales growth to USD 611.2 billion in 2024[19]. - The company plans to continue expanding its market presence and investing in new technologies to drive future growth[132]. Related Party Transactions - The company reported a total of 13,070.83 thousand yuan in related party transactions during the reporting period, with a significant portion being sales to related parties[91]. - The company generated rental income of 55.77 thousand yuan from leasing properties to its subsidiaries during the reporting period[96]. - The company engaged in related party transactions amounting to 1,683.07 thousand yuan for the sale of packaging materials and integrated circuit packaging products[91]. Financial Management - The company has entrusted financial management with a total amount of 133,856.54 million yuan, with no overdue amounts or impairment provisions[99]. - The controlling shareholder, Huatiansheng Electronics Group, plans to increase its shareholding by no less than 120 million yuan, having already completed the purchase of 21,204,966 shares, accounting for 0.66% of the total shares[100]. - The company has not engaged in any non-operating fund occupation by controlling shareholders or related parties during the reporting period[85].

上市公司 2024 年 1-6 月非经营性资金占用及其他关联资金往来情况汇总表 | 非经营性资金占用 | 资金占用方 | 占用方与上市公 | 上市公司核算 | 2024 年期初占 | 年 2024 | 月占用 1-6 累计发生金额（不 | 年 2024 用资金的利息 | 月占 1-6 | 年 2024 偿还累计发生 | 月 1-6 | 年 2024 6 期末占用资 | 月 | 占用形成原因 | 占用性质 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | | 名称 | 司的关联关系 | 的会计科目 | 用资金余额 | | | | | | | | | | | | | | | | | | 含利息） | （如有） | | 金额 | | 金余额 | | | | | 控股股东、实际控制 | | | | | | | | | | | | | | | | 人及其附属企业 | | | | | | | | | | | | | | | | 小计 | | | | | | | | | | | | ...

证券代码：002185 证券简称：华天科技 公告编号：2024-034 天水华天科技股份有限公司 第七届董事会第十七次会议决议公告 公司第七届董事会第十七次会议决议 同意 9 票，反对 0 票，弃权 0 票。 2024 年 半 年 度 报 告 全 文 及 摘 要 内 容 详 见 巨 潮 资 讯 网 （http://www.cninfo.com.cn），2024 年半年度报告摘要详见刊登于《证券时报》 的 2024-035 号公司公告。 二、审议通过了《董事会关于募集资金存放与使用情况的专项报告（2024 年半年度）》。 同意 9 票，反对 0 票，弃权 0 票。 《董事会关于募集资金存放与使用情况的专项报告（2024 年半年度）》内容 详见巨潮资讯网（http://www.cninfo.com.cn）和刊登在《证券时报》的 2024-036 号公司公告。 备查文件： 本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 天水华天科技股份有限公司（以下简称"公司"）第七届董事会第十七次会 议通知和议案等材料于 2024 年 8 月 16 日以电子邮件和书面送达方式送达 ...

经认真审核，监事会认为公司董事会编制的《董事会关于募集资金存放与使 用情况的专项报告（2024 年半年度）》中关于募集资金存放与使用情况的披露与 实际情况相符。 证券代码：002185 证券简称：华天科技 公告编号：2024-037 天水华天科技股份有限公司 第七届监事会第十四次会议决议公告 本公司及监事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 天水华天科技股份有限公司（以下简称"公司"）第七届监事会第十四次会 议通知和议案等材料已于 2024 年 8 月 16 日以电子邮件和书面送达方式送达各位 监事，并于 2024 年 8 月 27 日以通讯表决方式召开。会议应参加表决的监事 3 人，实际参加表决的监事 3 人。本次会议符合《公司法》及《公司章程》的有关 规定。会议审议通过了如下决议： 一、审议通过了公司《2024 年半年度报告全文及摘要》。 经认真审核，监事会认为董事会编制和审核公司 2024 年半年度报告全文及 摘要的程序符合法律、行政法规和中国证监会的规定，报告内容真实、准确、完 整地反映了公司的实际情况，不存在任何虚假记载、误导性陈述或重大遗漏。 同意 ...

证券代码：002185 证券简称：华天科技 公告编号：2024- 036 天水华天科技股份有限公司董事会 关于募集资金存放与使用情况的专项报告 （2024 年半年度） 本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 根据中国证监会发布的《上市公司监管指引第 2 号——上市公司募集资金管 理和使用的监管要求》和深圳证券交易所颁布的《深圳证券交易所上市公司自律 监管指引第 1 号——主板上市公司规范运作》《上市公司募集资金年度存放与使 用情况报告格式》等有关规定，天水华天科技股份有限公司（以下简称"公司"） 董事会将截至 2024 年 6 月 30 日募集资金存放与实际使用情况专项报告如下： 一、募集资金基本情况 1、 实际募集资金金额及资金到位时间 经中国证券监督管理委员会《关于核准天水华天科技股份有限公司非公开发 行股票的批复》（证监许可[2021]2942号）核准，公司于2021年10月向特定投资 者非公开发行人民币普通股（A股）464,480,874股，每股发行价格为10.98元， 募集资金总额为5,099,999,996.52元，扣除发行费用（不含税）5 ...

Investment Rating - The report maintains a "Buy" rating for the company, with a target price of 7.94 yuan [2][3] Core Views - The company is a leading domestic integrated circuit packaging and testing enterprise, with its industrial scale ranking among the top ten globally in the packaging and testing industry [1] - The company has been continuously expanding its product lines, with significant advancements in advanced packaging technologies and processes, including FOPLP, 2.5D, and 3D NAND Flash 32-layer ultra-thin chip stacking [1] - The company has achieved mass production of high-density RF SiP modules for 5G flagship smartphones and UFS3.1 products with FC+WB hybrid packaging [1] - The company has obtained 42 authorized patents in 2023, including 15 invention patents [1] - The company is actively promoting the localization of equipment and materials to ensure supply chain security, with progress in the verification and procurement of domestic packaging equipment and materials [2] Financial Performance - The company's revenue is expected to grow from 11,906 million yuan in 2022 to 17,478 million yuan in 2026, with a CAGR of 10.1% [3] - Net profit attributable to the parent company is forecasted to increase from 754 million yuan in 2022 to 1,380 million yuan in 2026, with a CAGR of 16.8% [3] - The company's gross margin is expected to improve from 16.8% in 2022 to 15.0% in 2026 [6] - The company's ROE (diluted) is projected to rise from 4.8% in 2022 to 7.4% in 2026 [6] Valuation Metrics - The company's current market capitalization is 254.44 billion yuan, with a total share capital of 3.204 billion shares [4] - The company's P/E ratio is expected to decrease from 34x in 2022 to 18x in 2026 [3][6] - The company's P/B ratio is forecasted to decline from 1.6x in 2022 to 1.4x in 2026 [6] Industry Overview - The global packaging and testing industry is highly concentrated, with the top ten companies accounting for over 75% of the market share, and this trend is expected to continue [1] - The domestic packaging and testing industry is the only segment in the integrated circuit industry chain that can compete comprehensively with international companies, with domestic companies like the report's subject company having reached a similar level of technological capability as foreign and joint venture enterprises [1]

证券代码：002185 证券简称：华天科技 公告编号：2024-033 天水华天科技股份有限公司 本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 重要提示： 1、本次股东大会未出现否决议案的情形。 2024 年第一次临时股东大会决议公告 2、本次股东大会未涉及变更前次股东大会决议。 一、会议召开和出席情况 （一）会议召开情况 1、会议召开时间： （1）现场会议召开时间：2024 年 8 月 12 日（星期一）14:30 （2）网络投票时间：通过深圳证券交易所（以下简称"深交所"）交易系 统进行网络投票的时间为 2024 年 8 月 12 日上午 9:15 至 9:25，9:30 至 11:30，下 午 13:00 至 15:00；通过深交所互联网投票系统投票的时间为 2024 年 8 月 12 日 9:15 至 15:00 期间的任意时间。 2、现场会议召开地点：甘肃省天水市秦州区赤峪路 88 号公司六楼会议室 3、会议的召开方式：本次股东大会采用现场投票与网络投票相结合的方式。 4、会议召集人：公司董事会 5、会议主持人：公司董事长肖胜利先生 6、会议召开的 ...

北京市竞天公诚律师事务所上海分所 关于 天水华天科技股份有限公司 2024 年第一次临时股东大会 之 法律意见书 上海市徐汇区淮海中路 1010 号嘉华中心 45 层 邮编：200031 Suite 45/F, K.Wah Centre, 1010 Huaihai Road (M), Xuhui District, Shanghai 200031, China 电话/Tel: +86 21 5404 9930 传真/Fax: +86 21 5404 9931 网址/Website: www.jingtian.com 本所根据《中华人民共和国公司法》《中华人民共和国证券法》《上市公司 股东大会规则》等现行有效的法律、法规、规范性文件及《天水华天科技股份有 限公司章程》（下称"《公司章程》"），按照律师行业公认的业务标准、道德 规范和勤勉尽责精神，出具本法律意见书。 二〇二四年八月 北京市竞天公诚律师事务所上海分所 法律意见书 北京市竞天公诚律师事务所上海分所 关于天水华天科技股份有限公司 2024 年第一次临时股东大会之法律意见书 致：天水华天科技股份有限公司 为出具本法律意见书，本所律师审查了本次股东大会相关 ...

Investment Rating - The investment rating for the company is maintained at "Buy-A" [1][2]. Core Views - The report highlights the completion and production commencement of the first phase of Shanghai Huati Technology, which is expected to achieve a wafer testing capacity of 480,000 pieces per year [1]. - The company is positioned as a major integrated circuit testing center in China, focusing on wafer testing and establishing a differentiated development pattern with other testing bases [1][2]. - The anticipated revenue growth for the company from 2024 to 2026 is projected at 15.2%, 18.2%, and 12.3% respectively, with net profit growth rates of 161.6%, 53.6%, and 41.1% [1][3]. Financial Data and Valuation - The company's revenue for 2024 is estimated at 13,020 million yuan, with a year-on-year growth of 15.2% [3]. - The projected net profit for 2024 is 592 million yuan, reflecting a significant increase of 161.6% compared to the previous year [3]. - The company's P/E ratios for 2024, 2025, and 2026 are expected to be 44.0, 28.6, and 20.3 respectively, indicating a potential for improved valuation as earnings grow [3][5]. Operational Highlights - Shanghai Huati has established a cleanroom area of 30,000 square meters and over 1,300 high-end testing devices, enabling comprehensive testing capabilities across various chip types [1]. - The company employs advanced technologies such as MES, SAP, and CIM to achieve intelligent manufacturing and automation in its production processes [1][2]. - The report emphasizes the strategic importance of the company's 3D Matrix platform in enhancing its technological moat and expanding production capacity [2].