【DT新材料】 获悉，4月25日， 北京八亿时空 发布公告，终止全资子公司 浙江八亿时空 " 年产 3000 吨六氟磷酸锂项目 "（以下简称"项目"）。 项目预计总投资约 2.80亿元，截至目前，已投入约495.01万元于项目前期开发、工艺设计及人工费用等。公司声明，由于 锂电市场供需结构的转变，电 解液市场进入到价格低迷、市场严重内卷的冷却期 ， 公司决定终止项目，用以保存实力投入到现有落地的项目。 就在前几日，4月24日，八亿时空发布2025 年第一季度报告，公司实现营业收入为2.14亿元，同比上升20.61%；归母净利润为2404.32万元，同比上升 25.25%；扣非归母净利润为2328.33万元，同比上升26.69%。 4月25日，八亿时空发布了 2024年度报告 ，公司实现全年营业收入7.37亿元，同比下降7.77%；实现归母净利润7,660.39万元，同比下降2 8.27%；实现 扣非归母净利润6,209.43万元，同比下降32.29%。 | | | | | 单位:万元 币种:人民币 | | --- | --- | --- | --- | --- | | 主要会计数据 | 2024年 | 202 ...

2025 年 04 月 27 日 供需格局优化，复合肥、金属铬、 细分农药迎景气提升，重点关注低 估值高成长标的 看好 ——《化工周报 25/04/21-25/04/25》 证 券 研 究 报 告 证券分析师 行 业 及 产 业 基础化工 马昕晔 A0230511090002 maxy@swsresearch.com 宋涛 A0230516070001 songtao@swsresearch.com 研究支持 邵靖宇 A0230524080001 shaojy@swsresearch.com 任杰 A0230522070003 renjie@swsresearch.com 赵文琪 A0230523060003 zhaowq@swsresearch.com 周超 A0230123090004 zhouchao@swsresearch.com 李绍程 A0230124070001 lisc@swsresearch.com 联系人 马昕晔 (8621)23297818× maxy@swsresearch.com 本研究报告仅通过邮件提供给 中庚基金 使用。1 本期投资提示： 请务必仔细阅读正文之后的各项信息披露与声 ...

Group 1: Industry Development and Innovation - The Chinese government emphasizes the importance of integrating innovation chains, industrial chains, financial chains, and talent chains to accelerate the transformation of technological achievements into productive forces [1] - Wuhan is focusing on developing new productive forces by establishing 16 industrial chains, with private enterprises playing a dual role as "chain leaders" and "key supporters" [1] - Companies like Huazhong CNC, Dinglong Holdings, and Chipking Technology are leading the charge in their respective fields, contributing to the formation of a collaborative innovation ecosystem in Wuhan [1] Group 2: Chip Industry - Chipking Technology has successfully mass-produced China's first 7nm automotive-grade intelligent cockpit chip, "Longying No. 1," and is leading the domestic market in this segment [3][4] - The company is also developing the "Xingchen No. 1" chip for advanced driver assistance systems, which is expected to be mass-produced this year and widely adopted by 2026 [3][4] - Chipking Technology is building a self-controlled automotive chip supply chain by collaborating with upstream and downstream partners [2][4] Group 3: Semiconductor Materials - Dinglong Holdings specializes in providing critical materials for semiconductor manufacturing, including CMP polishing pads and photoresists, and has become a key player in the global semiconductor materials supply chain [9][11] - The company has successfully reduced the delivery cycle of its products to 3-4 weeks, supporting the large-scale production of integrated circuits [10][12] - Dinglong Holdings is leading the establishment of the "Wuhan Advanced Functional Materials Industry Innovation Joint Laboratory" to focus on the research and development of advanced functional materials [12] Group 4: Advanced Manufacturing - Huazhong CNC has launched the "Huazhong No. 10" intelligent CNC system, which integrates AI technology to enhance manufacturing efficiency and product quality [19][20] - The company is collaborating with local enterprises to develop high-end CNC systems and is part of a joint laboratory aimed at advancing core technologies in this field [21] - The joint laboratory is expected to become a leading platform for high-end CNC system research and development, promoting the transformation and upgrading of Wuhan's high-end manufacturing industry [21] Group 5: Life Sciences Innovation - Aibotai has upgraded its role to a life sciences innovation hub, supporting 12 high-end life science instrument companies and focusing on technology and product recognition [25][26] - The company has successfully incubated innovative products in the cardiovascular field, with plans for market launch this year [26] - Aibotai aims to leverage Wuhan's strong educational and industrial foundation to become a leading center for life sciences innovation [26]

Core Insights - The company reported strong financial results for 2024 and Q1 2025, with significant year-on-year growth in revenue and net profit [1][2][3] - The semiconductor components business is rapidly growing, contributing to a larger share of total revenue, and is expected to benefit from domestic substitution trends [2][3] Financial Performance - In 2024, the company achieved revenue of 3.6 billion, a year-on-year increase of 38.6%; non-recurring net profit was 300 million, up 94.9%; and net profit attributable to shareholders was 400 million, an increase of 56.8% [1] - For Q1 2025, revenue reached 1 billion, a 29.5% increase year-on-year; net profit attributable to shareholders was 160 million, up 163.6%; and non-recurring net profit was 90 million, a 30.4% increase [1] - The company recorded investment income of 68.07 million in Q1 2025 from the partial transfer of equity in an associate, significantly boosting net profit [1] Business Segments - The high-end target material business generated revenue of 2.333 billion in 2024, a 39.5% increase, with the company expanding its global market share in sputtering target materials [1] - The semiconductor components business achieved revenue of 887 million in 2024, a 55.53% increase, and accounted for 24.6% of total revenue, up 2.7 percentage points year-on-year [2] - The company’s components are widely used in key semiconductor processes, and there is significant potential for domestic substitution in the supply chain [2] Future Outlook - The company has raised its profit forecasts and maintains a "buy" rating, expecting revenue for 2025-2027 to be 4.56 billion, 5.75 billion, and 7.35 billion respectively, with year-on-year growth rates of 26.4%, 26.2%, and 27.8% [3] - Net profit for the same period is projected to be 520 million, 670 million, and 920 million, with growth rates of 29.0%, 29.7%, and 37.9% respectively [3]

2025 年 04 月 24 日 沪硅产业(688126.SH) 300mm 硅片放量显成效，短期承压不改 长期成长逻辑 事件：4 月 23 日，公司发布 2024 年度报告 1）2024 年公司实现营业收入 33.88 亿元，同比+6.18%；归母净利润 -9.71 亿元，同比-620.28%；扣非归母净利润-12.43 亿元，同比- 649.09%。 2）24Q4 公司实现营业收入 9.09 亿元，同比+13.61%；归母净利润- 4.34 亿元，同比-1569.5%；扣非归母净利润-5.98 亿元，同比- 481.08%。 300mm 硅片放量驱动营收增长，产能扩张拖累短期盈利 收入端，24 年公司 300mm 半导体硅片表现亮眼，销量同比增长超 70%、 收入增长超 50%，成为全年营收增长的核心动力。利润端，多重因素 下公司业绩短期承压，主要原因包括：1）价格压力：200mm 硅片受行 业景气度下滑影响，均价显著下跌；2）商誉减值：因并购标的估值 调整，公司计提 Okmetic、新傲科技商誉减值约 3 亿元；3）折旧压 力：公司 300mm 半导体硅片产能释放，但由于行业高固定成本特性， 导致扩产项 ...

Company Overview - The company is dedicated to the research, production, and sales of semiconductor packaging materials, specifically epoxy molding compounds and electronic adhesives, and is one of the few specialized factories in China for chip-level solid and liquid packaging materials [8][9] - The main products include epoxy molding compounds and electronic adhesives, which are widely used in semiconductor packaging and board-level assembly [9][12] Business Model - The company employs a research and development model focused on optimizing the formulation and production processes of semiconductor packaging materials [10] - The procurement model involves a dedicated procurement department that collaborates with various departments to select suppliers and manage material needs [10] - The production model combines sales-driven production with demand forecasting to ensure alignment between production plans and sales [11] - The sales model is customer-centric, primarily targeting direct customers while also engaging with trading partners, with a strong sales presence in East China, Southwest China, and South China [11] Industry Position - Since its establishment in 2010, the company has focused on the R&D and industrialization of semiconductor packaging materials, achieving significant technological advancements and market recognition [19] - The company is recognized as a national high-tech enterprise and has established stable partnerships with leading industry players, enhancing its market share and brand influence [19] Financial Performance - In the reporting period, the company achieved operating revenue of 331.63 million yuan, a year-on-year increase of 17.23%, and a net profit attributable to shareholders of 40.06 million yuan, up 26.63% year-on-year [24] Profit Distribution Plan - The company plans to distribute a cash dividend of 2.00 yuan per 10 shares (including tax) for the 2024 fiscal year, with a total proposed cash dividend amounting to approximately 24.13 million yuan, representing 60.23% of the net profit attributable to shareholders [55][54]

Report Industry Investment Rating No relevant content provided. Core Views - The company's convertible bond, Dinglong Convertible Bond, has a fundraising of 910 million yuan. After deducting issuance fees, it will be used for the industrialization project of 300 tons of KrF/ArF photoresist per year, the project of a domestic industrial base for key upstream raw materials of optoelectronic semiconductor materials, and the replenishment of working capital. It is expected to be listed on April 23, 2025, with a listing price above 130 yuan [1]. - The company has successfully expanded from printing and copying consumables to semiconductor materials. With high R & D intensity, the company's semiconductor business has a gross profit margin above 60% and is rising steadily, and the comprehensive gross profit margin has rapidly increased to over 45%. As revenue grows, profitability has also improved rapidly [2]. - The company is accelerating R & D to achieve a platform - based layout of semiconductor materials. In the future, the localization rate of semiconductor materials in China will increase. According to Wind's consensus forecast, the company's expected归母 net profits in 2024 and 2025 are 507 million yuan and 690 million yuan respectively, corresponding to PEs of 55.33X and 40.67X [3]. - The company's valuation is at a medium level in the past 5 years, with good stock price elasticity and high institutional attention. The convertible bond has a general parity and good bond - bottom protection [4]. Summary by Directory I. Convertible Bond Clause Analysis - The issuance scale of the convertible bond is 910 million yuan, with a term of 6 years. The initial conversion price is 28.68 yuan. The dilution rate of full conversion to the company's A - share total share capital is 3.38%, and to the non - restricted tradable shares is 4.36%. The conversion period starts from October 9, 2025, to the maturity date (April 1, 2031). The original shareholder placement ratio is 71.10% [10]. - The 6 - year coupon rates of the convertible bond are 0.20%, 0.40%, 0.80%, 1.50%, 1.80%, and 2.00% respectively, which are comparable to the average level of recently issued convertible bonds. The redemption price at maturity is 110 yuan. The bond has an AA rating for both the issuer and the bond itself, and there is no guarantee. The additional terms are standard. As of April 21, 2025, the conversion parity is 104.32 yuan, and the pure - bond YTM is 2.44%, indicating good bond - bottom protection [11][12]. II. Underlying Stock Fundamentals - The company is a privately - owned enterprise with a general equity concentration. As of September 30, 2024, Zhu Shuangquan and Zhu Shunquan are the controlling shareholders and actual controllers, holding a total of 29.71% of the company's shares [13]. - The company has transformed from printing and copying consumables to semiconductor materials. In the first three quarters of 2024, the company achieved sales revenue of 2.425 billion yuan, a year - on - year increase of 29.54%. The revenue of optoelectronic semiconductor materials and chips reached 1.086 billion yuan, accounting for 45%, while the revenue of printing and copying general consumables was 1.322 billion yuan, with a relatively stable scale but a decreasing proportion [13][14]. - Benefiting from the increasing proportion of semiconductor materials, the company's gross profit margin has been rising year by year. The gross profit margin of printing and copying general materials fluctuates between 25% - 30%, while that of semiconductor materials has been above 60% and reached nearly 70% in Q3 2024. The current comprehensive gross profit margin is above 45% [17]. - The company's R & D investment is high, with the R & D expense ratio increasing from 10% to 12% in the past three years. It has broken foreign monopolies in multiple semiconductor material fields and formed a rich product matrix [18]. - The global semiconductor material market is expected to reach over $87 billion by 2027, and the domestic market is growing faster. However, many key semiconductor materials are still dominated by foreign companies, and the localization rate of semiconductor materials in China will increase in the future [25]. - The company has become a leading domestic CMP polishing pad manufacturer. It has also achieved mass production of CMP polishing fluid and is accelerating capacity construction. In the display material field, it has broken the monopoly of Japanese and Korean enterprises and achieved domestic leading supply. High - end semiconductor photoresist and advanced packaging materials are under R & D, and the mass - production plan of semiconductor photoresist is in progress [27]. - The company's printing and copying consumables business is developing steadily. In 2024, the company's profitability increased rapidly, with the expected归母 net profit ranging from 490 million yuan to 530 million yuan, a year - on - year increase of 120.71% - 138.73% [28]. III. Analysis of Convertible Bond Fund - Raising Projects - The company's convertible bond fundraising of 910 million yuan will be used for the industrialization project of 300 tons of KrF/ArF photoresist per year (with an investment of 804 million yuan and a planned use of 480 million yuan of the raised funds), the project of a domestic industrial base for key upstream raw materials of optoelectronic semiconductor materials (with an investment of 235 million yuan and a planned use of 170 million yuan of the raised funds), and the replenishment of 260 million yuan of working capital [35][36]. - The 300 - ton KrF/ArF photoresist industrialization project is to build a production line in Qianjiang Jianghan Salt Chemical Industrial Park, mainly for 12 - inch wafer manufacturing in advanced processes, with a planned construction period of three years. The project of a domestic industrial base for key upstream raw materials of optoelectronic semiconductor materials is to research and produce key upstream raw materials for semiconductor process materials and semiconductor display materials, with a planned construction period of two years [35].

证券代码：300236 证券简称：上海新阳 公告编号：2025-023 一、重要提示 本年度报告摘要来自年度报告全文，为全面了解本公司的经营成果、财务状况及未来发展规划，投资者 应当到证监会指定媒体仔细阅读年度报告全文。 所有董事均已出席了审议本报告的董事会会议。 众华会计师事务所（特殊普通合伙）对本年度公司财务报告的审计意见为：标准的无保留意见。 本报告期会计师事务所变更情况：公司本年度会计师事务所由变更为众华会计师事务所（特殊普通合 伙）。 非标准审计意见提示 □适用 √不适用 公司上市时未盈利且目前未实现盈利 □适用 √不适用 董事会审议的报告期利润分配预案或公积金转增股本预案 √适用 □不适用 公司经本次董事会审议通过的利润分配预案为：以311496558为基数，向全体股东每10股派发现金红利 2.6元（含税），送红股0股（含税），以资本公积金向全体股东每10股转增0股。 董事会决议通过的本报告期优先股利润分配预案 □适用 √不适用 二、公司基本情况 1、公司简介 ■ 晶圆制造及先进封装用电镀液和添加剂系列产品为公司面向芯片制造领域开发的第二代电子电镀产品。 主要包括大马士革铜互连、TSV、Bumpi ...

Investment Rating - The investment rating for the company is "Buy-A" with a target price of 87.50 CNY per share, maintaining the rating [4]. Core Insights - The company achieved a revenue of 3.605 billion CNY in 2024, representing a year-on-year increase of 38.57%, and a net profit of 401 million CNY, up 56.79% year-on-year [1]. - The company is a leading domestic supplier of semiconductor sputtering targets, with a significant market share and continuous growth in its ultra-pure target business, which generated 2.333 billion CNY in revenue, accounting for 64.73% of total revenue [7]. - The precision components business saw a substantial revenue increase of 55.53% year-on-year, reaching 887 million CNY, with products covering over 85% of industry needs [7]. Financial Performance - The company's gross margin for 2024 was 28.17%, a decrease of 1.03 percentage points year-on-year, with specific margins for ultra-pure targets, precision components, and other businesses at 31.35%, 24.27%, and 17.92%, respectively [2]. - Research and development expenses for the year were 217 million CNY, with a compound annual growth rate of 32.06% over the past three years, indicating a strong commitment to innovation [2]. - The company forecasts revenues of 4.756 billion CNY, 6.185 billion CNY, and 7.970 billion CNY for 2025, 2026, and 2027, respectively, with net profits projected at 553 million CNY, 737 million CNY, and 980 million CNY [9][11]. Market Position and Growth Potential - The company is positioned to benefit from the accelerated localization of semiconductor equipment, with increasing demand for component replacements and new equipment purchases [7]. - A partnership with KSTE INC. aims to localize the production of electrostatic chucks, tapping into a market projected to grow from 1.724 billion USD in 2023 to 2.426 billion USD by 2030, with a compound annual growth rate of 5% [8]. - The company has made significant breakthroughs in new ultra-pure target products and is expanding its product offerings in precision components, enhancing its competitive edge in the market [3][7].

证券研究报告 | 首次覆盖报告 gszqdatemark 2025 04 11 年 月 日 清溢光电（688138.SH） 掩模版国产替代中军，平板显示+半导体双轮加速成长 深耕掩膜版领域，业绩稳健增长。清溢光电成立于 1997 年，专注高精度掩膜版的生产和技 术创新，2019 年成功在上海证券交易所上市，在掩膜版领域公司始终保持国内领先地位， 公司作为国内规模最大的掩膜版产品和服务提供商之一，具备各类掩膜版产品设计、研发、 制造与销售能力，产品主要涉及平板显示和半导体产业，涵盖了平板显示、触控、柔性电路、 集成电路凸块、集成电路代工、集成电路载板、MicroLED 芯片、微机电等领域掩膜版，凭借 自主创新的技术研发实力、订单的响应快速速度、丰富优质的产品及服务来满足客户需求。 从业绩角度来看，清溢光电 2024 年实现营收 11.12 亿元，同比增长 20.35%，实现归母净 利润 1.7 亿元，同比增长 28.8%，2019-2024 年，公司营收及归母净利润 CAGR 分别达 18.32%，19.66%，实现业绩稳健发展。 面板产能提升+新型显示技术发展驱动掩模版市场增长，本土厂商大有可为。掩膜版是平板 ...