Core Viewpoint - The semiconductor packaging leader, ASE Technology Holding Co., announced a significant acquisition to enhance its advanced packaging capacity, driven by strong demand from high-performance computing (HPC) clients and the growing need for advanced packaging solutions [2][4]. Group 1: Acquisition and Expansion Plans - ASE Technology plans to acquire a facility from Win Semiconductors for NT$6.5 billion (approximately US$215 million) to expand its advanced packaging capacity in Kaohsiung [2]. - The new facility acquisition is expected to contribute NT$19.39 billion (approximately US$640 million) in profits, translating to a pre-tax earnings contribution of NT$4.57 per share [2]. - ASE's new K28 plant is set to begin construction in October 2024 and is expected to be completed by 2026, focusing on CoWoS advanced packaging capacity [2][3]. Group 2: Financial Performance and Projections - ASE's revenue for the third quarter is projected to increase by 12% to 14% in USD terms, with a corresponding increase of 6% to 8% in New Taiwan Dollar terms, despite a slight decline in gross margin due to currency appreciation [3][4]. - The advanced packaging and testing business is expected to contribute an additional US$1 billion in revenue compared to 2024, representing a 10% annual growth rate for the packaging segment [3][4]. - The company anticipates that the demand for high-end packaging, particularly 2.5D and 3D packaging, will continue to rise, necessitating the expansion to alleviate capacity constraints [3][4]. Group 3: Market Outlook and Strategic Positioning - ASE is optimistic about the recovery of the global semiconductor market by 2026, leveraging its technological leadership and capacity advantages to solidify its market position [4]. - The company aims to enhance its turnkey services, integrating advanced packaging and testing, with testing revenue growth expected to outpace packaging revenue growth this year [3][4]. - ASE's revenue for July reached NT$51.542 billion, marking a 4.1% month-over-month increase and a 7.95% year-over-year increase for the first seven months of the year [4].

Core Viewpoint - The release of the PCIe 8.0 standard marks a significant milestone in the evolution of PCIe technology, doubling the data transfer rate to 256GT/s and reinforcing its critical role in high-speed data transfer across various computing environments [1][38]. Group 1: Evolution of PCIe Technology - PCIe, introduced by Intel in 2001, has evolved from the original PCI standard, which had a maximum bandwidth of 133 MB/s, to a series of iterations that have consistently doubled the data transfer rates [3][14]. - The transition from PCI to PCIe represents a shift from parallel bus technology to a serial communication mechanism, significantly enhancing data transfer efficiency and reducing signal interference [9][11]. - The PCIe 1.0 standard initiated the serial interconnect revolution with a transfer rate of 2.5GT/s, while subsequent versions have seen substantial increases, culminating in the upcoming PCIe 8.0 [14][38]. Group 2: Key Features of PCIe - PCIe's architecture includes three core features: serial communication, point-to-point connections, and scalable bandwidth capabilities, which collectively enhance performance and reduce latency [9][11]. - The introduction of advanced signal processing techniques, such as CTLE in PCIe 3.0 and PAM4 modulation in PCIe 6.0, has been pivotal in maintaining signal integrity and supporting higher data rates [18][24]. - PCIe 8.0 is set to introduce new connector technologies and optimize latency and error correction mechanisms, ensuring reliability and efficiency in high-bandwidth applications [42][38]. Group 3: Market Applications and Trends - PCIe technology is predominantly utilized in cloud computing, accounting for over 50% of its market share, with increasing adoption in automotive and consumer electronics sectors [46][49]. - The demand for high-speed interconnects is driven by the growth of AI applications, high-performance computing, and data-intensive workloads, positioning PCIe as a foundational technology in these areas [45][51]. - Predictions indicate that the PCIe market in AI applications could reach $2.784 billion by 2030, with a compound annual growth rate of 22% [51]. Group 4: Competitive Landscape and Challenges - PCIe faces competition from proprietary interconnect technologies like NVLink and CXL, which offer higher bandwidth and lower latency for GPU communications [55][63]. - The establishment of the UALink alliance aims to create open standards for GPU networking, challenging the dominance of proprietary solutions and enhancing interoperability [56]. - Despite its established position, PCIe must navigate challenges related to bandwidth limitations and evolving market demands, necessitating continuous innovation and adaptation [64][71].

Summary of Conference Call Notes on Taiwan Semiconductor Industry Industry Overview - **Industry**: Semiconductors - **Key Companies**: TSMC (Taiwan Semiconductor Manufacturing Company), GlobalWafers (GWC) Core Insights and Arguments 1. **US Tariff Announcement**: On August 6, 2025, President Trump announced a proposed 100% tariff on imported semiconductor chips, with exemptions for companies building manufacturing facilities in the US [1] 2. **Impact on TSMC and GWC**: TSMC and GWC are likely to be exempt from the tariff due to their US operations and expansion plans, positioning them favorably for US customers seeking domestic sourcing [2][3] 3. **Investor Sentiment**: The tariff exemption is expected to alleviate investor concerns regarding semiconductor tariff uncertainties, which have been a significant valuation overhang [2] 4. **TSMC's Market Performance**: TSMC's share price has increased by 15%, but it has underperformed compared to other AI-related companies, indicating investor concerns over geopolitical risks [3] 5. **Earnings Visibility**: The tariff exemption is anticipated to enhance TSMC's earnings visibility and reduce downside risks to its growth outlook, as management has already factored potential tariff impacts into their 2025 guidance [3] 6. **Mature Node Capacity**: The proposed tariff exemption may limit downside risks to TSMC's mature node capacity, potentially making its pricing more competitive [4][7] 7. **Vanguard and UMC Implications**: Vanguard may face negative implications due to lack of US exposure, while UMC's collaboration with Intel on a 12nm process lacks clarity on tariff exemption eligibility [8] Company-Specific Developments 1. **TSMC's US Investment**: TSMC plans to invest an additional US$100 billion in advanced semiconductor manufacturing in the US, bringing its total investment to US$165 billion, including multiple fabrication plants and R&D centers [9] 2. **GWC's Expansion**: GWC is expanding its capacity in the US, with significant customer interest in US-based products due to localization trends. Revenue is expected to ramp up gradually from 2H25 to 1H26 [10] Investment Thesis 1. **TSMC**: TSMC is viewed as a leading global foundry with over 60% market share, positioned to capture long-term growth opportunities in AI, 5G, HPC, and EV sectors. The stock is rated as a Buy with a target price of NT$1,370 [12][13][14] 2. **GWC**: GWC is rated Neutral due to slower end-demand recovery and high inventory levels among key customers, with a target price of NT$380 [16][19][18] Risks and Considerations 1. **TSMC Risks**: Key risks include deterioration in end-demand recovery, slower customer node migrations, and increased competition affecting profitability [15] 2. **GWC Risks**: Risks include fluctuations in end-demand recovery, competition, and production costs [20] Additional Insights - The tariff situation is expected to shift the cost dynamics in the semiconductor industry, potentially benefiting companies like TSMC that can offer competitive pricing while ensuring supply chain security [7]

Financial Data and Key Metrics Changes - Revenue for Q2 2025 was $642 million, up 2% sequentially and at the midpoint of prior guidance [10] - Non-GAAP EPS was $0.55, also at the midpoint of prior guidance [10] - Non-GAAP gross margin was 10.2%, up 10 basis points sequentially and flat year over year [10] - Non-GAAP operating margin was 4.7%, up 10 basis points sequentially [10] - Cash balance decreased by $90 million from Q1 to $265 million, with a free cash outflow of $15 million during the quarter [13][15] Business Line Data and Key Metrics Changes - Semi cap revenue decreased 2% quarter over quarter but grew 11% year over year [11] - Industrial revenue was up 4% quarter over quarter and flat year over year [11] - A&D revenue increased 4% quarter over quarter and 16% year over year [11] - Medical revenue was up 6% quarter over quarter but down low single digits year over year [11] - AC and C revenue was flat quarter over quarter and down considerably year over year [11] Market Data and Key Metrics Changes - The semi cap sector is experiencing a slower recovery due to trade restrictions and tariff uncertainties, but is expected to outperform overall market growth [19] - The industrial sector showed mid single-digit sequential growth, with improvements in test and measurement and controls [20] - A&D sector is expected to maintain strong double-digit growth, driven by stable commercial air and strong defense demand [21] - Medical sector is anticipated to see sustained growth through the second half of the year, overcoming previous inventory challenges [21] Company Strategy and Development Direction - The company is focused on maintaining a customer-first approach and leveraging vertical integration to differentiate in the market [26] - Continued investments in semi cap and A&D sectors are expected to drive long-term growth [19][21] - The company successfully refinanced its debt, extending maturity to June 2030, and repatriated significant cash from overseas [8][14] Management's Comments on Operating Environment and Future Outlook - Management expressed optimism about returning to growth in 2025, supported by strong bookings and a recovering market [26] - The company is managing spending prudently to protect profitability and free cash flow while supporting dividends and share repurchases [26] - There is confidence in the long-term growth potential of the semi cap industry, with expectations of a $1 trillion market by 2030 [19] Other Important Information - The company repatriated $152 million of cash from China and Thailand, using $95 million to pay down debt [14] - The cash conversion cycle improved to 85 days, with inventory days down six days sequentially [15] Q&A Session Summary Question: Can you provide more perspective on the recovery in AC and C? - Management highlighted their experience in liquid cooling and the complexity of high-performance computing systems, expecting growth to ramp in Q4 and into 2026 [31][36] Question: How much of the semi cap market challenges are due to political factors? - Management indicated that both capital spending adjustments and government restrictions are impacting recovery, but they remain optimistic about long-term growth [37][38] Question: Can you break down the sequential growth in the medical segment? - Most growth is attributed to the base business recovering from inventory challenges, with significant new bookings contributing as well [46][72] Question: What are the expectations for the aerospace and defense sector? - Management noted stabilization in commercial air travel and solid demand across various parts of the industry, with less exposure to Boeing [66] Question: How do you expect to achieve inventory improvements? - Focus on operational discipline and better systems to optimize inventory days, targeting inventory turns of 5 to 5.5 [60][62]

Core Viewpoint - TSMC reported record profits in Q2, driven by strong demand for AI chips, with a projected revenue growth of nearly 30% for the year despite potential tariff impacts [2][3][11]. Financial Performance - TSMC's Q2 revenue reached NT$933.79 billion, a year-on-year increase of 38.6%, with net income of NT$398.27 billion, up 60.7% [2][4]. - Earnings per share (EPS) for Q2 was NT$15.36, reflecting a 60.7% increase compared to the previous year [5][11]. - The gross margin stood at 58.6%, with an operating margin of 49.6%, indicating strong operational efficiency [5]. Market Outlook - TSMC's chairman, C.C. Wei, indicated that AI chip demand remains robust, with non-AI applications also expected to recover moderately [3][11]. - The company has revised its full-year revenue growth forecast from 24-26% to nearly 30%, outperforming market expectations [12][22]. - Despite potential tariff uncertainties, TSMC's overall outlook remains positive, with no significant changes in customer behavior observed [3][4]. Capital Expenditure and Dividends - TSMC plans to maintain its capital expenditure forecast at US$38-42 billion for the year, ensuring sustainable dividend policies [4][13]. - The company anticipates a total cash dividend of at least NT$18 per share this year, increasing to at least NT$20 next year [4]. Advanced Technology and Production Capacity - TSMC is set to begin mass production of its 2nm process technology in the second half of the year, which is expected to provide significant revenue contributions [15][17]. - The company is expanding its manufacturing capabilities in Arizona, with plans for six wafer fabs and two advanced packaging facilities to support AI and HPC applications [18][19]. Industry Context - Analysts view TSMC's strong performance as a positive signal for the semiconductor market, particularly amid tariff and policy challenges [21][22]. - Concerns remain regarding potential impacts from tariffs and the performance of major clients like Apple, which could affect TSMC's outlook for the latter half of the year [22][23].

Core Insights - Super Micro Computer, Inc. (SMCI) has announced the certification of its BigTwin Server for immersion cooling, utilizing 4th and 5th Gen Intel Xeon Scalable Processors, enhancing performance and efficiency in data centers [1][6] Group 1: Certification and Collaboration - The Supermicro BigTwin server has undergone rigorous testing and is now recognized as a certified immersion server, ensuring compatibility with Intel's guidelines and the Open Compute Project (OCP) specifications [1][4] - Supermicro's long-standing collaboration with Intel combines advanced processor technologies with high-performance solutions, ensuring that the BigTwin server remains fully functional when immersed in specified liquids [2][4] Group 2: Efficiency and Environmental Impact - Immersion cooling technology significantly lowers Power Usage Effectiveness (PUE), with data centers using Supermicro immersion servers achieving PUE values close to 1.05 or lower, thus reducing energy costs and environmental impact [3][8] - The immersion cooling method allows for denser compute configurations without increasing thermal load, improving overall energy efficiency and reducing the need for traditional air-based cooling systems [3][5] Group 3: Industry Standards and Future Outlook - Supermicro's involvement in the OCP Community has been crucial in advancing immersion cooling standards, promoting compatibility, efficiency, and scalability across data center deployments [4][5] - The growing demand for immersion-certified servers is driven by the need for efficient cooling solutions in data centers, particularly for AI and HPC applications, which require powerful processors [8]

Core Viewpoint - Cornelis Networks is reintroducing its Omni-Path interconnect technology with the CN5000 series switches and NICs, aiming to compete with Nvidia's InfiniBand technology, particularly in the AI market, by offering higher performance at a lower cost [1][2][7]. Summary by Sections Overview of Omni-Path - Omni-Path was developed by Intel in 2015 as a lossless interconnect technology, primarily for high-performance computing (HPC) applications, and was initially deployed in several supercomputing platforms [1][2]. CN5000 Series Details - The CN5000 series includes switches and NICs that support 400Gbps bandwidth, with the ability to support over 500,000 endpoints in a cluster, and performance that scales almost linearly [2][4]. - The CN5000 switch options include a 1U high, 48-port switch with a total switching capacity of 19.2Tbps and a Director switch with up to 576 ports and a total bandwidth of 230.4Tbps [4][5]. Performance Comparison with InfiniBand - Cornelis claims its system offers up to 2x message transmission rates, 35% lower latency, and 30% faster simulation times compared to Nvidia's 400Gbps Quantum-2 InfiniBand [7]. - However, the CN5000 switch has fewer ports (48) compared to Nvidia's Quantum-2 (64), which may impact scalability in large deployments [7][9]. Scalability and Network Design - To connect 128,000 GPUs at 400Gbps, approximately 13,334 CN5000 switches would be needed, compared to about 10,000 Nvidia switches [9][10]. - The CN5000 Director switch can reduce the number of switches required for large deployments to 733, thus simplifying wiring [10]. Future Developments - Cornelis plans to launch the CN6000 series with 800Gbps support next year, which will be compatible with Ethernet, allowing for interoperability with other Ethernet devices [13][16]. - The company is also a supporter of the Ultra Ethernet initiative, which aims to modernize Ethernet protocols for HPC and AI applications [15][16]. Market Positioning - Cornelis aims to position its products as cost-effective alternatives to Nvidia's offerings, with a focus on performance and efficiency in AI and HPC environments [7][12].

Core Insights - The global wafer foundry industry is expected to see a revenue decline of approximately 5.4% in Q1 2025, totaling $36.4 billion, influenced by international market conditions and seasonal factors [2][3] - The second quarter is anticipated to show revenue growth for the top ten foundries, driven by China's old-for-new subsidy policy, pre-launch inventory for new smartphone models, and stable demand for AI HPC [2] Company Performance - TSMC remains the market leader with a revenue of $25.5 billion in Q1 2025, a decrease of 5% quarter-over-quarter, holding a market share of 67.6% [3][4] - Samsung's foundry revenue fell by 11.3% to $2.89 billion, with a market share of 7.7%, primarily due to weak mobile chip demand and ongoing inventory adjustments [5] - SMIC reported a revenue increase of 1.8% to $2.25 billion, benefiting from customer pre-orders and domestic consumption subsidies, ranking third in the industry [6] - UMC's revenue decreased by 5.8% to $1.76 billion, maintaining its fourth position, with stable wafer shipments offsetting seasonal impacts [6] - GlobalFoundries experienced a revenue decline of 13.9% to $1.58 billion, while HuaHong Group ranked sixth with stable performance [7] - Vanguard's revenue increased by 1.7% to $363 million, moving up to seventh place, while Tower's revenue decreased by 7.4% to $358 million [7] - Nexchip's revenue grew by 2.6% to $353 million, ranking ninth, while PSMC's revenue slightly decreased by 1.8% to $327 million, placing it tenth [8] Market Trends - TSMC's advanced process technologies, particularly in AI and HPC, are driving revenue growth, with 3nm, 5nm, and 7nm processes contributing 73% of wafer sales [4] - AI chip demand is projected to be a significant growth driver for TSMC, with a forecasted 100% increase in AI accelerator chip sales in 2025 [4] - SMIC anticipates a revenue decline of 4% to 6% in Q2 2025, indicating a challenging market environment ahead [6]

Core Insights - The global wafer foundry industry experienced a 5.4% quarter-over-quarter decline in total revenue for Q1 2025, amounting to $36.403 billion, but showed a significant year-over-year growth of 24.8% [1] - The traditional seasonal slowdown in the wafer foundry industry was somewhat mitigated this year due to uncertainties in international conditions prompting downstream customers to stock up inventory and China's ongoing trade-in policy [1] Industry Performance - Despite facing seasonal challenges, the wafer foundry industry demonstrated resilience, with expectations for revenue growth in Q2 2025 driven by the launch of new smartphone models and stable demand from AI and HPC sectors [4] - The top ten global wafer foundries accounted for 97% of the market share in Q1 2025, with a total revenue of $36.403 billion [2] Company Rankings - TSMC led the market with a revenue of $25.517 billion in Q1 2025, despite a 5.0% decline from Q4 2024, maintaining a market share of 67.6% [2] - Samsung's revenue fell by 11.3% to $2.893 billion, resulting in a market share of 7.7% [2] - SMIC reported a slight revenue increase of 1.8% to $2.247 billion, raising its market share to 6.0% [2] - Vanguard's capacity utilization was above average due to customer stockpiling, while Tower Semiconductor faced significant seasonal impacts and did not benefit from China's subsidy policies [4]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自联合报 。 集邦科技今日发布首季晶圆代工市占调查，美国新关税政府引发的提前备货及中国旧换新补贴影 响，急单涌进，抵销淡季效应，首季营收季减5.4%，优于预期，台积电也挟AI及HPC订单需求稳 定，首季全球市占再向上推升，达到67.6%，稳坐全球第一。 集邦调查，第1季主要晶圆代工厂营收合计仅季减约5.4%，为364亿美元，优于预期。展望第2季营 收表现，随着关税引发的提前备货告一段落，整体动能逐步放缓，唯中国旧换新的补贴政策拉货潮 有望延续，加上下半年智慧手机新品上市前备货陆续启动，以及AI HPC需求稳定，将成为带动第 2季产能利用率和出货的关键，预期前十大晶圆代工厂营收将呈现季增。 集邦指出，第1季各晶圆代工业厂仍由台积电以67.6%市占率稳居第一，虽其晶圆出货虽因智慧手 机备货淡季而下滑，但因AI及HPC需求和电视的关税避险急单仍然强劲，抵销手机端需求下滑不 利因素，营收255亿美元，季减5%。 第二名的三星代工部门因美国先进制程禁令限制中国客户投产，以及其客户组成关系，获得中国消 费补贴的红利有限，第1季营收季减11.3%，为28.9亿美元，市占 ...