国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 11月25日消息，据媒体报道，在台积电CoWoS先进封装产能持续紧缺的背景下，半导体行业对替代方案的需求日益凸显。近日，Marvell美满电子与联发 科正评估将英特尔EMIB技术引入其ASIC芯片设计选项，引发业界广泛关注。 当前，台积电面临双重挑战：一方面，其先进封装产能短期内难以迅速扩张；另一方面，美国客户对全产业链本土化提出要求，而台积电及其供应链在美 国的后段产能布局尚未完备。 这一供需矛盾使英特尔的EMIB技术成为备受关注的替代路径。该技术采用2.5D封装架构，在异构芯片集成方面展现出独特优势。 行业动态进一步印证了这一趋势。苹果、高通与博通近期发布的招聘信息中，均明确提及EMIB相关技术职位，显示出领先企业正积极布局先进封装领域 的人才储备。此外，英特尔最新推出的3.5D封装技术，通过更精密的硅通孔实现了更高密度的芯片互联。 半导体公众号推荐 半导体论坛百万微信群 加群步骤： 值得关注的是，EMIB采用的嵌入式桥接方案，相较于传统中介层设计，在成本控制与良率提升方面更具优势。随着先进制程 ...

Core Viewpoint - The article discusses Intel's future prospects, particularly focusing on its wafer foundry business and the recent mass production of the 18A process node, which marks the completion of Intel's "Four Nodes in Five Years" strategy aimed at regaining process technology leadership and revitalizing its foundry business [2]. Group 1: Intel's 18A Process Node - The mass production of the 18A process node signifies a critical milestone for Intel, enabling the production of both client and edge computing products, as well as data center processors [2]. - The transition from TSMC manufacturing to in-house production of CPU and GPU chips is expected to enhance Intel's scale, reduce costs, and improve profit margins while delivering competitive products [2]. Group 2: Advanced Packaging Technologies - Chiplet technology is gaining traction in the semiconductor industry, with Intel leveraging its advanced packaging techniques, such as Foveros and EMIB, to enhance chip design and performance [3]. - Foveros technology allows for flexible chip configurations based on application needs, while EMIB technology interconnects multiple 18A chips in the new Clearwater Forest processors [3]. Group 3: Ecosystem Impact - The introduction of 18A chips and products like Panther Lake is anticipated to benefit the entire ecosystem by providing competitive products that enhance battery life and performance while lowering costs for OEM manufacturers [4]. - A healthy and competitive PC chip ecosystem is expected to deliver higher quality products at more competitive prices to consumers [5]. Group 4: Opportunities in Mobile Industry - Intel's foundry success could extend to the smartphone industry, presenting opportunities for cost reduction and supply chain diversification, despite the current dominance of TSMC in this market [5]. - Major smartphone manufacturers, including Apple, rely heavily on TSMC, which produces approximately 90% of global smartphone SoC chips [5]. Group 5: Competitive Landscape - Intel's foundry services could provide a competitive alternative to TSMC, especially with the anticipated introduction of the 14A process node, potentially curbing TSMC's price increases [6]. - TSMC has raised prices significantly over the past five years, and Intel's competitive offerings could alleviate cost pressures on chip suppliers and OEMs [6]. Group 6: Future Prospects for Intel's Foundry - Intel's foundry is actively seeking new clients to utilize its advanced capabilities, with the success of Panther Lake and Clearwater Forest products likely to attract more companies [7]. - The demand for cheaper, low-power chips and the desire for geopolitical supply chain diversification are expected to drive more business towards Intel's foundry services in the future [7].

Core Viewpoint - Intel's recent decisions to cut promising projects and lay off key personnel, including a significant talent loss to Samsung, indicate a shift in focus towards reducing operational losses and enhancing shareholder value, potentially jeopardizing its long-term technological advancements [2][3]. Group 1: Talent Loss and Company Strategy - Intel has lost a key employee, Dan Gang, who was responsible for glass substrate and EMIB technology, to Samsung, highlighting the company's struggle to retain talent amid aggressive restructuring efforts [2]. - The company has made radical decisions in its organizational structure and vision, aiming to reduce operational losses and improve shareholder value, which has led to the cancellation of promising projects and significant layoffs [2][3]. Group 2: Glass Substrate Technology - Intel initially planned to integrate glass substrate technology into its packaging services by the end of 2025, leveraging its years of development in this area to maintain a competitive edge [3]. - The glass substrate technology is expected to revolutionize semiconductor packaging and support the ongoing progress of Moore's Law, particularly in data centers, artificial intelligence, and high-performance computing [3]. Group 3: Advantages of Glass Substrate - Glass substrates offer significant advantages over traditional organic substrates, including ultra-low flatness, excellent thermal stability, and higher mechanical stability, which are crucial for high-power chip cooling [4]. - The potential for increased interconnect density with glass substrates is notable, with Intel indicating a tenfold increase compared to organic substrates, allowing for more transistors to be packed into a single package [4][5]. Group 4: Challenges and Future Prospects - The introduction of glass substrates faces challenges such as fragility, complex manufacturing processes, and limited layering capabilities, which require innovative engineering solutions [6]. - Despite these challenges, the development and application of glass substrate technology are expected to play an increasingly important role in meeting the semiconductor industry's demand for higher performance and lower power consumption [7].