证券代码：002938 证券简称：鹏鼎控股 公告编号：2026-004 鹏鼎控股（深圳）股份有限公司 关于开展以套期保值为目的金融衍生品业务的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 重要内容提示： （一）交易品种及目的：鹏鼎控股（深圳）股份有限公司（以下简称"鹏鼎 控股"、"公司"）拟开展金融衍生品交易的主要业务品种包括远期外汇合约、外 汇掉期交易及利率互换等金融衍生品，及基于以上金融衍生品之结构性商品等。 金融衍生品的基础资产主要为汇率、利率。公司不进行单纯以投机和套利为目的 的金融衍生品交易，仅限于实需背景之下，从事与经营活动有关的汇率及利率相 关金融衍生品的交易，以规避汇率及利率波动对经营活动产生的影响。 （二）交易金额：具体额度为于 2026 年任意时点总额不超过人民币十亿元 (含等值外币金额)，预计动用的交易保证金和权利金不超过交易方金融机构提供 的授信额度且不超过人民币十亿元(含等值外币金额)，该额度在 2026 年内可循 环使用。 （三）交易方式：公司拟开展金融衍生品交易的主要业务品种包括远期外汇 合约、外汇掉期交易及利率互换等金融 ...

证券代码：002938 证券简称：鹏鼎控股 公告编号：2026-005 鹏鼎控股（深圳）股份有限公司 关于申请银行授信额度的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、申请综合授信额度的基本情况 根据业务发展的需要，公司全资/控股子公司向以下银行申请授信额度: 金额单位:万元 | 项次 | 授信银行名称 | 往来法人 | | 授信额度 | 备注 | | --- | --- | --- | --- | --- | --- | | | | | 币别 | 金额 | | | 1 | 招商银行股份有限公司 深圳分行 | 奎盛科技(深圳)有限公司 | CNY | 3,000 | 续约 | | 2 | 中国工商银行股份有限公司 秦皇岛经济技术开发区支行 | 宏启胜精密电子(秦皇岛)有限公 司 | CNY | 53,000 | 增额 | | 3 | 中国农业银行股份有限公司 秦皇岛开发区支行 | 宏启胜精密电子(秦皇岛)有限公 司 | CNY | 42,000 | 续约 | | 4 | 中国银行股份有限公司 淮安开发区支行 | 庆鼎精密电子(淮安)有限公司 | ...

鹏鼎控股（深圳）股份有限公司 金融衍生品交易可行性报告 一、开展金融衍生品交易业务的目的 三、拟开展的金融衍生品交易业务计划 根据公司《金融衍生品交易管理制度》，结合相关法律、法 规规定和公司实际经营需要，公司及下属子公司本年计划开展于 任意时点总额不超过人民币十亿元(含等值外币金额)的金融衍 生品业务，可循环使用。 公司及下属子公司操作经核准的金融衍生品业务，仅得依实 际营运活动所产生之风险资产或负债为范围开展，并严格依照公 司《金融衍生品交易管理制度》及相关作业办法管理及内控程序 执行。 四、金融衍生品会计核算原则 公司根据《企业会计准则第22号-金融工具确认和计量》、 《企业会计准则第24号-套期保值》、《企业会计准则第37号- 金融工具列报》相关规定及其指南，对拟开展的金融衍生品交易 业务进行相应的核算处理，反映资产负债表及损益表相关项目。 五、金融衍生品投资的风险分析 由于本集团主要客户及供应商均为境外企业，公司出口商品、 进口原材料主要使用外币结算，加上公司营运据点分布于境内外， 导致公司持续持有较大数额的外币资产和外币负债。随着生产、 销售规模的扩大，以及境外营运活动的增加，公司受到汇率及利 率 ...

证券代码：002938 证券简称：鹏鼎控股 公告编号：2026-003 鹏鼎控股（深圳）股份有限公司（以下简称"公司"、"本公司"）为规范经 营行为，保护公司及股东的合法权益，根据相关法律法规的规定，于2026年1月 21日召开第三届董事会第二十三次会议，会议以7票同意，0票弃权，0票反对的 表决结果（关联董事沈庆芳、游哲宏回避表决）审议通过了《关于预计公司2026 年度日常关联交易的议案》：公司2026年与关联方鸿海精密工业股份有限公司（以 下简称"鸿海集团"）及其控股子公司预计发生日常关联交易人民币318,000万元， 2025年公司与其日常关联交易实际发生额为人民币347,911万元；与关联方臻鼎 科技控股股份有限公司（以下简称"臻鼎控股"）及其除本公司以外的其他控股 子公司预计发生日常关联交易人民币102,000万元，2025年公司与其日常关联交 易实际发生额为人民币44,135万元；与关联方业成控股股份有限公司（以下简称 "业成控股"）及其控股子公司预计发生日常关联交易人民币151,000万元，2025 年公司与其日常关联交易实际发生额为人民币49,237万元。 以上《关于预计公司2026年度日常关 ...

鹏鼎控股（深圳）股份有限公司 第三届董事会第二十三次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、董事会会议召开情况 鹏鼎控股（深圳）股份有限公司（以下简称"本公司"或"公司"）第三届董事 会第二十三次会议于 2026 年 1 月 21 日以通讯方式召开，相关会议通知及会议资 料已于 2026 年 1 月 16 日以电子邮件方式向公司全体董事发出，本次董事会会议 应出席董事 9 人，实际出席董事 9 人，会议由董事长沈庆芳主持。本次董事会的 召开符合《中华人民共和国公司法》（以下简称"《公司法》"）和《鹏鼎控股（深 圳）股份有限公司章程》（以下简称"《公司章程》"）的相关规定。 二、董事会会议审议情况 本次会议经过充分讨论，经董事以记名投票方式表决，作出如下决议： 证券代码：002938 证券简称：鹏鼎控股 公告编号：2026-002 1、审议通过《关于预计公司 2026 年度日常关联交易的议案》 表决结果：7 票赞成，0 票反对，0 票弃权，董事长沈庆芳为公司关联方臻 鼎科技控股股份有限公司董事长、董事游哲宏在公司关联方鸿海精密工业股份有 ...

Core Viewpoint - The company has approved several proposals during the 23rd meeting of the third board of directors, including anticipated related party transactions for 2026, which will be submitted for shareholder approval due to the recusal of certain directors [1] Group 1: Proposals Approved - The proposal regarding expected related party transactions for the year 2026 was approved with 7 votes in favor, requiring further shareholder meeting approval due to the recusal of Chairman Shen Qingfang and others [1] - The proposals for applying for financial derivatives trading limits and bank credit limits were both approved with 9 votes in favor [1] Group 2: Loan Approvals - The company and its subsidiaries have agreed to provide loan limits to its controlling subsidiaries, with the company providing 303 million yuan, Hongqi Sheng Precision providing 100 million yuan, and Pengding International providing 40 million USD [1] - The loan period is set from January 1, 2026, to December 31, 2026, with interest rates not lower than the prevailing market rates [1]

Investment Rating - The report maintains an "Outperform" rating for the AI industry [1] Core Insights - The capital expenditure (Capex) guidance from major overseas companies is optimistic, with a continuous upward trend in computing power expected through 2026. The total Capex for Microsoft, Google, Amazon, and Meta is projected to reach $406.5 billion in 2025 and $596.4 billion in 2026, representing year-on-year growth of 46% and 47% respectively [3][5][22] - The demand for AI-related infrastructure is driving significant upgrades in interconnects, cooling, and power supply sectors, indicating a long-term growth cycle distinct from previous technology cycles [3][4] Summary by Sections 1. Overseas Major Companies' Capex Guidance - Major companies like Microsoft, Google, Amazon, and Meta are expected to increase their Capex significantly, with projections of $186.4 billion, $139.5 billion, $162.5 billion, and $108 billion respectively for 2026 [6][7][14][18][21] - The overall Capex for these four companies is expected to account for 62% of the global AI-related Capex, which is projected to reach $960 billion by 2026 [22][23] 2. Interconnect Sector: Optical Modules and PCBs - The interconnect sector is experiencing a fundamental shift in demand due to AI server cluster construction, leading to simultaneous upgrades in computing boards, switches, and optical modules, which will increase both demand and pricing [3][4] - The deployment of 800G technology is expected to accelerate, with 1.6T technology entering the introduction phase [3] 3. Cooling Sector: Liquid Cooling Demand - The power density of AI GPU racks is projected to rise from 130 kW in 2024 to over 1 MW by 2029, making liquid cooling technology essential [3][4] 4. Power Supply Sector: AIDC Power Distribution Evolution - The evolution of AIDC power distribution methods is crucial, with a focus on HVDC and SST technologies to enhance system efficiency and reduce energy losses [3][4] 5. Investment Recommendations - The report suggests focusing on specific companies within various sectors: - Computing power: Haiguang Information - Interconnects - Optical modules: LightSpeed Technology, Huagong Technology - Interconnects - PCBs: Shenghong Technology, Shennan Circuits, and others - Cooling: Invec - Power supply: Magpow [3][4]

Summary of Conference Call Notes Industry Overview: PCB Equipment Key Points - **Expansion Plans**: - Pengding plans to invest 4.3 billion yuan in expansion, focusing on HDI and HLC products aimed at AI servers, AI edge devices, and low-orbit satellites. The project is expected to be completed by the end of 2026, with PCB equipment orders anticipated to materialize within the same year [1][1][1] - **Technological Advancements**: - Huadian Co. is investing in a high-density optoelectronic integrated circuit board project in Jintan District, Changzhou, with a total investment of 300 million USD (phased into two parts). This initiative aims to establish platforms for cutting-edge technologies like CoWoP and advanced processes such as mSAP, focusing on next-generation technology directions like copper-light integration [1][1][1] Market Dynamics - **Accelerated Expansion and Technological Iteration**: - Leading PCB manufacturers are rapidly expanding, particularly in the AI PCB sector. Equipment manufacturers are expected to benefit significantly from this expansion wave, while material suppliers may see improvements in product structure due to the increasing layers in AI PCBs [2][2][2] - **High-End PCB Upgrades**: - Continuous advancements in chip technology are driving the upgrade of PCBs towards high-end applications, characterized by smaller aperture sizes and narrower line widths. Advanced packaging processes like CoWoP and micro-aperture/line-width processing techniques such as mSAP are expected to propel the development of high-end equipment, leading to increased demand for high-resolution LDI equipment and ultra-fast laser drilling [2][2][2] Investment Recommendations - **Focus Areas**: - It is recommended to pay attention to companies involved in the PCB drilling segment, such as Dazhu CNC, Zhongtung High-tech, and Dingtai High-tech, as well as those in the LDI segment like Chip Quik [2][2][2] Risk Factors - **Potential Risks**: - Macro-economic risks and the possibility of technology development falling short of expectations are highlighted as significant risk factors [2][2][2]

Group 1 - The core point of the article is that as of September 30, 2025, the total number of shareholders for Pengding Holdings is projected to be 75,458 [2]

Core Viewpoint - Pengding Holdings has consistently served international leading brand clients since its establishment, showcasing strong management capabilities, robust R&D strength, and efficient order response abilities [2] Group 1 - The company emphasizes its ability to ensure timely mass production and delivery of high-quality products and services to clients [2] - Pengding Holdings is actively engaging with international brand clients for product development and technological layout over the next 1 to 2 years [2] - The company is conducting research on new material applications, new process technology breakthroughs, new product quality verification, and smart manufacturing line construction as part of its technological reserves [2] Group 2 - The focus is on five main areas: new products, new technologies, new processes, new materials, and new equipment [2] - The company aims to concentrate on key common technologies and cutting-edge product technologies to stay ahead of product development trends [2]