天水华天科技股份有限公司 舆情管理制度 二〇二四年十月 天水华天科技股份有限公司 舆情管理制度 舆情管理制度 第一章 总则 第一条 为了提高天水华天科技股份有限公司（以下简称"公司"）应对各类舆 情的能力，建立快速反应和应急处置机制，及时、妥善处理各类舆情对公司股价、 公司商业信誉及正常生产经营活动造成的影响，切实保护公司及投资者合法权益， 根据相关法律法规的规定和《公司章程》，特制定本制度。 （三）可能或者已经影响社会公众投资者投资取向，造成股价异常波动的信息； （四）其他涉及公司信息披露且可能对公司股票及其衍生品交易价格产生较大 影响的事件信息。 第三条 舆情信息的分类： 第二条 本制度所称舆情包括： （一）报刊、电视、网络等媒体对公司进行的负面报道； （二）社会上存在的已经或将给公司造成不良影响的传言或信息； （一）重大舆情：指传播范围较广，严重影响公司公众形象或正常经营活动， 使公司已经或可能遭受损失，已经或可能造成公司股票及其衍生品种交易价格变动 的负面舆情； （二）一般舆情：指除重大舆情之外的其他舆情。 第二章 舆情管理的组织体系及工作职责 第四条 公司应对各类舆情实行统一领导、统一组织、快速反应 ...

证券代码：002185 证券简称：华天科技 公告编号：2024-038 天水华天科技股份有限公司 关于控股股东增持公司股份及增持计划的公告 天水华天电子集团股份有限公司保证向本公司提供的信息内容 真实、准确、完整，没有虚假记载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供 的信息一致。 特别提示： 2024 年 9 月 10 日，公司控股股东天水华天电子集团股份有限公司以自 有资金人民币 118.0980 万元，通过深圳证券交易所交易系统集中竞价方式增持 了公司股份 162,000 股，约占公司已发行股份总数的 0.0051%（以下简称"本次 增持"）。 天水华天电子集团股份有限公司计划自本次增持之日起 6 个月内，通过 深圳证券交易所交易系统集中竞价方式继续增持公司股份，累计增持总金额不低 于 3,000 万元人民币（含本次增持）。 天水华天科技股份有限公司（以下简称"公司"或"本公司"）于 2024 年 9 月 10 日接到公司控股股东天水华天电子集团股份有限公司（以下简称"华天 电子集团"）的通知，华天电子集团已增持部分公司股份，并计划继续增持公司 股份，现将有关情况公 ...

Investment Rating - The investment rating for the company is "Buy" with a 6-month outlook maintained [1]. Core Views - The company's performance in the first half of 2024 showed significant improvement, with revenue reaching 6.718 billion yuan, a year-on-year increase of 32.02%, and net profit attributable to the parent company at 223 million yuan, up 254.23% year-on-year [1]. - The recovery in the integrated circuit market has positively impacted the company's operations, allowing it to seize market opportunities and enhance customer engagement [1]. - The company has expanded its automotive electronics packaging capacity and accelerated the mass production of high-end products, including various advanced packaging technologies [2]. - The company has received 11 patent authorizations in the first half of 2024, with a focus on quality management and customer satisfaction [2]. - The company is actively pursuing cost reduction and efficiency improvement through automation upgrades, enhancing production efficiency [2]. - The establishment of the Pangu Semiconductor project and the launch of the Shanghai Huatian testing base are significant milestones for the company's growth strategy [2]. Financial Summary - The company reported a total revenue of 11,298.25 million yuan in 2023, with a projected increase to 13,023.49 million yuan in 2024, reflecting a growth rate of 15.27% [5]. - The net profit attributable to the parent company is expected to rise from 226.32 million yuan in 2023 to 615.54 million yuan in 2024, indicating a growth rate of 171.98% [5]. - The company's earnings per share (EPS) is projected to increase from 0.07 yuan in 2023 to 0.19 yuan in 2024 [5]. - The company's asset-liability ratio is projected to be 41.66% in 2024, down from 43.34% in 2023, indicating improved financial stability [7].

Investment Rating - The report maintains a rating of "Accumulate" for the company [1]. Core Views - The company's revenue for H1 2024 reached 6.718 billion yuan, a year-on-year increase of 32.02%, while the net profit attributable to shareholders was 223 million yuan, up 254.23% year-on-year [1][2]. - The integrated circuit market is gradually recovering, leading to significant improvements in the company's profitability, with a gross margin of 10.91% and a net margin of 3.45% in H1 2024 [2][5]. - The company is expanding its advanced packaging scale and expects to capture more orders as production ramps up [2][5]. Financial Performance Summary - Revenue (million yuan): - 2022A: 11,906 - 2023A: 11,298 - 2024E: 13,300 - 2025E: 15,825 - 2026E: 18,217 - Year-on-year growth rates: -1.6% (2022A), -5.1% (2023A), 17.7% (2024E), 19.0% (2025E), 15.1% (2026E) [1][6]. - Net profit attributable to shareholders (million yuan): - 2022A: 754 - 2023A: 226 - 2024E: 684 - 2025E: 1,088 - 2026E: 1,549 - Year-on-year growth rates: -46.7% (2022A), -70.0% (2023A), 202.3% (2024E), 59.1% (2025E), 42.3% (2026E) [1][6]. - ROE (%): - 2022A: 5.3 - 2023A: 1.5 - 2024E: 4.3 - 2025E: 6.5 - 2026E: 8.5 [1][6]. Industry Outlook - The semiconductor market is experiencing a recovery, with global and Chinese semiconductor sales maintaining double-digit growth since 2024 [5]. - The company is focusing on advanced packaging technology and product innovation, with R&D expenditures constituting over 5% of revenue [5][6]. - The automotive electronics packaging product scale is expanding, with several projects progressing towards mass production [2][5].

Group 1: Company Overview and Performance - The company achieved a revenue of 6.718 billion CNY in the first half of 2024, representing a year-on-year increase of 32.02% [2] - The net profit attributable to shareholders was 223 million CNY, with a significant year-on-year growth of 254.23% [3] - In Q2 2024, the net profit reached 166 million CNY, showing a quarter-on-quarter increase of 190.53% [3] Group 2: Production Bases and Product Lines - The main production bases include Tianshui, Xi'an, Kunshan, Nanjing, Shaoguan, and newly established facilities in Jiangsu and Shanghai [2] - Tianshui focuses on lead frame products, while Xi'an specializes in substrate products such as QFN and DFN [2] - The Jiangsu facility produces advanced packaging products like Bumping and WLCSP, and the Shanghai facility is engaged in wafer testing and finished product testing [2] Group 3: Industry Trends and Future Outlook - The global semiconductor market is experiencing a recovery, with sales expected to reach 611.2 billion USD in 2024 and 687.4 billion USD in 2025 [3] - The semiconductor industry in China is growing rapidly, driven by demand in consumer electronics, automotive electronics, and AI applications [3] - The packaging and testing segment is becoming increasingly competitive and is expected to achieve full domestic substitution [3] Group 4: Research and Development - The company invests over 5% of its revenue in R&D, with 4.23 billion CNY allocated in the first half of 2024, accounting for 6.29% of revenue [3] - Key R&D focuses include advanced packaging technologies such as Fan-Out and automotive electronics [3] Group 5: Financial Health and Capital Expenditure - The company is experiencing a recovery in gross margin, with significant improvements noted in Q1 and Q2 of 2024 [4] - Capital expenditures for the first half of 2024 exceeded 2 billion CNY, primarily for advanced packaging investments, expected to total around 3.5 billion CNY for the year [4] - The company is actively seeking acquisition opportunities to enhance packaging technology and optimize customer structure [4]

Financial Performance - The company's operating revenue for the first half of 2024 was CNY 6,718,197,240.22, representing a year-on-year increase of 32.02% compared to CNY 5,088,913,477.69 in the same period last year[12]. - The net profit attributable to shareholders for the first half of 2024 was CNY 222,733,881.47, a significant increase of 254.23% from CNY 62,878,628.32 in the previous year[12]. - The net cash flow from operating activities reached CNY 1,225,432,401.36, up 61.58% from CNY 758,426,812.98 in the same period last year[12]. - The company achieved a basic earnings per share of CNY 0.0695, reflecting a 254.59% increase compared to CNY 0.0196 in the previous year[12]. - The total assets at the end of the reporting period were CNY 36,675,185,869.03, an increase of 8.66% from CNY 33,751,820,450.19 at the end of the previous year[12]. Operational Risks - The company reported a significant reliance on the semiconductor industry's economic conditions, indicating potential operational risks due to industry fluctuations[2]. - Rising production costs were highlighted as a concern, particularly due to changes in raw material prices and increasing labor costs[2]. - The report outlines various risks, including those related to market expansion and competition in the integrated circuit packaging and testing industry[2]. - The acquisition of Unisem in January 2019 may lead to goodwill impairment risks if future performance does not meet expectations, influenced by macroeconomic conditions and industry competition[2]. - The company faces risks related to the semiconductor industry's cyclical nature and rising production costs, which may impact operational performance[54][55]. Research and Development - The company emphasized the necessity for continuous technological research and new product development to meet market demands, with risks associated with potential failures in these areas[2]. - The company received 11 authorized patents during the reporting period, including 9 invention patents, highlighting its commitment to technological innovation[21]. - Research and development expenses increased by 42.38% to ¥422,808,168.66 from ¥296,963,984.38 year-on-year[26]. - The company plans to enhance its R&D capabilities and product development to mitigate risks associated with technological advancements and market demands[56]. Investment and Financing - The company plans not to distribute cash dividends or issue bonus shares, indicating a focus on reinvestment[2]. - The company is advancing its fundraising investment projects, with production preparations completed for its Jiangsu and Shanghai facilities, entering the production phase[21]. - The company raised a total of ¥5,099,999,996.52 through a non-public stock issuance in 2021, with a net amount of ¥5,047,580,675.01 after expenses[42]. - The company has established strict approval and supervision procedures for the use of raised funds to ensure dedicated usage[43]. Environmental Compliance - The company is classified as a key pollutant discharge unit and adheres to various environmental protection laws and standards[64]. - The total discharge of COD was 232.45 tons, with a concentration of 162.5 mg/L, complying with electronic industry water pollution standards[66]. - The company has implemented a wastewater reuse treatment system, significantly reducing freshwater consumption[71]. - The company has undergone ISO14001:2015 environmental management system certification[80]. Shareholder and Governance - The management team, including key figures like CEO Xiao Shengli, is committed to ensuring the accuracy and completeness of the financial report[2]. - The company has not experienced any changes in its board of directors, supervisors, or senior management during the reporting period[62]. - The company has a shareholder meeting scheduled for April 26, 2024, with an investor participation ratio of 28.86%[60]. - The company has maintained strict compliance with its commitments regarding shareholding increases, with no reductions planned during the specified periods[84]. Market Development - The company plans to further enhance its domestic and international market development efforts to sustain rapid growth[24]. - The semiconductor industry showed signs of recovery in the second half of 2023, with a projected global semiconductor sales growth to USD 611.2 billion in 2024[19]. - The company plans to continue expanding its market presence and investing in new technologies to drive future growth[132]. Related Party Transactions - The company reported a total of 13,070.83 thousand yuan in related party transactions during the reporting period, with a significant portion being sales to related parties[91]. - The company generated rental income of 55.77 thousand yuan from leasing properties to its subsidiaries during the reporting period[96]. - The company engaged in related party transactions amounting to 1,683.07 thousand yuan for the sale of packaging materials and integrated circuit packaging products[91]. Financial Management - The company has entrusted financial management with a total amount of 133,856.54 million yuan, with no overdue amounts or impairment provisions[99]. - The controlling shareholder, Huatiansheng Electronics Group, plans to increase its shareholding by no less than 120 million yuan, having already completed the purchase of 21,204,966 shares, accounting for 0.66% of the total shares[100]. - The company has not engaged in any non-operating fund occupation by controlling shareholders or related parties during the reporting period[85].

上市公司 2024 年 1-6 月非经营性资金占用及其他关联资金往来情况汇总表 | 非经营性资金占用 | 资金占用方 | 占用方与上市公 | 上市公司核算 | 2024 年期初占 | 年 2024 | 月占用 1-6 累计发生金额（不 | 年 2024 用资金的利息 | 月占 1-6 | 年 2024 偿还累计发生 | 月 1-6 | 年 2024 6 期末占用资 | 月 | 占用形成原因 | 占用性质 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | | 名称 | 司的关联关系 | 的会计科目 | 用资金余额 | | | | | | | | | | | | | | | | | | 含利息） | （如有） | | 金额 | | 金余额 | | | | | 控股股东、实际控制 | | | | | | | | | | | | | | | | 人及其附属企业 | | | | | | | | | | | | | | | | 小计 | | | | | | | | | | | | ...

证券代码：002185 证券简称：华天科技 公告编号：2024-034 天水华天科技股份有限公司 第七届董事会第十七次会议决议公告 公司第七届董事会第十七次会议决议 同意 9 票，反对 0 票，弃权 0 票。 2024 年 半 年 度 报 告 全 文 及 摘 要 内 容 详 见 巨 潮 资 讯 网 （http://www.cninfo.com.cn），2024 年半年度报告摘要详见刊登于《证券时报》 的 2024-035 号公司公告。 二、审议通过了《董事会关于募集资金存放与使用情况的专项报告（2024 年半年度）》。 同意 9 票，反对 0 票，弃权 0 票。 《董事会关于募集资金存放与使用情况的专项报告（2024 年半年度）》内容 详见巨潮资讯网（http://www.cninfo.com.cn）和刊登在《证券时报》的 2024-036 号公司公告。 备查文件： 本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 天水华天科技股份有限公司（以下简称"公司"）第七届董事会第十七次会 议通知和议案等材料于 2024 年 8 月 16 日以电子邮件和书面送达方式送达 ...

经认真审核，监事会认为公司董事会编制的《董事会关于募集资金存放与使 用情况的专项报告（2024 年半年度）》中关于募集资金存放与使用情况的披露与 实际情况相符。 证券代码：002185 证券简称：华天科技 公告编号：2024-037 天水华天科技股份有限公司 第七届监事会第十四次会议决议公告 本公司及监事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 天水华天科技股份有限公司（以下简称"公司"）第七届监事会第十四次会 议通知和议案等材料已于 2024 年 8 月 16 日以电子邮件和书面送达方式送达各位 监事，并于 2024 年 8 月 27 日以通讯表决方式召开。会议应参加表决的监事 3 人，实际参加表决的监事 3 人。本次会议符合《公司法》及《公司章程》的有关 规定。会议审议通过了如下决议： 一、审议通过了公司《2024 年半年度报告全文及摘要》。 经认真审核，监事会认为董事会编制和审核公司 2024 年半年度报告全文及 摘要的程序符合法律、行政法规和中国证监会的规定，报告内容真实、准确、完 整地反映了公司的实际情况，不存在任何虚假记载、误导性陈述或重大遗漏。 同意 ...

证券代码：002185 证券简称：华天科技 公告编号：2024- 036 天水华天科技股份有限公司董事会 关于募集资金存放与使用情况的专项报告 （2024 年半年度） 本公司及董事会全体成员保证信息披露的内容真实、准确、完整， 没有虚假记载、误导性陈述或重大遗漏。 根据中国证监会发布的《上市公司监管指引第 2 号——上市公司募集资金管 理和使用的监管要求》和深圳证券交易所颁布的《深圳证券交易所上市公司自律 监管指引第 1 号——主板上市公司规范运作》《上市公司募集资金年度存放与使 用情况报告格式》等有关规定，天水华天科技股份有限公司（以下简称"公司"） 董事会将截至 2024 年 6 月 30 日募集资金存放与实际使用情况专项报告如下： 一、募集资金基本情况 1、 实际募集资金金额及资金到位时间 经中国证券监督管理委员会《关于核准天水华天科技股份有限公司非公开发 行股票的批复》（证监许可[2021]2942号）核准，公司于2021年10月向特定投资 者非公开发行人民币普通股（A股）464,480,874股，每股发行价格为10.98元， 募集资金总额为5,099,999,996.52元，扣除发行费用（不含税）5 ...