格隆汇8月4日丨盛美上海(688082.SH)公布，2025年8月4日，公司完成回购，已实际回购公司股份 443,400股，占公司总股本的比例为0.10%，回购成交的最高价为115.49元/股，最低价为110.81元/股，回 购均价112.79元/股，使用资金总额人民币5,001.23万元（不含印花税、交易佣金等交易费用）。 ...

Core Viewpoint - The semiconductor industry in China is transitioning from a global cooperative model to a regional strategic industry due to geopolitical factors, with significant growth in domestic wafer production capacity expected in the coming years [2][3]. Group 1: Market Trends - By 2024, China's mainland wafer production capacity is projected to account for nearly 25% of the global total, increasing to 31% by 2029, indicating a strong demand signal for local semiconductor equipment manufacturers [2]. - The equipment market size for wafer fabrication in mainland China is expected to reach $41.2 billion in 2024, leading other regions globally. However, a decline of 5% to $39 billion is anticipated in 2025 due to prior expansions and equipment stockpiling [2]. Group 2: Competitive Landscape - The impressive performance of equipment manufacturers in mainland China is attributed to their enhanced technological competitiveness and market development capabilities, supported by strong backing from the government and clients [3]. Group 3: Industry Players - A detailed table lists various companies involved in different process nodes, highlighting key players in the semiconductor equipment sector, such as North Huachuang, SMIC, and others, across various technologies [4].

Core Insights - The semiconductor CMP (Chemical Mechanical Polishing) equipment market is crucial for wafer surface flattening and is dominated by US Applied Materials and Japan's Ebara, with high technical barriers [1][8][10] - The global semiconductor equipment market is projected to reach $117.1 billion in 2024, with the CMP equipment market estimated at $3.25 billion, driven by advancements in 2nm processes and memory stacking technologies [1][8][10] - China's CMP equipment market is experiencing rapid growth due to policy support and domestic substitution strategies, with domestic equipment market share expected to rise to 30% globally and over 50% domestically by 2024 [1][10][12] Industry Overview - CMP equipment is essential for achieving global wafer surface flattening through a combination of chemical etching and mechanical grinding, achieving ultra-high precision polishing with roughness less than 1nm [2][4] - The industry is characterized by a tightly integrated supply chain, with upstream focusing on core components and materials, midstream on design and manufacturing, and downstream applications in integrated circuit manufacturing and advanced packaging [6][8] Current Market Analysis - The global CMP equipment market is highly concentrated, with significant growth driven by the demand for advanced semiconductor processes and the increasing number of memory layers in chips [8][10] - In 2024, the CMP equipment market is expected to grow by 6.9% year-on-year, reflecting strong demand from major chip manufacturers like TSMC and Intel [8][10] Domestic Market Dynamics - China's CMP equipment industry has made significant strides, with leading companies like Huahai Qingshi achieving breakthroughs in 12-inch CMP equipment, capturing over 50% of the domestic market [10][18] - The domestic market for CMP equipment is projected to reach approximately 6.13 billion yuan in 2024, growing by 13.5% year-on-year [10][12] Import and Export Trends - Despite growth in the domestic CMP equipment market, high-end equipment remains largely reliant on imports, with a notable increase in export volumes in 2024 [12][14] - The average price of imported CMP equipment remains significantly higher than that of exported equipment, indicating a strong demand for high-end technology [14][16] Competitive Landscape - The competitive landscape is marked by a breakthrough in international monopolies and differentiation among domestic players, with Huahai Qingshi leading in 12-inch CMP equipment and other companies focusing on advanced packaging and third-generation semiconductor polishing [18][20] - The domestic market's localization rate has increased from 3% in 2017 to 50% in 2024, although high-end equipment and core components still rely on imports [18][20] Future Development Trends - The CMP equipment industry is moving towards high-end technology, with domestic companies making significant advancements in 28nm and 14-7nm processes to meet the demands of AI and HPC markets [22][23] - The industry is expected to see a deepening of domestic substitution and market expansion, with a projected 50% market share for domestic equipment in high-end markets by 2025 [22][23] - Collaboration across the supply chain and strong policy support are driving the development of a secure and controllable industrial ecosystem [24]

Core Insights - Wang Hui, the founder of Shengmei Shanghai, has successfully led the company to become a leading player in the semiconductor equipment industry with a market value of 54 billion yuan [2][17] - The company has achieved remarkable growth, with a net profit of 1.153 billion yuan in 2024, representing over a sevenfold increase since 2019 [2][15] - Shengmei Shanghai is planning a private placement to raise 4.482 billion yuan, primarily for research and development [3][21] Company Development - Wang Hui's journey began with his education in precision instruments at Tsinghua University, followed by advanced studies in Japan and the United States, where he gained significant technical expertise [6][10] - After returning to China in 2005, he identified the market potential in the semiconductor sector and founded Shengmei Shanghai, focusing on localizing technology to fill market gaps [9][10] - The company developed the world's first SAPS single-wafer megasonic cleaning technology, breaking foreign monopolies and entering the supply chain of major clients like Hynix [11][12] Financial Performance - Shengmei Shanghai's revenue grew from 254 million yuan in 2017 to 5.618 billion yuan in 2024, with a net profit increase from approximately 10.86 million yuan to 1.153 billion yuan in the same period [14][15] - The company has seen a 6.42-fold increase in revenue and a 7.54-fold increase in net profit over the past five years [15] - As of the first quarter of 2025, the company's total assets reached 12.638 billion yuan [16] Market Position and Strategy - Shengmei Shanghai has established itself as a leading provider of semiconductor cleaning equipment, holding a 23% market share in China and 6.6% globally, ranking fifth [12][16] - The company emphasizes a strategy of technological differentiation and innovation, with over 1,520 invention patents and 468 authorized patents [12] - Wang Hui aims to position Shengmei Shanghai as a comprehensive semiconductor equipment supplier, with plans to cover a market worth approximately 20 billion US dollars through seven major product lines [18][19][21] Future Outlook - The company is focused on global expansion, aiming to compete with international giants by offering advanced equipment for AI chip development and other high-precision applications [20][21] - Wang Hui's vision is to ensure that Chinese semiconductor equipment holds a significant place in the global supply chain [21]

登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：688082 证券简称：盛美上海 公告编号：2025-054 盛美半导体设备（上海）股份有限公司 2024年年度权益分派实施公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容的 真实性、准确性和完整性依法承担法律责任。 重要内容提示： 每股现金红利0.65386元（含税） ● 相关日期 ■ 一、通过分配方案的股东会届次和日期 本次利润分配方案经公司2025年6月12日的2024年年度股东大会审议通过。 二、分配方案 1.发放年度：2024年年度 2.分派对象： 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任公司上海分公司（以下简 称"中国结算上海分公司"）登记在册的本公司全体股东（公司回购专用证券账户中的股份除外）。 公司于2025年3月19日办理完成2023年限制性股票激励计划首次授予部分第一个归属期的股份登记手 续，新增股份2,550,435股，公司已发行股份总数由438,740,753股增加至441,291,188股。具体内容详见公 司于2025年3月21日在上海证券交易所网站（w ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-055 盛美半导体设备（上海）股份有限公司 关于 2024 年年度权益分派实施后 调整回购价格上限的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 调整前回购价格上限：不超过人民币120.00元/股（含） 调整后回购价格上限：不超过人民币119.35元/股（含） 回购价格上限调整起始日：2025年8月1日（2024年年度权益分派除权除 息日） 一、回购股份的基本情况 盛美半导体设备（上海）股份有限公司（以下简称"公司"）于2024年8月6 日召开第二届董事会第十二次会议及第二届监事会第十二次会议，审议通过了 《关于以集中竞价交易方式回购公司股份方案的议案》，同意公司使用首次公开 发行人民币普通股取得的部分超募资金及公司自有资金通过集中竞价交易方式 进行股份回购。回购股份将在未来适宜时机用于股权激励或员工持股计划。回购 价格不超过90元/股（含），回购资金总额不低于人民币5,000万元（含），不超 过人民币10,000万元（含），回购期限为 ...

北京市金杜律师事务所上海分所 关于 盛美半导体设备（上海）股份有限公司 2024 年度差异化分红事项 之 专项法律意见书 二〇二五年七月 致：盛美半导体设备（上海）股份有限公司 北京市金杜律师事务所上海分所（以下简称"本所"或"金杜"）接受盛美半导 体设备（上海）股份有限公司（以下简称"公司"）的委托，根据《中华人民共和 国公司法（2023年修订）》（以下简称"《公司法》"）、《中华人民共和国证券法》 （以下简称"《证券法》"）、《上市公司股份回购规则》（以下简称"《回购规则》"）、 《上海证券交易所上市公司自律监管指引第7号——回购股份（2025年3月修订）》 （以下简称"《监管指引第7号》"）等法律、法规、部门规章及其他规范性文件 （以下简称"法律法规"）和《盛美半导体设备（上海）股份有限公司章程》（以下 简称"《公司章程》"）的有关规定，就公司2024年度利润分配所涉及的差异化分 红（以下简称"本次差异化分红"）相关事项，按照律师行业公认的业务标准、道 德规范和勤勉尽责精神，出具本法律意见书。 本法律意见书的出具已得到公司如下保证： 1、公司向本所提供的所有文件资料及所作出的所有陈述和说明均是真实、 准 ...

二、 分配方案 证券代码：688082 证券简称：盛美上海 公告编号：2025-054 盛美半导体设备（上海）股份有限公司 2024年年度权益分派实施公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： | 股权登记日 | 除权（息）日 | 现金红利发放日 | | --- | --- | --- | | 2025/7/31 | 2025/8/1 | 2025/8/1 | 一、 通过分配方案的股东会届次和日期 本次利润分配方案经公司2025 年 6 月 12 日的2024年年度股东大会审议通过。 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任 公司上海分公司（以下简称"中国结算上海分公司"）登记在册的本公司全体股东 （公司回购专用证券账户中的股份除外）。 根据《上海证券交易所上市公司自律监管指引第 7 号——回购股份》等有关 规定，公司回购专用证券账户中的股份不享有利润分配的权利。 是否涉及差异化分红送转：是 每股分配比例 每股现金红利0.65386元（含税） 相关日期 1. 发放年度：20 ...

股票简称：盛美上海 股票代码：688082 盛美半导体设备（上海）股份有限公司 ACM Research（Shanghai）, Inc. （中国（上海）自由贸易试验区丹桂路 999 弄 5、6、7、8 号全幢） 募集说明书 （注册稿） 保荐人（主承销商） （中国（上海）自由贸易试验区商城路 618 号） 二〇二五年七月 盛美半导体设备（上海）股份有限公司 募集说明书 声 明 本公司及全体董事、高级管理人员承诺募集说明书及其他信息披露资料不存 在任何虚假记载、误导性陈述或重大遗漏，并对其真实性、准确性及完整性承担 相应的法律责任。 公司负责人、主管会计工作负责人及会计机构负责人保证募集说明书中财务 会计资料真实、完整。 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对申请 文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其对发行人的 盈利能力、投资价值或者对投资者的收益作出实质性判断或保证。任何与之相反 的声明均属虚假不实陈述。根据《证券法》的规定，证券依法发行后，发行人经 营与收益的变化，由发行人自行负责。投资者自主判断发行人的投资价值，自主 作出投资决策，自行承担证券依法发行后因发行 ...

股票简称：盛美上海 股票代码：688082 盛美半导体设备（上海）股份有限公司 ACM Research（Shanghai）, Inc. （中国（上海）自由贸易试验区丹桂路 999 弄 5、6、7、8 号全幢） 2 0 2 4 年度向特定对象发行 A 股股票 募集说明书 （ 注 册 稿 ） 保荐人（主承销商） （中国（上海）自由贸易试验区商城路 618 号） 二〇二五年七月 盛美半导体设备（上海）股份有限公司 募集说明书 声 明 本公司及全体董事、高级管理人员承诺募集说明书及其他信息披露资料不存 在任何虚假记载、误导性陈述或重大遗漏，并对其真实性、准确性及完整性承担 相应的法律责任。 公司负责人、主管会计工作负责人及会计机构负责人保证募集说明书中财务 会计资料真实、完整。 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对申请 文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其对发行人的 盈利能力、投资价值或者对投资者的收益作出实质性判断或保证。任何与之相反 的声明均属虚假不实陈述。根据《证券法》的规定，证券依法发行后，发行人经 营与收益的变化，由发行人自行负责。投资者自主判断发行人的投 ...