证 券 研 究 报 告 SK 海力士（000660.KS）FY2025Q4 业绩点评及业绩说明会纪要 HBM 构筑核心增长动能，25 年营收利润均破 纪录 ❖ 事项： 2026 年 1 月 29 日 SK 海力士发布 2025 年 Q4 季度报告，并召开业绩说明会。 公司财务季度 FY2025Q4 截至 2025 年 12 月 31 日，即自然季度 CQ2025Q4。 2025Q4，公司实现营收 32.8 万亿韩元，同比增长 66%，环比增长 34%；毛利 率为 69%，同比提升 17pct，环比提升 12pct。 ❖ 评论： 1. 业绩总览：25Q4 营收 32.8 万亿韩元（QoQ +34%，YoY +66%），创下季度 营收新高。毛利率为 69%（QoQ +12pct，YoY +17pct），主要得益于市场对 HBM 和传统服务器内存的需求大幅增长，致使 DRAM 和 NAND 价格的大幅上涨以 及 NAND 位出货量的增长。25Q4 实现净利润 15.2 万亿韩元（QoQ +21%，YoY +90%），净利率为 46%（QoQ -6pct，YoY +5pct）。 2. 终端市场：1）整体需求，DRAM ...

证 券 研 究 报 告 ASML（ASML）2025Q4 业绩点评及业绩说明会纪要 AI 驱动需求高增，积压在手订单达 388 亿欧元 会议地点：线上 ❖ 事项： 2026 年 1 月 28 日 ASML 发布 2025 年 Q4 季度报告，并召开业绩说明会。公 司财务季度 FY2025Q4 截至 2025 年 12 月 31 日，即自然季度 CQ2025Q4。 2025Q4，公司实现营收 97.18 亿欧元，同比增长 4.9%，环比增长 29.3%；毛利 率 52.2%，同比提升 0.5pct，环比提升 0.6pct。2025 全年，公司实现营业收入 326.67 亿欧元，同比增长 15.6%；全年毛利率为 52.8%；全年净利润为 96 亿 欧元。 ❖ 评论： 1. 业绩总览：1）25Q4，公司实现营业收入 97.18 亿欧元（QoQ+29.3%， YoY+4.9%），高于指引中值（指引范围 92-98 亿欧元）；季度毛利率 52.2% （QoQ+0.6pct，YoY+0.5pct），位于指引(51-53%)中位；季度净利润 28.4 亿欧 元，净利率 29.2%。2）2025 年，全年公司实现营业收入 ...

证券代码：002156 证券简称：通富微电 通富微电子股份有限公司投资者关系活动记录表 编号：2026-003 | 投资者关系活动 ☑ | 特定对象调研 □分析师会议 | | --- | --- | | 类别 | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 （请文字说明其他活动内容） | | 参与单位名称及 | 中大君悦：陈修能、曲芳；东吴证券：刘玥娇；彤源：麦世学； | | 人员姓名 | 农银汇理基金：张璋；华宝信托：张卿隆；太平养老：张凯；华 | | | 源电子：熊宇翔；弘毅远方：陈祥辉；源乐晟：吴雨哲；博衍基 | | | 金：卢湛 | | 时间 2026 | 年 1 月 29 日 | | 地点 | 公司会议室 | | 上市公司接待人 | 董事会秘书 蒋澍 | | 员姓名 | | | | 一、公司概况 | | | 通富微电是集成电路封装测试服务提供商，为全球客户提供 | | | 从设计仿真到封装测试的一站式服务。公司的产品、技术、服务 | | | 全方位覆盖了人工智能、高性能计算、大数据存储、显示驱动、 | | 5G | 等网络通讯、信息终端 ...

Investment Rating - The report maintains a "Buy" rating for the company, indicating a strong performance relative to the market [4][7]. Core Insights - The company has successfully delivered export orders for panel-level laser micro-hole equipment used in glass substrate semiconductor packaging, marking a significant step in the industrialization of TGV (Through-Glass Via) technology [1]. - The company has achieved breakthroughs in its non-photovoltaic business layout, which is expected to open up growth opportunities [7]. Financial Data and Profit Forecast - Total revenue projections for the company are as follows: - 2024: 2,014 million - 2025: 2,453 million - 2026: 2,745 million - 2027: 3,290 million - Year-on-year growth rates are projected at 25.2% for 2024, 21.8% for 2025, 11.9% for 2026, and 19.9% for 2027 [3][8]. - Net profit attributable to the parent company is forecasted as: - 2025: 6.69 billion - 2026: 7.35 billion - 2027: 8.88 billion - The company’s PE ratios are projected to be 34 for 2025, 31 for 2026, and 26 for 2027, which are below the average PE of comparable companies [7][8]. Market Data - As of January 27, 2026, the closing price of the company's stock is 83.47 yuan, with a market capitalization of 14,027 million yuan [4]. - The stock has a price-to-book ratio of 6.1 and a dividend yield of 0.47% [4].

Core Viewpoint - Advanced packaging is emerging as a new engine for computing power in the "post-Moore's Law" era, addressing the limitations of traditional chip performance improvements through innovative bonding technologies [4][5]. Group 1: Hybrid Bonding Overview - Hybrid bonding is an advanced packaging technology that combines dielectric bonding and metal interconnects, allowing for high-density, high-performance 3D integration [8][19]. - The development of hybrid bonding has evolved through various stages, from wire bonding to flip chip, and now to hybrid bonding, which enables ultra-fine pitch stacking and packaging [10][11]. - Hybrid bonding can be categorized into wafer-to-wafer (W2W) and chip-to-wafer (C2W) processes, with C2W offering higher flexibility and lower defect rates for smaller chips [14][16]. Group 2: Advantages and Challenges of Hybrid Bonding - The technology allows for extreme interconnect density and performance breakthroughs, achieving interconnect pitches below 1 μm, significantly enhancing data transfer bandwidth [23]. - Hybrid bonding is compatible with existing wafer-level manufacturing processes and can be integrated with TSV and micro-bump technologies, providing cost optimization potential [24]. - Challenges include yield issues, surface smoothness requirements, cleanliness standards, and complex testing processes that need to be addressed for successful mass production [26]. Group 3: Market Demand and Future Prospects - Major HBM manufacturers, including Samsung, Micron, and SK Hynix, have committed to adopting hybrid bonding technology for HBM5, which aims to meet the extreme demands of AI and high-performance computing [28]. - TSMC's SolC technology, which utilizes hybrid bonding, is expected to double its production by 2026, highlighting the growing adoption of this technology [29][30]. - The global market for hybrid bonding equipment is projected to exceed $600 million by 2030, with significant growth anticipated in the Asia-Pacific region [37]. Group 4: Competitive Landscape - The hybrid bonding equipment market is dominated by international players such as BESI, EV Group, and SUSS MicroTec, with BESI holding a market share of 67% in 2023 [44]. - The competitive landscape is evolving, with Chinese companies like Piotech entering the market, indicating advancements in domestic semiconductor equipment capabilities [42].

Investment Rating - The investment rating for the company is "Buy" (maintained) [2] Core Insights - The company has released a performance forecast for 2025, expecting revenue between 1.275 billion to 1.413 billion, representing a year-on-year growth of 40.87% to 56.11%. The net profit attributable to the parent company is projected to be between 489 million to 594 million, with a year-on-year increase of 46.42% to 77.86% [5] - The semiconductor equipment demand is expected to grow rapidly, driven by AI investments, with a forecasted total sales of semiconductor manufacturing equipment reaching 133 billion USD in 2025, a 13.7% increase [8] - The company is expected to achieve a breakthrough in orders for its new product STS8600, which targets AI and high-performance computing applications, in 2026 [8] - The profit forecast has been raised, with net profits for 2025-2027 expected to be 542 million, 727 million, and 927 million respectively, corresponding to PE ratios of 68X, 51X, and 40X [8] Financial Data and Profit Forecast - Total revenue is projected to grow from 905 million in 2024 to 2.119 billion in 2027, with year-on-year growth rates of 31.1%, 49.2%, 30.3%, and 20.4% respectively [7] - The net profit attributable to the parent company is expected to increase from 334 million in 2024 to 927 million in 2027, with corresponding growth rates of 32.7%, 62.4%, 34.0%, and 27.5% [7] - The gross profit margin is expected to remain stable around 74% over the forecast period [7]

Investment Rating - The report maintains a "Buy" rating for the company [2][7] Core Insights - The company is expected to achieve revenue of 4.2 to 4.6 billion yuan in 2025, representing a year-on-year increase of 16.37% to 27.45%, with a net profit attributable to the parent company of 75 to 100 million yuan, an increase of 13.08% to 50.77% [5] - The global semiconductor industry continues to grow, driven by demand in artificial intelligence, high-performance computing, and data center infrastructure [5] - The company is enhancing its advanced packaging capabilities, which are expected to improve delivery times and quality control for clients [5] - The company plans to invest up to 2.1 billion yuan in a new integrated circuit packaging and testing production base in Malaysia to deepen cooperation with overseas clients [6] Financial Projections - Revenue projections for 2025, 2026, and 2027 are 4.4 billion, 5.5 billion, and 7 billion yuan respectively, with net profits of 90.53 million, 273.14 million, and 453.60 million yuan [10][11] - The company anticipates a revenue growth rate of 22.68% in 2025 and 24.51% in 2026 [11] - The expected earnings per share (EPS) for 2025, 2026, and 2027 are 0.22 yuan, 0.67 yuan, and 1.11 yuan respectively [10][11]

Investment Rating - The report maintains a "Buy" rating for the company [2][7] Core Insights - The company is expected to achieve revenue of 4.2 to 4.6 billion yuan in 2025, representing a year-on-year increase of 16.37% to 27.45%, with a net profit attributable to the parent company of 75 to 100 million yuan, an increase of 13.08% to 50.77% year-on-year [5] - The global semiconductor industry continues to grow, driven by demand in artificial intelligence, high-performance computing, and data center infrastructure [5] - The company is enhancing its advanced packaging capabilities, which are expected to improve delivery times and quality control for clients [5] - The company plans to invest up to 2.1 billion yuan in a new integrated circuit packaging and testing production base in Malaysia to deepen cooperation with overseas clients [6] Financial Performance and Projections - The company is projected to achieve revenues of 4.4 billion yuan in 2025, 5.5 billion yuan in 2026, and 7 billion yuan in 2027, with net profits of 90.53 million yuan, 273.14 million yuan, and 453.60 million yuan respectively [10][11] - The expected growth rates for revenue are 22.68% in 2025, 24.51% in 2026, and 27.00% in 2027 [10] - The company's gross margin is projected to improve from 17.5% in 2025 to 19.9% in 2027, while the net profit margin is expected to rise from 2.0% to 6.5% over the same period [11]

| 调价背景：供需失衡与市场重构 行业分析指出，此次NAND闪存价格大幅上调的背后，是全球半导体市场在经历长期下行周期后的结构 性调整。此前，由于供过于求，NAND闪存价格连续多个季度处于低位，三星等头部厂商采取了减产措 施以应对市场压力。随着需求逐渐回暖，尤其是人工智能、高性能计算、智能手机升级等需求的拉动， 存储芯片市场供需格局发生显著变化。 报道透露，三星电子已于去年年底与主要客户完成了供应合同谈判，并在今年第一季度正式执行新的价 格体系。知情人士表示，三星正在与客户就第二季度的NAND价格展开新一轮谈判，市场普遍预期涨势 将持续。 | 连锁反应：从DRAM到NAND的全面涨价 此次NAND价格调整并非孤立事件。近期，DRAM内存价格也被曝出接近70%的涨幅，两大存储产品线 的同步调价，标志着存储市场已进入全面上涨通道。业内专家认为，随着数据中心建设加速、AI终端 设备普及以及消费电子需求回升，存储芯片作为关键元器件，其价格波动将对下游产业链产生广泛影 响。 据韩国媒体报道，三星电子已于2024年第一季度将NAND闪存供应价格上调超过100%，这一涨幅远超 市场预期，凸显了当前全球半导体市场严重的供需失 ...

Group 1 - The company, LianDong Technology (301369.SZ), forecasts a net profit attributable to shareholders of 31 million to 38 million yuan for the year 2025, representing a year-on-year growth of 52.68% to 87.16% [1][3] - The net profit after deducting non-recurring gains and losses is expected to be between 21.5 million and 28.5 million yuan, indicating a year-on-year increase of 46.99% to 94.85% [1][3] - The semiconductor industry is experiencing sustained growth, driven by demand from electric vehicles, renewable energy, AI, and high-performance computing, which is accelerating technological iterations and market expansion [1] Group 2 - The company is increasing its product research and development efforts and expanding its market presence, while also enhancing the technical and refined management of its sales team [1] - The company aims to deepen long-term cooperative relationships with customers, contributing to stable growth in operational performance during the reporting period [1]