PCB的催化又来了，LPU板层数又翻一倍 先看英伟达怎么说，"多跨越一个芯片，就多跨越一个接口，多跨越一个接口，就多增加延迟"。 所以LPU架构、正交背板架构、COWOP架构，还有一些现在并不知道的技术升级，是必然会发生的。 每个架构背后的逻辑，都是尽可能去减少芯片之间的传输距离，芯片堆叠多了，必然管脚会变得极其复杂，PCB 的加工难度、层数、精密度会极大程度增加，价值 PCB的催化又来了，LPU板层数又翻一倍 先看英伟达怎么说，"多跨越一个芯片，就多跨越一个接口，多跨越一个接口，就多增加延迟"。 每个架构背后的逻辑，都是尽可能去减少芯片之间的传输距离，芯片堆叠多了，必然管脚会变得极其复杂，PCB 的加工难度、层数、精密度会极大程度增加，价值量也会极大程度增加。 所以LPU用的50多层板单价至少四五万，70多层的正交背板单价能到三四十万。 PCB在整机柜中的价值量，从最初8卡服务器的1.5%，逐步提高到5%以上，未来有望到8%以上。 行业观点保持不变：产能极度紧缺，格局非常稳定。 #重点推荐：胜宏科技、沪电股份、鹏鼎控股、生益科技、生益电子等 新逻辑：载板今年必然还会涨价，已经成为制约芯片生产的有一大瓶颈，台 ...

证券日报网讯2月26日，鹏鼎控股（002938）在互动平台回答投资者提问时表示，公司目前暂无量子科 技相关具体项目，但对包括量子科技在内的新兴技术及行业发展动态始终保持积极关注。公司将始终结 合行业趋势、市场需求及自身技术布局，持续跟进客户新产品创新与落地。 ...

格隆汇2月26日丨鹏鼎控股(002938.SZ)在投资者互动平台表示，公司目前暂无量子科技相关具体项目， 但对包括量子科技在内的新兴技术及行业发展动态始终保持积极关注。公司将始终结合行业趋势、市场 需求及自身技术布局，持续跟进客户新产品创新与落地。 ...

（来源：淘金ETF） 1. 中际旭创（300308）作为全球高速光模块领域的绝对龙头企业，中际旭创深度绑定英伟达、微软、谷 歌等北美头部云厂商，是AI算力爆发周期内最具确定性的核心受益标的。800G与1.6T高速光模块出货 量稳居全球前列，产品结构持续向高端迭代，毛利率与盈利水平稳步抬升。随着英伟达GB300与Rubin 新一代算力平台规模化落地，单机光模块用量大幅提升，直接推动公司订单持续高增。在CPO共封装光 学领域，企业技术储备完善，与产业链上下游协同推进下一代互联方案，长期成长空间进一步打开。北 美四大云厂商资本开支同比增长超60%，叠加英伟达业绩超预期，公司未来两年业绩确定性极高，产能 持续满载，客户结构优质且壁垒深厚，是光模块板块中业绩弹性最强、成长逻辑最清晰的龙头企业。 2. 新易盛（300502） 专注于高速光模块研发、生产与销售的新易盛，是国内少数具备全球竞争力的核心企业，产品覆盖数据 中心、电信传输全场景，在400G、800G高端模块领域出货量位居行业第一梯队。企业海外收入占比 高，深度绑定全球主流云厂商与设备商，订单能见度高且交付能力突出。受益于AI数据中心建设提速 与高速互联需求爆发， ...

【算力硬件股持续活跃 沪电股份涨停创历史新高】智通财经2月26日电，算力硬件股持续活跃，PCB、 CPO概念均表现强势，沪电股份、广合科技涨停，天孚通信涨近10%，均创历史新高，智立方、威尔高 涨超10%，明阳电路、东山精密、胜宏科技、鹏鼎控股、生益科技跟涨。消息面上，2月25日，英伟达 展示了下一代Vera Rubin算力系统的内部构成与供应链细节。该机架集成72颗Rubin图形处理单元 （GPU）和36颗Vera中央处理器（CPU），整套系统共含130万个组件。 转自：智通财经 ...

2月25日，鹏鼎控股盘中上涨2.09%，截至10:08，报59.68元/股，成交5.82亿元，换手率0.43%，总市值 1383.41亿元。 分红方面，鹏鼎控股A股上市后累计派现97.25亿元。近三年，累计派现50.97亿元。 机构持仓方面，截止2025年9月30日，鹏鼎控股十大流通股东中，香港中央结算有限公司位居第三大流 通股东，持股8239.70万股，相比上期增加3459.08万股。华泰柏瑞沪深300ETF（510300）位居第五大流 通股东，持股1191.88万股，相比上期减少50.88万股。易方达沪深300ETF（510310）位居第七大流通股 东，持股855.80万股，相比上期减少28.22万股。兴全商业模式混合(LOF)A（163415）、兴全合润混合A （163406）、兴全新视野定期开放混合型发起式（001511）退出十大流通股东之列。 资金流向方面，主力资金净流入2036.80万元，特大单买入7085.97万元，占比12.17%，卖出6226.05万 元，占比10.69%；大单买入1.37亿元，占比23.59%，卖出1.26亿元，占比21.57%。 声明：市场有风险，投资需谨慎。本文基于第三 ...

Group 1 - The core point of the article is that Pengding Holdings (Shenzhen) Co., Ltd. has obtained a patent for a technology related to circuit board processing and battery modules, indicating innovation in the electronics manufacturing sector [1] - Pengding Holdings was established in 1999 and is primarily engaged in the manufacturing of computers, communications, and other electronic devices, with a registered capital of 2,318.051016 million RMB [1] - The company has invested in 15 enterprises, participated in 45 bidding projects, and holds 1,612 patents along with 340 administrative licenses [1] Group 2 - Qingding Precision Electronics (Huaian) Co., Ltd. was founded in 2014 and also focuses on the manufacturing of computers, communications, and other electronic devices, with a registered capital of 3,401.52213586 million RMB [1] - Qingding has invested in 1 enterprise, participated in 106 bidding projects, and holds 629 patents along with 303 administrative licenses [1]

Investment Rating - The industry is rated as "Buy" with expectations of an increase exceeding 15% in the next 3-6 months [57]. Core Insights - The report emphasizes that upstream materials are a key inflationary component in the PCB upgrade iteration process, with three main conclusions: the number of PCBs is increasing, the value of PCBs per cabinet/GPU is rising, and upstream materials are undergoing continuous upgrades [2][8]. - The market is focusing on materials that are close to "ultimate" technology or "upgrade" directions, indicating a potential profit release in 2026 [3][18]. - The report highlights the significant price inflation in electronic fabrics, particularly Low-CTE and Q fabrics, driven by supply constraints and increasing demand from high-end applications [4][15][24]. Summary by Sections Upstream Materials - The report identifies that the PCB board count is increasing, and the corresponding value per cabinet/GPU is also on the rise, particularly with the introduction of new PCB designs like the Vera Rubin NVL144 CPX [2][8]. - Continuous upgrades in PCB upstream materials are necessary to meet the higher demands for transmission speed and signal integrity from AI applications [11][12]. - Upstream materials are prone to inflation, with significant price differences observed in various generations of electronic fabrics [15][18]. Electronic Fabrics - The report predicts a continued price increase for Low-CTE fabrics in 2026 due to supply shortages and rising demand from high-end applications [4][36]. - The second-generation Low-Dk fabrics are expected to face a clear supply-demand gap in 2026, driven by the large-scale deployment of Google's TPU V7 and above [36][37]. - Q fabrics are highlighted for their superior performance and scarcity, with a gradual increase in production expected in 2027 [26][34]. Copper Foil - The report notes a clear upgrade trend in HVLP copper foil, with significant price increase potential due to rising demand from AI applications and planned expansions by leading manufacturers [5][41]. - The market for carrier copper foil is identified as a second growth pole, with a current global market size of approximately 5 billion, primarily dominated by Japanese companies [49][50]. Resins - The report discusses the importance of resin types, particularly carbon-hydrogen resins, in high-frequency and high-speed applications, with domestic companies accelerating production to meet demand [51][54].

Investment Rating - The investment outlook for the Chinese electronic components industry is stable, with overall credit quality expected to remain unchanged over the next 12 to 18 months [5][8]. Core Insights - The industry is driven by the recovery in consumer electronics, rapid growth in automotive electronics, and advancements in artificial intelligence, with traditional consumer electronics providing basic demand support but limited impact on overall growth [15][21]. - The industry is expected to gradually transition towards high-end products, with leading companies leveraging their high-end capacity and technological advantages to maintain a competitive edge [15][21]. - The overall credit risk in the electronic components industry is manageable, with no significant changes in ratings and no instances of bond extensions or defaults reported [22]. Industry Fundamentals Analysis - In 2025, domestic policies such as "trade-in" programs effectively boosted demand in the downstream market, helping to stabilize the electronic components industry amid fluctuating international trade conditions and tariff policies [9][11]. - The global competition landscape in the electronic components sector has remained stable, with significant growth in revenue and profits across various sub-sectors, although operating cash flow has declined [7][22]. - The industry is expected to see substantial order growth driven by automotive electronics and AI demand, with potential for upward adjustments in industry outlook if favorable conditions persist [7][8]. Credit Performance of Industry Enterprises - The financial performance of enterprises within the electronic components industry has improved, with revenue and profit growth reported, although operating cash flow has decreased [22][27]. - The average revenue growth for sample enterprises in the electronic components sector was 27.14% year-on-year, with significant contributions from AI-related demands [27][28]. - The debt scale of sample enterprises increased, but the overall financial leverage remains low, indicating good debt repayment capabilities [34][35].

Investment Rating - The report maintains a "Recommended" rating for Pengding Holdings (002938) with a target PE of 30x for 2025E and 24x for 2026E, while other companies like Shenghong Technology (300476) and Shengyi Technology (600183) do not have a specific rating [3]. Core Insights - North American cloud vendors are experiencing a significant increase in capital expenditures, driven by AI demand, with total capital expenditures projected to rise from approximately $160 billion to about $450 billion from 2023 to 2025, indicating a strong alignment between capital expenditure growth and AI computing demand [9][25]. - The NPO (Near-Photonics Optics) and CPO (Co-Packaged Optics) technologies are gaining traction in the industry, providing substantial growth opportunities for domestic optical communication companies [31][46]. - The report emphasizes the importance of scalable optical modules in future cloud infrastructure, with NPO currently favored by domestic cloud vendors due to its advantages in interconnect density and cost [34][36]. Summary by Sections North American Cloud Vendors' Financial Performance - Microsoft reported Q4 FY26 revenue of $81.273 billion, a year-over-year increase of 16.72%, with a net profit of $38.458 billion, up 59.52% [12]. - Google achieved Q4 FY25 revenue of $113.828 billion, a 17.99% increase year-over-year, with a net profit of $34.455 billion, up 29.84% [16]. - Amazon's Q4 FY25 revenue reached $213.386 billion, a 13.62% increase year-over-year, with a net profit of $2.1192 billion, up 5.93% [20]. - Meta's Q4 FY25 revenue was $59.893 billion, a 23.78% increase year-over-year, with a net profit of $22.768 billion, up 9.26% [21]. Capital Expenditure Outlook for 2026 - Google is expected to have a capital expenditure of $175-185 billion in 2026, representing a year-over-year increase of 97% [25]. - Meta's capital expenditure is projected to be in the range of $115-135 billion for 2026, indicating a 77% increase year-over-year [27]. - Amazon's capital expenditure for 2026 is estimated at around $200 billion, a 50% increase from previous estimates [20]. NPO and CPO Technology Developments - NPO technology is gaining popularity among cloud vendors due to its high interconnect density and cost-effectiveness, making it suitable for distributed scale-up networks [34][36]. - CPO technology, which integrates optical engines and switching chips, is being actively promoted by NVIDIA and is expected to replace traditional pluggable optical modules in the future [37][42]. - The report highlights the significant development space for domestic optical communication companies driven by the advancements in NPO and CPO technologies [31][46].