Investment Rating - The report maintains a "Strong Buy" investment rating for the company [2][6]. Core Views - The company's Q4 2025 performance met expectations, with revenue of approximately 54.33 billion yuan, a year-on-year increase of 25.45%, and a net profit of approximately 11.05 billion yuan, a year-on-year increase of 49.52% [6]. - The company is expected to benefit from the accelerating demand for high-performance computing servers and artificial intelligence, which will drive structural demand for printed circuit boards [6]. - The company is accelerating its capacity expansion and global strategy, which is anticipated to sustain high growth in performance [6]. - Significant investments in cutting-edge technologies such as CoWoP and mSAP are expected to enhance the company's high-end product capacity and optimize product structure, thereby improving overall profitability and risk resistance [6]. - The report forecasts revenue for 2025-2027 to be 189.5 billion, 265.2 billion, and 371.3 billion yuan, with corresponding net profits of 38.2 billion, 58.5 billion, and 85.2 billion yuan, respectively [6]. Financial Data and Valuation - Total revenue for 2023 is projected at 89.38 billion yuan, with a year-on-year growth of 7%, and is expected to reach 133.42 billion yuan in 2024, a growth of 49% [12]. - The company's net profit for 2023 is estimated at 15.13 billion yuan, with a year-on-year growth of 11%, and is projected to grow to 25.87 billion yuan in 2024, a growth of 71% [12]. - The earnings per share (EPS) is expected to increase from 0.79 yuan in 2023 to 1.34 yuan in 2024, and further to 1.99 yuan in 2025 [13]. - The price-to-earnings (PE) ratio is projected to decrease from 88.5 in 2023 to 35.0 in 2025, indicating an improving valuation [13].

Group 1: Infrastructure Investment - Major projects have been signed and construction has accelerated, focusing on infrastructure and high-end manufacturing, with traditional infrastructure steadily advancing while emerging industries become investment focal points [1] - China Railway announced winning bids for 8 railway projects, 3 highway projects, and 1 municipal project, with a total bid amount of approximately 43.292 billion yuan [2] - The National Development and Reform Commission has issued a list of early construction projects for 2026, totaling about 295 billion yuan, indicating strong policy support for infrastructure development [2] Group 2: Emerging Industries Investment - Emerging industries and future industries have seen a significant increase in project investment this year, driven by policy guidance and market demand [3] - In the integrated circuit sector, Shanghai Electric announced a project for high-density optical integrated circuit boards, expected to add an annual production capacity of 1.3 million pieces [3] - In the new materials sector, Baihehua plans to invest up to 100 million yuan in a project for 1,000 tons of PEEK materials, while Huafeng Chemical aims to invest 3.6 billion yuan in expanding production of low-carbon, intelligent spandex materials [3] Group 3: Investment Growth Outlook - Investment growth is expected to rebound as local governments focus on key areas and weak links to expand effective investment [4] - The 2026 early construction project list includes approximately 220 billion yuan for "two heavy" construction projects, a significant increase from 100 billion yuan in 2025 [4] - Manufacturing investment is projected to achieve a 4% overall growth in 2026, supported by new policy financial tools and a focus on high-tech industries [4][5]

Group 1: Infrastructure Investment - Major projects are being signed and accelerated in infrastructure and high-end manufacturing, with traditional infrastructure steadily advancing and emerging industries becoming investment focal points [1] - China Railway announced winning bids for 8 railway projects, 3 highway projects, and 1 municipal project, with a total bid amount of approximately 43.292 billion yuan [1] - The National Development and Reform Commission has organized the early batch of "two heavy" construction project lists and central budget investment plans for 2026, totaling approximately 295 billion yuan [1] Group 2: Emerging Industries Investment - Emerging industries are becoming the focus of project investments, with a significant increase in the proportion of emerging industry projects among major projects launched this year [2] - In the integrated circuit sector, Huadian Co. announced a project for high-density optical integrated circuit boards, expected to add an annual production capacity of 1.3 million pieces [2] - In the new materials sector, Baihehua plans to invest up to 100 million yuan in a project for an annual production of 1,000 tons of polyether ether ketone (PEEK) materials [2] Group 3: Investment Growth Outlook - Investment growth is expected to rebound as various regions focus on key areas and weak links to expand effective investment [3] - The support for infrastructure investment has significantly increased, with the early batch of "two heavy" construction projects for 2026 arranged at approximately 220 billion yuan, a notable increase from 100 billion yuan in 2025 [3] - Manufacturing investment is projected to achieve an overall growth of 4% in 2026, driven by policy support, technological innovation, and domestic and international demand [4]

Core Viewpoint - Huadian Co., Ltd. has experienced a decline in stock price and significant net outflow of funds, indicating potential challenges in the market despite strong revenue growth in recent financial reports [1][2]. Group 1: Stock Performance - On February 3, Huadian's stock price fell by 2.01% to 67.68 CNY per share, with a trading volume of 1.8 billion CNY and a turnover rate of 1.35%, resulting in a total market capitalization of 130.24 billion CNY [1]. - Year-to-date, Huadian's stock has decreased by 7.38%, with a 5-day decline of 5.46%, a 20-day decline of 8.17%, and a 60-day decline of 2.53% [1]. Group 2: Financial Performance - For the period from January to September 2025, Huadian reported a revenue of 13.512 billion CNY, representing a year-on-year growth of 49.96%, and a net profit attributable to shareholders of 2.718 billion CNY, up 47.03% year-on-year [2]. - Since its A-share listing, Huadian has distributed a total of 4.112 billion CNY in dividends, with 2.204 billion CNY distributed over the past three years [3]. Group 3: Shareholder Structure - As of September 30, 2025, Huadian had 162,000 shareholders, an increase of 26.43% from the previous period, with an average of 11,866 circulating shares per shareholder, down 20.88% [2]. - Among the top ten circulating shareholders, Hong Kong Central Clearing Limited holds 141 million shares, an increase of 17.244 million shares, while Huatai-PB CSI 300 ETF and E Fund SSE 50 Enhanced A have seen changes in their holdings [3].

Global Research ab 30 January 2026 HOLT APAC Selectively positioning after Taiwan PCB/ substrates' strong YTD performance Taiwan PCB/substrate stocks among the best-performing stocks this year Taiwan PCB/substrate stocks have risen by nearly 36% since the start of the year, outperforming other regional peers. Industry dynamics for PCB/substrates continue to be supportive, driven by increasing demand for IC substrates utilized in memory chips, graphic cards, and particularly AI chips deployed in AI servers ( ...

Memory - South Korea's core technology product exports showed a positive trend in January 2026, with memory exports increasing by 154% year-on-year, driven by price hikes and strong server-related demand [3] - Samsung and SK Hynix are expected to see significant revenue growth in Q1 2026, with projections of 178% and 233% year-on-year increases, respectively [3] - NAND chip exports surged by 366%, indicating robust demand in the memory sector [3] Autonomous Driving/Physical AI - Google's Project Genie, powered by Genie 3, aims to create interactive worlds through user-generated content, marking a significant step towards AGI [5][6] - Waymo plans to raise approximately $16 billion, with a target valuation of nearly $110 billion, highlighting the increasing investment interest in autonomous driving technology [6][7] Robotics - Tesla's Optimus robot is set for a key release in Q1 2026, with significant upgrades aimed at mass production [8][9] - Yushin Robotics anticipates delivering around 55,000 robots in 2025, with nearly 50% of orders coming from overseas markets [10][11] AI Computing Power - NVIDIA's CEO clarified that the company's planned investment in OpenAI will be gradual, not reaching the previously mentioned $100 billion [14] - Oracle aims to raise $45-50 billion to expand its cloud infrastructure, driven by demand from major clients like AMD and Meta [14] AI Applications - Tencent is increasing its investment in AI, with its app Yuanbao leveraging community marketing strategies to enhance user engagement and market penetration [37] - The global PCB market is expected to double in size by 2026-2027, driven by the demand for AI servers and high-performance materials [38] Liquid Cooling - Fositek's revenue is projected to grow at a CAGR of 46% from 2025 to 2028, driven by advancements in liquid cooling technology [26][27] - The liquid cooling segment is expected to exceed 50% of revenue by 2026, indicating a strong market trend towards efficient cooling solutions [29] PCB - The global PCB market is experiencing robust growth, with a significant increase in demand driven by AI services and high-performance computing [30][31] - Companies like WUS and Zhen Ding Technology are positioned to benefit from the ongoing upgrade cycle in AI infrastructure [34][35]

行 业 华福证券 电子 2026 年 02 月 02 日 行 业 投 资 策 略 截止到 2025Q3，三星 25Q1-Q3 全球智能手机出货量达到 6060 万 台，市场份额达 19%，保持全球第一；苹果 25Q3 出货量为 5650 万台， 同比上升 4%，市场份额位列第二；其次为小米/传音/vivo。据环球网 援引IDC 报告显示 2025年全球智能手机出货量预计将达到 12.4 亿部， 2024-2029 年 CAGR=1.5%，呈现温和增长。展望 2026 年，我们持续看 好手机结构化升级带来的创新需求，包括潜望式镜头成为安卓/苹果高 端手机标配带来渗透率持续提升。 研 究 电子行业 2026 年度策略报告：AI 与自主可控共 振 投资要点： 预计 2026 年手机行业温和复苏，看好结构创新带来增量需求 证 券 研 随着国产算力需求的不断增加，先进制程的产能需求也不断提升。 中芯国际、华虹公司、长鑫存储等企业的先进制程制造产能预计不断 增加。成熟制程工艺各个制造商各有千秋，特色工艺投资机会显现。 芯联集成、晶合集成、赛微电子各自特色领域优势显著。内生增长以 及外延并购提升半导体设备覆盖率。半导体制造 ...

转自：中国证券报·中证网 中证报中证网讯（记者 齐金钊）日前，民爆光电公告，公司拟现金收购厦芝精密51%股权，同时拟通 过发行股份的方式向厦门麦达购买厦芝精密49%股权并募集配套资金。 据悉，厦芝精密战略定位于高端PCB钻针市场，凭借持续的工艺创新与稳定的产品质量，赢得全球知名 PCB制造商认可。合作客户涵盖深南电路、奥特斯（AT&S）、胜宏科技、华通电脑、健鼎科技、沪电 股份、景旺电子、日本名幸电子等国内外龙头企业，客户粘性强。作为业内少数能实现AI服务器板用 钻针、高端载板极小径钻针批量稳定供应的厂商，已跻身核心客户供应链并开展联合开发，深度绑定高 景气赛道需求。 业内人士表示，PCB行业实行严格的"合格供应商认证制度"，需通过管理体系、质量控制、现场审核等 多维度考核，合作一旦建立便形成长期稳定粘性。厦芝精密是国内少数具备50倍径钻针量产能力的企 业，率先切入AI服务器板钻针领域，与胜宏科技、深南电路、景旺电子等头部客户建立稳定合作，先 发优势显著，技术与客户壁垒难以被竞争对手突破。 PCB钻针作为印制电路板制造的核心耗材，其市场需求与电子产业技术迭代深度绑定。随着AI服务器、 5G通讯、汽车电子等高端 ...

Group 1 - Company plans to invest 1.82 billion yuan in high-end printed circuit board (PCB) project, aiming to enhance product structure and core competitiveness to meet the growing demand in emerging sectors [1][2] - The project will focus on the production capacity of high-layer boards and HDI boards, targeting an annual output of 840,000 square meters, which are essential for applications in AI infrastructure, smart electric vehicles, and other emerging fields [1][2] - The investment is expected to address the capacity shortfall in high-end PCB products, increasing the proportion of high-value-added products and reducing reliance on mid-to-low-end products [2] Group 2 - The PCB industry is experiencing a "low-end surplus, high-end shortage" situation, driven by rapid growth in AI, new energy vehicles, and 5G/6G sectors, presenting significant development opportunities [2] - The competitive landscape is increasingly polarized, with leading companies like Shenzhen South Circuit, Huadian Technology, and Shenghong Technology making technological breakthroughs in high-end PCBs, while smaller firms focus on mid-to-low-end markets [2] - The industry is accelerating its transition towards high-end, green, and intelligent manufacturing, where technological research and development capabilities and environmental standards are becoming key competitive advantages [2][3]

Summary of WUS (002463.SZ) Conference Call Company Overview - **Company**: WUS (002463.SZ) - **Industry**: Printed Circuit Board (PCB) manufacturing Key Points 1. Rising PCB Usage - Management emphasized the increasing use of PCBs in AI server racks for connecting AI chips, highlighting three connection methods: copper cable, optical module/fiber, and PCB - PCB is seen as a reliable integration method that offers better durability under high temperatures and saves space, which can be utilized for liquid cooling and thermal management - The demand for high-speed connections driven by AI is leading to specification upgrades in PCB, including better materials, higher layers, and increased density, which complicates design and manufacturing processes - WUS aims to optimize the cost-to-performance ratio to enhance mass production capabilities [2][3] 2. Strategy and Capacity Expansion - WUS is focusing on high-end PCBs rather than aggressively expanding capacity in mature technologies, having exited the consumer electronics market in 2007 - Capacity expansion in China will concentrate on the latest technology and high-layer PCBs, with trial production expected to start in Q3 2026 - The Thailand production site has passed client qualifications and is capable of producing 26-layer PCBs, with expectations of breakeven or profitability by 2026E [3][4] 3. New Technology in Expansion - The industry is exploring the use of PCBs to directly connect chips within AI server racks, which could reduce substrate usage and create a flatter system, thereby shortening connection paths - This innovation is part of WUS's strategy to enhance power consumption efficiency and improve the cost-to-performance ratio [4][7] 4. Financial Projections - WUS's net income is projected to grow at a 30% CAGR from 2026 to 2028E - Gross margin is expected to expand to 37% by 2028E, compared to 35% in 9M25A - The total addressable market (TAM) for global PCBs is anticipated to grow by 113% and 171% YoY in 2026 and 2027E, respectively, which is favorable for WUS's growth and product mix upgrade [1][2] 5. Valuation and Price Target - A 12-month price target of RMB 127 is set, based on a target P/E multiple of 26x 2027E EPS - The target P/E is derived from the correlation between P/E and EPS growth of WUS's peers [7][9] 6. Key Risks - Potential risks include slower-than-expected migration to high-end AI servers and high-speed switches, increased competition in the AI PCB market, and delays in new capacity expansion [8] Additional Information - Current market cap is RMB 134.2 billion ($19.3 billion) with a price of RMB 69.75, indicating an upside potential of 82.1% [9]