Core Viewpoint - UCIe 2.0 introduces optional features that can be customized based on specific design needs, addressing concerns about its complexity and "weight" in advanced packaging interconnect standards [1][2][3] Summary by Sections UCIe 2.0 Features - UCIe 2.0 offers a range of optional features that can be tailored to various applications, from automotive to high-performance computing [2] - The standard allows for flexibility similar to PCIe, CXL, and NVMe, enabling users to implement only the necessary functions [2][5] Market Outlook - Current advanced packaging products are primarily developed by financially robust companies that control all components, enhancing their ability to manage chip interactions [4] - The vision for the future includes establishing a universal market for chiplets, with many customers expressing a desire to be part of an ecosystem [4] Management Functions - UCIe 2.0 includes management functions that ensure startup and composability, which are optional and can enhance communication between chiplets [7][9] - Key management functions include chip discovery, configuration, firmware download, power management, error reporting, and performance monitoring [7] Discovery Technology - Discovery technology is crucial for confirming chiplet communication and is designed to be efficient, allowing for quick register reads to verify connections [10][11] - The concept of dynamic discovery is less relevant for advanced packaging, where static discovery suffices for confirming chiplet contents [10][11] Competitive Landscape - UCIe and BoW are in a competitive landscape, with both standards having their proponents and unique advantages [20][21] - UCIe's optional features may help it achieve a lighter design compared to BoW, which is often perceived as more lightweight due to its simpler implementation [20][21] Industry Perspectives - Companies are cautious about fully committing to either standard, as proprietary designs continue to play a significant role in the market [21] - The industry is observing how both standards evolve and which features will prove most beneficial in practical applications [21]

Financial Data and Key Metrics Changes - Total revenue for Q1 2025 was $4.3 million, down 28% from Q1 2024 and down 24% from Q4 2024 [31] - New product revenue in Q1 was $3.8 million, down 23% from Q1 2024 and down 19% from Q4 2024 [31] - Non-GAAP gross margin in Q1 was 45.7%, significantly lower than 71.3% in Q1 2024 and 62.9% in Q4 2024 [32] - Non-GAAP net loss was $1.1 million or $0.07 per diluted share, compared to a net income of $1.7 million or $0.12 per diluted share in Q1 2024 [33] Business Line Data and Key Metrics Changes - Mature product revenue was $600,000, down from $1.1 million in Q1 2024 and $1 million in Q4 2024 [31] - Non-GAAP operating expenses in Q1 were approximately $3 million, compared to $2.5 million in Q1 2024 and $2.9 million in Q4 2024 [32] Market Data and Key Metrics Changes - The discrete FPGA market for U.S. military applications is approximately $1.5 billion, with significant interest in integrating eFPGA technology into ASICs and SoCs [14][44] - The defense industrial base is increasingly interested in using eFPGA technology to reduce costs and improve integration [70][71] Company Strategy and Development Direction - The company aims to capitalize on its unique position as the first available source for eFPGA hard IP for Intel 18A technology, focusing on integration to drive growth [10][14] - The partnership with Faraday is expected to accelerate expansion into new end markets and generate future revenue through storefront services [15][46] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in achieving solid revenue growth, non-GAAP profitability, and positive cash flow for the full year 2025 despite a slower start [46][41] - The company anticipates a revenue rebound beginning in Q3 2025, driven by new IP contracts and existing mature product sales [39][60] Other Important Information - The company raised approximately $1.5 million from institutional investors and $1.2 million net from an ATM offering [37] - The strategic RadHard FPGA government contract is expected to contribute significantly to future revenue, with ongoing engagement with the defense industrial base [19][86] Q&A Session Summary Question: Can you walk us through the ramp of Intel 18A and its revenue stream? - Management discussed the progress of Intel 18A and its importance in accelerating customer engagement, particularly in defense applications, with revenue expected from licensing and royalties [50][54] Question: What are the key drivers for revenue ramp in the second half of the year? - Key drivers include ongoing Anafuse FPGA business, the strategic RadHard contract, and new IP contracts, particularly in advanced process technologies [58][60] Question: Can you provide insights on storefront opportunities? - Management highlighted several storefront opportunities, including contracts with defense customers and participation in chiplet ecosystems, indicating a growing trend towards storefront services [64][66] Question: How does the company plan to address the $1.5 billion FPGA market? - The company aims to reduce verification costs and improve integration, which is critical for defense applications, thereby enhancing its market position [68][71] Question: Are there opportunities with Faraday beyond the current node? - Management expressed interest in exploring smaller nodes with Faraday as they gain confidence in the integration of eFPGA technology [74][76]

Financial Data and Key Metrics Changes - Total revenue for Q1 2025 was $16,500,000, representing a 28% year-over-year increase, exceeding guidance [17] - Annual contract value (ACV) plus royalties reached a record high of $66,800,000, up 15% year-over-year [17] - Remaining performance obligations (RPO) at the end of Q1 were $88,900,000, a 19% year-over-year increase [17] - Non-GAAP gross profit was $15,300,000 with a gross margin of 92% [17] - Non-GAAP operating loss for Q1 was $3,200,000, a 40% improvement compared to the prior year [20] - Free cash flow was positive at $2,700,000 for the quarter [21] Business Line Data and Key Metrics Changes - The company achieved several key design wins, including contracts with top global technology companies and automotive OEMs [6][7] - Adoption of technology in automotive, enterprise computing, and communications sectors is increasing, driven by design complexity and AI applications [6][8] - The company is seeing strong momentum in the microcontroller (MCU) system IP market, with initial royalties received from a top five MCU manufacturer [9] Market Data and Key Metrics Changes - The automotive sector remains a significant focus, with 10 automotive OEMs now as direct customers [8] - The company is expanding its presence in the AI market, with over 55% of total business now related to AI projects [72][78] - The semiconductor industry is experiencing a shift towards outsourcing system IP needs due to increasing design complexity and cost pressures [42][46] Company Strategy and Development Direction - The company is focusing on innovation and expanding ecosystem collaborations, including joining the Intel Foundry Accelerator Program [11] - The introduction of FlexGen, an AI-driven smart NOC IP technology, is expected to enhance productivity and performance in semiconductor designs [9] - The company aims to maintain its position as a neutral player in the system IP market while capitalizing on the growing demand for outsourced solutions [74] Management's Comments on Operating Environment and Future Outlook - Management acknowledges global economic uncertainty but reports no deal cancellations or delays in Q1 [13] - The company anticipates potential short-term headwinds in royalties due to customer confidence and tariffs [14] - Despite economic challenges, management remains optimistic about long-term growth and customer interest in outsourcing [15][26] Other Important Information - The company opened a new engineering and customer support center in Krakow, Poland, to enhance product development and customer support [12] - The company received multiple awards for innovation, including recognition for its NOC IP technologies [10] Q&A Session Summary Question: Changes in customer behavior due to tariffs and trade environment - Management noted some replanning of projects in China but observed an increased willingness among larger companies to outsource system IP to commercial vendors [29][30] Question: Expectations for FlexGen's revenue and ACV - Management reported positive feedback from customers evaluating FlexGen, with expectations for substantial bookings and revenue in the second half of the year [36][37] Question: Accelerating decision timelines by customers - Management indicated that while design cycles are being accelerated, licensing activity remains steady without significant changes in decision-making timelines [42] Question: Interest from joining the Intel Foundry Alliance - Management expects that joining the alliance will lead to additional business opportunities over the next twelve months [47] Question: Market size for system IP - Management estimated the system IP market to be between $1 billion and $1.2 billion, with significant growth potential as complexity increases [60] Question: Underlying technological changes prompting outsourcing - Management highlighted the increasing complexity of designs, particularly with the rise of AI and chiplets, as key factors driving the shift towards outsourcing [62][64]

Key Points Summary Core Viewpoint - The reduction in holdings by major funds in SMIC and Huahong reflects a strategic exit aligned with investment cycles, amidst pressures from industry cycles and geopolitical factors impacting the semiconductor sector [3][12]. Group 1: Company Performance and Financial Data - SMIC's net profit surged by 166.5% year-on-year to 1.356 billion yuan, driven by an increase in capacity utilization to 89.6% and product mix optimization, despite a projected revenue decline of 4%-6% in Q2 [1][2]. - Huahong's revenue grew by 18.66%, but net profit plummeted by 89.73% to 22.76 million yuan, with Q2 gross margin expected to drop to 7%-9% [1][2]. Group 2: Market Reactions and Investor Sentiment - The market reacted negatively to the reduction in holdings, with SMIC's stock dropping over 10% and Huahong's by 9.33% on the same day [1][7]. - Concerns over capital withdrawal and the potential impact on the semiconductor sector were evident, with a collective decline in the semiconductor sector following the news [7]. Group 3: Industry Dynamics and Competitive Landscape - The competitive landscape is tightening with international giants like TSMC and UMC ramping up their mature process capabilities, posing risks of price wars for domestic foundries [4]. - Geopolitical tensions, particularly U.S. export restrictions, are creating uncertainties for SMIC's advanced process equipment procurement, while Huahong's focus on power devices is less affected [4]. Group 4: Strategic Responses and Future Outlook - SMIC plans to increase the share of its mature process capacity (28nm and above) to 70% by 2025 and is focusing on partnerships with domestic clients to reduce reliance on foreign brands [8]. - Huahong is concentrating on niche markets with its 55nm BCD process and IGBT technology, aiming to ramp up production at its new facility to support growth in automotive chip business [9]. Group 5: Long-term Opportunities and Risks - The domestic semiconductor industry is expected to see a rise in localization, with the potential for domestic equipment and materials to increase from 20% to 40% by 2027 [11]. - Emerging markets, particularly in electric vehicles and photovoltaics, are anticipated to drive demand for power devices, with Huahong's automotive chip revenue share projected to grow from 28% in 2024 to 40% in 2026 [11].

Core Viewpoint - The article discusses the recent IPO progress of several domestic semiconductor companies, highlighting their innovations and market potential in the semiconductor industry. Group 1: IPO Progress of Semiconductor Companies - Multiple domestic chip companies, including Ziguang Tongchuang, Qinheng Micro, and others, have announced their IPO advancements [2] - Ziguang Tongchuang has initiated its IPO process with the support of CITIC Securities, focusing on FPGA chips and EDA development tools [3][5] - Qinheng Micro has completed its IPO counseling work and aims to provide solutions for IoT connectivity through its self-developed interface IP and microprocessor core [6][7][8] - Sibiqi has restarted its IPO process after previous setbacks, focusing on AI-driven voice technology and solutions for various industries [9][10] - Yuexin Semiconductor has begun its IPO counseling with Guotai Junan, aiming to enhance its production capacity for analog chips [11][12][13] - Ruishi Chuangxin is preparing for its IPO, focusing on high-performance RF front-end chips for 4G/5G applications [15][16] - Xinyaohui has also initiated its IPO process, specializing in semiconductor IP development and providing comprehensive IP platform solutions [17][18][19] Group 2: Market Potential and Innovations - FPGA chips are highlighted for their flexibility and low latency, making them suitable for various applications, including industrial and automotive sectors [4] - Qinheng Micro's focus on self-developed IP enhances its product performance and reduces costs, contributing to its competitive edge [8] - Sibiqi's strategy emphasizes the integration of cloud and chip technologies to drive AI applications in smart devices [9][10] - Yuexin Semiconductor's new production line aims to achieve a monthly output of nearly 80,000 12-inch wafers, significantly boosting its manufacturing capacity [12][13] - Ruishi Chuangxin's product offerings cater to the growing demand for RF components in mobile and IoT markets [16] - Xinyaohui's comprehensive IP solutions support advanced protocols and are positioned to meet the needs of AI and high-performance computing sectors [19][21]

来源： 硅芯科技官微 硅芯科技自研3Sheng Integration Platform，实现三维堆叠芯片的系统级规划、物理实现与分 析、可测性与可靠性设计等，集成"系统-测试-综合-仿真-验证"五引擎合一，具有统一数据底 座，支持三维异构集成系统的敏捷开发与可定制化的协同设计优化，并在多个功能和性能上具有 独创性。 直面需求 3月在HiPi联盟大会，已听到 多位业内顶级设计专家发声Chiplet和3D IC对设计和EDA挑战。 近年来国内设计三维异构集成芯片的困扰似乎集中于设计出的堆叠结构，却在仿真和验证以后 仍然发现诸多问题！于是 "缺乏架构设计，急需设计协同和优化，设计要素全线左移" 已经成 为了业界对三维芯片堆叠设计的共识！ 要做一个设计，初心始于SoC的迭代，如果没有架构设计，严格说是能融合支持IP划分、工艺 选择、版图探索、前仿真、互连检查与优化、基于电源和热的物理实现、跨Die物理签核的多 点协同设计的架构设计和早期分析工具，那这样的设计通常会南辕北辙。 在近期硅芯科技的行业分享讲座上，创始人赵毅博士 基于业界3D IC设计遇到的问题 做了又 一轮的总结。其中提到：顶层架构对于应用场景、有效探索 ...

Core Insights - The company reported a revenue of 390 million yuan for Q1 2025, representing a year-on-year increase of 22.49%, but incurred a net loss of 220 million yuan [1] - The gross margin improved to 39.06% in Q1 2025 from 33.34% in Q4 2024, indicating better cost management or pricing power [1] - The company continues to invest heavily in R&D, with an expenditure of 1.247 billion yuan planned for 2024 and 300 million yuan spent in Q1 2025 [1] Revenue Breakdown - Revenue from downstream sectors such as system manufacturers, internet companies, cloud service providers, and automotive companies accounted for 37.3% of total revenue [3] - Consumer electronics revenue saw a significant year-on-year increase of 103.81%, making up 44.12% of total revenue [3] - Chip design business revenue reached 122 million yuan, up 40.75%, with 89.05% of this from 28nm and below process nodes [3] Business Segments and Growth Areas - The company is focusing on AIGC, data centers, intelligent driving systems, smart wearable devices, IoT, and Chiplet technologies [3] - In the AIGC sector, the company has 82 clients and 142 chip applications across various devices [3] - The automotive electronics segment has made strides in cockpit and autonomous driving technologies, with multiple IPs adopted by automotive chip companies [3] Investment Outlook - The company is positioned as a leading IP and custom chip service provider, expected to benefit from trends in cloud-side AI, edge AI, autonomous driving, and advanced packaging [4] - Revenue projections for 2025 to 2027 are 2.902 billion yuan, 3.512 billion yuan, and 4.32 billion yuan respectively, with net losses expected to decrease over the same period [4] - The target price is set at 104.3 yuan, based on an 18x PS for 2025, maintaining an "Accumulate-A" investment rating [4]

Investment Rating - The report maintains an "Add-A" investment rating for the company, with a target price of 104.3 yuan based on an 18x price-to-sales (PS) ratio for 2025 [3][5]. Core Insights - The company reported a revenue of 390 million yuan in Q1 2025, representing a year-on-year increase of 22.49%. The net profit attributable to shareholders was -220 million yuan, with a gross margin of 39.06%, up from 33.34% in Q4 2024. The company continues to invest heavily in research and development, with R&D expenses of 1.247 billion yuan planned for 2024 and 300 million yuan in Q1 2025 [1][2]. - The company is expected to benefit from trends in AIGC (Artificial Intelligence Generated Content), autonomous driving, and Chiplet technologies. The revenue from the consumer electronics sector saw a significant increase of 103.81% year-on-year, accounting for 44.12% of total revenue. The chip design business generated 122 million yuan, up 40.75%, with 89.05% of revenue coming from 28nm and below process nodes [2][3]. Summary by Sections Financial Performance - For 2025, the company is projected to achieve revenues of 2.902 billion yuan, 3.512 billion yuan in 2026, and 4.320 billion yuan in 2027. The net profits are expected to be -385 million yuan in 2025, -189 million yuan in 2026, and a positive 92 million yuan in 2027 [3][10]. - The gross margin is forecasted to be 39.0% in 2025, 40.0% in 2026, and 41.0% in 2027, indicating a gradual improvement in profitability [11]. Market Position and Strategy - The company is positioned as a leading provider of IP and customized chip services, with a first-mover advantage in cloud-side AI, edge-side AI, autonomous driving, and advanced packaging sectors. It has established a strong presence in various fields, including AIGC, data centers, automotive electronics, smart wearables, IoT, and Chiplet technologies [2][3]. - The company has a diverse customer base, with 82 clients in the AIGC sector and significant engagements with major internet companies and automotive chip manufacturers [2][3].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 2025势银异质异构集成封装产业大会 将于 4月29日 在浙江宁波 · 甬江实验室举办。 会议议程 ⊙ 09:00 - 12:00 专题论坛： 异构集成研究中心成立仪式 09:00 09:10 相关领导 主办方、联合主办方致辞 09:10 09:20 相关领导 混合键合在异构集成先进封装中的应用 09:20 钟飞 主任助理、信息材料与微纳器件制备 09:40 平台负责人 爵江实验室 Chiplet EDA全流程:设计空间探索,物 理实现及多物理验证 09:40 吴晨 项目总监 10:00 芯粒CAD和制造浙江省工程研究中心/深圳 市比昂芯科技有限公司 聚焦2.5D/3D先进封装EDA平台,探索后 10:00 端全流程设计、仿真与验证协同创新模式 10:20 赵毅 创始人兼首席科学家 珠海硅芯科技有限公司 空部 10:20 1 ...

以下文章来源于IC后摩院 ，作者赵瑜斌 IC后摩院 . 产业为天，学术为地，搬运在这天地间 如果您希望可以时常见面，欢迎标星收藏哦~ | Contents | | | --- | --- | | 引 | | | 01 | 架构设计 | | 02 | 设计实现 | | 03 | 仿真 | | 04 | PV验证/签核 | | 05 | 供电 / 功耗 | | 06 | 标准/底座/生态 | | 07 | 商用工具现状 | 本篇主要分享从设计视角，对于Chiplet tool的真实需求。在开始前，我们略去了Chiplet设计的必要性和 后摩路径的好处（在其他篇中我们再分享），但是我们从一个基本的角度来看必须用Chiplet来构建未来系 统，尤其是算力系统的必要性——晶体管transistor的增长。 上个月底参加了HiPi联盟大会，以及在近期多场和3DIC、先进封装有关的会议中，国内设计界对EDA的呼声 可谓此起彼伏。这几天方得空整理了一下若干专家对此的讨论和分享。由于流程环节繁多，内容庞大，本文仅 挑一些要点做分享，如有更适合的场合再分别做详细介绍。 2024年，成功商用单片（苹果M3 max@3nm）晶体管最 ...