"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 珠海硅芯科技有限公司 诚邀您莅临于2025年4月29日在浙江 · 宁波 （ 甬江实验室） 举办的 2025势银异质异构集成封装产业大会 公司介绍 珠海硅芯科技有限公司主要从事新一代2.5D/3D堆叠芯片EDA软件设计的研发及产业化。创始人团队从2008年开始研究2.5D/3D芯片设计方法，是世界最 早期研究设计方法的研究团队之一，并在堆叠芯片EDA后端布局、布线、可测试、可靠性等方面均有世界领先成果。 公司自主研发3Sheng Integration Platform，分为系统级架构设计、物理实现、Multi-die测试容错、分析仿真、多Chiplet集成验证五大中心，涵盖堆叠 芯片设计所需环节的全流程工具。目前，硅芯科技系列产品已通过先进封装产业验证，完成设计制造闭环，并打造首批客户案例，全方位助力 AI,GPU,CPU, ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 公司介绍 上海沉汇仪器有限公司在高端材料领域积累了资深经验，例如：Arf、Krf光刻胶、光刻胶树脂、光酸、引发剂、刻蚀剂、薄膜旋涂和测量等。 我们与韩国、日本、美国和国内资深研发工程师有亲密合作，因此可以提供实验室的全套设备。 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 上海沉汇仪器有限公司 诚邀您莅临于2025年4月29日在浙江 · 宁波 （ 甬江实验室） 举办的 2025势银异质异构集成封装产业大会 沉汇仪器的优势是公司每个工程师皆受原厂培训，所以对实验室仪器设备和工业检测设备安装、调试、维护和校正皆可独立进行，可为客户提供完善的专 业服务。 热烈欢迎大家莅临指导! 电话： 刘先生 - 17317376649 官网： www.chen-hui.com 地址：上海市闵行区中春路 6818弄318~320室 产品介绍 Lab Companion 30.0 < 1 -- ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 长川科技 董事、副总经理 钟锋浩 已 确认参 加 2025势银异质异构集成封装产业大会 ，并作为嘉宾进行主题为 《 Chiplet异构集成对测试技术 的挑战 》 的演讲。 钟锋浩， 长川科技董事、副总经理，高级工程师，专注集成电路测试装备研究开发近30 年，是集成电路测试装备领域一流资深技术专家，Chiplet测试标准编写组组长，全国集 成电路标准化技术委员会TC599专家成员。目前已申请集成电路测试技术相关专利79 项。 杭州长川科技股份有限公司 成立于2008年4月，是一家专注于集成电路封测装备研发、 生产和销售的高新技术企业，主要产品包括集成电路测试机、分选机、探针台、AOI设备 和自动化检测装备，客户包含了日月光、台积电、华天科技、长电科技、通富微电、矽 力杰等国内外一流集成电路企业。通过17年的技术积累和研发创新， ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 台湾永光 电子化学事业研发协理 黄新义 已确认参 加 2025势银异质异构集成封装产业大会 ，并作为嘉宾进行主题为 《 绿色感光材料协助先进 封装产业达成ESG目标 》 的演讲。 黄新义， 电子化学事业研发协理。 学历 Education ：中央大学 化学与材料工程 博士 经历 Experience：台湾永光化学工业股份有限公司 电子化学事业 研发协理 (2024~) 电子化学事业 研发处长 (2016~2024) 工程师, 组长, 课长, 经理 (1997~2016) 30+ 专利, 期刊, 演讲 台湾永光化学工业股份有限公司 创立于1972年，秉持「追求进步创新，发扬人性光辉， 增进人类福祉」的经营理念，以「正派经营，爱心管理」为文化核心，以永续经营为使 命，致力研发、生产对人类有正面价值的高科技化学品，与客户共创价值， ...

继新思科技、西门子EDA等国际巨头接连出手并购之后，国内EDA（电子设计自动化）产业的并购步 伐明显提速。 4月11日晚间，国内EDA领先厂商概伦电子披露，公司拟通过发行股份及支付现金的方式取得锐成芯微 100%股权及纳能微45.64%股权，本次交易完成后，锐成芯微与纳能微均将成为上市公司的全资子公 司。 3月31日，行业龙头华大九天亦公布了收购芯和半导体100%股权预案；前者在3月下旬还通过九天盛世 EDA基金在亚科鸿禹B轮融资中战略领投…… 对于近阶段EDA频繁涌现的并购案，芯谋研究企业部总监王笑龙近日向证券时报记者分析："并购整合 是EDA产业发展的重要手段。全球EDA规模约150亿美元，容纳不下太多企业，长期以来国际三巨头也 是通过多年发展以及不断并购，各自构建了完整的产业生态链，形成非常高的壁垒。近几年国内EDA 企业纷纷冒出，但以开发单点工具居多，在此背景下，行业龙头可以通过并购整合补齐多款关键核心工 具，这不仅可以构建更完整的生态系统，还有助于实现全流程EDA平台企业这一目标，提升面对国际 巨头的竞争力。" 他还指出，在国际贸易摩擦不断升级背景下，国内EDA企业不可避免受到一定影响，这更需要企业 ...

Core Viewpoint - The advanced packaging sector in China's semiconductor industry is experiencing significant growth driven by technological advancements and increasing application demands, particularly in 2.5D/3D packaging, Chiplet technology, and System-in-Package (SiP) innovations [1] Financial Performance of Advanced Packaging Companies - Changdian Technology reported a revenue of RMB 35.96 billion for 2024, a year-on-year increase of 21.24%, with a net profit of RMB 1.61 billion, up 9.52% [2] - Tongfu Microelectronics achieved a revenue of RMB 23.88 billion, a 7.24% increase, and a net profit of RMB 678 million, soaring 299.90% [4] - Huatian Technology's revenue reached RMB 14.46 billion, marking a 28% growth, with a net profit of RMB 616 million, a significant increase of 172.29% [3] - Yongxi Electronics reported a revenue of RMB 3.61 billion, a 50.76% increase, and turned a profit with a net profit of RMB 67.1 million [5] - Guizhong Technology's revenue was RMB 1.96 billion, up 20.26%, but net profit decreased by 15.71% to RMB 313 million [5] - Jingfang Technology expects a net profit between RMB 240 million and RMB 264 million, reflecting a growth of 59.90% to 75.89% [6] Market Trends and Drivers - The advanced packaging market is recovering, with most companies reporting revenue growth between 20% and 50%, except for Guizhong Technology, which saw a decline in net profit [7] - The growth in revenue is attributed to increased demand in sectors such as data centers and automotive electronics, alongside the recovery of the semiconductor market [10] - Changdian Technology focuses on advanced technologies and key application markets, optimizing product structure and enhancing capacity utilization [7] - Tongfu Microelectronics has seen significant growth in automotive products, leveraging its technology advantages in industrial control and automotive applications [7] - Huatian Technology's revenue growth is supported by government subsidies, which contributed significantly to its profits [9] Capacity Expansion and Technological Advancements - Changdian Technology's advanced packaging capacity is fully utilized, prompting expansion efforts to meet customer demand [11] - Tongfu Microelectronics is implementing a multi-point layout strategy, enhancing its production capabilities across various locations [11] - Huatian Technology is progressing with new production bases and significant investment projects aimed at expanding its advanced packaging capacity [11] - Emerging advanced packaging projects are also making strides, with new facilities being established to enhance production capabilities [12] - Domestic advanced packaging companies are continuously iterating their technologies, with notable advancements in high-density packaging and chip integration [13]

Group 1 - Investment Rating: Strongly Recommended for China Merchants Bank (600036.SH) [2][7][11] - Core Viewpoint: The company's revenue and asset quality are significantly affected by macroeconomic conditions, but its long-term competitive advantage remains solid, with absolute revenue capability still leading the industry [2][11] - Financial Performance: In 2024, the company achieved operating revenue of 337.5 billion yuan, a year-on-year decrease of 0.48%, and a net profit attributable to shareholders of 148.4 billion yuan, a year-on-year increase of 1.22% [7][11] Group 2 - Investment Rating: Recommended for Xiaomi Group-W (1810.HK) [3][12] - Core Viewpoint: The addition of Xiaomi's automotive business creates a "people-car-home" ecosystem, with significant demand for its vehicles, which are currently in short supply [3][13] - Financial Projections: Expected net profits for Xiaomi from 2025 to 2027 are projected to be 35.4 billion, 49.6 billion, and 62.6 billion yuan respectively, indicating strong growth potential [3][14] Group 3 - Investment Rating: Recommended for Chipone Technology (688521.SH) [4][19] - Core Viewpoint: The company is a leading domestic semiconductor IP provider, with a focus on customized chip solutions and semiconductor IP licensing [4][19] - Financial Projections: Revenue forecasts for 2024 to 2026 are adjusted to 2.323 billion, 2.980 billion, and 3.668 billion yuan respectively, reflecting a downward revision from previous estimates [4][19] Group 4 - Investment Rating: Recommended for Jin Hong Gas (688106.SH) [21][24] - Core Viewpoint: The company reported a revenue of 2.525 billion yuan in 2024, with a year-on-year increase of 4.03%, despite a significant drop in net profit [21][24] - Business Growth: The on-site gas production project has become a new growth driver, with a revenue of 278 million yuan in 2024, a year-on-year increase of 39.06% [21][22] Group 5 - Investment Rating: Recommended for Ningde Times (300750.SZ) [30][33] - Core Viewpoint: The company achieved a revenue of 362.01 billion yuan in 2024, with a year-on-year decrease of 9.70%, but net profit increased by 15.0% [30][33] - Market Position: As a leading global lithium battery company, Ningde Times is well-positioned to benefit from the growing demand for power and energy storage batteries [30][33]

Core Insights - The article discusses the increasing demand for smaller chips due to the need for more transistors and higher processing power, particularly in the context of large-scale language models [1][2] - It highlights the challenges in semiconductor manufacturing, particularly the limitations in increasing transistor density and the difficulties in wiring connections between transistors [4][6] - The article compares different chip architectures, specifically the WSE-3 and Nvidia H100, emphasizing the trade-offs in performance, memory capacity, and cost-effectiveness [9][10] Group 1: Chip Architecture and Performance - The trend towards using smaller chips is driven by the desire to increase the number of transistors within a limited area, with current limits around 800 square millimeters for manufacturing [2][3] - The WSE-3 chip, while having a larger size and more on-chip memory, faces challenges in storing all necessary weights for large language models, leading to a complex external memory configuration [10][8] - The performance comparison shows that WSE-3 has a memory capacity 880 times greater than H100, but only achieves 20 times the performance, indicating a complex balance between cost and value [10][8] Group 2: Cost and Value Considerations - The article discusses the cost implications of using chiplets versus monolithic designs, noting that chiplets can potentially reduce manufacturing costs while allowing for greater flexibility in product design [15][16] - It emphasizes the importance of evaluating the value derived from using chiplets, as the benefits must outweigh the additional costs associated with their implementation [24][26] - The article also mentions that the value of chiplets can vary significantly between companies, depending on their specific manufacturing processes and technologies [26]