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中芯国际取得半导体结构、形成方法及掩膜版专利
Sou Hu Cai Jing· 2025-12-09 04:21
来源:市场资讯 中芯国际集成电路制造(北京)有限公司,成立于2002年,位于北京市,是一家以从事计算机、通信和 其他电子设备制造业为主的企业。企业注册资本100000万美元。通过天眼查大数据分析,中芯国际集成 电路制造(北京)有限公司共对外投资了1家企业,参与招投标项目53次,专利信息5000条,此外企业 还拥有行政许可225个。 声明:市场有风险,投资需谨慎。本文为AI基于第三方数据生成,仅供参考,不构成个人投资建议。 国家知识产权局信息显示,中芯国际集成电路制造(上海)有限公司、中芯国际集成电路制造(北京) 有限公司取得一项名为"半导体结构、形成方法以及掩膜版"的专利,授权公告号CN114068558B,申请 日期为2020年7月。 天眼查资料显示,中芯国际集成电路制造(上海)有限公司,成立于2000年,位于上海市,是一家以从 事计算机、通信和其他电子设备制造业为主的企业。企业注册资本244000万美元。通过天眼查大数据分 析,中芯国际集成电路制造(上海)有限公司共对外投资了4家企业,参与招投标项目127次,财产线索 方面有商标信息150条,专利信息5000条,此外企业还拥有行政许可446个。 ...
芯片龙头ETF(516640)开盘跌0.38%,重仓股中芯国际跌1.38%,寒武纪跌3.02%
Xin Lang Cai Jing· 2025-12-09 02:21
Core Viewpoint - The Chip Leader ETF (516640) opened at a decline of 0.38%, priced at 1.046 yuan, indicating a downward trend in the semiconductor sector [1] Group 1: ETF Performance - The Chip Leader ETF (516640) has a performance benchmark based on the CSI Chip Industry Index return rate [1] - Since its establishment on August 19, 2021, the ETF has achieved a return of 5.16% [1] - Over the past month, the ETF has experienced a return of -2.03% [1] Group 2: Major Holdings Performance - Major holdings within the ETF include: - SMIC (中芯国际) down 1.38% [1] - Cambricon (寒武纪) down 3.02% [1] - Haiguang Information (海光信息) down 1.33% [1] - Northern Huachuang (北方华创) down 0.43% [1] - Lattice Technology (澜起科技) up 0.02% [1] - Zhaoyi Innovation (兆易创新) down 0.88% [1] - Zhongwei Company (中微公司) down 1.47% [1] - OmniVision (豪威集团) up 0.02% [1] - Chipone (芯原股份) down 2.06% [1] - Changdian Technology (长电科技) down 0.43% [1]
港股异动 | 芯片股承压走低 华虹半导体(01347)跌超3% 中芯国际(00981)跌超2%
智通财经网· 2025-12-09 01:37
消息面上,据环球网援引媒体报道,美国总统特朗普当地时间8日在社交媒体上发文宣布,美国政府将 允许英伟达向中国出售其H200人工智能芯片,但对每颗芯片收取一定费用。报道称,H200芯片为英伟 达"性能第二强"的芯片。特朗普表示,美方将从相关芯片出口中收取 25% 的分成。他还称,美国商务 部正在敲定相关安排细节,同样的安排也将适用于超微半导体公司、英特尔等其他人工智能芯片公司。 智通财经APP获悉,芯片股承压走低,截至发稿,华虹半导体(01347)跌3.08%,报77港元;中芯国际 (00981)跌2.09%,报70.3港元。 ...
12月8日科创板主力资金净流入27.46亿元
沪深两市全天主力资金净流入26.02亿元,其中,科创板主力资金净流入27.46亿元,主力资金净流入的 有263只股,主力资金净流出的有328只股。 主力资金净流入排名 | 代码 | 简称 | 主力资金净流入(万元) | 主力资金流入率(%) | 涨跌幅(%) | 换手率(%) | | --- | --- | --- | --- | --- | --- | | 688256 | 寒武纪-U | 75884.83 | 5.48 | 4.63 | 2.36 | | 688027 | 国盾量子 | 40589.76 | 12.84 | 9.48 | 7.98 | | 688205 | 德科立 | 32527.80 | 11.12 | 13.19 | 13.96 | | 688981 | 中芯国际 | 32042.57 | 5.39 | 2.64 | 2.54 | | 688008 | 澜起科技 | 31163.12 | 8.48 | 3.25 | 2.61 | | 688072 | 拓荆科技 | 26372.84 | 13.68 | 1.70 | 2.25 | | 688195 | 腾景科技 | 25702.08 | ...
南向资金丨小米集团获净买入11.73亿港元
Di Yi Cai Jing· 2025-12-08 10:03
(本文来自第一财经) 南向资金净买入15.40亿港元,小米集团-W、中芯国际、泡泡玛特净买入额位列前三,分别获净买入 11.73亿港元、4.67亿港元、4.32亿港元。净卖出方面,腾讯控股、华虹半导体、中国平安分别遭净卖出 7.62亿港元、2.09亿港元、1.80亿港元。 ...
南向资金 | 小米集团-W获净买入11.73亿港元
Di Yi Cai Jing· 2025-12-08 10:03
(本文来自第一财经) 南向资金今日净买入15.40亿港元,小米集团-W、中芯国际、泡泡玛特净买入额位列前三,分别获净买 入11.73亿港元、4.67亿港元、4.32亿港元。净卖出方面,腾讯控股、华虹半导体、中国平安分别遭净卖 出7.62亿港元、2.09亿港元、1.80亿港元。 ...
南向资金今日净买入超15亿港元 小米集团获净买入居前
Mei Ri Jing Ji Xin Wen· 2025-12-08 09:53
Group 1 - Southbound funds recorded a net purchase of approximately 1.54 billion HKD on December 8 [1] - Xiaomi Group-W and SMIC received net purchases of approximately 1.173 billion HKD and 0.467 billion HKD, respectively [1] - Tencent Holdings experienced a net sell-off of 0.762 billion HKD [1]
上市公司监督管理条例公开征求意见,资金面略有收敛,债市震荡回暖
Dong Fang Jin Cheng· 2025-12-08 09:44
Report Summary 1. Report Industry Investment Rating No relevant information provided. 2. Core Viewpoints On December 5, the liquidity slightly tightened; the bond market fluctuated and recovered; the main indices of the convertible bond market collectively rose, and most convertible bond issues increased in price; yields on U.S. Treasuries across all maturities generally increased, and yields on 10-year government bonds of major European economies generally rose [1]. 3. Summary by Directory 3.1 Bond Market News - **Domestic News**: On the evening of December 5, Chinese and U.S. economic and trade leaders held a video call, discussing the implementation of previous consensuses and promoting stable and positive development of Sino-U.S. economic and trade relations [3]; on December 6, China Securities Regulatory Commission Chairman Wu Qing emphasized accelerating the creation of first-class investment banks and institutions to boost high-quality development of the capital market [4]; on December 5, the CSRC solicited public opinions on the "Regulations on the Supervision and Administration of Listed Companies"; the "Administrative Measures for Financial Leasing Business of Financial Leasing Companies" will be implemented from January 1, 2026; the central bank renewed a bilateral currency swap agreement with the Macao Monetary Authority, expanding the scale to 50 billion yuan/57 billion Macao patacas [5][6]. - **International News**: U.S. economic data for September showed inflation and personal income increases, but actual personal consumption expenditures remained stagnant; the preliminary December consumer confidence index rose, and short-term inflation expectations dropped to the lowest level since January; key European economies' 10-year government bond yields generally increased [7][8][30]. - **Commodities**: On December 5, international crude oil futures prices continued to rise, with WTI January crude futures up 0.69% to $60.08 per barrel and Brent February crude futures up 0.77% to $63.75 per barrel; COMEX February gold futures closed flat at $4,243 per ounce; NYMEX natural gas prices rose 5.25% to $5.337 per ounce [9][10]. 3.2 Liquidity - **Open Market Operations**: On December 5, the central bank conducted 139.8 billion yuan of 7-day reverse repurchase operations at an interest rate of 1.40%, with 303.1 billion yuan of reverse repurchases maturing, resulting in a net withdrawal of 161.5 billion yuan [12]. - **Funding Rates**: On December 5, the liquidity slightly tightened but remained generally loose. DR001 rose 0.06bp to 1.300%, and DR007 rose 0.04bp to 1.438% [13]. 3.3 Bond Market Dynamics - **Interest Rate Bonds**: On December 5, affected by rumors of the Politburo's mention of "dual cuts," the bond market fluctuated and recovered. Yields on 10-year government bonds and 10-year China Development Bank bonds decreased [16]. - **Credit Bonds**: On December 5, the trading prices of two industrial bonds deviated by over 10%; several companies, including Zhengyuan Real Estate and Fosun Group, faced regulatory actions due to information disclosure violations; many companies, such as Vanke and Longfor Group, announced bond-related events [18][19][22]. - **Convertible Bonds**: On December 5, the A-share market rose, and the convertible bond market followed suit. The main convertible bond indices increased, and most individual convertible bonds rose. Several companies, including Aowei Electronics, announced convertible bond-related events [21][23][27]. - **Overseas Bond Markets**: On December 5, yields on U.S. Treasuries across all maturities generally increased, and yields on 10-year government bonds of major European economies generally rose; the daily price changes of Chinese dollar bonds are provided [26][30][32].
半导体与半导体生产设备行业周报、月报:先进封装2026年供不应求,摩尔线程上市科创板-20251208
Guoyuan Securities· 2025-12-08 08:11
Investment Rating - The report maintains a "Recommended" investment rating for the semiconductor and semiconductor production equipment industry [6]. Core Insights - The advanced packaging sector is expected to face a supply shortage in 2026, with major players like ASE, SPIL, and Amkor leading the market [3]. - The global smartphone market is projected to grow, driven by strong demand for the iPhone 17 series, with a 1.5% increase in shipments expected for 2025 [3][30]. - The report highlights significant growth in the foldable smartphone segment, with a 14% year-on-year increase in Q3 2025 shipments, marking a record high for this category [2][26]. Market Indices Summary - The overseas AI chip index rose by 1.20% this week, with Marvell increasing nearly 11% and Nvidia and MPS both up over 3% [1][9]. - The domestic AI chip index saw a 0.5% increase, with companies like SMIC and Cambrian Technologies showing gains between 1% and 3% [1][9]. - The server ODM index increased by 1.5%, with Wistron up 4.4% and other major players like Supermicro and Hon Hai Precision also seeing gains [1][10]. - The storage chip index declined by 3.2%, with Beijing Junzheng and Zhaoyi Innovation showing gains, while others faced significant declines [1][10]. - The power semiconductor index increased by 2.9%, indicating a stable market performance [1][10]. Major Events Summary - The AI chip packaging market is expected to be dominated by ASE, SPIL, and Amkor over the next five years, with TSMC ramping up advanced packaging capacity [3][29]. - Moore Threads went public on December 5, raising approximately 7.576 billion yuan, with expectations of profitability starting in 2027 [3][29]. - The report notes that the iPhone 17 series has significantly boosted smartphone shipments, but there are concerns about storage chip shortages and rising costs impacting 2026 [3][30]. - Nvidia's new AI server is expected to enhance inference performance for various AI models by up to 10 times, showcasing its competitive edge in the AI inference market [3][31].
PCB、存储、被动元件...这些芯片大厂都在涨价!
芯世相· 2025-12-08 06:30
Core Viewpoint - The article discusses the ongoing price increases across the semiconductor supply chain, driven by rising raw material costs and surging demand from AI applications, leading to a widespread tightening of supply and price hikes across various components [3][4][6]. Group 1: Price Increases in PCB and Wafer Manufacturing - The price increase trend has spread to the PCB industry, with major players like 建滔 and 南亚 raising prices by 5% to 10% and 8% respectively due to rising raw material costs [8][9]. - TSMC has announced price hikes for advanced process nodes, with increases expected to be in the range of 8% to 10% starting in 2026, and potentially up to 50% for 2nm wafers [12][11]. Group 2: Storage Market Dynamics - The storage market is experiencing significant price increases, with DRAM and NAND prices rising by 20% to 30% due to AI demand and supply constraints [15][19]. - Major manufacturers like 三星 and SK海力士 have suspended pricing for certain products, indicating a tightening supply situation [17][18]. - Flash memory prices have surged, with companies like 闪迪 announcing a 50% increase in NAND flash contract prices [21]. Group 3: Passive Components Price Adjustments - Passive component manufacturers are also raising prices, with increases driven by raw material costs and heightened demand from AI applications [32][33]. - Companies like 国巨 and 风华高科 have issued price hikes for various components, with increases ranging from 5% to 30% [35][36]. Group 4: Power Devices and Other Components - The power semiconductor market is seeing price increases, particularly following the 安世事件, which has led to a surge in demand for alternative products [42][44]. - 华润微 has confirmed price increases for certain IGBT products, citing rising raw material costs and strong order performance as key factors [45]. Group 5: Market Sentiment and Future Outlook - The overall sentiment in the semiconductor market remains optimistic, with expectations of continued price increases and strong demand driven by AI and other emerging technologies [26][27][28]. - The storage market is anticipated to maintain a tight supply situation, with companies like 兆易创新 predicting further price increases in the coming quarters [23].