Group 1 - TSMC has decided to adjust its advanced packaging capacity planning for CoWoS 2.5D heterogeneous integration technology, increasing its production targets for 2026-2027 [2] - The primary reason for TSMC's adjustment is the strong demand for high-end AI chips, particularly from its largest customer, NVIDIA, and the accelerating growth of AI ASIC production [4] - TSMC plans to add two new advanced packaging facilities focused on CoWoS technology at its AP8 plant in the southern science park, while also converting existing facilities originally intended for SoIC processes to CoWoS production [4] Group 2 - Media reports indicate that MediaTek, which recently entered the AI ASIC design service market, is increasing its orders with TSMC due to insufficient CoWoS capacity to meet customer demand [4] - The mass production timeline for panel-level CoPoS packaging has been postponed to 2029 [4] - TSMC is also considering building a new advanced packaging facility in Yunlin, and plans to double the number of advanced packaging facilities at its Arizona subsidiary from two to four [4]

盘面上，大型科技股多数走低，腾讯控股跌近4%，哔哩哔哩、网易跌超3%，百度集团跌近3%，小米集团、美团跌超1%；苹果概念股走弱，丘钛科技、 富智康集团、高伟电子跌超4%，瑞声科技跌超3%，舜宇光学科技跌超1%；半导体股多数下跌，上海复旦跌超5%，华虹半导体跌超4%，中芯国际跌超 2%；应用软件股下挫，金蝶国际跌超12%。 【导读】港股涨跌不一，应用软件股大跌！香港财政司司长陈茂波最新发声 2月4日，港股震荡，三大指数走势分化。 截至收盘，恒生指数涨0.05%，报26847.32点；恒生科技指数跌1.84%，报5366.44点；恒生国企指数跌0.05%，报9048.38点。 锂电池股齐涨，宁德时代（300750）涨超4%；煤炭股上扬，兖矿能源（600188）涨超10%，中煤能源（601898）涨超8%，中国神华（601088）、首钢资 源涨超5%。 | 名称 | 现价 | 涨跌幅 | | --- | --- | --- | | 腾讯控股 | 558.000 | -3.96% | | 0700.HK | | | | 阿里巴巴-W | 159.500 | -0.93% | | 9988.HK | | | | 小米集 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 在 2026 年 2 月 4 日举行的财务业绩发布会上，ROHM 总裁回答提问时表示："由于我们公司与 台积电共同创立的历史，我们已经从台积电购买了许可证，现在正朝着自主生产的方向发展。" ROHM计划在其滨松工厂（滨松市）启动一条8英寸生产线并开始生产。该公司还表示，如果需求 突然增加，将把部分生产外包给VIS。虽然投产时间将取决于项目启动的进展情况，但该公司正在 迅速采取行动，以尽可能减少影响，直到台积电撤出为止。 参考链接 https://eetimes.itmedia.co.jp/ee/articles/2602/04/news114.html （来源 ： 编译自eetjp ） 点这里加关注，锁定更多原创内容 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代表半导体芯闻对该 观点赞同或支持，如果有任何异议，欢迎联系我们。 推荐阅读 10万亿，投向半导体 芯片巨头，市值大跌 黄仁勋：HBM是个技术奇迹 Jim Keller：RISC-V一定会胜出 全球市值最高的10家芯片公司 喜欢我们的内容就点 "在看 " 分享给小伙伴哦~ 继台 ...

Core Viewpoint - The "Beijing Atomic-Level Manufacturing Innovation Development Action Plan (2026-2028)" emphasizes the development of high-precision scientific instruments and testing technologies, focusing on semiconductor and new materials sectors, with 20 key tasks outlined for technological breakthroughs [1][2]. Group 1: Instrument and Testing Equipment Breakthroughs - The plan includes a specific focus on "Atomic-Level Performance Measurement Equipment," aiming to develop high-end scientific instruments for atomic-scale measurement across three main areas: ultra-high precision measurement, micro-analysis detection, and extreme trace detection [1][2]. - Ultra-high precision measurement targets the development of laser interferometry equipment to achieve "sub-angstrom" precision, essential for advanced chip manufacturing [1]. - Micro-analysis detection involves creating integrated measurement equipment for failure analysis and defect localization in integrated circuits, addressing the need for material microstructure analysis [2]. - Extreme trace detection aims to develop equipment for detecting ultra-low concentration pollutants, targeting "ppb-level" gas sensing, crucial for environmental monitoring and semiconductor process cleanliness [2]. Group 2: Software Development for Atomic-Level Manufacturing - The action plan outlines the development of various software to support atomic-level manufacturing, including dynamic simulation software, process design software, phase change control software, and surface detection software [4][5]. - These software solutions aim to enhance precision modeling, process optimization, and quality monitoring in atomic-level manufacturing [4]. Group 3: Equipment for Atomic-Level Processing - The plan supports breakthroughs in equipment for atomic-level processing, including single crystal silicon wafer removal, atomic precision etching, and ultra-high vacuum maintenance equipment [6][7]. - Specific goals include achieving atomic-level precision in silicon wafer etching and developing equipment for the preparation of two-dimensional metal materials [6][7]. Group 4: Performance Measurement Equipment - The action plan emphasizes the development of laser interferometry measurement equipment and packaging detection equipment to meet the needs of advanced packaging integrated circuit chip failure analysis [10][11]. - The focus is on achieving high-resolution magnetic field detection and temperature field measurement capabilities [10]. Group 5: Application Breakthroughs - The plan aims to create typical applications in semiconductor manufacturing and new material creation, focusing on polishing, deposition, thinning, and detection processes [12]. - It emphasizes the integration of atomic-level manufacturing technologies and equipment to meet the demands of advanced semiconductor processes and special performance materials [12]. Group 6: Support Measures - The action plan includes measures to cultivate technology-based SMEs, high-tech enterprises, and innovative companies in the atomic-level manufacturing sector [13]. - It aims to secure national funding support and strengthen the talent pool in the industry, promoting the establishment of standardized committees and pilot platforms for atomic-level manufacturing [13].

英飞凌披露业绩，第一季度利润总额为6.55亿欧元，预计第二季度营收约为38亿欧元。公司预测 人工智 能 数据中心需求将带来收入增长。 ...

每经编辑｜段炼 2月4日，A股早盘震荡调整。截至中午休市，沪指报4067.67点，基本平收；深证成指报13997.72点，跌0.92%；创指报3266.99点，跌1.74%。全市超2300 股上涨，近3000股下跌。 煤炭股强势爆发，兖矿能源、中煤能源、陕西黑猫、晋控煤业等多股涨停；地产板块走强，荣安地产、京投发展、财信发展涨停；航空股"起飞"，东航涨 停，国航、南航等大涨。 | 新闻 | 大V 成分 | 资金 | 研报 | | | --- | --- | --- | --- | --- | | √ 含新股次新股 | | 最新 | 涨幅 | 5分钟涨速 | | 究矿能源 | | | | | | SH600188 | | 15.27 | +10.01% | 0.00% | | 业绩龙头 4 市值龙头 4 | | | | | | 美锦能源 | | 5.17 | +10.00% | 0.00% | | SZ000723 | | | | | | 中煤能源 SH601898 | | 14.08 | +10.00% | 0.00% | | 业绩龙头 2 市值龙头 3 | | | | | | 陕西黑猫 | | 4.62 | ...

分组1: Semiconductor Sector - The market is currently in a risk-off mode, influenced by Nvidia's recent performance and comments from OpenAI [2][4] - AMD's upcoming earnings report is critical for the semiconductor sector, with expectations that strong results could stabilize the market [4] - Intel is viewed as a potential alternative to Nvidia, with key price levels to watch around 52 and 54, indicating a possible breakout towards 65 if these levels are surpassed [5][6][7] 分组2: Apple - Apple has had a strong earnings report but faces concerns regarding memory and margins, with a recent trade deal with India boosting sentiment [13][15] - The stock is currently trading around 270, with potential targets of 275 to 285 if it breaks key resistance levels [14][16] - The stock's performance is notable given the overall market conditions, indicating a potential spike in near-term demand [16] 分组3: Hut 8 - Hut 8 has transitioned from Bitcoin mining to data center operations, showing resilience and outperforming many blue-chip stocks [24][25] - The stock has seen significant growth, up over 165% in the last 12 months, with a potential breakout target around 66 if it surpasses 59.60 [26][28] - Key price levels to monitor include 54 as a resistance point and 64.60 as a closing high, with the stock currently trading at 57.45 [29][32]

Core Viewpoint - Samsung Electronics and SK Hynix have announced the mass production of the sixth generation High Bandwidth Memory (HBM4), but they have postponed the introduction of hybrid bonding machines, which were initially expected to be partially used in HBM4 production [1][2] Group 1: Production and Technology - Samsung and SK Hynix plan to use existing TC bonding machines from companies like Semes and Hanmi Semiconductor for HBM4 mass production, even for the initially expected 16-layer HBM4 products [1] - The companies will continue to use the micro bump DRAM stacking method by adjusting the stacking height of HBM4, which involves reducing the bump pitch [1][2] - Hybrid bonding technology, considered a disruptive technology for the next generation of HBM, is still under research and testing, with large-scale production expected to take time [1][2] Group 2: Performance and Market Dynamics - The number of channels in HBM4 has doubled compared to the previous generation, and the interface width has increased, leading to enhanced signal transmission speeds per pin [2] - The design goal for HBM4 is to reduce the micro bump pitch to approximately 10 micrometers (µm), which is still expected to meet performance targets [2] - Current TC bonding machines can meet the standards set by the International Semiconductor Standards Organization (JEDEC), while hybrid bonding machines and no-flux bonding machines are more expensive and have lower yields [2] Group 3: Future Outlook - Samsung has sent samples of HBM4 using hybrid bonding technology to customers and expects gradual commercialization of HBM4E, the next generation [2] - Despite the potential of hybrid bonding technology for high-end product lines, TC bonding machines will continue to play a core role in mainstream HBM4E products due to stability and cost-effectiveness [2]

2026.02. 03 09:25 A股开盘丨三大指数集体高开 本文字数：655，阅读时长大约1分钟 作者 | 一财 阿驴 09:29 房地产板块高开，京投发展、城建发展涨停，华夏幸福、大龙地产、荣盛发展纷纷高开。消息面上，上海收购二手住房用于保障性租赁住房项目 工作实质性启动，浦东新区、静安区、徐汇区作为首批试点区。 09:27 半导体板块盘初走强，朗科科技、普冉股份双双涨超7%，芯导科技、恒烁股份、强一股份、北京君正、长川科技等个股跟涨。日前，中共中央、 国务院批复《现代化首都都市圈空间协同规划（2023-2035年）》，规划提出推动创新链产业链深度融合，发展先进制造业集群。 09:26 现货白银日内大涨7%，现报84.83美元/盎司。 沪指涨0.7%，深成指涨1.18%，创业板涨1.65%。科创综指涨1.5%。 | 代码 | 名称 | 两日图 | 现价 | 涨跌 | 涨跌幅 | | --- | --- | --- | --- | --- | --- | | 000001 | 上证指数 | | 4043.91 | 28.16 | 0.70% | | 399001 | 深证成指 | | 13986.89 | ...

公众号记得加星标⭐️，第一时间看推送不会错过。 日本青森县正遭逢近40年来最强暴风雪，当地官员直言：「威胁生命的危机已迫在眉睫」。青森是全 球前三大、亚洲最大探针卡厂MJC，及碳化矽大厂富士电机津轻半导体生产重镇，当地工商活动几乎 停摆，冲击攸关AI半导体生产关键元件探针卡与高压应用必备的碳化矽供应，科技业断链警铃大响。 其中，尤以探针卡供应状况最受瞩目，时值AI需求大爆发，业界直言，探针卡为晶圆测试不可或缺的 核心耗材，广泛应用于AI伺服器与高频宽记忆体（HBM），一旦生产或出货延误，将直接影响晶圆 测试排程，进而牵动整体交期。 MJC在青森共有两个生产据点，是旗下重要生产地。 MJC提供多种探针卡产品，广泛应用于半导体 晶圆测试及平面显示器（FPD）测试，主要分为记忆体（如DRAM和NAND Flash），以及微处理器 和逻辑IC等非记忆体领域。 MJC不仅在球AI时代扮演关键角色，近期记忆体市况火热，MJC在记忆体探针卡市占率居全球第 一，若后续出货受阻，同步影响记忆体晶片测试，进而牵动记忆体与AI出货进程，影响甚大。 青森也是富士电机津轻半导体的功率半导体生产重镇，富士电机津轻半导体在当地生产碳化矽元 ...