格隆汇8月1日丨中石科技(300684.SZ)公布，截至2025年7月31日，公司通过回购专用证券账户以集中竞 价交易方式回购公司股份461,500股，占公司目前总股本的0.15%，最高成交价为21.93元/股，最低成交 价为21.15元/股，成交总金额为996.4023万元(不含交易费用)。 ...

证券代码：300684 证券简称：中石科技 公告编号：2025-047 北京中石伟业科技股份有限公司（以下简称"公司"或"中石科技"）于 2025 年 4 月 14 日召开了第五届董事会第二次会议以及第五届监事会第二次会议，审 议并通过了《关于回购公司股份方案的议案》，同意公司使用自有资金以集中竞 价交易的方式回购公司部分股份，用于实施股权激励或员工持股计划。本次回购 股份的资金总额不低于人民币1,500万元（含），且不超过人民币3,000万元（含）， 回购股份的价格不超过 30.00 元/股；回购期限自公司董事会审议通过本次回购股 份方案之日起 12 个月内。具体内容详见公司分别于 2025 年 4 月 14 日、2025 年 4 月 15 日在巨潮资讯网（www.cninfo.com.cn）披露的《关于回购公司股份方案 的公告》（公告编号：2025-009）和《回购报告书》（编号：2025-010）。 因实施 2024 年年度权益分派，公司本次回购股份价格上限由不超过人民币 30.00 元/股（含）调整为不超过人民币 29.35 元/股（含）。具体内容详见公司于 2025 年 5 月 21 日在巨潮资讯网 ...

Core Viewpoint - The article emphasizes the critical role of thermal management in the performance and reliability of electronic devices, driven by increasing power density due to advancements in technologies like 5G, AI, and IoT. Effective heat dissipation solutions are essential to prevent device failures and ensure optimal operation [7][10][15]. Group 1: Thermal Density and Management - The rise in power density of electronic components necessitates advanced thermal management solutions, as temperature increases can significantly reduce system reliability [7][10]. - The failure rate of electronic components increases exponentially with temperature, with a 50% reduction in reliability for every 10°C increase [7][8]. - The thermal flow density has surged from under 10W/cm² to nearly 100W/cm², driven by both increased power and reduced chip sizes [11][15]. Group 2: Passive Cooling Solutions - Passive cooling methods, which do not use active components, include materials like metal heat sinks, graphite films, and heat pipes, relying on thermal interface materials (TIMs) to transfer heat away from components [23][26]. - Metal heat sinks are effective for low-power devices but face limitations in high-power applications due to their thermal transfer rates [28][31]. - Graphite films have been widely adopted in consumer electronics for their high thermal conductivity in the X-Y plane, although their Z-axis conductivity is limited [32][33]. Group 3: Active Cooling Solutions - Active cooling methods, such as forced air cooling and liquid cooling, are becoming necessary as device power levels increase beyond the capabilities of passive systems [68][69]. - Liquid cooling systems can achieve heat dissipation rates of 10-1000W/cm², significantly outperforming air cooling methods [73][74]. - Data centers are increasingly adopting liquid cooling solutions to manage the rising power density of servers, with some configurations exceeding 30kW per cabinet [80][81]. Group 4: Market Opportunities and Beneficiaries - Companies involved in the development of advanced thermal management solutions, such as VC (vapor chamber) technology and liquid cooling systems, are positioned to benefit from the growing demand for efficient heat dissipation in high-performance electronics [49][54]. - Key players in the market include companies like Feirongda, Suzhou Tianmai, and others that are innovating in thermal management technologies [5][6].

证券之星消息，7月31日电子化学品板块较上一交易日下跌1.53%，容大感光领跌。当日上证指数报收 于3573.21，下跌1.18%。深证成指报收于11009.77，下跌1.73%。电子化学品板块个股涨跌见下表： 以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。 从资金流向上来看，当日电子化学品板块主力资金净流出7.95亿元，游资资金净流出5670.95万元，散户 资金净流入8.51亿元。电子化学品板块个股资金流向见下表： | 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | --- | --- | --- | --- | --- | --- | | 301489 | 思泉新材 | 103.66 | 20.00% | 6.63万 | 6.67亿 | | 688603 | 天承科技 | 65.26 | 1.97% | 9.80万 | 6.59亿 | | 301630 | 同宇新材 | 175.37 | 0.91% | 3.21万 | 5.72亿 | | 002741 | 光华科技 | 19.80 | 0.6 ...

Core Viewpoint - The company, Zhongshi Technology, confirmed its products are utilized in the consumer electronics sector, including applications in Huawei smartphones, and serves major global clients in the industry [2]. Group 1: Company Products - The main products offered by the company in the consumer electronics industry include high thermal conductivity graphite products, thermal interface materials, heat pipes, heat spreaders, thermal modules, EMI shielding materials, adhesive materials, and sealing materials [2]. - These products are applied in various devices such as smartphones, tablets, laptops, smart wearable devices, and smart home devices [2]. Group 2: Clientele - The company has achieved comprehensive coverage of leading clients in the 3C industry, providing long-term services to major North American clients, including Samsung, Microsoft, Google, Amazon, Honor, DJI, and others [2].

Investment Rating - The report maintains an "Outperform" rating for the heat management industry, driven by the slowdown of Moore's Law and the rise of edge AI applications [1]. Core Insights - The heat management industry is undergoing significant upgrades due to the deceleration of Moore's Law and the explosive growth in cloud computing power demands, leading to increased pressure on thermal management solutions for edge AI applications [1][2]. - Passive cooling methods are nearing their physical limits, prompting a shift towards active cooling technologies in mobile devices [3][4]. Summary by Sections 1. Moore's Law Slowdown and Edge AI Iteration - The growth rate of transistor density has significantly slowed, with the compound annual growth rate (CAGR) dropping to single digits for processes below 5nm, indicating the gradual failure of Moore's Law [19][20]. - As performance demands increase, the power consumption per unit area of chips is rising, necessitating enhanced thermal management solutions [24][25]. - The limitations of passive cooling methods are becoming evident, as the area of vapor chambers (VC) is increasing while material iterations are slowing down [43][44]. 2. Transition to Active Cooling Technologies - The industry is expected to enter an active cooling era, with technologies like micro-pump liquid cooling and micro fans becoming more prevalent [3][4]. - By 2030, it is projected that the penetration rate of active cooling in smartphones will reach 30%, with a market size of approximately 20 billion yuan [3][4][75]. 3. Investment Highlights and Beneficiary Segments - Active cooling technologies are anticipated to unlock the full potential of edge AI applications, with significant benefits for companies involved in the thermal management supply chain [4][4]. - Key players in the thermal management module sector include Feirongda, Suzhou Tianmai, and Zhongshi Technology, while chip-related companies include Aiwei Electronics and Nanchip Technology [4][4].

格隆汇7月30日丨中石科技(300684.SZ)在互动平台表示，公司热管理解决方案产品包括高导热石墨产 品、导热界面材料、热管、均热板、热模组等，广泛应用于消费电子（智能手机、平板电脑、笔记本电 脑、智能穿戴设备、智能家居设备等）、数字基建（通信基站、服务器、光通信模块等）、智能交通、 清洁能源等行业的电子设备。公司主要产品具有普适性，可应用于AI眼镜领域。 ...

Group 1 - The company responded to an investor inquiry regarding the applicability of its thermal management products in AI glasses, indicating that its products are versatile and can be used in this field [2] - The company's thermal management solutions include high thermal conductivity graphite products, thermal interface materials, heat pipes, heat spreaders, and thermal modules [2] - These products are widely used in various industries, including consumer electronics, digital infrastructure, smart transportation, and clean energy [2] Group 2 - The company's main products are applicable to electronic devices in sectors such as smartphones, tablets, laptops, smart wearable devices, and smart home equipment [2] - The company highlighted that its solutions are suitable for digital infrastructure applications like communication base stations, servers, and optical communication modules [2]

Core Viewpoint - The company provides a range of thermal management and EMI shielding materials for the consumer electronics industry, serving major global clients including Huawei, Samsung, Microsoft, Google, Amazon, and others [1] Group 1: Product Offerings - The company offers high thermal conductivity graphite products, thermal interface materials, heat pipes, heat spreaders, thermal modules, EMI shielding materials, adhesives, and sealing materials [1] - These products are utilized in various devices such as smartphones, tablets, laptops, smart wearables, and smart home devices [1] Group 2: Client Base - The company has achieved comprehensive coverage of leading clients in the 3C (computer, communication, consumer electronics) industry [1] - It has long-term service relationships with major North American clients and other international consumer electronics companies [1]

Group 1 - The core viewpoint of the news highlights the significant performance of Zhongshi Technology (300684), with a stock price increase of 11.18% to 30.33 yuan as of July 29, 2025, and a trading volume of 362,100 hands, amounting to 1.059 billion yuan [1] - The company reported a total operating revenue of 349 million yuan for Q1 2025, reflecting a year-on-year growth of 16.41%, and a net profit attributable to shareholders of 61.73 million yuan, which is a remarkable increase of 105.70% [1] - The company's financial ratios indicate a strong liquidity position, with a current ratio of 5.384 and a quick ratio of 4.898, alongside a low debt-to-asset ratio of 13.91% [1] Group 2 - Zhongshi Technology has made investments in 11 companies and participated in 27 bidding projects, showcasing its active engagement in the market [2] - The company holds a total of 10 trademark registrations and 149 patents, indicating a strong focus on intellectual property [2] - Additionally, Zhongshi Technology possesses 7 administrative licenses, further demonstrating its operational capabilities [2]