01 周价格表 | 多晶硅 (Per KG) | 高点 | 低点 | 均价 | 涨跌幅 | | --- | --- | --- | --- | --- | | N型复投料(RMB) | 55.000 | 47.000 | 50.000 | 0.00% | | N型致密料(RMB) | 53.000 | 45.000 | 48.000 | 0.00% | | N型颗粒硅(RMB) | 49.000 | 45.000 | 47.000 | 0.00% | | 非中国区多晶硅(USD) | 22.000 | 13.100 | 17.500 | 0.00% | | 硅片 (Per Pc) | 高点 | 低点 | 均价 | 涨跌幅 | | N型183单晶硅片-183mm/130pm (RMB) | 1.200 | 1.150 | 1.150 | 0.00% | | N型210单晶硅片-210mm/130pm (RMB) | 1.500 | 1.450 | 1.500 | 0.00% | | N型210R单晶硅片-210*182mm/130μm (RMB) | 1.200 | 1.150 | 1.200 | 0.00% ...

根据Tr e n dFo r c e集邦咨询最新调查，随着汽车产业加速电动化、智能化进程， 预计将推升全球 车 用 半 导 体 市 场 规 模 从 2 0 2 4 年 的 6 7 7 亿 美 元 左 右 ， 稳 健 增 长 至 2 0 2 9 年 的 近 9 6 9 亿 美 元 ， 2 0 2 4 - 2 0 2 9复合年增长率(CAGR)达7 . 4% 。 Dec. 17, 2025 然 而 ， 各 车 用 芯 片 市 场 的 成 长 极 不 平 均 ， 以 逻 辑 处 理 器 和 高 阶 存 储 器 为 代 表 的 高 性 能 计 算 (HPC)芯片，增速显著超越微控制器(MCU)等传统零部件，反映市场价值快速向支持智能化、 电动化的核心技术领域集中。 Tr e n dFo r c e集邦咨询研究显示， 2 0 2 5年全球电动汽车(含BEV、PHEV、FCV、HEV)于新车 市场的渗透率将上升至2 9 . 5% ，汽车产业也同时加快智能化脚步，需依赖多传感器配置、高速 通讯与AI模型应用等核心要素，电子电气架构(E/E Ar c h it e c t u r e ) 从分散式过渡至域集中式、 中央集中式 ...

Group 1 - The article highlights the significant growth in the demand for optical transceiver modules, predicting that the global market for modules above 800G will reach 24 million units by 2025 and nearly 63 million units by 2026, representing a growth rate of 2.6 times [2] - The semiconductor industry is expected to see a strong performance in Q3 2025, driven by high-performance computing (HPC) and demand for new consumer electronics, with the top ten foundries collectively generating revenue of approximately $45.1 billion, a quarter-over-quarter increase of 8.1% [5][6] - The introduction of NVIDIA's H200 chip is anticipated to attract significant procurement from Chinese cloud service providers (CSPs) and OEMs, as it offers substantial performance improvements over the previous H20 model [7] Group 2 - The article discusses the ongoing price increases in memory products, with expectations that smartphone and laptop brands will raise prices and downgrade specifications due to rising costs, leading to a concentration of resource advantages among a few leading brands [3] - The article provides a detailed breakdown of memory configurations for smartphones and laptops, indicating a trend towards lower specifications in mid-range and entry-level devices, with high-end smartphones maintaining configurations of 12-16GB and laptops focusing on 16GB as the mainstream option [4] - The global humanoid robot market is projected to reach over 50,000 units by 2026, driven by advancements in key components and differing application scenarios across major economies, particularly Japan, the US, and China [10]

Core Insights - The global wafer foundry industry continues to benefit from high-performance computing (HPC) and demand for new consumer electronics, with the top ten foundries experiencing a revenue increase of 8.1% quarter-over-quarter in Q3 2025, reaching approximately $45.1 billion [2][3]. Revenue Performance - TSMC (Taiwan Semiconductor Manufacturing Company) reported a revenue of $33.1 billion in Q3 2025, a 9.3% increase from the previous quarter, maintaining a market share of 71% [3][6]. - Samsung's revenue remained stable at approximately $3.2 billion, with a slight market share decrease to 6.8% [3][6]. - SMIC (Semiconductor Manufacturing International Corporation) achieved a revenue of $2.4 billion, up 7.8% quarter-over-quarter, holding a market share of 5.1% [3][6]. - UMC (United Microelectronics Corporation) reported a revenue of nearly $1.98 billion, a 3.8% increase, with a market share of 4.2% [3][6]. - GlobalFoundries maintained its revenue at approximately $1.69 billion, with a slight market share decline to 3.6% [3][7]. - HuaHong Group's revenue exceeded $1.21 billion, with a market share of 2.6% [3][8]. - Vanguard (VIS) reported a revenue increase of 8.9% to $412 million, maintaining a market share of 0.9% [3][8]. - Nexchip's revenue grew by 12.7% to $409 million, surpassing Tower Semiconductor to become the eighth-largest foundry [3][9]. - Tower Semiconductor's revenue was approximately $396 million, a 6.5% increase, with a market share of 0.9% [3][9]. - PSMC (Powerchip Semiconductor Manufacturing Corporation) reported a revenue of $363 million, a 5.2% increase, with a market share of 0.8% [3][9]. Market Trends - The demand for advanced process nodes (7nm and below) is driving significant revenue contributions, particularly from HPC and consumer electronics [2]. - The industry anticipates a conservative outlook for 2026 due to international market conditions and a cautious approach to mainstream terminal applications [2].

Core Insights - The article highlights the anticipated significant increase in memory prices in Q1 2026, which will lead to cost challenges for global end products, particularly in the smartphone and laptop industries. This situation is expected to result in price adjustments and specification reductions, concentrating resource advantages among a few leading brands [2][3]. Memory Price Impact on Smartphones - Memory components are increasingly affecting the BOM cost of consumer electronics like smartphones and PCs. For instance, the iPhone series will see a notable rise in memory's share of BOM cost, prompting Apple to reconsider new device pricing and potentially reduce or eliminate price cuts on older models [2][3]. - Android brands, which target the mid-to-low price market, will also face pressure to raise new device prices and adjust old device pricing or supply cycles due to the soaring memory prices [2][3]. Adjustments in Laptop Market - Laptop brands are expected to modify their product mix, procurement strategies, and regional sales layouts in response to rising memory prices. High-end lightweight laptops, which typically have mobile DRAM soldered onto the motherboard, will likely experience the most significant price pressure [3]. - The consumer laptop market may maintain existing pricing in the short term due to inventory support but is expected to enter a notable price adjustment phase by Q2 2026 [3]. Specification Adjustments - Brands are increasingly adopting "spec reduction" or "upgrade postponement" as necessary strategies to balance costs, particularly with DRAM, which has a high cost share. High-end and mid-range products will see DRAM capacity specifications converge towards the market's minimum standards, slowing down enhancement speeds [3]. - The low-end market will be the most affected price segment, with smartphones expected to revert to a predominant 4GB configuration in 2026. Low-cost laptops will face limitations in DRAM configuration adjustments due to processor and operating system requirements [3][4]. Summary of Adjusted Specifications - **Smartphones**: - High-end: 12-16GB (slower progression towards 16GB) - Mid-range: 6-8GB (12GB gradually disappearing) - Low-end: 4GB (returning to 4GB due to supply and cost limits) [4] - **Laptops**: - High-end: 16-64GB (mainstream shipments concentrated at 16GB) - Mid-range: 8-16GB (shifting towards 8GB) - Low-end: 8GB (short-term adjustments unlikely) [4]

根据Tr e n dFo r c e集邦咨询最新发布的存储现货价格趋势报告，DRAM方面，DDR5和DDR3现货 价 格 本 周 小 幅 回 落 ， 此 前 的 快 速 上 涨 促 使 部 分 交 易 商 在 年 底 获 利 了 结 ； 而 DDR4 价 格 则 继 续 攀 升，尤其是1 6Gb产品。与此同时，NAND闪存的关键支撑来自供应端，由于供应商在年底临近 之际并未发布更多Wa f e r，在市场活动受限的情况下，现货价格持续走高。 本周( 1 2 / 3 - 1 2 / 9 )以来，DDR5与DDR3部分因为先前价格快速拉高、涨势过快，近期略微出现小 幅下跌。Tr e n dFo r c e观察到，部分交易商因为年终将近，进行部分获利调节，但不影响整体市况 吃紧态势。 DDR4部分价格持续上涨，尤其以1 6Gb颗粒为最。近期现货价格的变化不影响1Q2 6合约价格仍 将大幅上涨的预测。主流颗粒DDR4 1Gx 8 3 2 0 0MT/s在本周的价格涨幅为2 . 0 0%(由US$ 1 6 . 7 2 9 上涨至US$ 1 7 . 0 6 4 )。 本周( 1 2 / 3 - 1 2 / 9 )Wa f ...

Core Viewpoint - The article discusses the current state of the photovoltaic industry, highlighting the weak supply-demand dynamics across various segments, including polysilicon, wafers, cells, and modules, while also providing price trends and forecasts for each segment [5][8][11][13]. Polysilicon - The market is experiencing a "weak demand and increasing supply" scenario, with downstream crystal pulling factories reducing production significantly, leading to cautious procurement [5]. - Industry inventory remains high at over 450,000 tons, with a concentration among leading companies, which enhances their pricing power [6]. - Despite the supply-demand imbalance, the concentrated market structure and policy support for silicon material storage platforms provide price resilience in the short term, with potential for price rebounds if management mechanisms are effective [6]. Wafers - The market is facing a severe "double weakness" in supply and demand, with a rapid decline in downstream demand and significant price pressure from manufacturers [8]. - Inventory levels have surpassed 25 GW, primarily concentrated in the 210RN size, indicating substantial pressure for inventory digestion [9]. - Although some low-price dumping by individual companies is affecting price stability, prices are nearing cash cost levels, suggesting limited room for further declines [10]. Cells - The industry is adopting significant production cuts in response to severe supply-demand excess and rising silver paste costs, particularly among leading manufacturers [11]. - Inventory levels in the cell segment are rising, with turnover days reaching around 10 days due to insufficient downstream demand [11]. - Current prices are close to cash cost lines, with market stabilization expected due to high silver paste costs and the establishment of silicon material storage platforms [12]. Modules - The ongoing off-season effect has led to a noticeable decline in terminal demand, resulting in a significant drop in orders for module manufacturers [13]. - The price focus for modules continues to decline, with conventional prices dropping to around RMB 0.65/W, and some extreme low-price orders reaching RMB 0.62/W [13]. - The overall market is expected to remain under the influence of off-season effects, with limited price recovery anticipated in the short term [13].

Dec. 10, 2025 产业洞察 观察中国整体高阶AI芯片市场发展，预估2 0 2 6年总量有望成长逾6 0%。预计2 0 2 6年本土AI芯 片 仍 会 朝 向 自 主 化 发 展 ， 较 具 发 展 潜 力 的 主 要 IC 设 计 业 者 有 机 会 扩 大 市 场 占 比 至 5 0% 左 右 ， NVIDIA H2 0 0或AMD MI 3 2 5等其他同级的海外产品，在可输入中国市场的情况下，有机会维 持约近3 0%占比。 H2 0 0因效能明显优于H2 0，出口中国有望吸引CSP、OEM采购。 预估2 0 2 6年中国主要IC设计业者AI芯片占比将提升至5 0% 如果你觉得这篇文章有价值，记得点赞并分享给更多人知道！ TrendForce集邦咨询 TrendForce 半导体产业 趋势分析 商业洞察 信息精选 据新华社报道，美国将允许NVIDIA（英伟达）向中国出口H2 0 0芯片，Tr e n dFo r c e集邦咨询表 示 ， H2 0 0 效 能 较 H2 0 大 幅 提 升 ， 对 终 端 客 户 具 有 吸 引 力 ， 若 2 0 2 6 年 能 顺 利 销 售 ， 预 期 中 ...

Dec. 9, 2025 在全球各主要经济体持续推动人形机器人发展趋势下，日本厂商持续精进传动、感测、控制等 关 键 零 组 件 技 术 ， 以 提 高 替 代 门 槛 ， 与 美 国 、 中 国 业 者 积 极 发 表 终 端 人 形 产 品 的 做 法 形 成 对 比。美、中、日机器人产业锁定的应用场景各异，于2 0 2 6年也将面临不同发展节点。 Tr e n dFo r c e集邦咨询预估， 2 0 2 6年将是人形机器人迈向商用化的关键年，全球出货量可望突 破5万台，年增逾7 0 0% 。在国际机器人大会(iREX 2 0 2 5 ) 上，Kawa s a k i He a v y I n d u stri e s发 表最新人形整机Ka l e i d o 9，可搬3 0公斤货架、学习使用清扫工具，并支援虚拟头戴装置远端操 控，主攻灾害现场。Ha rmo n i c Dri v e针对人形机器人各部位提出减速机最佳化配置，如颈部、 手臂着眼扁平高扭矩，以兼顾输出与空间利用，手指则导入超小型系列产品，精进抓取能力。 PS:当您需要在报道中引用TrendForce集邦咨询提供的研报内容或分析资料，请注明 ...

Dec. 8, 2025 产业洞察 根据Tr e n dFo r c e集邦咨询最新研究，随着数据中心朝大规模丛集化发展，高速互联技术成为决 定 AI 数 据 中 心 效 能 上 限 与 规 模 化 发 展 的 关 键 。 2 0 2 5 年 全 球 8 0 0G 以 上 的 光 收 发 模 块 达 2 4 0 0 万 支，2 0 2 6年预估将会达到近6 3 0 0万组，成长幅度高达2 . 6倍。 至于光收发模块当中，除了发射端的激光光源之外，同时也需要光二极管（Ph o t oDi o d e , PD） 作为光接收元件。为了要搭配更高速的激光光源传输速度，目前各家PD厂商也纷纷投入开发可 以接收2 0 0G传输信号的高速PD，包括Co h e r e n t, Ma c om, Br o a d c om,Lume n t um等厂商也推出 了2 0 0G的高速PD。 由于高速PD和EML与CW激光一样，皆采用INP(磷化铟) 基板再进行磊晶。在激光光源短缺的 情况下，激光厂商倾向将多数磊晶产能配置于生产激光光源，同时通过外包的方式将INP磊晶 交由iET-英特磊、全新等专业磊晶代工厂商协助生产。 Tr ...